CN108922860A - A kind of auto loading fixture of full array pin ceramic shell - Google Patents
A kind of auto loading fixture of full array pin ceramic shell Download PDFInfo
- Publication number
- CN108922860A CN108922860A CN201810980412.4A CN201810980412A CN108922860A CN 108922860 A CN108922860 A CN 108922860A CN 201810980412 A CN201810980412 A CN 201810980412A CN 108922860 A CN108922860 A CN 108922860A
- Authority
- CN
- China
- Prior art keywords
- shell
- cpga
- vacuum chuck
- pedestal
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 18
- YTRNSQPXEDGWMR-UHFFFAOYSA-N alpha-Cyclohexylmandelic acid Chemical compound C=1C=CC=CC=1C(O)(C(=O)O)C1CCCCC1 YTRNSQPXEDGWMR-UHFFFAOYSA-N 0.000 claims abstract description 40
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000009826 distribution Methods 0.000 claims abstract description 13
- 230000005540 biological transmission Effects 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000005538 encapsulation Methods 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to semiconductor packages manufacturing technology fields, it is related to a kind of auto loading fixture of full array pin ceramic shell, including automatically delivering carrier and pedestal, it is characterized in that, the carrier that automatically delivers for CPGA shell to be transmitted to the pedestal is located at right above pedestal, the load boat for being used to load CPGA shell for automatically delivering carrier equipped with several in array distribution；The pedestal is equipped with several in array distribution for adsorbing the vacuum chuck of CPGA shell, and the vacuum chuck includes for being inserted into the location hole of CPGA shell stitch, the vacuum hole for vacuumizing being connected to positioned at the groove at vacuum chuck center, with the groove surrounded by the location hole and the wedge-shaped limited post positioned at vacuum chuck periphery；Auto loading fixture of the invention may be implemented full array pin ceramic shell automatically deliver loading and vacuum is fixed, ensure that going on smoothly for encapsulation, improve production efficiency.
Description
Technical field
The present invention relates to a kind of auto loading fixture, specifically a kind of auto loading of full array pin ceramic shell
Fixture belongs to semiconductor packages manufacturing technology field.
Background technique
Ceramic package shell mainly applies the fields such as highly reliable military aviation space flight, the ceramic package shell of full stitch
（CPGA）It is widely used with advantages such as plate grade installation reliability height.Since there is full array at the back side of such shell
Stitch causes common area vacuum sucker in actual potting process that can not carry out absorption fixation, cannot be with automatically
Loading device carries out automation load production, can only influence production efficiency by carrying out load production by hand.Therefore one kind is needed
Practicability and effectiveness, strong operability work piece holder come carry out the type shell automatically deliver loading and vacuum is fixed, utilize from
Dynamic loading device, guarantees the automated production of encapsulation, improves production efficiency and guarantees going on smoothly for subsequent encapsulation.
Summary of the invention
It is an object of the present invention to overcome the shortcomings of the prior art and provide a kind of full array pin ceramic shells
Auto loading fixture, by auto loading fixture may be implemented full array pin ceramic shell to automatically deliver loading and vacuum solid
It is fixed, it ensure that going on smoothly for encapsulation, improve production efficiency.
To realize the above technical purpose, the technical scheme is that：A kind of automatic dress of full array pin ceramic shell
Plate clamp, including automatically deliver carrier and pedestal, which is characterized in that for CPGA shell to be transmitted to the automatic biography of the pedestal
Carrier is sent to be located at right above pedestal, the carrier that automatically delivers is equipped with several in array distribution for loading CPGA shell
Load boat；The pedestal is equipped with several in array distribution for adsorbing the vacuum chuck of CPGA shell, and the vacuum is inhaled
Disk include for be inserted into the location hole of CPGA shell stitch, by the location hole surround positioned at vacuum chuck center groove,
The vacuum hole for vacuumizing and the wedge-shaped limited post positioned at vacuum chuck periphery being connected to the groove.
Further described to automatically deliver the carrier bracket for being additionally provided on carrier and being used to support and carrying boat, the multiple load boat is logical
Carrier bracket is crossed to connect together.
Further, the center grooved for carrying boat, four angles are equipped with the corner bracket for carrying CPGA shell.
Further, the pedestal is equipped with boss and is used to support the base seat support of boss, the vacuum chuck setting
On boss.
Further, the load boat is identical as the array distribution of vacuum chuck, and carries the quantity of boat and the number of vacuum chuck
Measure identical, the surface for carrying boat and being located at corresponding vacuum chuck.
Further, the size for carrying boat is identical as the size of CPGA shell.
The present invention has the following advantages that：
1）A kind of auto loading fixture of the CPGA shell of full array, structure design advantages of simple；
2）The present invention pass through devise transmission load CPGA shell automatically deliver carrier and with the load boat phase that automatically delivers carrier
The corresponding vacuum chuck that can adsorb CPGA shell, enables CPGA shell to adsorb fixation under vacuum, ensure that encapsulation work
Going on smoothly for skill, improves production efficiency.
Detailed description of the invention
Fig. 1 is that load fixture of the invention uses assembling schematic cross-sectional view.
