JPH08255849A - Cap temporarily joining jig of package which house chip and cap joining device and method - Google Patents

Abstract

PURPOSE: To set a vacuum oven chamber high in heating temperature by a method wherein a carrier which houses a package and an attracting plate provided with a permanent magnet in its recess are provided inside the vacuum oven chamber, and the carrier is attracted by the permanent magnet to be positioned. CONSTITUTION: An attracting plate 1 is formed of non-magnetic material such as aluminum or the like and provided with circular recesses arranged at a regular interval on its upside, and a permanent magnet 6 is buried in each of the recesses. Furthermore, reference pins 4 are implanted in the corners of the attracting plate 1 upright, and positioning pin holes 5 are cut in the rear of the attracting plate 1 for positioning the plate 1 to a work table 3. A carrier 9 of magnetic material is formed like a flat plate identical to the attracting plate 1 in shape, recesses are provided in line to the carrier 9 for positioning a package, and pin holes 11 where the reference pins 4 of the attracting plate 1 are fitted in are provided in the corners of the carrier 9. When the carrier 9 is transferred by a transfer rail and reaches the work table 3, the carrier 9 is positioned by the reference pins 4 and attracted by the attracting plate 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, I
A cap temporary fixing jig for temporarily fixing a metal cap when a chip such as C or a crystal oscillator is hermetically sealed in a ceramic or metal package by a micro parallel seam bonding method or the like. The present invention relates to a cap joining device and a cap joining method using this jig.

[0002]

2. Description of the Related Art Conventionally, a micro parallel seam bonding method has been widely used as a method for hermetically sealing a chip in a package. As the package, there are a ceramic package in which a metal seal frame is joined to a ceramic substrate, and a metal package entirely made of metal. These packages are available. Many J are positioned and mounted on the carrier.

After the chip is housed inside the package mounted on this carrier and the internal wiring with the lead is made, the open end of the package is covered with a cap. Then, the joint portion between the package and the cap is pressed and energized by a pair of roller electrodes with tapers which rotate along the opposite edges of the cap, and the joint formed at this joint portion. Due to the heat of the package, the open end of the package and the cap are seam-joined.

At the time of this seam joining, the pair of roller electrodes are brought into rolling contact with each other along the opposite edges of the cap, but at this time, the cap covering the opening end of the package moves. It had the drawback of being easy. Therefore, conventionally, spot joining is performed to temporarily fix the cap to the opening end of the package. That is, while the cap is positioned and held at the opening end of the package, a pair of electrodes are pressed against the peripheral edge of the cap to energize and spot-join to temporarily fix the package and the cap.

However, in order to perform the temporary fixing, after the cap and the open end of the package are positioned, the carrier is conveyed to the work table of the temporary fixing device, or
If the pair of temporary fixing electrodes do not contact the two points on the periphery of the cap at the same time, the relative position between the positioned package and the cap is displaced, and there is a problem that reliable hermetic sealing cannot be performed.

In order to solve the above-mentioned problems, the inventor has found that the cap and the package should be temporarily fixed by spot welding after the cap is positioned and placed on the open end of the package. We invented a cap temporary fixing jig for a semiconductor package that can prevent relative displacement, and filed a prior application (Japanese Patent Application No. 4-273451).
(JP-A-6-104347).

As shown in FIG. 7, this is a jig for temporarily fixing the magnetic material cap 31 to the opening end surface of the package 30 having the magnetic material at least on the opening end surface. The holding substrate is made of a non-magnetic material. 32, a permanent magnet 34 loaded in a recess 33 formed in the upper surface of the holding substrate 32, and a package facing the permanent magnet 34 fixed to the upper surface of the holding substrate 32.
Of the semiconductor package having a positioning plate 36 made of a non-magnetic material in which a positioning hole 35 of the package 30 is formed, and the package 30 and the cap 31 form a magnetic path of a magnetic field by the permanent magnet 34. The present invention relates to a jig for temporarily fixing a cap.

With this structure, the cap 31 is firmly attracted and fixed to the package 30 by the magnetic force, so that the cap 31 is conveyed from the positioning work table to the temporary fixing work table. Also, even if the pair of temporary fixing electrodes 37 do not contact the cap 31 at the same time, there is no relative displacement between the positioned package 30 and the cap 31, and the airtight sealing is ensured in the subsequent seam welding. It has the effect of being able to stop.

Then, the holding substrate 32 and the permanent magnet 34
In the case of a cap temporary fixing jig including the positioning plate 36, in order to remove the water in the package 30,
With the package 30 mounted, the entire jig is carried into an oven chamber filled with an inert gas such as nitrogen gas, where it is heated to a high temperature and dried.

