JPH08306813A - Temporarily fixing cap of semiconductor package - Google Patents

Abstract

PURPOSE: To make it unnecessary for many permanent magnets formed in disc types to be built in a retaining board, by making the magnetic path of magnetic field of a permanent magnet, of a package and a cap. CONSTITUTION: A retaining board 1 is formed in a rectangle by using nonmagnetic material, and a plurality of rectangular recess parts 2 are formed on the upper surface. In the recessed part 2 of the retaining board 1, a permanent magnet 3 is mounted which is symmetrically polarized in two poles with respect to the longitudinal axial line of the recessed part 2 as the center of the poles. A positioning plate 5 of nonmagnetic material is fixed on the upper surface of the retaining board 1. In the positioning plate 5, the approximate center of a package positioning hole 7 faces the axial line. Thereby, many permanent magnets formed in disc types are made unnecessary to be built in the retaining board 1, and the working and the assembling of magnets and the retaining board 1 are simplified.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention uses a metal cap to temporarily seal a semiconductor element, a crystal oscillator or the like (hereinafter referred to as a chip) in a ceramic or metal container by a micro parallel seam bonding method. The present invention relates to a jig used for stopping, that is, a jig for temporarily fixing a cap of a semiconductor package.

[0002]

2. Description of the Related Art Conventionally, a micro parallel seam bonding method has been widely used as a method for hermetically sealing a chip in a package.

According to this method, as shown in FIG. 9, a ceramic container (ceramic package) in which a metallic seal frame 23 is brazed to a ceramic container 22 or a metallic container (metal package) 2 entirely made of metal is used.
0 (hereinafter collectively referred to as a package), the semiconductor chip 24 is housed, and after the internal wiring is connected to the leads 25, the cap (lid plate) 21 is opened in the container 22 or in the package 20. Cover, cap 21
Pulsation energization is performed under a constant pressurizing condition by using a pair of tapered roller electrodes 26 that rotate along opposite edges. By the Joule heat generated in the joint portion due to this energization, the seam joint between the opening portion of the package 20 and the cap 21 is performed by the roll spot type joint portion forming method.

A pair of roller electrodes 26 are attached to the cap 2 here.
Since the cap 21 is easily moved when the cap 21 is brought into contact with the opposite edge of No. 1, spot joining is conventionally performed to temporarily fix the cap 21 to the package opening. That is, in a state where the cap 21 is positioned and held on the opening of the package 20, a pair of electrodes 26 are pressed against the peripheral edge of the cap 21 to energize for spot joining.

However, the temporary fixing by this spot joining is
It is necessary to carry out with the cap 21 held in a state of being positioned by the positioning device. However, when transported from the positioning place to the temporary fixing place or when the pair of temporary fixing electrodes (not shown) do not simultaneously contact two points on the peripheral edge of the cap 21, the positioned package 20 and the cap 21 are positioned.
However, there is a problem in that the relative position of the above may be displaced and reliable airtight sealing may not be possible.

In order to solve the above-mentioned problems, the relative displacement between the cap 21 and the package 20 is prevented before the cap 21 is positioned and mounted on the opening end of the package 20 and then temporarily fixed by spot welding. A semiconductor package cap temporary fixing jig that can be used has been invented and filed previously (Japanese Patent Application Laid-Open No. 6-104347 and Japanese Patent Application No. 6-331043).

As shown in FIGS. 9 to 11, this is a jig for temporarily fixing the magnetic cap 21 to the opening end surface of the package 20 having the magnetic material on at least the opening end surface.
The holding substrate 31 made of a non-magnetic material, the permanent magnet 33 loaded in the recess 32 formed on the upper surface of the holding substrate 31, and the positioning hole 34 of the package 20 facing the permanent magnet 33 are formed. A non-magnetic material positioning plate 35 shown in FIG. 10 is provided so that the package 20 and the cap 21 form a magnetic path of a magnetic field by the permanent magnet 33 as shown by a broken line in FIG. The present invention relates to a fixing jig.

Since the permanent magnet 33 is formed into a disk shape and is magnetized to the N pole and the S pole symmetrically with respect to the diameter, a magnetic path is formed from the N pole to the S pole, and the package 20
The cap 21 that is sucked in through does not rotate. With such a configuration, the cap 21 is firmly attracted and fixed to the package 20 by the magnetic force, and thus is transported from the positioning work table (not shown) to the temporary fixing work table (not shown). When the pair of temporary fixing electrodes 26 do not contact the cap 21 at the same time, the positioned package 20 and the cap 21
The present invention has an effect of reliably hermetically sealing in the subsequent seam welding without causing relative displacement of

When the jig for temporarily fixing the cap is used as a package conveying jig (hereinafter referred to as a carrier), the permanent magnets 33 are incorporated so as to face each one of the packages 20. The package 20 is conveyed as a unit in a sucked state, and is positioned and fixed on the work table. Next, when the cap 21 is positioned and placed on each package 20, the cap 2
1 is strongly adsorbed. Next, the carrier that has adsorbed the cap 21 is integrally conveyed to the work table of the temporary fixing device, and after the package 20 and the cap 21 are temporarily fixed, the carrier is further micro-parallel seam bonding device (not shown). It is transported to the work table and seam bonded.

The jig shown in FIG. 9 incorporates as many permanent magnets 33 as the number of packages 20 for each jig, and usually about 100 to 200 such jigs are used. However, there is a problem that a large number of are required and the cost becomes very high. To solve this problem, the number of permanent magnets 33 used is significantly reduced by separating the positioning plate 35 for positioning and mounting the package 20 from the holding substrate 31 loaded with the permanent magnets 33. You can

This conventional example will be described with reference to FIGS. 12 and 13 show a positioning plate, FIG. 12 is a plan view, and FIG. 13 is a sectional view taken along the line AA in FIG. As shown in FIGS. 12 and 13, a carrier 41 made of a magnetic material in which a positioning recess 42 (corresponding to the positioning hole 34 of FIG. 10) of the package 20 is formed, and FIGS.
5, the carrier 41 has substantially the same shape as that of the carrier 41. The carrier 43 includes a suction plate 45 formed of a non-magnetic material in which a recess 43 formed to face the positioning recess 42 is filled with a permanent magnet 44. The attraction plate 45 is installed on the work table, and the carrier 41 is conveyed above the attraction plate 45 to be attracted to the permanent magnets 44 and the package 21 is capped.
Is fixed.

In this way, the number of permanent magnets 44 required is only the number of magnets used in the attraction plate 45 fixed to the work table of the temporary attachment device, so that the permanent magnets 44 are significantly larger than those of the above-mentioned type. Costs can be saved.

[0013]

However, all of these jigs are formed in a disk shape, and have N poles and S poles symmetrically about the diameter.
A plurality of permanent magnets 33 and 44 magnetized to the poles must be incorporated in the holding substrate 31 or the attraction plate 45.
There is a problem that processing and assembling of 3, 44 and the holding substrate 31 or the suction plate 45 are complicated and expensive.

[0014]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and after the cap is positioned and placed in the opening of the package, the relative displacement between the package and the cap is temporarily fixed by spot joining. An object of the present invention is to provide an inexpensive jig for temporarily fixing a cap of a semiconductor package that can prevent the above problem.

[0015]

According to the first invention, an object of the present invention is to provide a jig for temporarily fixing a magnetic material cap to an opening end face of a container having at least an opening end face of a magnetic material. A holding substrate made of a non-magnetic material having a rectangular recess formed on the upper surface, and a permanent magnet that is loaded in the rectangular recess of the holding substrate and magnetized into two poles symmetrical about the longitudinal axis of the recess. A positioning plate made of a non-magnetic material, which is fixed to the upper surface of the holding substrate and has a positioning hole for the container whose approximate center is aligned with the axis, and wherein the container and the cap magnetize the magnetic field of the permanent magnet. This is achieved by a jig for temporarily fixing a cap of a semiconductor package, which is characterized in that a path is formed.

According to the second invention, an object of the present invention is a jig for temporarily fixing a cap made of a magnetic material to an opening end surface of a container having a magnetic material at least on the opening end surface, the positioning recess for positioning the container on the upper surface. A positioning plate made of a magnetic material, a holding substrate made of a non-magnetic material having a rectangular recess formed on the upper surface thereof, and a rectangular recess of the holding substrate, which is loaded around the longitudinal axis of the recess. A magnetic path of a magnetic field generated by the permanent magnet, wherein the positioning plate is placed above the holding substrate and is attracted to the permanent magnet. Is achieved by a jig for temporarily fixing a cap of a semiconductor package.

[0017]

EXAMPLE An example of using a ceramic package as a package will be described below. FIG. 1 is an enlarged cross-sectional view in which this embodiment is partially omitted, FIGS. 2 to 4 are exploded views thereof, FIG. 2 is a plan view of a positioning plate, FIG. 3 is a plan view of a holding substrate, and FIG. It is a perspective view of a permanent magnet with which a substrate is loaded.

In these figures, reference numeral 1 is a holding substrate, which is made of a non-magnetic material such as aluminum and has a rectangular shape. A plurality of rectangular recesses 2 are formed on the upper surface of the holding substrate 1. In this embodiment, two rows of recesses 2 are provided.

