JPH01161736A - Package for semiconductor device - Google Patents

Package for semiconductor device

Info

Publication number
JPH01161736A
JPH01161736A JP62320332A JP32033287A JPH01161736A JP H01161736 A JPH01161736 A JP H01161736A JP 62320332 A JP62320332 A JP 62320332A JP 32033287 A JP32033287 A JP 32033287A JP H01161736 A JPH01161736 A JP H01161736A
Authority
JP
Japan
Prior art keywords
case
cap
bonded
package
peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62320332A
Other languages
Japanese (ja)
Inventor
Shuichi Kawai
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP62320332A priority Critical patent/JPH01161736A/en
Publication of JPH01161736A publication Critical patent/JPH01161736A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]

Abstract

PURPOSE: To improve the moisture resistance of a package by so forming a sealing path of a bonded part of a case with a cap covering the case in combination faces of obliques or uneven parts as to become longer than a horizontal linear distance.
CONSTITUTION: In a package for a semiconductor device having a ceramic or glass case 1, a cap 2 covering the upper opening of the case 1, and a resin sealer 6 for sealing the bonded part of the case 1 with the cap 2, a sealing path between an inside and an outside of the bonded part is so formed in combination faces of obliques or uneven parts as to become longer than a horizontal linear distance. For example, the upper face of the peripheral wall of the case 1 is formed in its section with a protrusion shape. A recess to be engaged with the protrusion of the peripheral wall of the case is formed on the periphery of the cap 2 sealingly bonded with the case 1 by the sealer 6, and the protrusion of the peripheral wall of the case 1 is engaged through the sealer 6 with the recess of the periphery of the cap 2.
COPYRIGHT: (C)1989,JPO&Japio
JP62320332A 1987-12-17 1987-12-17 Package for semiconductor device Pending JPH01161736A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62320332A JPH01161736A (en) 1987-12-17 1987-12-17 Package for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62320332A JPH01161736A (en) 1987-12-17 1987-12-17 Package for semiconductor device

Publications (1)

Publication Number Publication Date
JPH01161736A true JPH01161736A (en) 1989-06-26

Family

ID=18120299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62320332A Pending JPH01161736A (en) 1987-12-17 1987-12-17 Package for semiconductor device

Country Status (1)

Country Link
JP (1) JPH01161736A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120366A (en) * 1992-10-06 1994-04-28 Sony Corp Semiconductor device
JPH06188325A (en) * 1992-12-17 1994-07-08 Kyocera Corp Package for semiconductor-element housing
JPH06196583A (en) * 1992-12-24 1994-07-15 Kyocera Corp Semiconductor device
US5889323A (en) * 1996-08-19 1999-03-30 Nec Corporation Semiconductor package and method of manufacturing the same
US6218730B1 (en) * 1999-01-06 2001-04-17 International Business Machines Corporation Apparatus for controlling thermal interface gap distance
JP2002043450A (en) * 2001-06-15 2002-02-08 Sony Corp Semiconductor device
WO2003030275A1 (en) * 2001-09-28 2003-04-10 Osram Opto Semiconductors Gmbh Improved sealing for oled devices
US6856015B1 (en) * 2003-08-21 2005-02-15 Siliconware Precision Industries Co., Ltd. Semiconductor package with heat sink
JP5680226B2 (en) * 2012-07-27 2015-03-04 京セラ株式会社 Wiring board and package, and electronic device
CN108520866A (en) * 2018-04-27 2018-09-11 宁波江丰电子材料股份有限公司 Welding structure and semiconductor device

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120366A (en) * 1992-10-06 1994-04-28 Sony Corp Semiconductor device
JPH06188325A (en) * 1992-12-17 1994-07-08 Kyocera Corp Package for semiconductor-element housing
JPH06196583A (en) * 1992-12-24 1994-07-15 Kyocera Corp Semiconductor device
US5889323A (en) * 1996-08-19 1999-03-30 Nec Corporation Semiconductor package and method of manufacturing the same
US6218730B1 (en) * 1999-01-06 2001-04-17 International Business Machines Corporation Apparatus for controlling thermal interface gap distance
JP2002043450A (en) * 2001-06-15 2002-02-08 Sony Corp Semiconductor device
WO2003030275A1 (en) * 2001-09-28 2003-04-10 Osram Opto Semiconductors Gmbh Improved sealing for oled devices
CN100407475C (en) * 2001-09-28 2008-07-30 奥斯兰姆奥普托半导体有限责任公司 Improved sealing for OLED devices
JP2005505141A (en) * 2001-09-28 2005-02-17 インスティチュート オブ マテリアルズ リサーチ アンド エンジニアリング Sealing member for OLED device
US6933537B2 (en) * 2001-09-28 2005-08-23 Osram Opto Semiconductors Gmbh Sealing for OLED devices
US6856015B1 (en) * 2003-08-21 2005-02-15 Siliconware Precision Industries Co., Ltd. Semiconductor package with heat sink
JP5680226B2 (en) * 2012-07-27 2015-03-04 京セラ株式会社 Wiring board and package, and electronic device
CN108520866A (en) * 2018-04-27 2018-09-11 宁波江丰电子材料股份有限公司 Welding structure and semiconductor device

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