The package 30 that has been dried is taken out of the vacuum oven chamber and conveyed while being mounted on a jig, and positioned and fixed on the work table of the temporary fixing device. Next, cap 31 on each package 30.
When is positioned and placed, the cap 31 is firmly attracted to the package 30 by the permanent magnet 34 of the jig. After the package 30 and the cap 31 are temporarily fixed in this state, the entire jig is further conveyed to the work table of the micro parallel seam bonding apparatus, and the package 3
The entire circumference of 0 and the cap 31 is seam-joined.

[0011]

As described above, since the cap temporary fixing jig in which the permanent magnet 34 is incorporated and the package 30 are both heated to a high temperature in the vacuum oven chamber, the permanent magnet is not heated. Due to the Curie point of 34, the heating temperature could not be raised above this Curie point, and there was a problem that it took time to dry.

Further, since a cap temporary fixing jig in which the permanent magnets 34 are incorporated by the number of the packages 30 is required, a large number of expensive permanent magnets 34 are required, resulting in a problem that the cost becomes very high. It was For example, 6 × 9 permanent magnets 34 are used for one jig, and about 100 to 200 such jigs are used. The number of permanent magnets 34 used in this number of jigs is enormous.

[0013]

A first aspect of the present invention is a cap temporary fixing jig for temporarily fixing a cap placed on an open end of a package accommodating a chip, which is made of a magnetic material. A non-magnetic carrier having a recess formed on the upper surface of a flat plate and having a recess for accommodating the package therein, and a permanent magnet having substantially the same shape as the carrier and filled in the recess formed facing the recess of the carrier. A suction plate formed of a material, the suction plate is positioned and installed in the work table, and the carrier is conveyed above the suction plate to be attracted to the permanent magnet to position the carrier. It is a thing.

A second aspect of the present invention is a cap joining method for joining a cap to a package containing a wire-bonded chip by controlling the movement stop of the carrying rail and the ascending / descending of the cylinder by a computer. In the device, it is formed on the upper surface of a flat plate made of magnetic material and has a package inside.
A non-magnetic material having a concave portion for accommodating a die, a permanent magnet having substantially the same shape as the carrier and filled in the concave portion formed facing the concave portion of the carrier, and a positioning pin hole on the back surface. The formed suction plate for sucking the carrier, the positioning pin for fitting and positioning the suction plate into the positioning pin hole, and the reference pin for positioning the carrier on the suction plate are projected, and the package and the cap are provided. A temporary fixing device having a work table for temporarily fixing the carrier, a micro parallel bonding device for carrying a seam and carrying a carrier with the cap temporarily fixed, and a carrier equipped with a package. A vacuum oven chamber for heating, drying and vacuuming is provided.

According to a third aspect of the present invention, the cap is joined to the package containing the wire-bonded chips by controlling the movement stop of the carrier rail for carrying the carrier and the ascent and descent of the cylinder by the computer. In the cap joining method for forming a package, a carrier having a package is housed in a vacuum oven chamber and heated and dried, and is formed to have substantially the same shape as the carrier and to face an open end of the package. The attraction plate formed of a non-magnetic material having a permanent magnet filled in the recessed portion and a positioning pin hole on the back surface is positioned and fixed to the positioning pin of the worktable of the temporary fixing device, and is placed above the attraction plate. When there is no carrier, set the cylinder axis to the raised position and transfer the carrier taken out from the vacuum oven chamber by the transfer rail,
At the position where this carrier faces above the suction plate, the transport tray is placed.
When the carrier rail is stopped and the transport rail is stopped, the carrier is attracted to the suction plate while the cylinder shaft is descending and the reference pin on the work table is positioned at the temporary fixing position. A cap is placed on the open end of the package by a pick-and-place operation, and the cap and the cap are temporarily fixed while the cap is attracted to the permanent magnets of the attraction plate. Only the temporarily fixed carrier is conveyed to perform seam joining.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention is shown in FIGS.
It will be described in detail based on. 1 is a front view of a main part of an embodiment of the present invention, FIG. 2 is a side view of the main part of FIG. 1, FIG. 3 is a partially exploded perspective view, FIG. 4 is a plan view of a carrier 9, and FIG. FIG. 6 is a plan view showing the steps of a main part of an embodiment of the present invention.

