JP3194544B2 - Jig for temporarily fixing cap of semiconductor package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal cap for hermetically sealing a semiconductor element, a quartz oscillator or the like (hereinafter referred to as a chip) to a ceramic or metal envelope by a micro parallel seam joining method or the like. And a jig for temporarily fixing a cap of a semiconductor package.

[0002]

2. Description of the Related Art Conventionally, a micro parallel seam bonding method has been widely used as a method for hermetically sealing a chip in a package.

[0003] This method, ceramic envelope in contact brazing metal Sea <br/> Le frame the ceramic substrate (ceramic package), or entirely made of a metal metal envelope (metal packaging) After the chip is housed inside and the internal wiring is connected to the leads, a cap (lid plate) is placed over the opening of the envelope, that is, the package opening, and a pair of caps is rotated along the opposing peripheral edges of the cap. Pulsation energization is performed under a constant pressurizing condition using a tapered roller electrode. The seam joining between the package opening and the cap is performed by a roll spot type joint forming method by the Joule heat generated in the joint due to the energization.

Here, when the pair of roller electrodes is brought into rolling contact with the opposing edge of the cap, the cap is easily moved, and conventionally, spot joining has been performed to temporarily fix the cap to the package opening. That is, in a state where the cap is positioned and held on the package opening, a pair of electrodes is pressed against the periphery of the cap and energized to perform spot joining.

[0005]

However, the temporary fixing by the spot joining needs to be performed in a state where the cap is held in a state where the cap is positioned by the positioning device. However, when transporting from the positioning location to the temporary fixing location, or when the pair of temporary fixing electrodes do not simultaneously contact two points on the periphery of the cap, the relative positions of the positioned package and the cap are shifted, and a reliable hermetic sealing is performed. There was a problem that sometimes could not.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has been described in which the relative displacement between the package and the cap is determined after the cap is positioned and mounted on the opening of the package and temporarily fixed by spot bonding. It is an object of the present invention to provide a jig for temporarily fixing a cap of a semiconductor package which can prevent the occurrence of the problem.

[0007]

According to the present invention, an object of the present invention is to provide a jig for temporarily fixing a cap made of a magnetic material to an opening end face of an envelope having a magnetic material at least at the opening end face, the jig being made of a non-magnetic material. A holding substrate and a concave portion formed on the upper surface of the holding substrate, the upper surface of which has at least two different polarities.
A permanent magnet magnetized such that, secured to said upper surface of the holding substrate provided with said envelope nonmagnetic material made of the positioning plate positioning hole is formed in facing the permanent magnet, the permanent <br The magnetic field generated by the permanent magnet is parallel to the cap inside the cap.
This is achieved by a jig for temporarily fixing a cap of a semiconductor package, characterized in that the jig is passed through .

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which a ceramic package is used as a package will be described below. FIG. 1 is a plan view partially omitting this embodiment, FIG. 2 is an exploded side view thereof, FIG. 3 is an exploded perspective view partially enlarged, FIG. 4 is a partially enlarged plan view, and FIG. It is a VV line sectional view.

In these figures, reference numeral 10 denotes a holding substrate,
It is made almost square with non-magnetic material such as aluminum. On the upper surface of the holding substrate 10, a plurality of circular concave portions 12 are provided.
Are formed. In this embodiment, a total of 54 concave portions 12 of 9 horizontally and 6 vertically are arranged at regular intervals.

Reference numeral 14 denotes a disk-shaped permanent magnet.
Has been loaded. As shown in FIG. 4, one of the straight lines 16 passing through the center of the permanent magnet 14 is an N pole, and the other is an S line.
Magnetized to poles. Therefore, the upper surface of the magnet 14 has a different polarity by half. By configuring the magnet 14 in this manner, a rotational force is prevented from being generated in the cap attracted by the magnet 14.

Reference numeral 18 denotes a positioning plate made of a non-magnetic material such as aluminum, which is placed on the upper surface of the holding substrate 10 and fixed by an appropriate number of screws 20 (16 in the embodiment). The positioning plate 18 has a positioning hole 22 that opens above the permanent magnet 14. The positioning hole 22 is for positioning the ceramic package 24.

The positioning plate 18 includes a holding substrate 1
A pin hole is formed in which the two positioning pins 26, 26 (FIG. 1) implanted at 0 are engaged, and accurate positioning of the positioning plate 18 with respect to the holding substrate 10 is performed by the pins 26.

A ceramic package 24 as an envelope
Has a ceramic substrate 28, a seal frame 30 made of a magnetic material, and a cap 32 also made of a magnetic material. The ceramic substrate 28 may be, for example, a multilayer structure in which AIN (aluminum nitride) sheets are stacked and fired in a reducing gas atmosphere, or an alumina ceramic substrate.

The seal frame 30 is made of, for example, Fe-Ni-
It is made of a magnetic material such as a Co alloy (Kovar) in a frame shape, and is brazed to the ceramic substrate 28. The seal frame 30 has been subjected to processing such as gold plating.

The cap 32 is made of a magnetic material such as Kovar similarly to the seal frame 30. The cap 32 is slightly depressed downward so that the inside of the lower surface thereof is engaged with the inner peripheral edge of the seal frame 30 (FIG. 5).

A semiconductor element 34 such as an IC is adhered to the ceramic substrate 28 inside the seal frame 30 as shown in FIG. Leads 36 pass through the seal frame 30 and are sealed with glass. The semiconductor element 34 is connected to the lead 36 by an internal wiring.

