TWI736022B - Cooling device and cooling system - Google Patents

Abstract

A cooling system includes cooling device and a plurality of electronic devices. The cooling device is used to cool the electronic devices. The cooling device includes a cooling tank. The cooling tank receives cooling fluid and the electronic devices. The cooling tank includes a bottom board, two opposite first side boards and other two opposite second side boards. The bottom board, two first side boards and two second side boards define a first receiving space. The first receiving space receives the electronic devices. Two first side boards are fixedly connected with bottom board by plastic welding. Two second side boards are fixedly connected with the bottom board by plastic welding. Two first side boards are fixedly connected with two second side boards. The cooling device provided by this invention not only has the advantages of lighter weight, lower manufacturing cost and higher manufacturing efficiency, but also effectively reduces the risk of weld leakage by adopting a cooling tank made of plastic welding.

Description

Cooling device and cooling system

The invention relates to a heat dissipation device and a heat dissipation system using the heat dissipation device.

At present, immersed liquid-cooled servers are the mainstream way for data centers to realize server heat dissipation. The current immersion liquid-cooled server manufacturing process uses stainless steel heat sinks to be fully welded to achieve the functions of sealing, load-bearing and pressure-bearing. However, this integrated welding method has problems of labor-consuming, time-consuming, low efficiency, and high cost. Prone to weld leakage.

In view of the above, it is necessary to provide a heat dissipation device with low cost, good pressure and load bearing effect and a heat dissipation system using the heat dissipation device.

A heat dissipation device is used for dissipating heat for a plurality of electronic devices, the heat dissipation device includes a heat dissipation groove, the heat dissipation groove is used for accommodating a cooling liquid and the plurality of electronic devices, the heat dissipation groove includes a bottom plate, and two oppositely arranged first One side plate and two opposite second side plates. The bottom plate, the two first side plates and the two second side plates jointly form a first accommodating space, and the first accommodating space is used for accommodating the plurality of electronic devices. The first side plate is fixedly connected to the bottom plate by plastic welding, the second side plate is fixedly connected to the bottom plate by plastic welding, and the first side plate is fixedly connected to the first side plate by plastic welding. The two side plates are fixedly connected.

Further, the heat dissipation groove further includes a first groove plate, a second groove plate, and two opposite third side plates. The first groove plate, the second groove plate, the two third side plates, and the two second side plates jointly form The second accommodating space; the first slot plate is vertically connected to the two second side plates by plastic welding, the The second groove plate is vertically connected to the two second side plates by plastic welding, and the two third side plates are vertically connected to the first groove plate and the second groove plate by plastic welding.

Further, the second side plate is provided with a liquid inlet and a first liquid outlet, the liquid inlet is used to introduce the cooling liquid into the heat sink, and the first liquid outlet is used to The cooling liquid flows out from the heat dissipation groove.

Further, a diversion module is arranged in the heat dissipation groove, and the diversion module is used to guide the cooling liquid into and out of the heat dissipation groove.

Further, the diversion module includes a liquid inlet diversion module, the liquid inlet diversion module includes a spacer, a baffle, a baffle, and a limiting box; the spacer is arranged in parallel on the heat sink On the bottom plate of the groove, and each spacer block is arranged at intervals to form a diversion channel, the baffle plate covers the diversion channel, and a diversion hole is formed on the baffle plate; the flow restriction box It is arranged on the second side plate and covers the liquid inlet.

Further, the spacer block includes a first spacer block and a second spacer block, and the first spacer block is used to erect the baffle so that the baffle does not contact the bottom plate of the heat sink; the second The spacer blocks are arranged in parallel on the bottom plate of the heat dissipation groove, and each second spacer block is arranged at intervals to form the diversion channel.

Further, the diversion module includes an outlet diversion module, the outlet diversion module includes a diversion groove and a diversion tube, and the diversion groove is provided with a communication port that is connected to the diversion tube. Hole; the flow guide tube is provided below the flow guide groove, the flow guide tube covers the first liquid outlet, the first liquid outlet, the flow guide groove and the flow guide tube Communicate with each other. When the height of the cooling liquid in the heat dissipation groove is higher than the diversion groove, the cooling liquid will be discharged from the diversion groove, the diversion tube and the first liquid outlet Cooling slot.