Fig. 2 is the structural schematic diagram that the present invention automatically delivers carrier.
Fig. 3 is the schematic cross-sectional view of A-A in Fig. 2.
Fig. 4 is the positive structure diagram of pedestal of the present invention.
Fig. 5 is the side structure schematic view of pedestal of the present invention.
Fig. 6 is the structural schematic diagram of vacuum chuck of the present invention.
Description of symbols：It is true that 1- automatically delivers carrier, 11- load boat, 12- carrier bracket, 112- corner bracket, 2- pedestal, 21-
The far wedge-shaped limited post of suction disk, 22- boss, 23- base seat support, 211- location hole, 212- groove, 213- and 214- vacuum hole.
Specific embodiment
Below with reference to specific drawings and examples, the invention will be further described.
As shown in Fig. 1, a kind of auto loading fixture of full array pin ceramic shell, including automatically deliver carrier 1, base
Seat 2 and full array pin ceramic shell 3（CPGA shell）, load is automatically delivered for what CPGA shell was transmitted to the pedestal 2
Tool 1 is located at right above pedestal 2, and the carrier 1 that automatically delivers for being placed with CPGA shell is transmitted to automatic dress by automatic conveyor
2 top of pedestal of piece equipment；
It is described to automatically deliver carrier 1 equipped with 2*4 array distribution for loading the load of CPGA shell as shown in attached drawing 2 and Fig. 3
Boat 11 and the carrier bracket 12 for being used to support load boat 11,8 load boats 11 are connected together by carrier bracket 12；Each load boat
11 center grooved, four angles are equipped with the corner bracket 112 for carrying CPGA shell；
As shown in 4 ~ Fig. 6 of attached drawing, the pedestal 2 is equipped with boss 22 and is used to support the base seat support 23 of boss 22, described convex
Platform 22 is equipped with the vacuum chuck 21 for being used to adsorb CPGA shell of 2*4 array distribution, and the vacuum chuck 21 includes for inserting
Enter CPGA shell stitch location hole 211, by the location hole 211 surround positioned at 21 center of vacuum chuck groove 212, with
The vacuum hole 214 for vacuumizing and the wedge-shaped limited post 213 positioned at 21 periphery of vacuum chuck that the groove 212 is connected to, institute
There is vacuum hole 214 to be interconnected.
In the present embodiment the load boat 11 of 2*4 array distribution be located at the vacuum chuck 21 of corresponding 2*4 array distribution just on
Side, the size for carrying boat 11 is identical as the size of CPGA shell, the shape of 211 arranged distribution of location hole of the vacuum chuck 21
Shape and size are identical as CPGA shell.
Work process of the invention is, as shown in Figure 1, the back side of CPGA shell is covered with outer stitch, in potting process
Middle that CPGA shell rear surface is placed on downward on the load boat 11 for automatically delivering carrier 1, four angles for carrying boat 11 are equipped with for branch
The corner bracket 112 of CPGA shell is supportted, boat 11 is carried and is designed as the matrix of 2*4, can place 8 CPGA shells simultaneously, in assembling process,
2 top of pedestal for automatically delivering carrier 11 and being transmitted to auto loading equipment of CPGA shell will be placed with by automatic conveyor,
The design of pedestal 2 has corresponding 2*4 to amount to 8 vacuum chucks 21；
When it is implemented, when automatically delivering carrier 1 and being transmitted to the surface of pedestal 2, by 8 load boat 11 and 8 vacuum chucks
21 correspond, and the transmission track in automatic conveyor can automatically deliver carrier 1 with 1 vertical drop of carrier is automatically delivered
It can land on the base 2, automatically deliver the vacuum that the CPGA shell on the load boat 11 of carrier 1 can be put into corresponding position on pedestal 2
On sucker 21, the stitch of CPGA shell rear surface can be inserted into the location hole 211 on corresponding vacuum chuck 21, in vacuum chuck 21
Between region reserve the groove 212 of certain area, vacuumized, can be guaranteed by the vacuum hole 214 being connected with groove 212
Vacuum chamber is formed in groove 212, and CPGA shell is adsorbed to fix with this, guarantees the stability of absorption；If automatically delivering carrier 1
Position just offset on the base 2 or CPGA shell in dropping process not in the center of vacuum chuck 21, vacuum is inhaled
The wedge-shaped limited post 213 of 21 surrounding of disk can make CPGA shell enter the progress of vacuum chuck 21 vacuum along wedge slope and fix, so
The automation encapsulation production for carrying out subsequent chip package afterwards, improves production efficiency.
The present invention and its embodiments have been described above, description is not limiting, it is shown in the drawings also only
It is one of embodiments of the present invention, practical structures are not limited thereto.All in all if those skilled in the art
It is enlightened by it, without departing from the spirit of the invention, is not inventively designed similar with the technical solution
Frame mode and embodiment, are within the scope of protection of the invention.
