CN108520866A - Welding structure and semiconductor device - Google Patents
Welding structure and semiconductor device Download PDFInfo
- Publication number
- CN108520866A CN108520866A CN201810390573.8A CN201810390573A CN108520866A CN 108520866 A CN108520866 A CN 108520866A CN 201810390573 A CN201810390573 A CN 201810390573A CN 108520866 A CN108520866 A CN 108520866A
- Authority
- CN
- China
- Prior art keywords
- face
- bottom plate
- groove
- protrusion
- cover board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
Abstract
A kind of welding structure of present invention offer and semiconductor device, are related to semi-conductor device technology field, welding structure includes cover board and bottom plate；Bottom plate has first end face, and first end face is equipped with groove, and the both ends of groove, respectively with the side wall of bottom plate through setting, groove is formed with first end face and is open；There is cover board second end face, first end face to be oppositely arranged with second end face, and second end face is equipped with protrusion, and protrusion can close opening, and have gap between first end face and second end face, and for solder layer to be arranged, cover board and bottom plate are welded by solder layer in gap.In welded cover plate and bottom plate, solder layer is heated, pressure towards bottom plate is applied to cover board, pressure towards cover board is applied to bottom plate, since protrusion can close opening, prevents the solder layer in gap from flowing into groove, prevent the insufficient solder connection between cover board and bottom plate, the probability of failure welding is reduced, and also prevents water channel or air flue from blocking, it is poor to improve welded welding quality.
Description
Technical field
The present invention relates to semi-conductor device technology fields, having the weldering more particularly, to a kind of welding structure, and one kind
The semiconductor device of binding structure.
Background technology
Semiconductor refers to material of the electric conductivity between conductor and insulator under room temperature.Semiconductor is in radio, TV
It has a wide range of applications on machine and thermometric.If diode is exactly the part using semiconductor fabrication.Most electronic product,
As the core cell in computer, mobile phone or digital audio tape all has extremely close connection with semiconductor.Often
The semi-conducting material seen has silicon, germanium, GaAs etc..
In semiconductor device, it is often necessary to which water channel or air flue are set, so that liquid or gas flow in water channel or air flue.
In the prior art, as shown in Figure 1, the semiconductor device with water channel or air flue is made of cover board 1 ' and bottom plate 2 ', bottom plate 2 '
There is groove 3 ', the bottom surface of cover board 1 ' to be oppositely arranged with the top surface of bottom plate 2 ', and the bottom surface of cover board 1 ' is plane on top surface.
When welding cover board 1 ' and bottom plate, solder layer 4 ' is set, so between the bottom surface of cover board 1 ' and the top surface of bottom plate 2 '
Solder layer 4 ' is heated afterwards, and the pressure towards bottom plate 2 ' is applied to cover board 1 ', bottom plate 2 ' is applied towards cover board
Pressure, to which cover board 1 ' and bottom plate weld, cover board 1 ' forms water channel or air flue with groove 3 ' at this time.However, welding
Solder is easy to be flowed into groove 3 ' by the top surface of bottom plate in journey, leads to the insufficient solder connection between cover board 1 ' and bottom plate 2 ', causes to weld
It connects bad, and after solder flows into groove 3 ', water channel or air flue can be caused to block, the welded weldering with water channel or air flue
It connects second-rate.
Invention content
The purpose of the present invention is to provide a kind of welding structures, to solve the weldering in the prior art with water channel or air flue
The poor technical problem of the welding quality of binding structure.
Welding structure provided by the invention, including cover board and bottom plate；
The bottom plate have first end face, the first end face be equipped with groove, and the both ends of the groove respectively with institute
The side wall of bottom plate is stated through setting, the groove is formed with the first end face and is open；
There is the cover board second end face, the first end face to be oppositely arranged with the second end face, the second end face
It is equipped with protrusion, the protrusion can close the opening, and have gap between the first end face and the second end face,
For solder layer to be arranged, the cover board and the bottom plate are welded by the solder layer in the gap.
Further, the protrusion stretches into the groove, and the side wall of the protrusion can close the opening.
Further, vertically, the section of the protrusion and the section of the groove are rectangle.
Further, the welding structure further includes limit assembly, and the depth of the groove is stretched into for limiting the protrusion
Degree.
Further, the limit assembly includes the first shackle member and the second shackle member；
First shackle member is arranged on the side wall of the groove, and second shackle member is arranged in the side of the protrusion
On wall, first shackle member and second shackle member can coordinate clamping.
Further, the limit assembly includes baffle, and the baffle is fixed on the side wall of the groove.
Further, the limit assembly includes baffle, and the baffle is fixed on the side wall of the protrusion.
Further, first protrusion is covered in the overthe openings.
Further, the cover board and the bottom plate are made of semi-conducting material.