Further, the baffle, the restrictor box, the diversion groove, and the diversion tube are all fixedly connected to the second side plate by plastic welding, and the plastic welding adopts an inner and outer double V-shaped weld welding process .

The present application also provides a heat dissipation system using the heat dissipation device. The heat dissipation system includes a plurality of electronic devices and the heat dissipation device, and the heat dissipation device is used to dissipate heat for the plurality of electronic devices.

Further, the heat dissipation device further includes a second liquid outlet, and when the heat dissipation system includes a plurality of heat dissipation devices, the plurality of heat dissipation devices communicate with each other through the second liquid outlet to balance the heat dissipation device The height of the medium coolant.

The heat dissipation device provided by the present application uses a heat dissipation groove formed by splicing internal and external plastic welding processes. Compared with the heat dissipation device manufactured by the traditional method, the heat dissipation device is not only lighter in weight, but also effectively reduces the risk of weld leakage and reduces the manufacturing cost. , Improve manufacturing efficiency; the heat dissipation device is provided with a liquid inlet diversion module and a liquid outlet diversion module, so that the cooling liquid stays in the heat sink for a longer time, and the cooling liquid is more fully obtained Utilize, thereby saving coolant.

300: cooling system

100: heat sink

200: electronic equipment

10: heat sink

15: first opening

11: First Containment Space

111: bottom plate

112: The first side panel

113: second side panel

12: Second Containment Space

121: first slot board

122: second slot board

123: third side panel

127: Liquid inlet

128: The first liquid outlet

129: The second liquid outlet

132: Diversion Module

133: Inlet Diversion Module

135: Block

1351: first block

1352: Second Block

1353: diversion channel

136: Baffle

137: Deflector

1371: Guiding through holes

138: Limiting Box

134: Outlet Diversion Module

139: Diversion Trough

1391: third opening

140: draft tube

141: Temperature measuring device

142: Depth Gauge

143: Support

144: cable port

20: Bracket

21: The first bracket

22: second bracket

30: cover

32: transparent board

33: lock fastener

34: handle

40: The first plate to be welded

50: The second plate to be welded

Fig. 1 is a schematic diagram of a heat dissipation system according to a preferred embodiment of the present application.

Fig. 2 is an exploded view of a heat dissipation device according to a preferred embodiment of the present application.

Fig. 3 is an internal schematic diagram of a heat dissipation device according to a preferred embodiment of the present application.

Fig. 4 is a schematic diagram of the welding seam of the plastic welding method used in the heat sink in Fig. 2.

The following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of this application.

In this application, unless expressly stipulated and limited otherwise, for orientation words, such as the terms "above", "below", "upper", "lower", "lower surface", "clockwise", "inverse" The indicating position and positional relationship of the hour hand, "left", "right", etc. are based on the position or positional relationship shown in the drawings. They are only used to facilitate the description of the application and simplify the description, and do not indicate or imply that the indicated device or element must be Having a specific orientation, constructing and operating in a specific orientation, cannot be construed as limiting the specific protection scope of this application.

In this application, unless otherwise clearly defined and defined, the "upper" or "lower" of the first feature and the second feature may include direct contact between the first feature and the second feature, or include the first feature and the second feature It is not in direct contact but in contact with other characteristics between them. Moreover, the "above", "below" and "above" of the first feature on the second feature include the first feature directly above and diagonally above the second feature, or it simply means that the level of the first feature is higher than that of the second feature The height. The "above", "below" and "below" of the first feature and the second feature include the first feature directly below or obliquely below the second feature, or it simply means that the level of the first feature is lower than the second feature.

In this application, unless expressly stipulated and limited otherwise, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features . Thus, the definition of "first" and "second" features may explicitly or implicitly include one or more of these features.

In this application, unless expressly stipulated and limited otherwise, the term "connection" should be interpreted in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can also be a mechanical connection. ; It can be directly connected, or connected through an intermediate medium, and the two components can be connected internally. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in this application can be understood according to specific circumstances.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of this application. The terms used in the specification of the application herein are only for the purpose of describing specific embodiments, and are not intended to limit the application.

