JPH0251256A - Sealing cap for semiconductor device - Google Patents
Sealing cap for semiconductor deviceInfo
- Publication number
- JPH0251256A JPH0251256A JP63203621A JP20362188A JPH0251256A JP H0251256 A JPH0251256 A JP H0251256A JP 63203621 A JP63203621 A JP 63203621A JP 20362188 A JP20362188 A JP 20362188A JP H0251256 A JPH0251256 A JP H0251256A
- Authority
- JP
- Japan
- Prior art keywords
- sealing cap
- cap
- semiconductor device
- sealed
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 17
- 239000004065 semiconductor Substances 0.000 title claims abstract description 10
- 239000000919 ceramic Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置用封止キャップに関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a sealing cap for a semiconductor device.
従来、半導体チップ５を封入するこの種の封止キャップ
は、第４図に示すように、キャップ１のまわり全体が全
てケース４の壁部に密着している形状となっていた。Conventionally, this type of sealing cap for enclosing a semiconductor chip 5 has a shape in which the entire circumference of the cap 1 is in close contact with the wall of the case 4, as shown in FIG.
上述した従来の半導体装置用封止キャップはキャップ１
のまわり全体が全てケース４に密着している形状となっ
ているため、それを開封する際にはキャップ１に穴をあ
け、そこを切口としてニッパ−等でキャップ１をはがし
ていたため、チップ５にキズをつげたりワイヤー６を切
ってしまったりし解析不能になってしまうという欠点が
あった。The conventional sealing cap for semiconductor devices described above is Cap 1.
Since the entire circumference of the chip 5 is in close contact with the case 4, when opening it, a hole is made in the cap 1 and the hole is used as a cut to peel off the cap 1 with nippers. This had the disadvantage that it could scratch the wire or break the wire 6, making analysis impossible.
本発明の半導体装置用封止キャップはキャップのまわり
がケースと密着している部分より外側にはみ出した部分
を有している。The sealing cap for a semiconductor device of the present invention has a portion around the cap that protrudes outside the portion that is in close contact with the case.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の横断面図である。FIG. 1 is a cross-sectional view of one embodiment of the present invention.
ケース４にチップ５を取り付はポンディングワイヤー６
でリード３と接続した後密着部２で封止キャップ１を封
着した半導体装置において、封止キャップ１が密着部２
よりも外側にはみ出した部分を有している。第２図は、
第１図の封止キャッブ１の平面図であり、密着部２の外
側の部分Ａがはみ出し部である。Attach the chip 5 to the case 4 using the bonding wire 6
In a semiconductor device in which the sealing cap 1 is sealed at the contact portion 2 after connecting with the lead 3 at the contact portion 2, the sealing cap 1 is connected to the contact portion 2.
It has a part that protrudes outward. Figure 2 shows
2 is a plan view of the sealing cap 1 shown in FIG. 1, in which a portion A outside the close contact portion 2 is a protruding portion.
第３図は本発明の他の実施例の封止キャップ部の平面図
であり、はみ出し部Ａを少なくすることによりキャップ
の面積を小さくすることができコストダウンを計れると
いう利点がある。FIG. 3 is a plan view of a sealing cap portion according to another embodiment of the present invention. By reducing the protruding portion A, the area of the cap can be reduced, which has the advantage of reducing costs.
以上説明したように本発明は封止キャップがケースとの
密着部よりも外側にはみ出した部分を有していることよ
り開封の際このはみ出した部分にニッパ−等をはさみこ
こからキャップを開けることができるため開封作業を容
易にする上、開封の際のチップへのキズ、ワイヤー切断
等のミスを減少させる効果がある。As explained above, in the present invention, the sealing cap has a part that protrudes outward from the part that is in close contact with the case, so when opening the cap, the protruding part can be inserted with nippers or the like and the cap can be opened from there. This not only makes opening the package easier, but also reduces errors such as scratching the chip and cutting wires when opening the package.
の半導体装置用封止キャップの横断面図である。FIG. 2 is a cross-sectional view of a sealing cap for a semiconductor device.
１・・・・・・封止キャップ、２・・・・・・密着部、
３・・・・・・リード、４・・・・・・ケース、５・・
・・・・チップ、６・・・・・・ポンディングワイヤー
、Ａ・・・・・・はみ出し部。1...Sealing cap, 2...Tight part,
3...Lead, 4...Case, 5...
...Chip, 6...Ponding wire, A...Protrusion part.
代理人 弁理士 内 原 晋Agent Patent Attorney Susumu Uchihara
Claims (1)
該封止キャップの封止部よりも外側にケースと接触部を
もたないはみ出した部分を有するようにしたことを特徴
とする半導体装置用封止キャップ。A seal for a semiconductor device, characterized in that a sealing cap of a ceramic container for enclosing a semiconductor element has a protruding portion outside the sealing portion of the sealing cap that does not have a contact portion with the case. cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63203621A JPH0251256A (en) | 1988-08-15 | 1988-08-15 | Sealing cap for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63203621A JPH0251256A (en) | 1988-08-15 | 1988-08-15 | Sealing cap for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0251256A true JPH0251256A (en) | 1990-02-21 |
Family
ID=16477078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63203621A Pending JPH0251256A (en) | 1988-08-15 | 1988-08-15 | Sealing cap for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0251256A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0511538U (en) * | 1991-07-18 | 1993-02-12 | テイーデイーケイ株式会社 | Electronic parts |
| US5502338A (en) * | 1992-04-30 | 1996-03-26 | Hitachi, Ltd. | Power transistor device having collector voltage clamped to stable level over wide temperature range |
| US8243571B2 (en) | 2008-10-02 | 2012-08-14 | Panasonic Corporation | Reproduced signal evaluating method, information recording medium, reproducing device, and recording device |
-
1988
- 1988-08-15 JP JP63203621A patent/JPH0251256A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0511538U (en) * | 1991-07-18 | 1993-02-12 | テイーデイーケイ株式会社 | Electronic parts |
| US5502338A (en) * | 1992-04-30 | 1996-03-26 | Hitachi, Ltd. | Power transistor device having collector voltage clamped to stable level over wide temperature range |
| US8243571B2 (en) | 2008-10-02 | 2012-08-14 | Panasonic Corporation | Reproduced signal evaluating method, information recording medium, reproducing device, and recording device |
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