JP2002134887A - Array apparatus and mounting device of conductive balls - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an array apparatus and mounting device of conductive balls which can prevent imperfect alignment of conductive balls in a ball supplying part. SOLUTION: In this array apparatus which supplies conductive balls 14 in a state of alignment, a tapered part 15e having a slant surface 15d inclined conically toward a central part is formed on a bottom surface of a recessed part 15a. A plurality of the recesses are formed in a lattice type in an array part 15 and each of the recess accommodates one conductive ball 14. In the central part of the bottom surface, a penetrating hole 15b for vacuum chuck is formed. As a result, the conductive ball 14 accommodated in the recess 15a can be stabilized at a center position, and it can be prevented that the other conductive ball 14 is left on the recess 15a and imperfect alignment is caused.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive ball aligning apparatus for supplying conductive balls in an aligned state, and a conductive ball mounting apparatus for mounting the arranged conductive balls on a work.

[0002]

2. Description of the Related Art As a method of forming a metal bump on an electrode of a substrate or an electronic component, there is known a method of mounting a conductive ball such as a solder ball (hereinafter simply abbreviated as "ball") on an electrode and performing solder bonding. Have been. For mounting a ball, a method of vacuum-sucking the ball with a mounting head is widely used. In this method, balls are sucked into a large number of suction holes provided on the lower surface of the suction tool of the mounting head, the suction tool is moved onto the work, and the ball is mounted on the work by releasing the vacuum suction. is there.

As a method of adsorbing a ball on the lower surface of a suction tool, an alignment jig is used instead of a method of directly lowering a mounting head directly to a ball tank and adsorbing the ball on a lower surface of the suction tool. Has been adopted. According to this method, the balls are aligned in advance in an alignment section having a concave portion for accommodating the balls in accordance with the arrangement of the suction holes of the suction tool, and the balls in the aligned state are suctioned. According to this method, there is an advantage that the ball suction operation by the suction tool can be performed quickly.

[0004]

However, the conventional apparatus for aligning conductive balls has the following problems due to the shape of the recess for accommodating and aligning the balls. FIG. 8 is a partial cross-sectional view of an alignment unit of a conventional conductive ball alignment apparatus. In FIG. 8A, a conductive ball B is accommodated in a concave portion A provided in the alignment portion and supplied to a mounting head. In supplying the conductive balls B, the diameter of the recesses A is set to be larger than the diameter of the conductive balls B so that the conductive balls B can be quickly accommodated in the recesses A.

For this reason, in the ball aligning operation of moving the conductive ball B on the upper surface of the aligning portion, if the position of the conductive ball B ′ already housed in the recess A is deviated in the recess A, FIG. As shown in b), a phenomenon occurs in which the lower portion of another conductive ball B fits into the recess between the edge of the recess A and the conductive ball B ′. If the conductive balls B remain as they are, there is a misalignment in which the conductive balls remain on the upper surface of the alignment portion other than at a predetermined arrangement position. As described above, the conventional conductive ball aligning device using the aligning portion provided with the concave portion for accommodating the ball has a problem that an extra ball remains on the aligning member, resulting in poor alignment.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a conductive ball aligning device and a mounting device capable of preventing a conductive ball from being misaligned in a ball supply section.

[0007]

According to a first aspect of the present invention, there is provided an apparatus for arranging a conductive ball, wherein the conductive ball is arranged in an aligned state. An alignment section having a plurality of recesses that can be accommodated in a predetermined arrangement, an inclination mechanism for inclining the alignment section at a predetermined inclination angle with respect to a horizontal plane, and an alignment section in an inclined state by moving a conductive ball. A ball supply means for supplying conductive balls; and a tapered portion having an inclined surface conically inclined toward the center at the bottom surface of the concave portion.

According to a second aspect of the present invention, there is provided an apparatus for aligning a conductive ball, comprising the steps of:
The taper angle between the inclined surface of the tapered portion and the upper surface of the alignment portion is set to be larger than the inclined angle.

According to a third aspect of the present invention, there is provided an apparatus for aligning a conductive ball, comprising:
A through hole having a hole diameter smaller than a diameter of a contact circle where the conductive ball accommodated in the tapered portion contacts the inclined surface is formed at a center position of the tapered portion.

