JP2010239071A - Optical device - Google Patents

Optical device Download PDF

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Publication number
JP2010239071A
JP2010239071A JP2009088086A JP2009088086A JP2010239071A JP 2010239071 A JP2010239071 A JP 2010239071A JP 2009088086 A JP2009088086 A JP 2009088086A JP 2009088086 A JP2009088086 A JP 2009088086A JP 2010239071 A JP2010239071 A JP 2010239071A
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Japan
Prior art keywords
lid
housing
optical
optical device
electrode
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Japanese (ja)
Inventor
Kei Kato
圭 加藤
Masaru Shiraishi
勝 白石
Yasuhiro Ishikawa
泰弘 石川
Toru Sugamata
徹 菅又
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Sumitomo Osaka Cement Co Ltd
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Sumitomo Osaka Cement Co Ltd
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Priority to JP2009088086A priority Critical patent/JP2010239071A/en
Publication of JP2010239071A publication Critical patent/JP2010239071A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Abstract

<P>PROBLEM TO BE SOLVED: To prevent that the characteristics of an optical device deteriorate by splashing generated, in a process for welding a housing and a lid. <P>SOLUTION: In the optical device 1, an optical component 30 having an electrode on the top surface and an electric component 40, having an electrode on the top surface are installed in the interior of a housing 10, having an opening surface wherein the electrode at the optical component is connected to the electrode at the electric component, a lid 20 for covering the opening surface is welded to the housing 10; at the lid 20, a projected part 20A or a recessed part is formed on a contact surface welded to the housing 10; and at the housing 10, a recessed part 10A is formed on a contact surface welded to the lid 20 for engaging with the projected part 20A on the lid 20, or a projected part is formed on a contact surface welded to the lid to engage with the recessed part at the lid 20. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、筐体内に光学部品を収容した光学装置に関し、特に、光学装置の筐体を溶接する技術に関する。   The present invention relates to an optical device in which an optical component is accommodated in a housing, and particularly to a technique for welding the housing of the optical device.

例えば光通信用の光学装置（光変調器、光送信器、光受信器、光合分波器、光増幅器など）は、動作特性の長期信頼性を確保するために、シーム溶接等により筐体を気密封止している。図３に、従来の光学装置１０１の断面構成図を示す。図３において、光学装置１０１は、筐体１１０の内部底面に光学部品３０や光学部品３０に電気信号を供給して光学部品３０を制御する電気部品４０等が設置され、筐体１１０上面の開口を覆うように設けられた蓋１２０と筐体１１０とがＡ部及びＢ部でシーム溶接（抵抗溶接）されて、構成されている。
シーム溶接の従来技術として、例えば特許文献１が知られている。 For example, optical devices for optical communications (optical modulators, optical transmitters, optical receivers, optical multiplexers / demultiplexers, optical amplifiers, etc.) are cased by seam welding to ensure long-term reliability of operating characteristics. It is hermetically sealed. FIG. 3 shows a cross-sectional configuration diagram of a conventional optical device 101. In FIG. 3, the optical device 101 includes an optical component 30 on the inner bottom surface of the housing 110, an electrical component 40 that controls the optical component 30 by supplying an electrical signal to the optical component 30, and the like. The lid 120 and the casing 110 provided so as to cover the seam are seam welded (resistance welded) at the A part and the B part.
As a prior art of seam welding, for example, Patent Document 1 is known.

特開平８−２７４２０８号公報JP-A-8-274208

ここで、筐体１１０と蓋１２０をシーム溶接する際、溶接されるＡ部及びＢ部において、溶融した筐体１１０の一部や蓋１２０の一部から金属の微粒子が噴出して、その飛沫（スプラッシュ）が光学部品３０や電気部品４０の表面（上面）に飛散することがある。光学部品３０や電気部品４０の上面には、電気部品４０から光学部品３０へ電気信号を供給するための電極（不図示）が形成されており、また、それら電極間には、金属配線（不図示）が接続されている。そのため、溶接工程で上記のようにスプラッシュが発生して電極や配線に付着すると、光学装置１０１に電気的な不具合が生じてしまうおそれがある。   Here, when seam-welding the casing 110 and the lid 120, metal fine particles are ejected from a part of the melted casing 110 and a part of the lid 120 in the welded A part and B part. (Splash) may be scattered on the surface (upper surface) of the optical component 30 or the electrical component 40. Electrodes (not shown) for supplying electrical signals from the electrical component 40 to the optical component 30 are formed on the upper surfaces of the optical component 30 and the electrical component 40, and metal wiring (not shown) is provided between these electrodes. Are connected. Therefore, if splash occurs in the welding process as described above and adheres to the electrode or wiring, there is a possibility that an electrical failure may occur in the optical device 101.