Please refer to FIG. 1. In a preferred embodiment of the present application, a heat dissipation system 300 includes a heat dissipation device 100 and a plurality of electronic devices 200. The heat dissipating device 100 is used to dissipate heat of the plurality of electronic devices 200. In this embodiment, the electronic device 200 may be a server.

The heat dissipation device 100 includes a heat dissipation slot 10, a bracket 20 and a cover 30. The heat sink 10 is used to contain a cooling liquid (not shown) and the plurality of electronic devices 200. The plurality of electronic devices 200 are immersed in the cooling liquid. The bracket 20 is sleeved on the outside of the heat dissipation groove 10 for receiving and supporting the heat dissipation groove 10. The heat dissipation slot 10 has a first opening 15, and one end of the cover plate 30 is movably connected to the bracket 20 and can cover the first opening 15 of the heat dissipation slot 10.

Please refer to FIG. 2, in this embodiment, the heat sink 10 includes a bottom plate 111, two oppositely disposed first side plates 112, and two oppositely disposed second side plates 113. The bottom plate 111, two first side plates 112, and two oppositely disposed second side plates 113 The second side plates 113 jointly form a first accommodating space 11, and the first accommodating space 11 is used for accommodating the electronic device 200. Specifically, the first side plate 112 is fixedly connected to the bottom plate 111 by plastic welding. The second side plate 113 is fixedly connected to the bottom plate 111 by plastic welding. The first side plate 112 is fixedly connected to the second side plate 113 by plastic welding.

In a preferred embodiment, the two second side plates 113 are both T-shaped. The heat dissipation slot 10 may further include a first slot plate 121, a second slot plate 122, and two opposite third side plates 123. The first slot plate 121, the second slot plate 122, the two opposite third side plates 123 and the two second side plates 113 jointly form the second receiving space 12. The first groove plate 121 is vertically connected to one end of the two second side plates 113 by plastic welding, and the second groove plate 122 is vertically connected to one of the two second side plates 113 by plastic welding. At the other end, the two third side plates 123 are vertically connected to the first groove plate 121 and the second groove plate 122 by plastic welding.

In this embodiment, the second side plate 113 may be provided with a liquid inlet 127, a first liquid outlet 128, and a second liquid outlet 129.

The liquid inlet 127, the first liquid outlet 128 and the second liquid outlet 129 are all arranged at the lower part of the second side plate 113. The liquid inlet 127 is used to introduce the cooling liquid into the heat dissipation tank 10, and the first liquid outlet 128 and the second liquid outlet 129 are used to discharge the cooling liquid from the heat dissipation tank 10.

Please refer to FIG. 3, in this embodiment, a diversion module 132, a temperature measuring device 141, a depth gauge 142, a support 143 and a cable port 144 are arranged in the heat sink 10. Specifically, the temperature measuring device 141, the depth gauge 142, the support 143 and the cable opening 144 are arranged on the second side plate 113.

The diversion module 132 is used to introduce the cooling liquid into the heat dissipation groove 10 or lead the cooling liquid out of the heat dissipation groove 10, and the diversion module 132 includes a liquid inlet diversion module 133 and Outlet diversion module 134.

The liquid inlet diversion module 133 is arranged corresponding to the liquid inlet 127, and the liquid inlet diversion module 133 includes a spacer 135, a baffle 136, a baffle 137 and a flow restriction box 138. The cushion block 135 includes a plurality of first cushion blocks 1351 and a plurality of second cushion blocks 1352. In this embodiment, the number of the first spacers 1351 is 4, and these first spacers 1351 can be respectively disposed on the four top corners of the bottom plate 111 of the heat dissipation slot 10. The baffle 136 is disposed on the first block 1351, so that the baffle 136 will not contact the bottom plate 111 of the heat sink 10. The baffle 136 is provided with a notch corresponding to the position of the liquid inlet 127. The plurality of second spacers 1352 are arranged side by side on the bottom plate 111 of the heat dissipation groove 10, and each second spacer 1352 is arranged at intervals to form a diversion channel 1353. The diversion channel 1353 forms a channel opening on the side close to the liquid inlet 127 to facilitate the cooling liquid to enter the diversion channel 1353 through the liquid inlet 127. The deflector 137 is laid on the second cushion block 1352, the deflector 137 is provided with a diversion hole 1371, and the diversion hole 1371 corresponds to the diversion channel 1353. The restrictor box 138 is fixedly arranged on the second side plate 113 and covers the liquid inlet 127. Wherein, the restrictor box 138 is provided with a second opening (not shown), and the second opening corresponds to the notch on the baffle 136 for introducing the cooling liquid into the guide through the liquid inlet 127 Flow channel 1353. When When the cooling liquid is input into the heat sink 10, the cooling liquid enters through the liquid inlet 127, then passes through the restrictor box 138, and passes through the second opening of the restrictor box 138 and the stopper. The gap of the plate 136 enters the diversion channel 1353. When the cooling liquid overflows the diversion channel 1353, the cooling liquid overflows upward through the diversion hole 1371, and finally the cooling liquid gradually immerses the electronic equipment in the heat sink 10 from bottom to top.