1 to 3, 1 is a suction plate, and FIG.
As shown in FIG. 5, it is formed in a rectangular shape with a non-magnetic material such as aluminum, and a plurality of circular recesses 2 are formed on the upper surface in line at regular intervals. In the case of this embodiment,
A total of 54 recesses 2 of length 6 and width 9 are formed at regular intervals. Further, reference pins 4 are provided on the upper surface of the suction plate 1 at corners in four directions. A plurality of positioning pin holes 5 for positioning the work table 3 are recessed on the back surface of the suction plate 1.

Reference numeral 6 denotes a disk-shaped permanent magnet which is embedded in the recess 2 and is magnetized to have N and S poles centering on the diameter. A magnetic path is formed from the N pole to the S pole, and the upper surface is formed. The cap 8 which is sucked through the package 7 is configured so as not to rotate.

Reference numeral 9 denotes a carrier made of a magnetic material, which is shown in FIG.
As shown in FIG. 6, 6 × 9 positioning recesses 10 for positioning and arranging the package 7 are arranged on the flat plate having substantially the same shape as the suction plate 1 so as to face the recesses 2 of the suction plate 1. In addition, the pin holes 11 are formed at the corners in the four directions so as to face the reference pin 4 of the suction plate 1 and into which the reference pin 4 is fitted.

As shown in FIG. 7, the package 7 is composed of a ceramic substrate 12 to which a chip 14 is attached and a seal frame 13 made of a magnetic material.
A lead 19 penetrates the seal frame 13 and is glass-sealed. The chip 14 attached to the ceramic substrate 12 is wire-bonded to the lead 19. In this way, the chip 14 is housed inside the package 7 and placed on the carrier 9 (FIGS. 3 and 6) and conveyed, and the work station in the temporary fixing device 22 (FIG. 6) is conveyed. The opening end is covered by the cap 8 on the bull 3.

As the ceramic substrate 12, for example, an IN (aluminum nitride) sheet having a multilayer structure obtained by laminating sheets and firing in a reducing gas atmosphere, or an alumina ceramic substrate can be used. The seal frame 13 has a frame formed of a magnetic material such as Fe—Ni—Co alloy (cobalt), is plated with gold, and is brazed to the ceramic substrate 12.

Like the seal frame 13, the cap 8 is made of a magnetic material such as kovar, and may be a flat plate, but as shown in FIG. 7, the inside of the lower surface is the seal frame. -Slightly recessed downward so as to engage with the inner peripheral edge of the hole 13 is convenient for positioning.

The work table 3 is provided with a positioning pin 15 which is fitted into the positioning pin hole 5 of the suction plate 1 to position the suction plate 1.

Reference numeral 17 is a carrying rail for carrying the carrier 9 to the work table 3. When the carrier 9 reaches a predetermined position on the work table 3, it is moved up and down by the cylinder 18. Is configured.

In FIG. 6, reference numeral 21 denotes a vacuum oven chamber, in which heating and vacuum processing are performed in a state where the package 7 is mounted on the carrier 9. 22 is a temporary fixing device
The jig 7 and the cap 8 are temporarily fixed. Reference numeral 23 is a micro-parallel seam bonding apparatus, and the cap 8 is seam bonded. Reference numeral 24 is a computer that controls the operation of each unit.

Next, the process of joining the cap 8 to the package 7 using the cap temporary fixing jig composed of the suction plate 1 and the carrier 9 configured as described above will be described. First, with the positioning pin 15 of the work table 3 fitted in the positioning pin hole 5 of the suction plate 1, the suction plate 1 is positioned in the work table 3 of the temporary fixing device 22. It is fixed.

On the other hand, the package 7 in which the chip 14 and the lead 19 are internally wired by a wire bonding device (not shown) is arranged on the carrier 9 and placed in the nitrogen atmosphere of the vacuum oven chamber-21. After being stored therein, heated at a high temperature and dried, it is placed on the transport rail 17 and transported to the next temporary fixing device 22.

A sequence of operations such as stopping the conveyance of the carrier 9 by stopping the movement of the conveying rail 17 and ascending and descending the conveying rail 17 is sequence-controlled by the computer 25. Therefore, when the carrier 9 transported by the transport rail 17 reaches above the work table 3, the transport rail 1
7 stops. At this time, the axis of the cylinder 18 is in a raised state. Therefore, when the transport rail 17 stops, the shaft of the cylinder 18 starts to descend, so that the carrier 9 descends together with the transport rail 17. At this time, the carrier 9 is positioned by the reference pin 4 and the work
It is adsorbed to the adsorption plate 1 on the bull 3.