本発明は上記の点に鑑みてなされたものであり、その目的は、筐体と蓋を溶接する工程において発生するスプラッシュによって光学装置の特性が劣化してしまうことを防止することにある。   The present invention has been made in view of the above points, and an object of the present invention is to prevent the characteristics of the optical device from being deteriorated by splash generated in the process of welding the casing and the lid.

本発明は上記の課題を解決するためになされたものであり、上面に電極を有する光学部品と前記電極に接続された電極を上面に有する電気部品とが開口面を有する筐体の内部に設置され、前記開口面を覆う蓋を前記筐体に溶接してなる光学装置において、前記蓋には、前記筐体と溶接される接触面に凸部又は凹部が形成され、前記筐体には、前記蓋と溶接される接触面に前記蓋の凸部と嵌合する凹部又は前記蓋の凹部と嵌合する凸部が形成されていることを特徴とする。
また、本発明は、上記の光学装置において、前記蓋の凸部又は凹部、及び前記筐体の凹部又は凸部は、前記開口の外周に沿って形成されていることを特徴とする。 The present invention has been made to solve the above problems, and an optical component having an electrode on the upper surface and an electric component having an electrode connected to the electrode on the upper surface are installed inside a housing having an opening surface. In the optical device in which a lid covering the opening surface is welded to the housing, the lid has a convex portion or a concave portion formed on a contact surface welded to the housing, The contact surface to be welded with the lid is formed with a concave portion that fits with the convex portion of the lid or a convex portion that fits with the concave portion of the lid.
In the optical device according to the aspect of the invention, the convex portion or the concave portion of the lid and the concave portion or the convex portion of the casing are formed along the outer periphery of the opening.

また、本発明は、上面に電極を有する光学部品と前記電極に接続された電極を上面に有する電気部品とが開口面を有する筐体の内部に設置され、前記開口面を覆う蓋を前記筐体に溶接してなる光学装置において、前記筐体の壁の少なくとも一部は、外壁面の最上部が内壁面の最上部よりも低い位置となるようにその上面が形成されていることを特徴とする。
また、本発明は、上記の光学装置において、前記筐体の壁は、その全周にわたって外壁面の最上部が内壁面の最上部よりも低い位置となるようにその上面が形成されていることを特徴とする。
また、本発明は、上記の光学装置において、前記筐体の壁の上面には、外壁面の最上部が内壁面の最上部よりも低い位置となるように段差が形成され、前記蓋には、前記筐体の段差と対向するように凸部が形成されていることを特徴とする。
また、本発明は、上記の光学装置において、前記筐体の段差及び前記蓋の凸部は、前記開口の外周に沿って形成されていることを特徴とする。 In the present invention, an optical component having an electrode on the upper surface and an electric component having an electrode connected to the electrode on the upper surface are installed inside a housing having an opening surface, and a lid covering the opening surface is provided on the housing. In the optical device welded to the body, at least a part of the wall of the housing has an upper surface formed such that the uppermost portion of the outer wall surface is positioned lower than the uppermost portion of the inner wall surface. And
In the optical device according to the present invention, the upper surface of the wall of the housing is formed so that the uppermost part of the outer wall surface is lower than the uppermost part of the inner wall surface over the entire circumference. It is characterized by.
According to the present invention, in the optical device described above, a step is formed on the top surface of the wall of the housing so that the uppermost portion of the outer wall surface is lower than the uppermost portion of the inner wall surface. A convex portion is formed to face the step of the casing.
In the optical device according to the present invention, the step of the casing and the convex portion of the lid are formed along the outer periphery of the opening.