The liquid outlet diversion module 134 is provided corresponding to the first liquid outlet 128. The outlet diversion module 134 includes a diversion groove 139 and a diversion tube 140. The diversion groove 139 is arranged on the upper part of the second side plate 113 and is arranged above the first liquid outlet 128. The diversion groove 139 has a third opening 1391, and the top of the diversion groove 139 is parallel to the first groove plate 121 and the second groove plate 122. The diversion groove 139 is provided with a through hole (not shown) on a surface close to the first liquid outlet 128. The diversion tube 140 is disposed under the diversion groove 139. Specifically, the flow guide tube 140 is arranged corresponding to the through hole of the flow guide groove 139, and the flow guide groove 139 is communicated with the flow guide tube 140. The guide tube 140 covers the first liquid outlet 128, so that the first liquid outlet 128, the guide tube 140, and the guide groove 139 communicate with each other. When the liquid level of the cooling liquid is higher than the diversion groove 139, the cooling liquid will be discharged from the heat dissipation groove 10 through the diversion groove 139, the diversion tube 140 and the first liquid outlet 128.

The temperature measuring device 141 is used to measure the temperature of the cooling liquid. In one embodiment, the temperature measuring device may be disposed at the intersection of the first side plate 112 and the second side plate 113.

The depth gauge 142 is arranged above the diversion groove 139. In one embodiment, the depth gauge 142 may be an iron sheet with a depth value engraved on it, so that by observing the depth value, The height of the cooling liquid in the heat sink 10 can be obtained.

The supporting member 143 is used to carry the plurality of electronic devices 200. In this embodiment, the supporting member 143 is disposed on the surface of the first side plate 112. The cable opening 144 is disposed on the upper part of the first side plate 112 and is used for accommodating the cables of the plurality of electronic devices 200.

Please refer to FIG. 2 again. The bracket 20 includes a first bracket 21 and a second bracket 22. The first bracket 21 and the second bracket 22 are both rectangular bodies with edges formed by square tubes. The first bracket 21 is used for supporting and accommodating the heat dissipation slot 10, and the top of the first bracket 21 abuts the first slot plate 121 and the second slot plate 122 of the heat dissipation slot. The second bracket 22 is used for accommodating the first bracket 21 and the heat dissipation slot 10.

In this embodiment, both the first bracket 21 and the second bracket 22 can be metal tube outer frames.

The cover plate 30 is movably connected to one end of the top of the second bracket 22, so as to cover the heat dissipation slot 10. In this embodiment, a transparent plate 32 is embedded on the cover plate 30, so that the inside of the heat dissipation groove 10 can be observed.

The cover plate 30 is further provided with a locking member 33 for locking the cover plate 30 with the second bracket 22 to improve the safety of the heat dissipation device 100. Specifically, in this embodiment, the locking member 33 is disposed on a side of the cover plate 30 close to the upper front plate 124, and the second bracket 22 is close to a side of the upper front plate 124 .

In this embodiment, the cover plate 30 is further provided with a handle 34 for opening the cover plate 30.