According to a fourth aspect of the present invention, in the conductive ball mounting apparatus, the conductive ball of the ball supply unit is vacuum-adsorbed and held by a suction head having a plurality of suction holes formed on a lower surface and mounted on a work. A ball supply unit, the ball supply unit includes an alignment unit having a plurality of concave portions capable of accommodating one conductive ball on an upper surface in a predetermined arrangement, and the alignment unit has a predetermined inclination angle with respect to a horizontal plane. And a ball supply means for supplying a conductive ball to the aligned portion in the inclined state by moving the conductive ball, and a conical slope toward the center of the bottom surface of the concave portion. A tapered portion having an inclined surface is formed.

A conductive ball mounting apparatus according to a fifth aspect is the conductive ball mounting apparatus according to the fourth aspect,
The angle formed by the inclined surface of the tapered portion and the upper surface of the alignment portion is set to be larger than the inclined angle.

A conductive ball mounting apparatus according to claim 6 is the conductive ball mounting apparatus according to claim 4,
A through hole having a diameter smaller than a diameter of a contact circle where the conductive ball accommodated in the tapered portion contacts the inclined surface is formed at a center position of the tapered portion.

According to the present invention having the above structure, the tapered portion having the inclined surface conically inclined toward the center is formed on the bottom surface of the concave portion provided in the alignment portion for arranging the conductive balls. The conductive ball accommodated in the concave portion can be stabilized at the center position, and misalignment due to the remaining conductive ball remaining on the concave portion can be prevented.

[0014]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of a conductive ball mounting apparatus according to one embodiment of the present invention, FIG. 2 is a perspective view of a ball alignment apparatus of the conductive ball mounting apparatus according to one embodiment of the present invention, and FIG. FIG. 4 is a structural view of an alignment jig of a conductive ball mounting apparatus according to an embodiment of the present invention, FIG. 4 is a partial cross-sectional view of an alignment jig of the conductive ball mounting apparatus of one embodiment of the present invention, and FIG. FIG. 6 is a block diagram showing a configuration of a control system of a conductive ball mounting apparatus according to an embodiment of the present invention; FIG. 6 is a process explanatory view of a ball alignment operation of the conductive ball mounting apparatus according to an embodiment of the present invention; FIG. 7 is an explanatory view of an extra ball inspection of the conductive ball mounting apparatus according to one embodiment of the present invention.

First, the structure of the conductive ball mounting device will be described with reference to FIG. In FIG. 1, a positioning unit 2 is provided on a base 1, and a substrate 3 as a work is mounted on the positioning unit 2. A ball aligning device 4 that supplies conductive balls (hereinafter, abbreviated as “balls”) in an aligned state is provided beside the positioning section 2. The ball alignment device 4 is configured by arranging an alignment jig 5 via a support table 7 on a base portion 6 supported by a tilt mechanism 9 so as to be tiltable with respect to a horizontal plane. A moving mechanism 8 for a ball movement restricting member, which will be described later, is provided on the base 6.

A ball mounting section 10 is disposed above the positioning section 2 and the ball aligning device 4. The ball mounting unit 10 is configured by combining a moving table 11 and a moving mechanism 12 and mounting a mounting head 13 on the moving mechanism 12. The moving table 11 moves the moving mechanism 12 in the X direction, and the moving mechanism 12 moves the mounting head 13 in three directions of YZθ. As a result, the mounting head 13 becomes XYZθ
In four directions. Mounting head 13
A suction tool is mounted on the lower surface. The suction tool (not shown) provided on the suction tool suctions and holds the balls aligned on the alignment jig 5 of the ball alignment device 4. It is mounted on the substrate 3.

Next, the ball aligning device 4 will be described with reference to FIG. 2, FIG. 3, and FIG. In FIG. 2, the base 6
Is rotated by a predetermined angle around the rotation axis 9a by the tilting mechanism 9, whereby the base 6 is tilted in both directions with respect to the horizontal plane. A support table 7 is fixedly provided on the upper surface of the base 6, and an alignment jig 5 is mounted on the support table 7. A vibrator (not shown) is provided inside the support table 7, and the vibration is applied to the alignment jig 5 by driving the vibrator.

At both ends of the upper surface of the base portion 6, guide rails 16 are arranged in parallel in the X direction, and two posts 17 are erected on the guide rail 16 by a slider (not shown) so as to be slidable. Have been. The upper part of the post 17 is connected by a connecting member 18, and the connecting member 1
8 is provided with a ball movement restricting member 19. The ball movement restricting member 19 reciprocates in the X direction integrally with the connecting member 18 along the upper surface of the alignment jig 5 by driving the moving mechanism 8. The moving mechanism 8 includes the one post 1
7, a feed screw 20 screwed to the nut 20a, and a motor 2 for driving the feed screw 20 to rotate.
1

A light projecting portion 22a and a light receiving portion 22b constituting the ball detection sensor 22 are attached to the left and right posts 17, respectively. The light emitted from the light projecting portion 22a is received by the light receiving portion 22b. The presence or absence of a ball on the optical axis of irradiation light can be detected. Floodlight unit 2
2a, the height of the light receiving portion 22b attached to the post 17 can be finely adjusted, and an appropriate height is set according to the detection target.