本発明によれば、筐体及び蓋の溶接される接触面に互いに嵌合する凸部と凹部、あるいは互いに対向する段差と凸部を設けたので、溶接により発生する金属微粒子の飛沫（スプラッシュ）は、この凸部と凹部の嵌合部分あるいは段差と凸部の対向部分に入り込んで、光学部品や電気部品が設置されている筐体内部空間へ飛び出してくることがない。したがって、スプラッシュが光学部品や電気部品の表面へ飛散せず、電気的な不具合が生じないため、溶接工程による光学装置の特性劣化を防止することができる。   According to the present invention, the contact surface to be welded of the housing and the lid is provided with the convex portion and the concave portion that are fitted to each other, or the step and the convex portion that face each other, so that the splash of metal fine particles generated by welding (splash) Does not enter the fitting portion of the convex portion and the concave portion or the portion where the step and the convex portion are opposed to each other, and jump out into the internal space of the housing in which the optical component and the electrical component are installed. Accordingly, the splash does not scatter to the surface of the optical component or the electrical component, and no electrical failure occurs, so that the characteristic deterioration of the optical device due to the welding process can be prevented.

本発明の一実施形態による光学装置の断面構成図である。It is a section lineblock diagram of an optical device by one embodiment of the present invention. 本発明の変形例を示す図である。It is a figure which shows the modification of this invention. 従来の光学装置の断面構成図である。It is a cross-sectional block diagram of the conventional optical apparatus.

以下、図面を参照しながら本発明の実施形態について詳しく説明する。
図１は、本発明の一実施形態による光学装置１の断面構成図である。
光学装置１は、上面が開口した金属製の筐体１０の内部底面に光学部品３０と電気部品４０が設置され、筐体１０の開口を覆うように金属製の蓋２０が筐体１０と溶接された構造を有する。本実施形態において、光学装置１は、光通信用の光学装置である。光通信用の光学装置として、例えば、光変調器、光送信器、光受信器、光合分波器、光増幅器などがあり、光学部品３０や電気部品４０は、適宜、それらのいずれかに応じた部品が利用される。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a cross-sectional configuration diagram of an optical device 1 according to an embodiment of the present invention.
In the optical device 1, the optical component 30 and the electrical component 40 are installed on the inner bottom surface of the metal housing 10 whose upper surface is open, and the metal lid 20 is welded to the housing 10 so as to cover the opening of the housing 10. Has a structured. In the present embodiment, the optical device 1 is an optical device for optical communication. Examples of the optical device for optical communication include an optical modulator, an optical transmitter, an optical receiver, an optical multiplexer / demultiplexer, an optical amplifier, and the like, and the optical component 30 and the electrical component 40 are in accordance with any one of them. Parts are used.

光学部品３０は、例えばニオブ酸リチウム基板を用いた光導波路素子であり、その表面に所定形状の電極パターンが形成され、その一部が露出している。
電気部品４０は、光学部品３０に電気信号を供給する回路基板であり、その上部表面には電極が形成されている。
光学部品３０側の電極の上記露出部分と電気部品４０側の電極は、例えばワイヤボンディング等の金属配線によって接続されている。
これにより、電気部品４０から光学部品３０の電極パターンへ電気信号が供給され、電極パターンに供給された電気信号によって光学部品３０の光導波路に電界が印加されて、この電界に応じて変化する光導波路の屈折率変化を受けて、光導波路を伝搬する光の位相が制御される。 The optical component 30 is an optical waveguide element using, for example, a lithium niobate substrate, and an electrode pattern having a predetermined shape is formed on the surface thereof, and a part of the electrode pattern is exposed.
The electrical component 40 is a circuit board that supplies an electrical signal to the optical component 30, and electrodes are formed on the upper surface thereof.
The exposed portion of the electrode on the optical component 30 side and the electrode on the electric component 40 side are connected by, for example, metal wiring such as wire bonding.
As a result, an electric signal is supplied from the electric component 40 to the electrode pattern of the optical component 30, and an electric field is applied to the optical waveguide of the optical component 30 by the electric signal supplied to the electrode pattern. In response to a change in the refractive index of the waveguide, the phase of light propagating through the optical waveguide is controlled.