Next, a suction head (not shown) movable in the horizontal direction and the vertical direction is arranged above the work table 3, and the cap 8 operates in a pick-and-place operation. Each of them is sucked by negative pressure one by one and carried to the upper surface of the open end of each package 7, the suction head descends, and the cap 8 opens the open end of the package 7 (of the seal frame 13). Placed on the upper end).

At this time, the seal frame 13 is the permanent magnet 6
Since it is a part of the magnetic path formed by, when the cap 8 is placed on the upper end, it passes from the N pole through the seal frame 13 and
A magnetic path is formed through the cap 8 toward the south pole.
Therefore, the cap 8 is attached to the opening end of the package 7 (see
It is strongly adsorbed to the upper end of the frame 13 and does not move.

As described above, when the caps 8 are placed on all the packages 7 by the pick-and-place operation, the pair of temporary fixing electrode heads 20 descend and the caps 8 move.
Is pressed against the opposite edges of the package 7 to be energized, and the cap 8 is temporarily fixed to the open end of the package 7 (the upper end of the seal frame 13).

Then, the shaft of the cylinder 18 is raised, the carrier 9 is separated from the suction plate 1 and returned to the initial position together with the carrying rail 17, and the cap 9 is temporarily fixed.
The next station is the micro parallel system.
It is conveyed to a work table (not shown) of the jointing device 23 and positioned and fixed.

Next, a pair of taper-shaped roller electrodes (similar to FIG. 7) are energized while rolling contact with the opposite edges of the cap 8 from above, and seam joining is performed. When the seam bonding of all the caps 8 is completed, the carrier 9 is transported to the next step.

In this embodiment, the permanent magnet is disk-shaped, but the shape is not limited to this, and it may be rectangular or square. Furthermore, the poles of the magnet may be divided into four or more poles. In short, the cap 8
The package 7 and the package 7 may have any shape as long as they form a part of the magnetic path.

[0035]

According to the first aspect of the present invention, there is provided a cap temporary fixing jig for temporarily fixing a cap placed at an open end of a package accommodating a chip. Formed of a carrier having a concave portion for accommodating the package therein, and a non-magnetic material having a substantially same shape as the carrier and having a permanent magnet filled in the concave portion formed facing the concave portion of the carrier The suction plate is positioned and installed in the work table, and the carrier is conveyed above the suction plate to be attracted to the permanent magnet to position the carrier. -Lee-
The heating temperature in the vacuum oven chamber for drying and vacuum processing can be set high without considering the point temperature.

Further, the suction plate is the work station of the temporary attachment device.
Since only the number of magnets used in the suction plate fixed to the bull is enough, the cost can be saved significantly compared to the conventional type.

In the case of the conventional dedicated jig, the package
The jigs were transferred to the dedicated jig by hand one by one, but in the case of the jig of the present invention, the carrier delivered in the state of wire bonding can be used as it is.

A second aspect of the present invention is a cap joining for joining a cap to a package containing a wire-bonded chip by controlling the movement stop of the carrying rail and the ascending / descending of the cylinder by a computer. In the device, it is formed on the upper surface of a flat plate made of magnetic material and has a package inside.
A non-magnetic material having a concave portion for accommodating a die, a permanent magnet having substantially the same shape as the carrier and filled in the concave portion formed facing the concave portion of the carrier, and a positioning pin hole on the back surface. A suction plate that is formed and sucks the carrier, a positioning pin that is inserted into the positioning pin hole to position and fix the suction plate, and a reference pin that positions the carrier on the suction plate are provided in a protruding manner to form a package. A temporary fixing device having a work table for temporarily fixing the cap, a micro-parallel joining device for carrying and seaming the carrier with the cap temporarily fixed, and a carrier carrying a package Since it is equipped with a vacuum oven chamber for heating, drying and vacuuming, it is not necessary to use many expensive permanent magnets and the heating temperature can be set arbitrarily. Cost of such overall cap bonding apparatus that is greatly reduced.

In the third aspect of the invention, the cap is joined to the package containing the wire-bonded chips by controlling the movement stop of the carrier rail for carrying the carrier and the ascending / descending of the cylinder by the computer. In the cap joining method, a carrier having a package is housed in a vacuum oven chamber and heated and dried, and the carrier has substantially the same shape as that of the carrier and faces the open end of the package. A permanent magnet filled in the formed recess,
A suction plate made of non-magnetic material with a positioning pin hole on the back side is positioned and fixed to the positioning pin of the worktable of the temporary fixing device, and when there is no carrier above the suction plate, the cylinder shaft is raised. The carrier is set to the position, the carrier is taken out from the vacuum oven chamber by the carrier rail, and the carrier rail is stopped at a position where the carrier faces above the suction plate. When stopped, the axis of the cylinder descends and the reference pin on the work table causes the carrier to be adsorbed to the adsorption plate while being positioned at the temporary fixing position, and the cap is attached to the open end of the package on the carrier. The carrier is placed by pick-and-play operation, and the cap and the cap are temporarily fixed while the caps are respectively attracted to the permanent magnets of the attraction plate. Since it was designed to carry and seam, if a dedicated jig for temporary cap fixing was used, the package containing the wire-bonded chip is mounted on the dedicated jig. At the same time, it was very troublesome to replace each of them on the carrier of the company by hand, but according to the present invention, the wire-bonded package can be used as a carrier as it is. The time and labor required for replacement can be omitted, and the working time can be greatly reduced.