Next, a method of using this jig will be described. This jig is fixed to a work table (not shown) with the ceramic package 24 before the cap 32 is placed in the positioning hole 22 in advance. The worktable is positionable in the horizontal and rotational directions.

Above the work table, a suction head (not shown) movable in the horizontal and vertical directions is disposed, and the caps 32 are sucked one by one by a negative pressure to seal the caps in the respective positioning holes 22. Carry on frame 30. At this time, accurate positioning of the suction head and the work table is performed by the relative movement between the two. Then, when the suction head is lowered to place the cap 32 on the seal frame 30 and the suction by the negative pressure is released and the suction head is raised, the cap 32 is released from the suction head and the seal frame 30 is released.
Remain on top.

When the cap 32 is placed on the seal frame 30, as shown in FIG. 5, the cap 32 and the seal frame 30 form a part of a magnetic path through which the magnetic field of the permanent magnet 14 passes. In FIG. 5, the broken line indicates the magnetic field passing through this magnetic path, and this magnetic field goes from the north pole to the south pole. Therefore, the cap 32 is firmly attracted to the seal frame 30, and the movement of the cap 32 is prevented.

After the caps 32 are placed on the seal frames 30 of all the positioning holes 22 in this manner, the entire jig is fixed to a work table of a temporary fixing device. The cap 32 is temporarily fixed on the seal frame 30 by pressing against the edge and energizing. Thereafter, the entire jig is further fixed to a work table (not shown) of the micro parallel seam joining apparatus. Then, a pair of tapered roller electrodes 38, 38
(FIG. 5) is electrically connected to the opposing edge of the cap 32 while being rolled from above to perform seam joining. While moving the work table and the roller electrode 38, the caps 32 of all the positioning holes 22 are seam-joined.

In this embodiment, the cap 32 is slightly swelled downward at the center except for the periphery, and the swell is engaged with the inner periphery of the seal frame 30. It becomes more difficult to be distorted, and the positioning accuracy at the time of temporary fixing is improved.

In this embodiment, the permanent magnet 14 is disk-shaped, but may be rectangular or square. It is simple and preferable that the upper surface of the magnet 14 is divided into two poles in terms of structure. However, the magnet 14 may be divided into four or more regions. In short, the cap and the seal frame form a magnetic path. What is necessary is just to form a magnetic field so as to be a part.

Further, the permanent magnet may be formed in an annular shape, or an opening continuous with the opening of the permanent magnet may be provided on the holding substrate side. In this case, in an IC having a lead extending downward from the bottom of the ceramic package, the jig of the present invention can be used by passing the lead through the opening of the magnet.

The present invention can also be applied to an apparatus using a metal package as an envelope, and includes this. In this case, the bottom of the metal package also becomes a part of the magnetic path, and the magnetic field passes through the two magnetic paths of the bottom and the cap. The fixing force of the cap is increased by increasing the magnetic force of the permanent magnet used. Can be made sufficiently large, so there is no inconvenience.

[0025] In addition the above embodiments are described as using a jig of the present invention when tacking to the cap contact Seams soluble <br/>. However, it goes without saying that the present invention can also be used for temporary attachment in other welding methods such as resistance welding and laser welding.

[0026]

As described above, according to the first aspect of the present invention, the holding substrate (10) below the positioning plate (18) has a small upper surface.
A permanent magnet (14) magnetized to have two different polarities is attached, and a cap (32) and a package (2) are mounted.
4) form a part of the magnetic path through which the magnetic field of the magnet (14) passes, so that the magnetic field can pass through the cap (32).
Since it passes through in parallel with the top (32) ,
The cap (32) is firmly attracted and fixed to the package (24) by magnetic force. Therefore, package (2
4) The cap (32) is positioned and mounted on the work table, and the cap (32) is positioned even when the work table is transported from the work table to the temporary work table or when the pair of temporary fixing electrodes does not simultaneously contact the cap (32). The relative displacement between the package (24) and the cap (32) does not occur, and reliable hermetic sealing can be performed in subsequent seam welding or the like.

Further, if the jig according to the present invention is used, it is possible to prevent the displacement of the package (24) by merely placing the cap (32) on the package (24). An inexpensive flat-type cap can be used instead of the cap slightly swelling downward.

[Brief description of the drawings]

FIG. 1 is a plan view partially illustrating an embodiment of the present invention;

FIG. 2 is an exploded side view thereof.

FIG. 3 is an exploded perspective view in which a part is enlarged.

FIG. 4 is a partially enlarged plan view.

FIG. 5 is a sectional view taken along line VV.

[Explanation of symbols]

 Reference Signs List 10 holding substrate 12 concave portion 14 permanent magnet 18 positioning plate 22 positioning hole 24 ceramic package 28 ceramic substrate 30 seal frame 32 cap 34 IC

Claims (1)

(57) [Claims] 1. A jig for temporarily fixing a cap made of a magnetic material to an opening end surface of an envelope having a magnetic material at least on an opening end surface, the holding substrate being made of a non-magnetic material, and an upper surface of the holding substrate Is loaded in the recess formed in the
At least two permanent magnets magnetized so as to have different polarities, a positioning plate made of a non-magnetic material and fixed to the upper surface of the holding substrate and formed with a positioning hole of the envelope facing the permanent magnet; comprising a magnetic field by the permanent magnet is the calibration
A jig for temporarily fixing a cap of a semiconductor package, wherein the jig passes through the inside of the cap in parallel with the cap.