筐体１０と蓋２０は、筐体１０の開口の外周、即ち図１中のＡ部及びＢ部で互いに接触している。図１のＡ部拡大図に示すように、この接触面において、蓋２０の側には、凸部２０Ａが形成されており、また、筐体１０の側には、蓋２０の凸部２０Ａと嵌合するように凹部１０Ａが形成されている（点線Ｃ部）。なお、ここでいう「嵌合」とは、図１のように凸部２０Ａと凹部１０Ａの間に遊び（隙間）があるいわゆる「すきま嵌め」の状態を指すが、凸部２０Ａと凹部１０Ａの間に遊びがないいわゆる「締まり嵌め」の状態であってもよい。   The housing 10 and the lid 20 are in contact with each other at the outer periphery of the opening of the housing 10, that is, at portions A and B in FIG. 1. As shown in the enlarged view of part A in FIG. 1, a convex part 20A is formed on the lid 20 side on the contact surface, and the convex part 20A of the lid 20 is formed on the housing 10 side. A concave portion 10A is formed so as to be fitted (dotted line C portion). The term “fitting” as used herein refers to a so-called “clear fit” state in which there is play (gap) between the convex portion 20A and the concave portion 10A as shown in FIG. It may be in a so-called “tight fit” state with no play in between.

凸部２０Ａと凹部１０Ａは、筐体１０の上面の開口を取り囲むように当該開口の外周に沿って設けられていることが望ましいが、光学部品３０や電気部品４０から十分に（溶接時に金属微粒子の飛沫が光学部品３０等に到達しない程度に）離れた場所では、凸部２０Ａや凹部１０Ａはなくてもよい。   The convex portion 20A and the concave portion 10A are preferably provided along the outer periphery of the opening so as to surround the opening on the upper surface of the housing 10, but are sufficiently removed from the optical component 30 and the electric component 40 (metal fine particles during welding). The protrusion 20A and the recess 10A may not be provided at a place far away (so that the splash does not reach the optical component 30 or the like).

上記構成の光学装置１を製造する組立て工程を説明する。
まず、筐体１０に光学部品３０と電気部品４０を所定の方法（例えば、接着剤による接着固定やレーザ溶接など）により固定する。
次に、光学部品３０の電極と電気部品４０の電極をワイヤボンディング等で接続する。
その後、筐体１０と蓋２０をそれぞれの凹部１０Ａと凸部２０Ａが噛み合うように嵌め合わせ、その接触部分（Ａ部及びＢ部）をシーム溶接（抵抗溶接）によって溶接し両者を接合することで、光学装置１が完成する。なお、シーム溶接に代えて、例えばＹＡＧレーザを用いたレーザ溶接により筐体１０と蓋２０を接合するようにしてもよい。 An assembly process for manufacturing the optical device 1 having the above configuration will be described.
First, the optical component 30 and the electrical component 40 are fixed to the housing 10 by a predetermined method (for example, adhesive fixing with an adhesive or laser welding).
Next, the electrode of the optical component 30 and the electrode of the electrical component 40 are connected by wire bonding or the like.
After that, the housing 10 and the lid 20 are fitted so that the concave portions 10A and the convex portions 20A are engaged with each other, and the contact portions (A portion and B portion) are welded by seam welding (resistance welding) to join the two. The optical device 1 is completed. Note that the casing 10 and the lid 20 may be joined by laser welding using, for example, a YAG laser instead of seam welding.

