CN104779184B - 封装设备以及封装方法 - Google Patents

封装设备以及封装方法 Download PDF

Info

Publication number
CN104779184B
CN104779184B CN201510017601.8A CN201510017601A CN104779184B CN 104779184 B CN104779184 B CN 104779184B CN 201510017601 A CN201510017601 A CN 201510017601A CN 104779184 B CN104779184 B CN 104779184B
Authority
CN
China
Prior art keywords
encapsulation
sealed
container
unit
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510017601.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN104779184A (zh
Inventor
冈本隆史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intersection Osaka Ltd Co
Original Assignee
Intersection Osaka Ltd Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intersection Osaka Ltd Co filed Critical Intersection Osaka Ltd Co
Publication of CN104779184A publication Critical patent/CN104779184A/zh
Application granted granted Critical
Publication of CN104779184B publication Critical patent/CN104779184B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Closing Of Containers (AREA)
  • Vacuum Packaging (AREA)
CN201510017601.8A 2014-01-14 2015-01-14 封装设备以及封装方法 Active CN104779184B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014004098 2014-01-14
JP2014-004098 2014-01-14
JP2014184731A JP5692453B1 (ja) 2014-01-14 2014-09-11 封止装置及び封止方法
JP2014-184731 2014-09-11

Publications (2)

Publication Number Publication Date
CN104779184A CN104779184A (zh) 2015-07-15
CN104779184B true CN104779184B (zh) 2017-10-31

Family

ID=52830785

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510017601.8A Active CN104779184B (zh) 2014-01-14 2015-01-14 封装设备以及封装方法

Country Status (3)

Country Link
JP (1) JP5692453B1 (ja)
CN (1) CN104779184B (ja)
TW (1) TWI570852B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6987376B2 (ja) * 2017-03-09 2021-12-22 株式会社昭和真空 封止機構

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5436202A (en) * 1991-03-15 1995-07-25 Hitachi, Ltd. Method and apparatus for hermetically sealing semiconductor package
CN1836324A (zh) * 2003-05-22 2006-09-20 反射公司 具有整体式加热器的微机电器件封装件

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2540942B2 (ja) * 1989-05-23 1996-10-09 三菱電機株式会社 混成集積回路のパッケ―ジ方法
JPH04107955A (ja) * 1990-08-28 1992-04-09 Matsushita Electric Ind Co Ltd 電子回路素子の封止方法
JPH11214551A (ja) * 1998-01-21 1999-08-06 Toyo Commun Equip Co Ltd 電子部品のパッケージの封止装置及び封止方法
JP2002176116A (ja) * 2000-12-05 2002-06-21 Daishinku Corp 電子部品用パッケージの気密封止方法
JP3941598B2 (ja) * 2002-06-10 2007-07-04 株式会社村田製作所 圧電部品の製造方法
KR100951266B1 (ko) * 2007-12-07 2010-04-02 삼성전기주식회사 세라믹 패키지 밀봉장치
JP5196677B2 (ja) * 2010-01-14 2013-05-15 日本アビオニクス株式会社 電子部品の封止装置
JP2013219237A (ja) * 2012-04-10 2013-10-24 Mitsubishi Electric Corp 真空パッケージおよびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5436202A (en) * 1991-03-15 1995-07-25 Hitachi, Ltd. Method and apparatus for hermetically sealing semiconductor package
CN1836324A (zh) * 2003-05-22 2006-09-20 反射公司 具有整体式加热器的微机电器件封装件

Also Published As

Publication number Publication date
JP2015156468A (ja) 2015-08-27
CN104779184A (zh) 2015-07-15
TWI570852B (zh) 2017-02-11
TW201541564A (zh) 2015-11-01
JP5692453B1 (ja) 2015-04-01

Similar Documents

Publication Publication Date Title
CA1081411A (en) Method for hermetically sealing an electronic circuit package
US20170117162A1 (en) Method For Mounting An Electrical Component, Wherein A Hood Is Used, And Hood Suitable For Use In Said Method
CN109196629A (zh) 接合装置
JP6150249B2 (ja) 電子デバイスのガラス封止方法
CN104779184B (zh) 封装设备以及封装方法
JP5223657B2 (ja) 電子部品の製造方法及び製造装置
US9161473B2 (en) Surface mount electronic component
JP2009278058A (ja) 電子部品の製造方法及び製造装置
JP5064142B2 (ja) 圧電デバイスの製造方法
US3436451A (en) Method of making molded ceramic articles
JP5196677B2 (ja) 電子部品の封止装置
KR101667864B1 (ko) 수지 밀봉 장치 및 수지 밀봉 방법
JP2015153833A (ja) 電子部品装置の製造方法、及び電子部品装置
JPH04271146A (ja) 気密性マイクロチップパッケージ及びその封止方法
JP6805081B2 (ja) 発光装置用蓋体
JP5294413B2 (ja) 電子部品の封止装置
JPH04116853A (ja) 電子部品のパッケージング方法
JPS5956752A (ja) 電子部品の製造方法
JP6028263B2 (ja) 加圧加熱機構
JPH1120358A (ja) Ｉｃカード用半導体装置の樹脂封止装置及び樹脂封止方法
JP2003324166A (ja) ガラス端子とその製造方法ならびにそれを用いた気密端子
JP3293326B2 (ja) 電子デバイスのキャップ封止装置とその封止方法
JP2018086793A (ja) 圧縮成形装置、圧縮成形方法、及び圧縮成形品の製造方法
JPH04107955A (ja) 電子回路素子の封止方法
JPH027453A (ja) ガラスキャップ法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
EXSB Decision made by sipo to initiate substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant