JP2808875B2 - Semiconductor device adsorption, separation and assembly equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention determines the electrode polarity of a semiconductor element such as a transistor or a diode, and assembles the element according to the polarity and the circuit configuration to be formed. The present invention relates to a semiconductor assembling apparatus for combining and inserting semiconductor elements into a jig.

[Conventional technology]

2. Description of the Related Art Conventionally, in a manufacturing process of mounting semiconductor elements such as transistors and diodes on a circuit board, semiconductor chips are arranged and inserted in an assembly jig in advance according to a circuit configuration to be formed, and the assembly jig and the circuit In the state where the semiconductor chip is combined with the board, the solder and the like are melted by overheating, and then cooled, and each semiconductor chip is placed on the circuit board.

The above process requires a step of determining the polarity of the electrode of the semiconductor element and a step of inserting the semiconductor element into the assembly jig in an arrangement and arrangement according to the polarity and the circuit configuration. At present, humans manually perform the insertion work into the assembly jig. In this operation, a vacuum suction device for holding a semiconductor device and a vibration type separation device for aligning and separating a large number of semiconductor elements one by one may be used separately. This vacuum suction device is provided with a suction nozzle at the tip of a suction tube or the like connected to the vacuum device. The suction nozzle is brought into contact with the semiconductor element, and the semiconductor element is suction-held by a pressure difference from the atmospheric pressure. Is what you do. In this case, when the suction between the suction nozzle and the semiconductor element is released, the pressure in the suction nozzle is returned to the atmospheric pressure, or conversely, the pressure in the suction nozzle is slightly increased. On the other hand, a vibration type separation device is, for example, a method in which a large number of semiconductor elements are placed in a container provided with a spirally rising groove, and the semiconductor element is placed in the spiral groove by applying vibration to the container. Are raised one by one in an aligned state.

[Problems to be solved by the invention]

However, in the above-described conventional vacuum suction device, even when the pressure inside the suction nozzle is returned to the atmospheric pressure, there is a problem that the semiconductor element and the suction nozzle are charged and the suction of the two is not released by the electrostatic force. Further, when the inside of the suction nozzle is slightly overpressurized to avoid this, there is a problem that the semiconductor element is blown off due to the pressure difference.

On the other hand, the vibration type separation device has a problem that the separation efficiency is inherently low, the semiconductor elements are entangled, and a long time is required to separate the semiconductor elements. When the amount of vibration is reduced to prevent the occurrence of these scratches and chips, the separation efficiency of the semiconductor element is further reduced.

Furthermore, although there are the above adsorption devices and separation devices,
Since the polarity determination of the semiconductor element and the work of inserting the semiconductor element into the assembly jig are manually performed by an operator, the work efficiency is poor, and the semiconductor element is damaged, and the semiconductor element is not properly combined. .

Therefore, the present invention is to solve the above problems,
The problem is to provide a suction device that can perform suction release reliably and quietly by providing mechanical suction release means,
The separation device utilizing intermittent rotation achieves high separation efficiency without damaging the semiconductor element. In addition, the combination of the adsorption device and the separation device enables the polarity determination of the semiconductor element and the jig for assembly. It is an object of the present invention to provide a semiconductor assembling apparatus for automatically inserting a semiconductor device.

[Means for solving the problem]

Means taken by the present invention to solve the above problems are:
It is as follows.

As the semiconductor element suction device, a suction hole is provided therein, a suction nozzle provided at a tip end of the suction hole, a movable shaft inserted into the suction hole, and the movable shaft is moved in the axial direction of the suction hole. And a movable shaft driving means to be moved, wherein the movable shaft has a spiral groove formed on a peripheral surface of the shaft. A rotary table having a plurality of element fixing recesses arranged in parallel along the outer periphery on the bottom surface, the rotary table having a side surface formed at the peripheral portion of the bottom surface, and being installed at a predetermined angle from a horizontal plane, A semiconductor element separation device including an intermittent rotation driving means for intermittently rotating at a predetermined rotation angle and a predetermined speed; and the semiconductor element suction device including the conductor-made suction nozzle, the semiconductor element suction device comprising: Two sets of equipment are installed in parallel The semiconductor device separating device is provided below the semiconductor device sucking device, and a voltage for determining the polarity of the semiconductor device is supplied to two sets of the suction nozzles of the semiconductor device sucking device to change the current characteristic of the semiconductor device. A polarity judging device having two terminals to be detected, a turning drive means for turning and a lifting drive means for moving up and down, and a horizontal direction for each of the two sets of the semiconductor element suction devices; According to such means, in the semiconductor device suction device, a movable shaft is provided in the suction hole, and the movable shaft is moved in the axial direction. Since the driving means is provided, when the suction is released, the pressure in the nozzle is returned to the atmospheric pressure, and then the movable shaft is protruded from the suction nozzle at the front end, so that the semiconductor element in contact with the suction nozzle is released. It can be separated gently press. As a result, it was impossible to release adsorption due to static electricity,
In addition, the semiconductor elements can be prevented from being separated by pressurization. Especially,
Since a spiral groove is formed on the peripheral surface of the movable shaft,
Since the spiral groove substantially increases the suction cross section, the suction force can be secured or increased, and the suction nozzle can be tapered. For this reason, it becomes possible to adsorb and push small semiconductor elements.

In the semiconductor device separating apparatus, instead of the conventional vibration, the semiconductor device is moved in the circumferential direction and the outer circumferential direction on the rotary table by the inertial force and the centrifugal force at the time of rotation start and rotation stop due to the intermittent motion of the rotary table. Can be moved. Since the rotary table is inclined at a predetermined angle from the horizontal plane, the semiconductor elements are integrated at the lowest position on the bottom surface of the rotary table, but by the movement based on the intermittent rotation,
The semiconductor elements are fitted one by one into recesses formed along the outer periphery of the bottom surface, and gradually rise to higher positions with intermittent rotation. In this case, the separation efficiency of the semiconductor element can be easily increased by adjusting the rotation speed and the intermittent angle of the intermittent rotation, but the centrifugal force due to the rotation naturally separates the semiconductor element along the radial direction of the rotary table. In other words, the inertial force due to the intermittent motion acts on the integrated semiconductor elements in the same direction, so that collisions between the semiconductor elements are smaller and weaker than the vibration type. In addition to the above-mentioned intermittent rotation conditions, the rotary table is added to the above-described intermittent rotation because, for example, there is no collision between the separated semiconductor elements, which is one of the causes of destruction of the semiconductor elements because the semiconductor elements are inserted one by one into the recesses and rotated. By appropriately adjusting the inclination angle of the semiconductor device, it is possible to reduce scratches, chipping, and the like of the semiconductor element without lowering the separation efficiency.

In the semiconductor assembling apparatus using the above-described semiconductor device suction device and the semiconductor device separation device, of the two sets of semiconductor device suction devices installed in parallel, the separation nozzle is separated from the rotary table of the separation device by the suction nozzle of one of the suction devices. By holding the semiconductor element thus sucked and rotating the tip ends of the two sets of suction nozzles to opposing positions by the turning drive means, the semiconductor element can be brought into a state of being sandwiched by the two sets of suction nozzles. . Here, these suction nozzles are made of a conductor and are connected to the two terminals of the polarity determination device, respectively, so that the polarity of the semiconductor device can be determined in the above state. This polarity determination is performed by applying a positive or negative voltage between the two suction nozzles and measuring and detecting the rectification characteristics and the like of the semiconductor element.
Based on the result of this polarity determination and the direction in which the semiconductor element is inserted into the jig for assembly, it is determined which of the two suction nozzles is to be gripped. After switching from the suction nozzle to the other suction nozzle, the two suction nozzles are separated again by the turning drive means, and thereafter, the suction nozzle holding the semiconductor element is moved by the lifting drive means or the translation drive means. The semiconductor element can be carried to a predetermined insertion portion of the assembly jig, and finally, the suction can be released by operating the movable shaft, and the semiconductor element can be inserted into the assembly jig.

According to this assembling apparatus, from the polarity determination of the semiconductor element to the insertion into the assembly jig can be performed in a series of operations, and according to the result of the polarity determination and the direction of insertion into the assembly jig, In some cases, it is necessary to change the holding surface of the semiconductor element, but as described above, the operation can be dealt with by exactly the same operation irrespective of the necessity of the change, so that the working efficiency can be significantly improved.

〔Example〕

Next, embodiments of the present invention will be described with reference to the accompanying drawings.

1 (a) and 1 (b) show the structure of an embodiment of a semiconductor device suction apparatus according to the present invention. Here, in the suction device A shown in FIG. 1 (a), the tip of a cylindrical member 2 made of a conductor, which is inserted and fixed to the block 1 or is slidably mounted vertically with a predetermined stroke, Also, a suction nozzle 3 made of a conductor is fitted therein, and a movable shaft 4 having a spiral groove 4a on its outer peripheral surface is inserted into the suction hole 2a and the suction nozzle 3 of the cylindrical member 2. The movable shaft 4 is integrated with a support member 6, and a spring 5 for supporting the movable shaft 4 is disposed between the cylindrical member 2 and the support member 6, and the support member 6 is provided with air above it. The cylinder 7 can be moved up and down. A tube 8 extending from the vacuum device is connected to the cylindrical member 2 via the block 1 to the suction hole 2a.

Further, as in a suction device A 'shown in FIG. 1 (b), the suction nozzle 3' may be attached by a spring 5 'so as to be elastically slidable up and down.

According to the suction device A or A ', when the electrode surface of the semiconductor element is brought into contact with the tip of the suction nozzle 3 or 3', the present conductor element can be sucked and held by the negative pressure in the suction hole 2a. it can. Here, the semiconductor device can be softly sucked by the sliding of the cylindrical member 2 in the suction device A and by the sliding of the suction nozzle 3 'in the suction device A', and have different thicknesses. It is possible to correspond to a semiconductor element.

On the other hand, the diameter of the suction nozzle 3 or 3 'is usually sufficiently small to fit a semiconductor element having a diameter of about 1.5 mm, and since the movable shaft 4 is inserted, the suction cross-sectional area is reduced and the suction power may be weakened. There is. However, the movable shaft 4
Since the spiral groove 4a is cut in a portion inserted into the suction hole 2a, a substantial suction cross-sectional area increases, and a sufficient suction force can be secured.

When the suction of the semiconductor element is released, the movable shaft 4 is lowered by the air cylinder 7 and the suction surface of the semiconductor element is pushed away, whereby the semiconductor element can be gently released.

Next, the structure of the semiconductor element isolation device B will be described with reference to FIGS. A rotating part 11 having a hollow hole 11a of an intermittent drive type motor is provided on a pedestal 10, and a table flange 12 is fixed to the rotating part 11 by bolts 13. A bearing member 14 is fixed inside the table flange 12, and a bearing shaft 15 having an engaging portion 15a at an upper end is inserted into the bearing member 14. A rotary table 18 is mounted on the table flange 12. The bolt 19 press-fitted on the back surface of the rotary table 18 is inserted into the engagement portion 15a of the support shaft 15, and the table flange 12
The rotary table 18 is fixed so as to rotate integrally with the table flange 12 by contacting the bolt 20 supported by the rotary table 18 with the side wall of the rotary table 18. A positioning pin 18a is provided on the lower surface side of the outer peripheral portion of the rotary table 18, and the positioning pin 18a is provided by a position detection sensor 22 supported by a support member 21 fixed on the pedestal 10.
The existence of a can be detected.

As shown in FIG. 2 (b), the upper portion of the turntable 18 has an element receiving portion formed by a bottom surface 18b and side surfaces 18c. 16 or 32 concave portions 24 are arranged symmetrically with respect to the center of rotation. This recess 24
Is formed at a position 1 mm away from the side surface 18c so that the depth is half the thickness of the semiconductor element.

The turntable 18 has a bottom surface 18b that is 25 degrees above a horizontal plane.
It is desirable to rotate at an angle in the range of ~ 35 degrees. If the angle is too large, the semiconductor element 23 may jump out of the turntable 18. Conversely, if the angle is small, the semiconductor element 23 cannot be separated. For this purpose, the pedestal 10 can adjust the inclination angle with respect to the apparatus main body. Since the bottom surface 18b is inclined as described above, the semiconductor element 23 placed on the turntable 18 is
Are integrated at the lowest position on the bottom surface 18b, but in this state, the motor is intermittently driven in one cycle of 0.2 to 0.5 seconds. The rotation angle of one cycle is 22.5 degrees when 16 recesses 24 formed on the bottom surface 18b are formed, and 10 degrees when 36 recesses 24 are formed. It is designed to rotate in response to. Due to the inertial force at the time of starting and stopping the intermittent rotation, the semiconductor elements 23 integrated at the lower portion of the bottom surface 18b move little by little on the bottom surface 18b and are fitted one by one into the concave portions 24 while being dispersed, The fitted semiconductor element 23 moves to the upper side due to the inclination of the turntable with the intermittent rotation. The semiconductor element 23 separated for each recess 24 in this way is different from the conventional vibration type separation device,
The impact given to the semiconductor element 23 is weak, and it is possible to prevent the semiconductor element 23 from being damaged or chipped. However, due to the centrifugal force generated due to the rotation, the semiconductor element 23 integrated at the bottom on the bottom surface 18b expands along the outer periphery of the bottom surface 18b, and the semiconductor element 23 fitted and separated into the concave portion 24 is intermittent. The separation efficiency (for example, the number of semiconductor elements 23 that can be separated per unit time) can be kept higher than that of the conventional device by moving to the upper side very quickly by rotation. In addition, by adjusting the angle of the intermittent rotation, the rotation speed, and the inclination angle of the rotary table, the separation efficiency and the semiconductor element can be improved.
Both low damage to 23 can be balanced at a high level.

Next, an embodiment of a semiconductor assembling apparatus according to the present invention will be described with reference to FIGS.

FIG. 3 shows a connection portion of the suction device A shown in FIG. 1 to a semiconductor assembly device. As shown in FIG. 3A, the block 1 of the suction device A includes a slide bearing 30.
This support block is connected to the support block 31 via
31 is fixed to a turning shaft 33 by bolts 32. Also,
In order to move the suction device A up and down by the slide bearing 30, as shown in FIG.
An elevating air cylinder 36 is attached to the support block 31 via an adjustment block 35 whose position can be changed by, and the block 1 to which the fixing member 38 is fixed moves as the elevating shaft 37 moves.

On the other hand, the turning shaft 33 shown in FIG. 3A is connected to the turning unit C shown in FIG. 4, so that the suction device A can rotate around the turning shaft 33 within a range of 90 degrees. It has become. The swivel unit C includes a swivel shaft 33 and a swivel block 41 and a swivel nut 43 via a swivel bearing 42.
And a rotary cylinder 45 with a coupling 44.
It is connected to and rotated. A stopper plate 46 and a stopper 47 are provided on the rear surface to limit the rotation range. Further, the revolving unit C is fixed to the upper and lower shafts 51 of the upper and lower air cylinders 50 and a mounting block 49, and the mounting block 49 is provided with a slide bearing 53 with respect to the upper and lower blocks 52 fixed to the main body of the upper and lower air cylinders 50. It is slidably installed through the. The upper and lower air cylinders 50, the upper and lower shafts 51, the upper and lower blocks 52 and the slide bearings 53 constitute an upper and lower unit D for moving the suction device A and the turning unit C up and down.

Next, the upper and lower blocks 52 of the upper and lower unit D
The slide base 64 of the slide unit E shown in FIG.
It is connected to the. The slide unit E is for moving the suction device A, the turning unit C and the vertical unit D as a whole in the horizontal direction. FIG. 5 (a) is a side view thereof, and FIG. 5 (b) is a view as seen from an AA 'plane of FIG. 5 (a). Top base 60, side base 6
A slide block 63 fixed to a slide base 64 is slidably mounted on a slide shaft 65 in the interior surrounded by 1 and 62. The slide base 64 is mounted on a top surface via a cylinder mounting member 66. The drive shaft 68 of the slide air cylinder 67 fixed to the base moves left and right. This movement amount is limited by a dropper 69 fixed to the slide block 63 and a stopper plate 70 whose position can be adjusted by a micrometer 71 and a fixing screw 72.

This slide unit E has, as shown in FIG.
Two sets of components including the same suction device A, turning unit C, and upper and lower unit D are connected, and one of the components is connected to the semiconductor device 23 from the rotary table 18 of the separation device B installed below these components. To take up the axis of rotation 75
Is provided, and a drive shaft 78 of an air cylinder 77 connected through a hook 76 allows a rotation about a rotation shaft 75 as a center.
The entire component can be moved about a degree.
Here, the air cylinder 77 is fixed to a connection portion with the slide unit E via an L fitting 79.

 The operation of this component will be described below.

After operating the air cylinder 77 and picking up the semiconductor element 23 from the concave portion 24 of the turntable 18 with the suction nozzle 3 on the left side at the position a in FIG. 6, the suction nozzle 3 is returned to the position b in FIG. From here, the swing unit C is operated, and b
The suction nozzle 3 is moved from the position to the position c. In this state, the suction nozzle 3 on the right side is also swirled in the same manner so that the semiconductor element 23
Is sandwiched between the left and right suction nozzles 3. here,
The left and right suction nozzles 3 are connected to two determination terminals of a polarity determination device, and the suction nozzle 3 is used as an electrode to form a semiconductor element.
23 polarity determinations can be made. This polarity judgment is
This is performed by applying a predetermined voltage between the two determination terminals and measuring the impedance value and the like of the semiconductor element 23 when the voltage polarity is inverted. After the polarity determination is completed, one of the left and right suction nozzles 3 is selected and sucked in accordance with the result of the determination and the direction of insertion into the assembly jig. The suction nozzle 3 is moved away. Thereafter, the semiconductor element 23 held by one of the suction nozzles 3 on the left and right sides is transported onto an assembling jig, and the movable shaft 4 of the suction device A is moved to move the semiconductor element 23 into the assembling jig. Insert

Finally, FIG. 7 shows an entire semiconductor assembly apparatus using the above-mentioned suction device A, separation device B, turning unit C, vertical unit D, and slide unit E. In the apparatus shown in this figure, the component X, in which two sets of the suction device A, the turning unit C and the vertical unit D are connected to one slide unit E, is moved in the direction perpendicular to the plane of the drawing. In addition, it is fixed to the moving unit F installed on the support column 81. The moving unit F is for transporting the semiconductor element 23 whose polarity has been determined to an assembly jig (not shown) set on a base 80 of the apparatus. In addition,
A vacuum generator 82 for the suction device A is installed on the side surface of the moving unit F, and a polarity determination device G is arranged below the base 8.

In this embodiment, two sets of the above-mentioned components X are installed so as to be opposed to each other above the separation device B installed on the base 80, and they are operated alternately to increase the work efficiency. Although it is designed as described above, it goes without saying that a case where only one set of the component X is installed is included in the scope of the present invention. Further, as shown in the whole of FIG. 6, two sets of suction devices A provided in the component X are provided.
Are fixed at predetermined intervals so that the semiconductor element 23 can be held at a position where the suction nozzles 3 on the left and right sides face each other.
The two suction devices A may be supported by separate slide units so that the distance between the two suction devices A can be changed.

〔The invention's effect〕

 As described above, the present invention has the following effects.