Reference numeral 3 is a rectangular rod-shaped permanent magnet, and the concave portion 2
Is loaded into. As shown in FIG. 4, one of the straight lines 4 passing through the center in the longitudinal direction of the permanent magnet 3 is the N pole,
The other is magnetized to the S pole. For this reason, the upper surface of the magnet 3 has different polarities. By configuring the magnet 3 in this way, it is possible to prevent a rotational force from being generated in the cap attracted by the magnet 3.

Reference numeral 5 denotes a positioning plate made of a non-magnetic material such as aluminum, which is placed on the upper surface of the holding substrate 1 and fixed by an appropriate number of screws 6 (six in the embodiment). The positioning plate 5 is formed with a positioning hole 7 that opens above the permanent magnet 3. The positioning hole 7 is for positioning the ceramic package 20. In this embodiment, a total of 18 positioning holes 9 (9 horizontally and 2 vertically) are arranged at regular intervals.

The package and cap mounted on the jig for temporarily fixing the cap are the same as those shown in FIG. 9, and the ceramic package 20 as a container includes a ceramic container 22 and a seal frame 23 made of a magnetic material. ,
Similarly, it has a cap 21 made of a magnetic material. The ceramic container 22 may have a multi-layer structure in which AIN (aluminum nitride) sheets are stacked and fired in a reducing gas atmosphere, or an alumina ceramics container.

The seal frame 23 is made of Fe-Ni-, for example.
The frame is made of a magnetic material such as Co alloy (Kovar) and is brazed to the ceramic container 22. The seal frame 23 is subjected to a treatment such as gold plating.

Like the seal frame 23, the cap 21 is made of a magnetic material such as Kovar. The cap 21 is slightly depressed downward so that the inside of the lower surface thereof engages with the inner peripheral edge of the seal frame 23 (FIG. 9).

A semiconductor chip 24 such as an IC is attached to the ceramic container 22 as shown in FIG. The leads 256 penetrate the seal frame 23 and are glass-sealed. The semiconductor chip 24 is the lead 2
5 is connected by internal wiring.

Next, a method of using this jig will be described. This jig is fixed to a work table (not shown) in a state where the ceramic package 22 before mounting the cap 21 is housed in the positioning hole 7 in advance. This work table can be positioned horizontally and rotationally.

A suction head (not shown) movable in the horizontal and vertical directions is arranged above the work table, and the caps 21 are sucked one by one by negative pressure to seal the respective positioning holes 7. Carry on frame 23. At this time, the relative position of the suction head and the work table is accurately aligned with each other. Then, when the suction head descends and the cap 21 is placed on the seal frame 23, and suction by negative pressure is released to raise the suction head, the cap 21 is released from the suction head and remains on the seal frame 23.

When the cap 21 is placed on the seal frame 23, as shown in FIG. 9, the cap 21 and the seal frame 23 become part of a magnetic path through which the magnetic field of the permanent magnet 3 passes. In FIG. 9, the broken line indicates the magnetic field passing through this magnetic path,
This magnetic field goes from the north pole to the south pole. Therefore, the cap 21
Is firmly attracted to the seal frame 23, and the cap 21
Are prevented from moving.

In this way, the cap 2 is attached to the seal frame 23 of the package 22 housed in all the positioning holes 7.
After placing 1 on the seal frame 23, the entire jig is fixed to the work table of the temporary fixing device, and the pair of temporary fixing electrodes are pressed against the opposite edges of the cap 21 to energize them so that the cap 21 is placed on the seal frame 23. It is temporarily stopped. After that, the entire jig is further fixed to a work table (not shown) of the micro parallel seam bonding apparatus. Then, a pair of tapered roller electrodes 26, 26 (FIG. 9) are energized while rolling contact with the opposing edges of the cap 21 from above, thereby performing seam joining.
While moving the work table and the roller electrode 26, the caps 21 of all the positioning holes 7 are seam-joined.

Next, another embodiment of the present invention will be described with reference to FIGS. 5 and 6 show a positioning plate in another embodiment, FIG. 5 is a plan view and FIG. 6 is FIG.
FIG. 9 is a cross-sectional view taken along the line CC in FIG. 7 and 8 show a suction plate in another embodiment, FIG. 7 is a plan view, and FIG.
FIG. 8 is a view on arrow D-D in FIG. 7. In each figure, the same reference numerals are given to the parts corresponding to those shown in FIGS. In this embodiment, the number of permanent magnets 3 used can be significantly reduced by separating the positioning plate 8 for positioning and mounting the package from the holding substrate 1 loaded with the permanent magnets 3.

As shown in FIGS. 5 and 6, this is a positioning plate 8 (hereinafter referred to as a carrier) made of a magnetic material in which a positioning recess 9 of the package 20 is formed, and this carrier 8.
And a suction plate 1 made of a non-magnetic material in which a permanent magnet 3 is filled in a recess 2 formed to face the positioning recess 9 of the carrier 8 and the suction plate 1 is installed on a work table. Then, the carrier 8 is conveyed above the attraction plate 1 to be attracted to the permanent magnet 3, and the cap 21 is fixed to the package 20.