Next, the structure of the alignment jig 5 will be described with reference to FIG. FIG. 3A shows a plane of the alignment jig 5, and FIGS. 3B and 3C show cross sections BB and C, respectively.
C is shown. As shown in FIGS. 3A and 3B, the alignment jig 5 is a substantially plate-shaped member provided with a combing portion 5a on four circumferences, and a concave portion 15a capable of accommodating only one ball 14 is provided at the center in the center. A large number of alignment portions 15 are formed in a predetermined lattice-like arrangement. The arrangement of these recesses 15a matches the arrangement of the suction holes formed on the lower surface of the mounting head 13.

As shown in FIG. 4A, a tapered portion 15e having an inclined surface 15d conically inclined at a taper angle θ1 toward the center is formed on the bottom surface of the concave portion 15a. A through hole 15b is provided at the center position of the tapered portion 15e, and as shown in FIG. 3 (b), the suction space 5f provided on the lower surface of the alignment jig 5 is vacuum-vacuated to thereby form the suction space 5f. Is suctioned from the through-hole 15b communicating with the nozzle. Thereby, the ball 14 in the concave portion 15a is held by the vacuum suction force. The suction space 5f is connected to a suction source 24 via a valve 23, and by operating the valve 23, control of suction and release of suction can be performed.

Here, as shown in FIG. 4C, the hole diameter d of the through hole 15b is determined by the size of the ball 14 housed in the recess 15a.
Is smaller than the diameter D of the contact circle that makes contact with the inclined surface 15d of the tapered portion 15e.
The shape and dimensions of 5b are set. Thus, in a state where the ball 14 is vacuum-sucked by the through-hole 15b, the ball 14 always has the inclined surface 15d of the tapered portion 15e.
And the edge of the through-hole 15 b opened in the tapered portion 15 e does not contact the surface of the ball 14. Therefore, no contact flaw is generated on the surface of the ball 14 due to being pressed against the edge when the ball 14 is vacuum-sucked.

Further, as shown in FIG.
The taper angle θ1 formed by the inclined surface 15d of 5e with the upper surface of the alignment portion 15 is set to be larger than the inclined angle θ2 at which the base portion 6 is inclined with respect to the horizontal plane by the inclination mechanism 9. As a result, even when the alignment portion 15 is inclined at the inclination angle θ2, the inclined surface 15 of the tapered portion 15e
As for d, the center side is lower than the surroundings with respect to the horizontal plane, so that the ball 14 in the concave portion 15a is always held at the center position.

As shown in FIGS. 3B and 3C, the shape of the alignment portion 15 is set so that the upper surface is higher than the surroundings by a height h, and the X direction (the inclination direction of the alignment jig 5). The alignment jig is formed by a slope portion 5c connecting the bottom surface and the upper surface of the alignment portion 15 with an inclined surface, and a step portion 15c provided at a right angle downward from the upper surface of the alignment portion 15 in the Y direction orthogonal to the X direction. 5 is separated from the bottom surface. The ball 1 is located between the slope 5c and the combing portion 5a.
4 is a storage portion 5b for storing the
A groove 5d that allows the ball 14 to move in the X direction is provided between c and the combing portion 5a. Guide members 5e are provided at the four inner corners of the alignment jig 5, so that the balls 14 can be circulated in the alignment jig 5 better.

Next, the configuration of the control system will be described with reference to FIG. In FIG. 5, the ball detection sensor 22 is connected to the determination unit 25, and the determination unit 25 determines the alignment unit 1 based on a detection signal from the ball detection sensor 22 as described later.
It is determined whether there is an extra ball 14 on the ball 5. The determination result is sent to the control unit 27.

The control unit 27 includes the ball movement restricting member 1.
9, a tilting mechanism 9 for tilting the alignment jig 5, a vibrator 26 for applying vibration to the alignment jig 5,
The driving of the mounting head moving mechanism 29 for moving the mounting head 13 is controlled. Further, the control unit 27 controls the operation of the ball alignment jig suction valve 23 and the mounting head suction valve 28 for performing suction by the mounting head 13.

Next, a ball alignment operation by the ball alignment device 4 will be described with reference to FIG. First, FIG.
Is a state before the start of ball alignment, and a predetermined amount of the ball 14 is supplied to the storage part 5b on one side of the alignment jig 5. In this state, the ball movement restricting member 19 is
5 at a predetermined standby position. The ball alignment operation is started from this state, and the alignment jig 5 is tilted in the ball moving direction, that is, in the direction opposite to the storage portion 5b in which the balls 14 are stored, as shown in FIG. At the same time, the vacuum suction in the suction space 5f is started. As a result, the vacuum suction from the recess 15a through the through hole 15b and the movement of the ball 14 into the recess 15a can be performed by suction.

Next, the motor 21 is driven to move the ball movement restricting member 19 at a predetermined speed along the inclined upper surface of the alignment portion 15 to supply the ball 14 to the alignment portion 15. As a result, the ball 14 in the storage portion 5b is
As shown in (c), the ball is gradually moved in the inclined direction on the alignment portion 15 while being dammed by the ball movement restricting member 19 (ball moving step). Therefore, ball movement restricting member 1
Reference numeral 9 denotes a ball supply unit that moves the ball 14 on the inclined alignment unit 15 and supplies the ball 14 to the alignment unit 15.
As the ball supply means, a configuration other than the above, for example, a configuration in which a ball storage container having an opening on the lower surface is moved along the upper surface of the alignment unit 5 may be used.

In the course of this movement, the balls 14 are held one by one in the recesses 15a (ball alignment step). At this time, the vibrator 26 is driven and the alignment jig 5
Is given vibration. Thereby, the movement of the ball 14 into the concave portion 15a is promoted. Also, the ball movement restricting member 19 blocks the ball 14 flowing along the inclined alignment portion 15 so that the ball 14
The ball 14 is held in all the recesses 15a only by inclining the alignment jig 5 once because the probability of holding the ball 14 is increased. In this ball moving step, the balls 14 overflowing from the alignment section 15 drop from the step sections 15c provided at both ends parallel to the inclination direction of the alignment section 15 into the groove section 5d, and move to the storage section 5b on the opposite side. Moving.

Thereafter, the ball movement restricting member 19 is
The ball 14 that has been moved to the other end of the block 5 and reaches the slope 5c flows downward along the slope 5c as shown in FIG. It is accommodated in the part 5b. As a result, one stroke of the ball movement restricting member 19 is completed, and the balls 14 are accommodated in the concave portions 15a of the aligning portion 15 in an aligned state. In this ball alignment step, the ball 14 is always located at the center of the concave portion 15a following the inclined surface 15d of the tapered portion 15e in the concave portion 15a, and the other balls 14 are housed in the peripheral portion of the concave portion 15a already in the concave portion 15a. The ball 14 can be prevented from remaining in the form of being stuck in the recess between the ball 14 and the top.

Thereafter, as shown in FIG. 6 (e), the alignment jig 5 is returned to the horizontal position, and the ball movement restricting member 19 is moved in the direction of the arrow a on the alignment portion 15, whereby the alignment portion 15 is moved. An extra ball 14 existing on the upper portion is removed (a ball removing step). The lower end of the ball movement restricting member 19 does not contact the ball 14 held in the concave portion 15a, but moves on the alignment portion 15 at a height at which it contacts the ball 14 existing on the alignment portion 15. Therefore, the balls 14 remaining on the alignment portion 15 without being accommodated in the concave portion 15 a are removed from the alignment portion 15 by the ball movement restricting member 19.

In this embodiment, the extra balls on the alignment section 15 are removed by using the ball movement restricting member 19, but the extra balls are stored in the storage section 5b by utilizing the inclination of the alignment jig 5. It may be a method of dropping to In this case, the ball alignment step and the ball removal step are performed simultaneously.

As a result, the balls 14 housed in the aligned state in the aligning portion 15 can be sucked by the mounting head 13, but before the ball sucking operation by the mounting head 13, extra balls are placed on the aligning portion 15. Is checked for the presence of Hereinafter, the extra ball inspection will be described with reference to FIG. As shown in FIG.
7a is received by the light receiving portion 22b. At this time, as shown in FIG. 7B, when the ball 14a exists on the alignment portion 15 except for the concave portion 15a. The amount of light received by the light receiving portion 22b is determined by the irradiation light of the ball 1
The amount of light is reduced by the amount shielded by 4a. Therefore, by detecting the amount of light received by the light receiving section 22b, the alignment section 1
5 can be inspected for the presence of extra balls. Then, the post 17 is moved by the moving mechanism 8 to scan the optical axes of the light projecting unit 22a and the light receiving unit 22b, so that the extra ball inspection of the entire range on the alignment unit 15 is performed.