The present invention also aims to provide a kind of semiconductor device, including welding structure of the present invention.
Welding structure provided by the invention, including cover board and bottom plate；The bottom plate has first end face, the first end face
It is equipped with groove, and the both ends of the groove are respectively with the side wall of the bottom plate through setting, the groove and the first end
Face forms opening；There is the cover board second end face, the first end face to be oppositely arranged with the second end face, the second end
Face is equipped with protrusion, and the protrusion can close the opening, and between having between the first end face and the second end face
Gap, for solder layer to be arranged, the cover board and the bottom plate are welded by the solder layer in the gap.In welded cover plate and bottom
When plate, solder layer is heated, the pressure towards bottom plate is applied to cover board, the pressure towards cover board is applied to bottom plate, to
The two is welded together, protrusion can form channel with groove at this time.Since in welding, the protrusion in second end face can
Closing opening can prevent the solder layer in gap from flowing into groove, to prevent the insufficient solder connection between cover board and bottom plate, drop
The probability of low failure welding, and channel blockage can also be prevented, welded welding quality can be improved.
Description of the drawings
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, in being described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, other drawings may also be obtained based on these drawings.
Fig. 1 is welded structural schematic diagram in the prior art；
Fig. 2 is welded structural schematic diagram provided in an embodiment of the present invention；
Fig. 3 is the welded structural schematic diagram provided in an embodiment of the present invention with baffle.
Icon：1- cover boards；11- protrusions；2- bottom plates；21- grooves；3- solder layers；4- baffles；1 '-cover board；
2 '-bottom plates；3 '-grooves；4 '-solder layers.
Specific implementation mode
Technical scheme of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
The every other embodiment that personnel are obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that such as occur term "center", "upper", "lower", "left", "right",
"vertical", "horizontal", "inner", "outside" etc., indicated by orientation or positional relationship be orientation based on ... shown in the drawings or position
Relationship is merely for convenience of description of the present invention and simplification of the description, and not indicating or implying the indicated device or element must have
There is specific orientation, with specific azimuth configuration and operation, therefore is not considered as limiting the invention.In addition, as occurred
Term " first ", is used for description purposes only " second ", is not understood to indicate or imply relative importance.Wherein, term
" first position " and " second position " is two different positions.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
Can also be electrical connection to be mechanical connection；It can be directly connected, can also indirectly connected through an intermediary, Ke Yishi
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
The present invention provides a kind of welding structure and semiconductor devices, and multiple embodiments are given below to provided by the invention
Welding structure and semiconductor device are described in detail.
Embodiment 1
Welding structure provided in this embodiment, as shown in Figure 2 to Figure 3, including cover board 1 and bottom plate 2；The bottom plate 2 has
First end face, the first end face is equipped with groove 21, and side wall of the both ends of the groove 21 respectively with the bottom plate 2 runs through
Setting, the groove 21 are formed with the first end face and are open；The cover board 1 has second end face, the first end face and institute
It states second end face to be oppositely arranged, the second end face, which is equipped with protrusion 11, described raised 11, can close the opening, and described
There is gap, the gap is for being arranged solder layer 3, the cover board 1 and the bottom between first end face and the second end face
Plate 2 is welded by the solder layer 3.
In welded cover plate 1 and bottom plate 2, solder layer 3 is heated, the pressure towards bottom plate 2 is applied to cover board 1, it is right
Bottom plate 2 applies the pressure towards cover board 1, and to weld together the two, protrusion 11 can form channel with groove 21 at this time.
Since in welding, the protrusion 11 in second end face can close opening, it can prevent the solder layer 3 in gap from flowing into groove 21
It is interior, to prevent the insufficient solder connection between cover board 1 and bottom plate 2, the probability of failure welding is reduced, and channel can also be prevented stifled
Plug, improves welded welding quality.
Specifically, as an implementation, it described raised 11 stretches into the groove 21, and raised 11 side wall
The opening can be closed.After protrusion 11 is stretched by opening in groove 21, the side wall of protrusion 11 is bonded with opening, so as to
Opening is blocked, so that closure of openings.Protrusion 11 stretch into groove 21 be suitble to position after, opening is closed, first end face with
There is gap between second end face, equipped with solder layer 3 in gap, solder layer 3 is heated, and to top plate and bottom plate 2 into
Row pressurization, applies the pressure towards bottom plate 2 to cover board 1, applies the pressure towards cover board 1 to bottom plate 2, top plate and bottom plate 2 are welded
It picks up and.Since opening 11 is blocked by protrusion, solder may not flow into groove 21, solder can first end face and second end face it
Between gap in heated, can prevent solder layer 3 in gap from flowing into groove 21, to prevent between cover board 1 and bottom plate 2
Insufficient solder connection, reduce the probability of failure welding, and channel blockage can also be prevented, improve welded welding quality.
