JPH0511538U - Electronic parts - Google Patents

Abstract

(57) [Abstract] [Purpose] In an electronic component in which a substrate is sealed with a container via a bonding layer, damage to a substrate terminal electrode due to a chuck tool is prevented when the electronic component is automatically mounted. [Configuration] Dimension W set in the relationship of W1>W3> W2
The substrate 2 having the dimension W3 is prepared together with the container 3 having the large dimension portion 3a of 1 and the small dimension portion 3b of the dimension W2. The container 3 is bonded to the substrate 2 via the small dimension portion 3b. When chucking, the chucking tool 6 always contacts the large dimension portion 3a of the container 3 having the largest dimension and does not contact the substrate 2.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an electronic component that hermetically seals various electronic components.

[0002]

[Prior Art]

 The structure shown in FIGS. 5 and 6 is known as an example of a sealing structure for various electronic components. 5 is a perspective view and FIG. 6 is a sectional view of FIG. Taking a chip resonator as an example of an electronic component, a substrate 12 made of, for example, ceramic, on which a ceramic vibrator, which is the component body 11, is attached, is a container 13, and a ceramic having an inverted U-shaped cross section is used as a bonding layer 14. It is sealed by being fixed via. On the desired surface of the substrate 12, terminal electrodes 15 that are electrically connected to the component body 11 are formed by a printing method or the like.

When such electronic components are used to automatically mount various electronic devices, a chucking tool 16 for automatic positioning is used as shown in FIG. 7, whereby both ends of the substrate 12 are chucked. Then, it is carried to the circuit board of the electronic device.

[0004]

[Problems to be solved by the device]

 By the way, in the conventional electronic component sealing structure, as is apparent from FIG. 7, the dimension W4 of the portion of the container 13 in the direction orthogonal to the height direction is the dimension W3 of the portion of the substrate 12 parallel to the W4 (the terminal electrode is Since the size is smaller than the included size), chucking is always performed at both ends of the substrate 12, so that there is a problem that the terminal electrode 15 will be damaged if the chucking position touches the terminal electrode 15. For this reason, in the worst case, the electronic components will be defective.

The present invention has been made in consideration of the above problems, and an object thereof is to provide an electronic component in which damage to a terminal electrode during chucking is prevented.

[0006]

[Means for Solving the Problems]

 In order to achieve the above object, the present invention provides an electronic component in which a substrate on which a component body is attached is sealed with a container via a bonding layer, in which the container has a large dimension and a small dimension in a direction orthogonal to the height direction. When the dimension of the large dimension portion is W1, the dimension of the small dimension portion is W2, and the dimension parallel to each dimension portion of the substrate is W3, the relation W1> W3> W2 is set. The small size portion of the container is attached to the substrate via the bonding layer.

[0007]

[Action]

 Using a container having a large dimension part of dimension W1 and a small dimension part of dimension W2, a substrate having dimension W3 is set in the relationship of W1> W3> W2, and then the container is inserted through the small dimension part. Adhere to the substrate. According to the sealing structure assembled in this way, when chucking an electronic component, chucking is always performed at both ends of the large size portion of the largest container. Therefore, since the chucking of the terminal electrodes on the substrate is not performed, the terminal electrodes can be prevented from being damaged.

[0008]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a cross-sectional view showing a first embodiment of an electronic component of the present invention. When a chip resonator is used as an electronic component, the component body 1 is made of, for example, a ceramic vibrator. The substrate 2 (dimension W3) is made of ceramic or the like and has a container 3 having an inverted U-shaped cross section having a large dimension portion 3a (dimension W1) and a small dimension portion 3b (dimension W2) in a direction orthogonal to the height direction. The small dimension portion 3b is sealed by being bonded via the bonding layer 4. Here, the respective dimensions are set to satisfy the relationship of W1> W3> W2.

According to the electronic component having the sealing structure assembled as described above, when chucking is performed during automatic mounting, as shown in FIG. 2, the chuck 6 is always the largest in size. It is performed at both ends of the large-sized portion 3a of the container 3.

Therefore, since the chucking tool 6 does not contact the terminal electrode 5 during chucking, the terminal electrode 5 can be prevented from being damaged. Therefore, the electronic parts will not be defective. Further, by setting the relationship of W3> W2, the substrate 2 can be reliably sealed with the container 3.

FIG. 3 shows a second embodiment of the present invention, which is a structure in which a large-sized portion 3a and a small-sized portion 3b are connected by a tapered surface 3A and sealed using a container 3. Is shown. Also in this embodiment, the chucking is performed as shown in FIG. 4, and since the chucking is always performed at both ends of the large dimension portion 3a of the container 3, the same effect as the above embodiment can be obtained. it can.

Further, the shape of the container 3 is not limited to the box shape shown in the embodiment of the present invention as long as it has an inverted U-shaped cross section, and the same effect can be obtained even if it is a cylindrical shape.

In this embodiment, a chip resonator has been described as an example of an electronic component, but the present invention is not limited to a specific component and can be similarly applied to other electronic components such as a chip resistor and a pyroelectric sensor. . Also, the materials for the substrate, container, etc. are not limited to specific materials.

[0015]

[Effect of the device]

 As is clear from the above description, according to the present invention, a container having a large dimension portion having a dimension W1 and a small dimension portion having a dimension W2 is used, and a substrate having a dimension W3 has a relationship of W1> W3> W2. After setting, the small size part of the container was adhered to the substrate via the bonding layer.Therefore, when chucking electronic components, the contact of the chuck tool with the substrate terminal electrode is avoided, so the terminal electrode Damage can be prevented.

[Brief description of drawings]

FIG. 1 is a sectional view showing a first embodiment of an electronic component of the present invention.

FIG. 2 is an explanatory diagram of a chucking method for electronic components according to the first embodiment.

FIG. 3 is a sectional view showing a second embodiment of the electronic component of the present invention.

FIG. 4 is an explanatory diagram of a chucking method for electronic components according to a second embodiment.

FIG. 5 is a perspective view showing a conventional electronic component.

6 is a cross-sectional view taken along the line AA of FIG.

FIG. 7 is an explanatory diagram of a conventional chucking method for electronic components.

[Explanation of symbols]

 1 Component Main Body 2 Substrate 3 Container 3a Large Dimension Section 3b Small Dimension Section 5 Terminal Electrode 6 Chuck Tool W1 Large Dimension Section Dimension W2 Small Dimension Section W3 Board Dimension

Front Page Continuation (72) Inventor Katsunori Oyamauchi 1-13-1 Nihonbashi, Chuo-ku, Tokyo Inside TDK Corporation

Claims (1)

[Scope of utility model registration request] 1. An electronic component in which a substrate is sealed with a container via a bonding layer, wherein the container has a shape having a large-sized portion and a small-sized portion in a direction orthogonal to a height direction, and a dimension of the large-sized portion. Where W1, the dimension of the small dimension portion is W2, and the dimension parallel to each of the dimension portions of the substrate is W3, W1> W3
An electronic component having a relationship of> W2, wherein the small-sized portion of the container is bonded to the substrate via a bonding layer.