In this embodiment, the heat sink 10 can be made by the following method: first select a thermoplastic plastic sheet of suitable thickness according to the pressure and pressure requirements; then cut the thermoplastic plastic sheet according to the required size; The requirement for internal and external welding is to chamfer the C-angle on the edge of the plate (as shown in Figure 4) to fill the electrode material to make it together; finally adjust the hot gas temperature of the welding gun to 350 degrees, and the air flow rate to 16-60 liters/ Divide intervals; adjust the angle between the welding rod and the weldment as close to 90 degrees as possible; blow the hot gas of the welding torch to the welding rod and the weldment at the same time; when the welding rod and the weldment are melted at the same time, the welding torch is The speed of 0.1-0.3m/min moves along the welding seam in the form of a pendulum and gradually presses the welding rod into the welding seam, so that the welding rod and the weldment are closely connected.

The heat sink 10 is made by splicing hot-melt plastic plates using the above-mentioned inner and outer plastic welding process. The plastic welding process can heat the hot-melt plastic sheet to reach the melting point, so that the molecules in the plastic sheet are separated and then pressed together again by external force. After the hot-melt plastic sheet is heated to the melting point, the molecules of the hot-melt plastic will expand and loosen, and the molecular voids produced by it will have the viscosity of accommodating the same kind. At this time, pressure can be applied to re-join the molecules together, and after the temperature is cooled to normal temperature, the welding is completed and a new structure is formed. The molecules of this new structure have not changed, so the weld has the same chemical and physical properties as the original material, so the weld is not prone to leakage problems.

Plastic welding splicing plates usually use electric heating. The compressed air or inert gas is heated by the resistance wire of the welding torch to the temperature required for welding the plastic. Then the preheated gas is used to heat the weldment and the electrode to make it sticky. State and combine.

Please refer to FIG. 4 again. Further, during the plastic welding process of the heat dissipation groove 10, the welding seam adopts an inner and outer double V-shaped form. Specifically, the welding edges of the first plate to be welded 40 and the second plate to be welded 50 are cut to form a chamfered C angle, and the two plates with chamfered C angles are joined together to form an inner and outer double V-shaped weld. The welding seam is used to fill the electrode material to bond the plates together.

Furthermore, the materials used for plastic welding to form the heat sink 10 in this embodiment include, but are not limited to, hot-melt plastic plates such as polypropylene, modified polypropylene, polyethylene, and polyethylene terephthalate. The heat sink 10 made by plastic welding adopted in this embodiment has the advantages of low price, light weight, easy processing, easy welding and chemical resistance.

In this embodiment, the baffle 136, the restrictor box 138, the diversion groove 139, and the diversion tube 140 are all assembled with the heat dissipation groove 10 by a plastic plate through a plastic welding process.

In one embodiment, the cooling liquid may be a non-conductive insulating liquid, so that the electronic device 200 immersed in the cooling liquid will not have a short circuit and other faults during operation.

In one embodiment, the heat dissipation system 300 includes a plurality of heat dissipation devices 100, a cooling loop device (not shown), and a plurality of electronic devices 200. The cooling loop device is used to receive the The cooling liquid with a certain temperature outputted by a plurality of heat dissipation devices 100, and cool the cooling liquid, so as to transport the cooled cooling liquid to the heat sink 10, so as to achieve the circulating use of the cooling liquid .

In one embodiment, the plurality of heat dissipation devices 100 are also communicated with each other through the second liquid outlet 129, so that the height of the cooling liquid in the plurality of heat dissipation grooves 10 is consistent, so as to achieve the purpose of saving cooling liquid.

It can be understood that the heat dissipation device 100 provided by the present application, by using the heat dissipation groove 10 made by splicing the inner and outer plastic welding processes, is not only lighter in weight than the heat dissipation device manufactured by the traditional method, but also effectively reduces the leakage of the welding seam. It also reduces the manufacturing cost and improves manufacturing efficiency.

It can be understood that, in the heat dissipation device 100 provided in the present application, by providing the liquid inlet diversion module 133 and the liquid outlet diversion module 134, the cooling liquid stays in the heat dissipation tank 10 for a longer time, and the cooling The liquid is more fully utilized, thereby saving the cooling liquid.