[Brief description of drawings]

FIG. 1 is a front view of essential parts showing an embodiment of the present invention.

FIG. 2 is a side view of a main part of FIG.

FIG. 3 is a perspective view including a partially exploded view showing an embodiment of the present invention.

FIG. 4 is a plan view of the carrier 9.

FIG. 5 is a plan view of the suction plate 1.

FIG. 6 is a process chart of an essential part showing an embodiment of the present invention.

FIG. 7 is a cross-sectional view of an essential part showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Adsorption plate 2 Recessed portion 3 Worktable 4 Reference pin 5 Positioning pin hole 6 Permanent magnet 7 Package 8 Cap 9 Carrier 10 Recessed portion 14 Chip 15 Positioning pin 17 Conveying rail 18 Cylinder 21 Vacuum oven chamber-22 Temporary fixing device 23 Micro parallel seam joining device 24 Computer

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tadahiro Iwatsuki 3-20-1 Nishishimbashi, Minato-ku, Tokyo Inside Japan Avionics Co., Ltd.

Claims (3)

[Claims] 1. A cap temporary fixing jig for temporarily fixing a cap placed at an open end of a package accommodating a chip, the jig being formed on the upper surface of a flat plate made of a magnetic material and having the above-mentioned inside. Adsorption formed of a non-magnetic material having a carrier having a recess for accommodating a package and a permanent magnet having substantially the same shape as the carrier and filled in the recess formed facing the recess of the carrier. A plate, the attraction plate is positioned and installed in a work table, and the carrier is conveyed above the attraction plate to be attracted to the permanent magnet to position the carrier. A jig for temporarily fixing the cap of the package that contains the characteristic chip. 2. A magnetic field in a cap joining device for joining a cap to a package containing a wire-bonded chip by controlling movement stop of a transfer rail and ascending / descending of a cylinder by a computer. A carrier formed on the upper surface of a flat plate made of a material and having a recess for accommodating the package therein, and a recess having a substantially same shape as the carrier and formed to face the recess of the carrier. A non-magnetic material having a permanent magnet and a positioning pin hole on the back surface, which attracts the carrier, a positioning pin which is fitted into the positioning pin hole and positions and fixes the attraction plate, A work piece is provided with a reference pin for positioning the carrier on the suction plate so as to temporarily fix the package and the cap.
A temporary fixing device having a table, a micro parallel joining device for carrying the seam and carrying the carrier with the cap temporarily fixed, and a carrier carrying the package for heating and drying treatment. And a vacuum oven chamber for performing vacuum processing. 3. A package in which a wire-bonded chip is accommodated by controlling stoppage of movement of a carrier rail for carrying a carrier and raising and lowering of a cylinder by a computer.
In a cap joining method for joining a cap to a package, the carrier on which the package is mounted is vacuum opened.
It is housed in a bun chamber and heated and dried, and has a permanent magnet having a substantially same shape as that of the carrier, the permanent magnet being filled in a recess formed facing the recess of the carrier, and a positioning pin hole on the back surface. The attraction plate made of magnetic material is positioned and fixed to the positioning pin of the work table of the temporary fixing device, and when there is no carrier above the attraction plate, the axis of the cylinder is set to the raised position and the transfer is performed. The carrier taken out from the vacuum oven chamber is conveyed by a rail, and the carrier rail is stopped at a position where the carrier faces above the suction plate, and the carrier rail is stopped.
When the cylinder stops, the axis of the cylinder descends and the carrier is attracted to the suction plate while being positioned at the temporary fixing position by the reference pin on the work table, and the carrier on the package A cap is placed on the opening end by a pick-and-place operation, and the cap and the cap are temporarily fixed in a state where the cap is attracted to the permanent magnets of the attraction plate, respectively. A cap joining method, characterized in that only a carrier in a temporarily fixed state is conveyed to perform seam joining.