With this arrangement, the number of permanent magnets 3 is the same as the number of magnets used in the attraction plate 1 fixed to the work table of the temporary attachment device. It can save a lot of cost.

Although these embodiments have been described by using a ceramic container as the container, the present invention can be applied to and includes a container using a metal package. In this case, the bottom of the metal package also becomes a part of the magnetic path, and the magnetic field passes through the two magnetic paths of the bottom and the cap. However, by increasing the magnetic force of the permanent magnet used, the fixing force of the cap is increased. Can be made large enough without any inconvenience.

In the above embodiments, the jig of the present invention is used for temporary attachment for seam welding the cap. However, it goes without saying that the present invention can also be used for temporary attachment in other welding methods such as resistance welding and laser welding.

[0034]

As described above, according to the first aspect of the present invention, the rectangular permanent magnet is mounted on the holding substrate below the positioning plate, and the cap and the package form a magnetic path through which the magnetic field of the magnet passes. Since the parts are formed, it is not necessary to incorporate a large number of disk-shaped permanent magnets into the holding substrate as in the conventional case, the processing and assembly of the magnet and the holding substrate are simplified, and the cap of an inexpensive semiconductor package is simplified. An effect that a temporary fixing jig can be provided is exerted.

Further, in the invention of claim 2, the positioning plate and the holding substrate in the invention of claim 1 are separated, and the suction plate corresponding to the holding substrate is fixed to the work table of the temporary attachment device. Since only the number of magnets used for the attraction plate fixed to the work table is required for the permanent magnets, the cost can be further reduced significantly.

[Brief description of drawings]

FIG. 1 is an enlarged sectional view in which an embodiment of the present invention is partially omitted.

FIG. 2 is a plan view of a positioning plate in FIG.

FIG. 3 is a plan view of a holding substrate in FIG.

FIG. 4 is a perspective view of a permanent magnet loaded on the holding substrate in FIG.

FIG. 5 is a plan view of a positioning plate according to another embodiment of the present invention.

6 is a sectional view of the positioning plate in FIG. 5, taken along the line C-C.

FIG. 7 is a plan view of a suction plate according to another embodiment of the present invention.

8 is a cross-sectional view of the suction plate in FIG. 7 taken along the line D-D.

FIG. 9 is an enlarged sectional view of a conventional jig for temporarily fixing a cap, partially omitted.

10 is a plan view of the positioning plate in FIG.

11 is a plan view of the holding substrate in FIG.

FIG. 12 is a plan view of a positioning plate of another conventional jig for temporarily fixing a cap.

13 is a sectional view of the positioning plate in FIG. 12 taken along the line AA.

FIG. 14 is a plan view of a suction plate of another conventional jig for temporarily fixing a cap.

15 is a cross-sectional view of the suction plate in FIG. 14 taken along the line BB.

[Explanation of symbols]

 1 Holding Substrate 2 Recess 3 Rectangular Magnet 5.8 Positioning Plate 6 Screw 7.9 Positioning Hole 20 Ceramic Package 21 Cap 22 Ceramic Container 23 Seal Frame 24 Semiconductor Chip 26 Roller Electrode

Claims (2)

[Claims] 1. A holding substrate made of a non-magnetic material, which is a jig for temporarily fixing a magnetic material cap to an opening end surface of a container having a magnetic material at least on the opening end surface, and which has a rectangular recess formed on the upper surface. And a permanent magnet magnetized in a rectangular recess of the holding substrate and magnetized into two poles symmetrical about the longitudinal axis of the recess, and fixed to the upper surface of the holding substrate to have an approximate center on the axis. A cap of a semiconductor package, comprising: a positioning plate made of a non-magnetic material in which a positioning hole of the facing container is formed, and the container and the cap form a magnetic path of a magnetic field by the permanent magnet. Jig for temporary fixing. 2. A jig for temporarily holding a magnetic material cap on an opening end surface of a container having a magnetic material at least on the opening end surface, the positioning member being made of a magnetic material and having a positioning recess for positioning the container on the upper surface. A plate, a holding substrate made of a non-magnetic material having a rectangular recess formed on the upper surface thereof, and a permanent magnet magnetized in a bilateral symmetry which is loaded in the rectangular recess of the holding substrate and symmetrical about the longitudinal axis of the recess. A magnet, and the positioning plate is placed above the holding substrate to be attracted to the permanent magnet so that the container and the cap form a magnetic path of a magnetic field by the permanent magnet. Jig for temporarily fixing cap of semiconductor package.