Further, vertically, raised 11 section and the section of the groove 21 are rectangle.In protrusion
After 11 stretch into groove 21, the side wall of protrusion 11 is bonded with the side wall of groove 21, can enhance sealing effect.
Wherein, protrusion 11 can also be interference fitted with groove 21, and the side wall of the side wall and groove 21 that enable protrusion 11 is more
Step up thickly to be bonded.
Further, the welding structure further includes limit assembly, and the groove 21 is stretched into for limiting described raised 11
Depth.
By limit assembly, adjust the depth that protrusion 11 stretches into groove 21, to adjust first end face and second end face it
Between gap distance, can be convenient for welding process in adjust gap to adjust setting solder amount.
As an implementation, the limit assembly includes the first shackle member and the second shackle member；First clamping
Part is arranged on the side wall of the groove 21, and second shackle member is arranged on raised 11 side wall, first card
Fitting and second shackle member can coordinate clamping.
Specifically, first shackle member can be set on the suitable position on the side wall of groove 21, in the side of protrusion 11
Second shackle member can be set on the suitable position of wall, and the first shackle member and the second shackle member can coordinate clamping, in protrusion
After 11 stretch into position extremely suitable in groove 21, the first shackle member is clamped with the second shackle member, to make protrusion 11 stretch into groove
The depth being suitble in 21, also makes to keep suitable gap between first end face and second end face.
As another embodiment, the limit assembly includes baffle 4, and the baffle 4 is fixed on the groove 21
On side wall.
Baffle 4 is fixed on the position being suitble on the side wall of groove 21, after protrusion 11 stretches into groove 21, until protrusion 11
It is contacted with baffle 4, baffle 4 blocks protrusion 11, and protrusion 11 cannot continue to move towards the bottom surface of groove 21, to consolidate protrusion 11
It is scheduled on suitable position, makes to keep suitable gap between first end face and second end face.
As another embodiment, the limit assembly includes baffle 4, and the baffle 4 is fixed on described raised 11
On side wall.
Baffle 4 is fixed on the suitable position of the side wall of protrusion 11, after protrusion 11 stretches into groove 21, until baffle 4
It is contacted with first end face, first end face blocks baffle 4, and protrusion 11 cannot continue to move towards the bottom surface of groove 21, thus will be convex
It plays 11 and is fixed on suitable position, make to keep suitable gap between first end face and second end face.
In addition, as another embodiment, first protrusion 11 is covered in the overthe openings.
Specifically, the outer profile of the first protrusion 11 is more than the outer profile of opening, and the first protrusion 11 can be covered in opening,
To by closure of openings, when the first protrusion 11 is covered in opening, the first protrusion 11 is contacted with first end face, first end face and
There is gap between second end face, equipped with solder layer 3 in gap, solder layer 3 is heated, and to top plate and bottom plate 2 into
Row pressurization, applies the pressure towards bottom plate 2 to cover board 1, applies the pressure towards cover board 1 to bottom plate 2, top plate and bottom plate 2 are welded
It picks up and.Since opening 11 is blocked by protrusion, solder may not flow into groove 21, solder can first end face and second end face it
Between gap in heated, can prevent solder layer 3 in gap from flowing into groove 21, to prevent between cover board 1 and bottom plate 2
Insufficient solder connection, reduce the probability of failure welding, and channel blockage can also be prevented, improve welded welding quality.
Further, the cover board 1 and the bottom plate 2 are made of semi-conducting material.
It should be noted that welding structure provided in this embodiment, after cover board 1 and bottom plate 2 weld, protrusion 11 and groove
21 channels formed can be used for being arranged any suitable medium such as liquid or gas, and welding structure provided in this embodiment
It can be applied in semiconductor device, can also be applied in any suitable parts such as machine components.
Welding structure provided in this embodiment, including cover board 1 and bottom plate 2；The bottom plate 2 has a first end face, and described the
End face is equipped with groove 21, and the both ends of the groove 21 are respectively with the side wall of the bottom plate 2 through setting, the groove 21
It is formed and is open with the first end face；The cover board 1 has second end face, and the first end face is opposite with the second end face to be set
It sets, the second end face, which is equipped with protrusion 11, described raised 11, can close the opening, and the first end face and described the
There is gap, for solder layer 3 to be arranged, the cover board 1 and the bottom plate 2 pass through the solder layer in the gap between biend
3 welding.In welded cover plate 1 and bottom plate 2, solder layer 3 is heated, the pressure towards bottom plate 2 is applied to cover board 1, the bottom of to
Plate 2 applies the pressure towards cover board 1, and to weld together the two, protrusion 11 can form channel with groove 21 at this time.By
In in welding, the protrusion 11 in second end face can close opening, can prevent the solder layer 3 in gap from flowing into groove 21
It is interior, to prevent the insufficient solder connection between cover board 1 and bottom plate 2, the probability of failure welding is reduced, and channel can also be prevented stifled
Plug, improves welded welding quality.