In the semiconductor device suction device of the present invention, since the spiral groove is formed on the peripheral surface of the movable shaft, the spiral groove substantially increases the suction cross section. This can be secured or increased, and the suction nozzle can be tapered. For this reason, it becomes possible to adsorb and push small semiconductor elements.

In the semiconductor assembling apparatus of the present invention, the semiconductor element is sandwiched between the two opposing suction nozzles, and the polarity is determined using the suction nozzle as an electrode. Therefore, the semiconductor element is transported, the polarity is determined, and the semiconductor element is inserted into the assembly jig. Since the setting of the direction and the insertion into the assembling jig can be performed by a series of the same operation, the working efficiency is remarkably improved as compared with the related art.

[Brief description of the drawings]

1 (a) and 1 (b) are partially cut front views showing the structure of an embodiment of a semiconductor device suction apparatus according to the present invention. FIG. 2A is a cross-sectional view showing the structure of a semiconductor element separating apparatus used in the semiconductor assembling apparatus of the present invention, and FIG. 2B is an enlarged cross-sectional view showing the structure of the outer periphery of a rotary table of the semiconductor element separating apparatus. FIG. 2 (c) is a plan view and a side view showing a schematic structure of the semiconductor element. FIG. 3 (a) is a front view showing a structure of a portion where a semiconductor element suction device is connected to the embodiment of the semiconductor assembling apparatus of the present invention, and FIG. 3 (b) is a side view of the same portion. FIG. 4 is a partially cutaway front view showing the structure of a turning unit and an upper and lower unit for driving the semiconductor element suction device. FIG. 5 (a) is a front view showing the structure of the slide unit in the embodiment, and FIG. 5 (b) is a view taken on line A- of FIG. 5 (a).
FIG. 3 is a cross-sectional arrow view cut along the A ′ plane. FIG. 6 is a side view showing the structure of a parallel connection portion of two semiconductor device suction devices. FIG. 7 is a front view showing the entire configuration of the embodiment. [Explanation of Main Symbols] A, A ': Adsorbing device B: Separating device C: Revolving unit D: Vertical unit E: Slide unit F: Moving unit G: Polarity determining device 2: Cylindrical member 2a ... Suction hole 3,3 '... Suction nozzle 4 ... Movable shaft 4a ... Spiral shaft 5,5' ... Spring 6 ... Support member 7 ... Air cylinder 10 ... Pedestal 11 ... Rotating part 12 … Table flange 18… Rotating table 18b… Bottom surface 23… Semiconductor element 24… Recess 33… Rotating shaft 36… Elevating air cylinder 45… Rotary cylinder 50… Vertical air cylinder 67… Slide air cylinder 75 ... Rotary axis.

Claims (2)

(57) [Claims] 1. A suction hole inside, a suction nozzle provided at a tip end of the suction hole, a movable shaft inserted into the suction hole, and moving the movable shaft in an axial direction of the suction hole. And a movable shaft driving means, wherein the movable shaft has a helical groove formed on a peripheral surface of the shaft. 2. A rotary table having a bottom surface and side surfaces formed on a peripheral portion of the bottom surface, and having a plurality of element fixing recesses arranged in parallel along the outer periphery on the bottom surface and inclined at a predetermined angle from a horizontal plane. A semiconductor device separating device provided with intermittent rotation driving means for installing and rotating the rotary table intermittently at a predetermined rotation angle and a predetermined speed, and the suction nozzle made of a conductor are provided in claim 1. A semiconductor device suction device, two sets of the semiconductor device suction devices are installed in parallel, the semiconductor device separation device is provided below the semiconductor device suction device, and two sets of the semiconductor device suction devices are provided. A polarity determining device having two terminals for supplying a polarity determining voltage of the semiconductor element to the suction nozzle and detecting a current characteristic of the semiconductor element is provided. hand A rotation driving means to be pivotal movement, a lifting drive means to be moved vertically, semiconductor fabrication apparatus characterized by having a translation drive means to be moved in the horizontal direction.