Such an extra ball is placed in the recess 15a by one.
When one ball 14 is already housed and another ball 14 is captured by vacuum suction, or when the ball 14 adheres due to the adhesive force of an adhesive such as a flux adhered to the upper surface of the alignment section 15. , Caused by various factors. This extra ball inspection is performed when the ball movement restricting member 19 shown in FIG. After confirming that there is no extra ball, the mounting head 13 performs a ball suction operation. If the presence of an extra ball is detected, the ball movement restricting member 19 is moved to remove the ball again.

Thereafter, the mounting head 13 holding the ball 14 by suction is moved onto the positioning section 2 and the held ball 14
Is mounted on the substrate 3. At this time, since the concave portion 15a has the shape provided with the tapered portion 15e as described above, the extra ball on the alignment portion 15 is reliably removed by the extra ball inspection described above. Therefore, the ball 14 is always held in a normal state on the mounting head 13, and the ball can be mounted without causing any trouble.

[0036]

According to the present invention, the tapered portion having the inclined surface conically inclined toward the center is formed on the bottom surface of the concave portion provided in the alignment portion for arranging the conductive balls. The accommodated conductive balls can be stabilized at the center position, and misalignment due to the remaining conductive balls remaining on the recesses can be prevented.

[Brief description of the drawings]

FIG. 1 is a perspective view of a conductive ball mounting device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a ball alignment device of the conductive ball mounting device according to one embodiment of the present invention.

FIG. 3 is a structural view of an alignment jig of the conductive ball mounting apparatus according to one embodiment of the present invention;

FIG. 4 is a partial sectional view of an alignment jig of the conductive ball mounting apparatus according to one embodiment of the present invention;

FIG. 5 is a block diagram showing a configuration of a control system of the conductive ball mounting apparatus according to one embodiment of the present invention;

FIG. 6 is a process explanatory view of a ball alignment operation of the conductive ball mounting apparatus according to one embodiment of the present invention;

FIG. 7 is an explanatory view of an extra ball inspection of the conductive ball mounting apparatus according to one embodiment of the present invention.

FIG. 8 is a partial cross-sectional view of an alignment unit of a conventional conductive ball alignment device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 3 substrate 4 ball alignment device 5 alignment jig 8 moving mechanism 9 tilting mechanism 13 mounting head 14 ball 15 alignment portion 15a recess 15b through hole 15e taper portion 19 ball movement restricting member

Claims (6)

[Claims] 1. A conductive ball aligning device for supplying conductive balls in an aligned state, comprising: an aligning portion having a plurality of recesses in a predetermined arrangement capable of accommodating one conductive ball on an upper surface;
An inclination mechanism for inclining the alignment portion at a predetermined inclination angle with respect to a horizontal plane, and a ball supply means for supplying a conductive ball to the alignment portion in an inclined state by moving a conductive ball; An apparatus for arranging conductive balls, wherein a tapered portion having an inclined surface conically inclined toward a center is formed on a bottom surface. 2. The conductive ball aligning device according to claim 1, wherein a taper angle formed by an inclined surface of the tapered portion and an upper surface of the alignment portion is set to be larger than the inclined angle. . 3. A through hole having a diameter smaller than a diameter of a contact circle where a conductive ball accommodated in the tapered portion comes into contact with the inclined surface is formed at a center position of the tapered portion. The conductive ball aligning device according to claim 1. 4. A conductive ball mounting apparatus for mounting a conductive ball aligned on a ball aligning apparatus, wherein the conductive ball is vacuum-adsorbed and held by a mounting head having a plurality of suction holes formed on a lower surface and mounted on a work. The ball aligning device includes an aligning portion having a plurality of concave portions capable of accommodating one conductive ball on an upper surface in a predetermined arrangement, an inclination mechanism for inclining the aligning portion at a predetermined inclination angle with respect to a horizontal plane, Ball supplying means for supplying conductive balls to the inclined portion by moving the conductive ball, and a tapered portion having a slope inclined conically toward the center at the bottom of the recess is formed. An apparatus for mounting a conductive ball, comprising: 5. The conductive ball mounting apparatus according to claim 4, wherein the angle formed by the inclined surface of the tapered portion and the upper surface of the alignment portion is set to be larger than the inclined angle. 6. A through hole having a diameter smaller than a diameter of a contact circle where a conductive ball accommodated in the tapered portion contacts the inclined surface is formed at a center position of the tapered portion. An apparatus for mounting the conductive ball according to claim 4.