Embodiment 2
Semiconductor device provided in this embodiment, including welding structure described in embodiment 1.
Welding structure, including cover board 1 and bottom plate 2；There is the bottom plate 2 first end face, the first end face to be equipped with recessed
Slot 21, and the both ends of the groove 21 are respectively with the side wall of the bottom plate 2 through setting, the groove 21 and the first end face
Form opening；There is the cover board 1 second end face, the first end face to be oppositely arranged with the second end face, the second end
Face, which is equipped with protrusion 11, described raised 11, can close the opening, and have between the first end face and the second end face
There are gap, the gap to be welded by the solder layer 3 for solder layer 3, the cover board 1 and the bottom plate 2 to be arranged.
In welded cover plate 1 and bottom plate 2, solder layer 3 is heated, the pressure towards bottom plate 2 is applied to cover board 1, it is right
Bottom plate 2 applies the pressure towards cover board 1, and to weld together the two, protrusion 11 can form channel with groove 21 at this time.
Since in welding, the protrusion 11 in second end face can close opening, it can prevent the solder layer 3 in gap from flowing into groove 21
It is interior, to prevent the insufficient solder connection between cover board 1 and bottom plate 2, the probability of failure welding is reduced, and channel can also be prevented stifled
Plug, improves the welding quality of semiconductor device.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Present invention has been described in detail with reference to the aforementioned embodiments for pipe, it will be understood by those of ordinary skill in the art that：Its according to
So can with technical scheme described in the above embodiments is modified, either to which part or all technical features into
Row equivalent replacement；And these modifications or replacements, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of welding structure, which is characterized in that including cover board and bottom plate；
The bottom plate have first end face, the first end face be equipped with groove, and the both ends of the groove respectively with the bottom
The side wall of plate is formed with the first end face and is open through setting, the groove；
There is the cover board second end face, the first end face to be oppositely arranged with the second end face, be set in the second end face
There is protrusion, the protrusion can close the opening, and have gap between the first end face and the second end face, described
For solder layer to be arranged, the cover board and the bottom plate are welded by the solder layer in gap.
2. welding structure according to claim 1, which is characterized in that the protrusion stretches into the groove, and described convex
The side wall risen can close the opening.
3. welding structure according to claim 2, which is characterized in that vertically, the section of the protrusion and described
The section of groove is rectangle.
4. welding structure according to claim 2, which is characterized in that the welding structure further includes limit assembly, is used for
Limit the depth that the protrusion stretches into the groove.
5. welding structure according to claim 4, which is characterized in that the limit assembly includes the first shackle member and second
Shackle member；
First shackle member is arranged on the side wall of the groove, and the side wall in the protrusion is arranged in second shackle member
On, first shackle member and second shackle member can coordinate clamping.
6. welding structure according to claim 4, which is characterized in that the limit assembly includes baffle, and the baffle is solid
It is scheduled on the side wall of the groove.
7. welding structure according to claim 4, which is characterized in that the limit assembly includes baffle, and the baffle is solid
It is scheduled on the side wall of the protrusion.
8. welding structure according to claim 1, which is characterized in that first protrusion is covered in the overthe openings.
9. welding structure according to claim 1, which is characterized in that the cover board and the bottom plate are by semi-conducting material
It is made.
10. a kind of semiconductor device, which is characterized in that including the welding structure described in any one of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810390573.8A CN108520866A (en) | 2018-04-27 | 2018-04-27 | Welding structure and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810390573.8A CN108520866A (en) | 2018-04-27 | 2018-04-27 | Welding structure and semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108520866A true CN108520866A (en) | 2018-09-11 |
Family
ID=63429333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810390573.8A Pending CN108520866A (en) | 2018-04-27 | 2018-04-27 | Welding structure and semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108520866A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111644719A (en) * | 2020-04-21 | 2020-09-11 | 托伦斯半导体设备启东有限公司 | Brazing structure of cooling plate and manufacturing process thereof |
| CN112930390A (en) * | 2018-10-30 | 2021-06-08 | 东洋制罐集团控股株式会社 | Culture container, culture method and transportation method |
| CN115290946A (en) * | 2022-09-29 | 2022-11-04 | 深圳市道格特科技有限公司 | Precision bonding structure of probe, welding method and probe card |
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| CN115290946A (en) * | 2022-09-29 | 2022-11-04 | 深圳市道格特科技有限公司 | Precision bonding structure of probe, welding method and probe card |
| CN115290946B (en) * | 2022-09-29 | 2022-12-30 | 深圳市道格特科技有限公司 | Precise bonding structure of probe, welding method and probe card |
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Application publication date: 20180911 |
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| RJ01 | Rejection of invention patent application after publication |