Claims (6)
1. a kind of auto loading fixture of full array pin ceramic shell, including automatically deliver carrier（1）And pedestal（2）, special
Sign is, for CPGA shell to be transmitted to the pedestal（2）Automatically deliver carrier（1）Positioned at pedestal（2）Surface, it is described
Automatically deliver carrier（1）Several are equipped in array distribution for loading the load boat of CPGA shell（11）；The pedestal（2）
Several are equipped in array distribution for adsorbing the vacuum chuck of CPGA shell（21）, the vacuum chuck（21）Including with
In the location hole of insertion CPGA shell stitch（211）, by the location hole（211）That surrounds is located at vacuum chuck（21）Center
Groove（212）And the groove（212）The vacuum hole for vacuumizing of connection（214）And it is located at vacuum chuck（21）Periphery
Wedge-shaped limited post（213）.
2. a kind of auto loading fixture of full array pin ceramic shell according to claim 1, it is characterised in that：It is described from
Dynamic transmission carrier（1）On be additionally provided with and be used to support load boat（11）Carrier bracket（12）, the multiple load boat（11）Pass through carrier
Bracket（12）It connects together.
3. a kind of auto loading fixture of full array pin ceramic shell according to claim 1, it is characterised in that：The load
Boat（11）Center grooved, four angles are equipped with the corner bracket for carrying CPGA shell（112）.
4. a kind of auto loading fixture of full array pin ceramic shell according to claim 1, it is characterised in that：The base
Seat（2）It is equipped with boss（22）Be used to support boss（22）Base seat support（23）, the vacuum chuck（21）It is arranged convex
Platform（22）On.
5. a kind of auto loading fixture of full array pin ceramic shell according to claim 1, it is characterised in that：The load
Boat（11）With vacuum chuck（21）Array distribution it is identical, and carry boat（11）Quantity and vacuum chuck（21）Quantity it is identical,
The load boat（11）Positioned at corresponding vacuum chuck（21）Surface.
6. a kind of auto loading fixture of full array pin ceramic shell according to claim 1, it is characterised in that：The load
Boat（11）Size it is identical as the size of CPGA shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810980412.4A CN108922860B (en) | 2018-08-27 | 2018-08-27 | Automatic chip mounting clamp for full-array pin ceramic shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810980412.4A CN108922860B (en) | 2018-08-27 | 2018-08-27 | Automatic chip mounting clamp for full-array pin ceramic shell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108922860A true CN108922860A (en) | 2018-11-30 |
| CN108922860B CN108922860B (en) | 2023-12-12 |
Family
ID=64406034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810980412.4A Active CN108922860B (en) | 2018-08-27 | 2018-08-27 | Automatic chip mounting clamp for full-array pin ceramic shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108922860B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110434030A (en) * | 2019-08-22 | 2019-11-12 | 中国电子科技集团公司第四十四研究所 | A kind of dispensing machine clamp device for ceramic cartridge photoelectrical coupler |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5000697A (en) * | 1990-03-27 | 1991-03-19 | R.H. Murphy Co., Inc. | Carrier system for PGA electrical components |
| JPH08255849A (en) * | 1994-12-08 | 1996-10-01 | Nippon Avionics Co Ltd | Cap temporarily joining jig of package which house chip and cap joining device and method |
| KR20000008817A (en) * | 1998-07-16 | 2000-02-15 | 윤종용 | Pre-centering device of handler for pin grid array package and pre-centering method using it |
| KR20010056361A (en) * | 1999-12-15 | 2001-07-04 | 윤종용 | Jig for fixing semiconductor device |
| CN1819136A (en) * | 2005-01-07 | 2006-08-16 | 先进自动器材有限公司 | Apparatus and method for aligning devices on carriers |
| CN208738204U (en) * | 2018-08-27 | 2019-04-12 | 无锡中微高科电子有限公司 | A kind of auto loading fixture of full array pin ceramic shell |
-
2018
- 2018-08-27 CN CN201810980412.4A patent/CN108922860B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5000697A (en) * | 1990-03-27 | 1991-03-19 | R.H. Murphy Co., Inc. | Carrier system for PGA electrical components |
| JPH08255849A (en) * | 1994-12-08 | 1996-10-01 | Nippon Avionics Co Ltd | Cap temporarily joining jig of package which house chip and cap joining device and method |
| KR20000008817A (en) * | 1998-07-16 | 2000-02-15 | 윤종용 | Pre-centering device of handler for pin grid array package and pre-centering method using it |
| KR20010056361A (en) * | 1999-12-15 | 2001-07-04 | 윤종용 | Jig for fixing semiconductor device |
| CN1819136A (en) * | 2005-01-07 | 2006-08-16 | 先进自动器材有限公司 | Apparatus and method for aligning devices on carriers |
| CN208738204U (en) * | 2018-08-27 | 2019-04-12 | 无锡中微高科电子有限公司 | A kind of auto loading fixture of full array pin ceramic shell |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110434030A (en) * | 2019-08-22 | 2019-11-12 | 中国电子科技集团公司第四十四研究所 | A kind of dispensing machine clamp device for ceramic cartridge photoelectrical coupler |
| CN110434030B (en) * | 2019-08-22 | 2021-08-10 | 中国电子科技集团公司第四十四研究所 | A point gum machine fixture device for ceramic tube optoelectronic coupler |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108922860B (en) | 2023-12-12 |
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