ここで、筐体１０と蓋２０を溶接する工程では、溶接箇所（Ａ部及びＢ部）の溶融した筐体１０と蓋２０から金属微粒子が噴出することもある。しかし、図１のＡ部拡大図において、凸部２０Ａと凹部１０Ａの嵌合部分（図中点線Ｃ部）より右側の領域で発生した金属微粒子の飛沫は、筐体１０と蓋２０の接触面の間隙を図の左方向へ向けて飛び出した場合、その噴出箇所から当該間隙を左側へ直線的に進んだ後に蓋２０の凸部２０Ａに衝突することになる。よって、嵌合部分の存在により、金属微粒子の飛沫は、筐体１０と蓋２０の接触面の間隙を抜けて筐体１０内側の空間へ飛び出すことができない。そのため、この金属微粒子の飛沫が光学部品３０や電気部品４０の表面に飛散してしまうことが防止される。   Here, in the process of welding the housing 10 and the lid 20, metal fine particles may be ejected from the housing 10 and the lid 20 where the welded portions (A part and B part) are melted. However, in the enlarged view of part A in FIG. 1, the splash of metal fine particles generated in the region on the right side from the fitting part (dotted line C part in the figure) between the convex part 20 </ b> A and the concave part 10 </ b> A is the contact surface of the housing 10 and the lid 20. When the gap jumps out in the left direction in the figure, it travels linearly to the left side from the jetting point and then collides with the convex portion 20A of the lid 20. Therefore, due to the presence of the fitting portion, the metal fine particle splash cannot escape through the gap between the contact surfaces of the housing 10 and the lid 20 and into the space inside the housing 10. Therefore, the splash of the metal fine particles is prevented from being scattered on the surfaces of the optical component 30 and the electrical component 40.

以上、図面を参照してこの発明の一実施形態について詳しく説明してきたが、具体的な構成は上述のものに限られることはなく、この発明の要旨を逸脱しない範囲内において様々な設計変更等をすることが可能である。
例えば、筐体１０の側に凸部を形成し、蓋２０の側に凹部を形成した構成としてもよい。
また、凸部と凹部を複数列（図１のＡ部拡大図において左右に複数並べて）設けてもよい。 As described above, the embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to the above, and various design changes and the like can be made without departing from the scope of the present invention. It is possible to
For example, it is good also as a structure which formed the convex part in the housing | casing 10 side and formed the recessed part in the lid | cover 20 side.
Further, a plurality of rows of convex portions and concave portions may be provided (a plurality of rows are arranged side by side in the enlarged view of the portion A in FIG. 1).

また、図２のように、筐体１０に外壁面の最上部が内壁面の最上部よりも低い位置（図の下側）となるように段差１０Ｂを形成し、この段差１０Ｂと対向するように蓋２０に凸部２０Ｂを形成した構成としてもよい。この構成においても、筐体１０の外壁面側で発生した金属微粒子の飛沫は、筐体１０と蓋２０の接触面の間隙を図の左方向へ向けて進むと段差１０Ｂの壁に衝突することになり、図１の場合と同様、筐体１０内側の空間へ飛び出すことができない。よって、この金属微粒子の飛沫が光学部品３０や電気部品４０の表面に飛散してしまうことが防止される。また、図２のような段差に代えて、例えば、筐体１０の内壁面の最上部とそれよりも低い位置（図２では下側）にある外壁面の最上部との間を傾斜面（平面又は曲面）として構成してもよい。   Further, as shown in FIG. 2, a step 10B is formed in the housing 10 so that the uppermost portion of the outer wall surface is lower than the uppermost portion of the inner wall surface (the lower side in the figure), and faces the step 10B. Alternatively, the protrusion 20B may be formed on the lid 20. Even in this configuration, the splash of the metal fine particles generated on the outer wall surface side of the housing 10 collides with the wall of the step 10B when the gap between the contact surfaces of the housing 10 and the lid 20 proceeds in the left direction in the figure. Thus, as in the case of FIG. 1, it cannot jump out into the space inside the housing 10. Therefore, the splash of the metal fine particles is prevented from being scattered on the surfaces of the optical component 30 and the electrical component 40. Further, instead of the step as shown in FIG. 2, for example, an inclined surface (between the uppermost portion of the inner wall surface of the housing 10 and the uppermost portion of the outer wall surface at a lower position (lower side in FIG. 2)) You may comprise as a plane or a curved surface.