The above embodiments are only used to illustrate the technical solutions of the application and not to limit them. Although the application has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the application can be modified or equivalently replaced None should deviate from the spirit and scope of the technical solution of this application. Those skilled in the art can also make other changes within the spirit of the application for the design of the application, as long as they do not deviate from the technical effect of the application. These changes based on the spirit of this application should all be included in the scope of protection claimed by this application.

100: heat sink

200: electronic equipment

300: cooling system

10: heat sink

15: first opening

20: Bracket

30: cover

Claims (9)

A heat dissipation device for dissipating heat for a plurality of electronic devices, the heat dissipation device includes a heat dissipation groove, the heat dissipation groove is used for accommodating the cooling liquid and the plurality of electronic devices, the improvement is that the heat dissipation groove includes a bottom plate, two A first side plate and two opposite second side plates are arranged oppositely. The bottom plate, the two first side plates and the two second side plates jointly form a first accommodating space, and the first accommodating space is used for accommodating the plurality of For electronic equipment, the first side plate is fixedly connected to the bottom plate by plastic welding, the second side plate is fixedly connected to the bottom plate by plastic welding, and the first side plate is fixedly connected to the bottom plate by plastic welding It is fixedly connected to the second side plate, wherein the second side plate is provided with a liquid inlet and a first liquid outlet, and the liquid inlet is used to introduce the cooling liquid into the heat dissipation groove, and the The first liquid outlet is used for draining the cooling liquid from the heat sink. The heat dissipation device according to claim 1, wherein the heat dissipation groove further includes a first groove plate, a second groove plate, and two opposite third side plates, the first groove plate, the second groove plate, and two third side plates. The three side plates and the two second side plates jointly form a second accommodating space; the first groove plate is vertically connected to the two second side plates by plastic welding, and the second groove plate is vertically connected by plastic welding On the two second side plates, the two third side plates are vertically connected to the first groove plate and the second groove plate by plastic welding. The heat dissipation device according to claim 1, wherein a diversion module is provided in the heat dissipation groove, and the diversion module is used to introduce the cooling liquid into the heat dissipation groove or take the cooling liquid from the heat dissipation groove. Lead out in the heat sink. The heat dissipation device according to claim 3, wherein the diversion module includes a liquid inlet diversion module, and the liquid intake diversion module includes a spacer, a baffle, a baffle, and a restriction box; The spacer blocks are arranged in parallel on the bottom plate of the heat dissipation groove, and each spacer block is arranged at intervals to form a diversion channel, the baffle plate covers the diversion channel, and the baffle plate is formed with The flow-guiding hole; the restrictor box is arranged on the second side plate and covers the liquid inlet. The heat dissipation device according to claim 4, wherein the spacer block includes a first spacer block and a second spacer block, and the first spacer block is used to erect the baffle so that the baffle does not contact all The heat dissipation groove bottom plate; the second pad blocks are arranged side by side on the bottom plate of the heat dissipation groove, and each second pad block is arranged at intervals to form the diversion channel. The heat dissipation device according to claim 3, wherein the diversion module includes a liquid diversion module, the liquid diversion module includes a diversion groove and a diversion tube, and the diversion groove is provided with A through hole connected to the flow guide tube; the flow guide tube is arranged below the flow guide groove, the flow guide tube covers the first liquid outlet, the first liquid outlet, the The diversion groove and the diversion tube are in communication with each other. When the height of the cooling liquid in the heat dissipation groove is higher than the diversion groove, the cooling liquid will pass through the diversion groove, the diversion tube and the The first liquid outlet exits the heat dissipation groove. The heat dissipation device according to claim 4 or 6, wherein the baffle, the restrictor box, the diversion groove, and the diversion tube are all fixedly connected to the second side plate by plastic welding, and the plastic welding The method adopts the internal and external double V-shaped welding seam welding process. A heat dissipation system, the improvement is that the heat dissipation system includes a plurality of electronic devices and a plurality of heat dissipation devices according to any one of claims 1-6, and the plurality of heat dissipation devices are used for providing the plurality of electronic devices. Perform heat dissipation. The heat dissipation system according to claim 8, wherein each of the heat dissipation devices further includes a second liquid outlet, and the plurality of heat dissipation devices are communicated with each other through the second liquid outlet to balance each The height of the cooling liquid in the heat sink.

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