JPH01161736A - Package for semiconductor device - Google Patents

Abstract

PURPOSE:To improve the moisture resistance of a package by so forming a sealing path of a bonded part of a case with a cap covering the case in combination faces of obliques or uneven parts as to become longer than a horizontal linear distance. CONSTITUTION:In a package for a semiconductor device having a ceramic or glass case 1, a cap 2 covering the upper opening of the case 1, and a resin sealer 6 for sealing the bonded part of the case 1 with the cap 2, a sealing path between an inside and an outside of the bonded part is so formed in combination faces of obliques or uneven parts as to become longer than a horizontal linear distance. For example, the upper face of the peripheral wall of the case 1 is formed in its section with a protrusion shape. A recess to be engaged with the protrusion of the peripheral wall of the case is formed on the periphery of the cap 2 sealingly bonded with the case 1 by the sealer 6, and the protrusion of the peripheral wall of the case 1 is engaged through the sealer 6 with the recess of the periphery of the cap 2.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a package of a semiconductor device using a resin seal phase, and particularly relates to improving the moisture resistance of the package.

[Conventional technology]

FIG. 3 is a sectional view of a semiconductor device using a conventional package. In FIG. 3, a semiconductor chip 7 is mounted in the central recess of a ceramic case 11, and wiring on the shoulder of the case 11 connects the electrodes of the chip 7 to the external leads 5 attached to the side of the case 11. After connecting with the bonding wire 8, a glass plate-shaped cap 12 is placed on the surface of the surrounding wall of the case 110, and the cap 12 is sealed with a resin sealant 6.

[Problem that the invention seeks to solve]

In the conventional package described above, the joint surface of the earth surface of the case peripheral wall with the cap is a horizontal plane perpendicular to the peripheral wall. Therefore, the sealing bath formed by the resin sealant 6 between the inside and outside of the package is the shortest distance equal to the thickness of the peripheral wall. Therefore, in a small package, the thickness of the peripheral wall is naturally thin, so the sealing bath is also very short, which has the drawback of insufficient moisture resistance.

[Means for solving problems]

In order to solve the above problem, the present invention makes the joint surface oblique in order to make the sealing bath as long as possible at the joint between the case, which has a circumferential wall of a limited constant thickness, and the cap that covers the case. , or a combination of uneven surfaces.

〔Example〕

Next, the present invention will be explained by examples.

FIG. 1 is a sectional view of a semiconductor device assembled using a package according to an embodiment of the present invention. In FIG. 1, the surface of the peripheral wall of a ceramic case 10 on which a semiconductor chip 7 is mounted has a convex cross section.

Around the glass cap 2 which is bonded and sealed to the case 1 by the resin sealant 6, a recess is provided that fits into a convex portion of the case peripheral wall. The protrusion on the peripheral wall of the case 1 and the recess around the cap 2 are fitted together to form a seal. Therefore, the seal bus at the joint between the case and the cap that communicates from the inside to the outside of the case is different from the conventional one shown in FIG.
It is twice as long, making it more difficult for moisture to pass through, improving moisture resistance.

FIG. 2 is a sectional view of a semiconductor device using a package according to another embodiment of the present invention. In the figure, the cross-sectional shape of the joint between the surrounding wall soil surface of the case 3 has a raised circular arc shape at the center, whereas the cap 4 has an arc-shaped recess that matches this circular arc around the cap 4. Since the convex and concave grooves are fitted together with a resin sealant in between and sealed, the seal bath is longer than the conventional seal bath with only the thickness of the peripheral wall, so the longer seal bath is moisture resistant. Improves sexual performance. Although this example is inferior to the example shown in FIG. 1 in terms of seal bath, it has the advantage of being easy to process.

Note that the means for lengthening the seal bath is not limited to the upper side, but can also be realized by using a joint surface cut diagonally from the peripheral wall of the case.

〔Effect of the invention〕

As explained above, the present invention has the effect of improving the moisture resistance of a package using a resin sealant by extending the sealing bath.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a semiconductor device assembled using a package according to an embodiment of the present invention, FIG. 2 is a sectional view of a semiconductor device according to another embodiment of the present invention, and FIG. 3 is a sectional view of a conventional semiconductor device. FIG. 2 is a cross-sectional view of a semiconductor device in a package. 1.3,11...Ceramic case, 2,4゜12...Glass cap, -External lead, 6...Resin sealant, 7... ...Semiconductor chip, 8...;・Ponding wire. Agent Patent Attorney Susumu Uchihara

Claims (1)

[Claims] In a semiconductor device package that includes a case made of ceramic or glass, a cap that covers the upper opening of the case, and a resin sealant that seals the joint between the case and the cap, the inside and outside of the joint are 1. A package for a semiconductor device, characterized in that the surface has a slope or a combination of concave and convex surfaces so that the seal bus between the two surfaces is longer than the horizontal straight line distance.