１…光学装置 １０…筐体 １０Ａ…凹部 １０Ｂ…段差 ２０…蓋 ２０Ａ…凸部 ２０Ｂ…凸部 ３０…光学部品 ４０…電気部品   DESCRIPTION OF SYMBOLS 1 ... Optical apparatus 10 ... Housing | casing 10A ... Concave part 10B ... Level difference 20 ... Lid 20A ... Convex part 20B ... Convex part 30 ... Optical component 40 ... Electrical component

Claims (6)

上面に電極を有する光学部品と前記電極に接続された電極を上面に有する電気部品とが開口面を有する筐体の内部に設置され、前記開口面を覆う蓋を前記筐体に溶接してなる光学装置において、
前記蓋には、前記筐体と溶接される接触面に凸部又は凹部が形成され、
前記筐体には、前記蓋と溶接される接触面に前記蓋の凸部と嵌合する凹部又は前記蓋の凹部と嵌合する凸部が形成されている
ことを特徴とする光学装置。 An optical component having an electrode on the upper surface and an electric component having an electrode connected to the electrode on the upper surface are installed inside a housing having an opening surface, and a lid covering the opening surface is welded to the housing In an optical device,
The lid is formed with a convex portion or a concave portion on a contact surface to be welded with the casing,
The optical device is characterized in that a concave portion that fits the convex portion of the lid or a convex portion that fits the concave portion of the lid is formed on the contact surface welded to the lid. 前記蓋の凸部又は凹部、及び前記筐体の凹部又は凸部は、前記開口の外周に沿って形成されていることを特徴とする請求項１に記載の光学装置。   The optical device according to claim 1, wherein the convex portion or the concave portion of the lid and the concave portion or the convex portion of the casing are formed along an outer periphery of the opening. 上面に電極を有する光学部品と前記電極に接続された電極を上面に有する電気部品とが開口面を有する筐体の内部に設置され、前記開口面を覆う蓋を前記筐体に溶接してなる光学装置において、
前記筐体の壁の少なくとも一部は、外壁面の最上部が内壁面の最上部よりも低い位置となるようにその上面が形成されている
ことを特徴とする光学装置。 An optical component having an electrode on the upper surface and an electric component having an electrode connected to the electrode on the upper surface are installed inside a housing having an opening surface, and a lid covering the opening surface is welded to the housing In an optical device,
At least a part of the wall of the housing has an upper surface formed so that the uppermost part of the outer wall surface is positioned lower than the uppermost part of the inner wall surface. 前記筐体の壁は、その全周にわたって外壁面の最上部が内壁面の最上部よりも低い位置となるようにその上面が形成されている
ことを特徴とする請求項３に記載の光学装置。 The optical device according to claim 3, wherein the upper surface of the wall of the housing is formed such that the uppermost part of the outer wall surface is lower than the uppermost part of the inner wall surface over the entire circumference. . 前記筐体の壁の上面には、外壁面の最上部が内壁面の最上部よりも低い位置となるように段差が形成され、
前記蓋には、前記筐体の段差と対向するように凸部が形成されている
ことを特徴とする請求項３に記載の光学装置。 On the upper surface of the wall of the housing, a step is formed so that the uppermost part of the outer wall surface is lower than the uppermost part of the inner wall surface,
The optical device according to claim 3, wherein a convex portion is formed on the lid so as to face a step of the casing. 前記筐体の段差及び前記蓋の凸部は、前記開口の外周に沿って形成されていることを特徴とする請求項５に記載の光学装置。   The optical device according to claim 5, wherein the step of the casing and the convex portion of the lid are formed along an outer periphery of the opening.
JP2009088086A 2009-03-31 2009-03-31 Optical device Pending JP2010239071A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108520866A (en) * 2018-04-27 2018-09-11 宁波江丰电子材料股份有限公司 Welding structure and semiconductor device
JP7099565B1 (en) 2021-01-29 2022-07-12 住友大阪セメント株式会社 Optical modulator and optical transmitter using it

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108520866A (en) * 2018-04-27 2018-09-11 宁波江丰电子材料股份有限公司 Welding structure and semiconductor device
JP7099565B1 (en) 2021-01-29 2022-07-12 住友大阪セメント株式会社 Optical modulator and optical transmitter using it
WO2022163393A1 (en) * 2021-01-29 2022-08-04 住友大阪セメント株式会社 Optical modulator and optical transmission device using same
JP2022117100A (en) * 2021-01-29 2022-08-10 住友大阪セメント株式会社 Optical modulator and optical transmission device using the same

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