TWI563556B - Apparatus of etching glass substrate - Google Patents

Apparatus of etching glass substrate

Info

Publication number
TWI563556B
TWI563556B TW100139091A TW100139091A TWI563556B TW I563556 B TWI563556 B TW I563556B TW 100139091 A TW100139091 A TW 100139091A TW 100139091 A TW100139091 A TW 100139091A TW I563556 B TWI563556 B TW I563556B
Authority
TW
Taiwan
Prior art keywords
glass substrate
etching glass
etching
substrate
glass
Prior art date
Application number
TW100139091A
Other languages
English (en)
Other versions
TW201218266A (en
Inventor
Ah-Ram Lee
Kwan-Young Han
Original Assignee
Samsung Display Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Display Co Ltd filed Critical Samsung Display Co Ltd
Publication of TW201218266A publication Critical patent/TW201218266A/zh
Application granted granted Critical
Publication of TWI563556B publication Critical patent/TWI563556B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C03C15/02—Surface treatment of glass, not in the form of fibres or filaments, by etching for making a smooth surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Surface Treatment Of Glass (AREA)
  • Weting (AREA)
TW100139091A 2010-10-28 2011-10-27 Apparatus of etching glass substrate TWI563556B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100106208A KR101233687B1 (ko) 2010-10-28 2010-10-28 유리 기판 식각 장치

Publications (2)

Publication Number Publication Date
TW201218266A TW201218266A (en) 2012-05-01
TWI563556B true TWI563556B (en) 2016-12-21

Family

ID=45065665

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100139091A TWI563556B (en) 2010-10-28 2011-10-27 Apparatus of etching glass substrate

Country Status (6)

Country Link
US (1) US9598310B2 (zh)
EP (1) EP2455350B1 (zh)
JP (1) JP5872221B2 (zh)
KR (1) KR101233687B1 (zh)
CN (1) CN102557465B (zh)
TW (1) TWI563556B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9698062B2 (en) * 2013-02-28 2017-07-04 Veeco Precision Surface Processing Llc System and method for performing a wet etching process
US9079210B2 (en) * 2013-07-22 2015-07-14 Infineon Technologies Ag Methods for etching a workpiece, an apparatus configured to etch a workpiece, and a non-transitory computer readable medium
KR102087193B1 (ko) 2013-09-09 2020-04-16 삼성디스플레이 주식회사 유기 발광 표시 장치의 제조 방법 및 터치 패널의 제조 방법
CN104779188B (zh) * 2015-05-04 2017-06-16 武汉华星光电技术有限公司 一种蚀刻装置
US11174195B2 (en) 2017-08-31 2021-11-16 Nippon Electric Glass Co., Ltd. Method for etching glass, etching treatment device and glass sheet
CN108704872A (zh) * 2018-06-05 2018-10-26 昆山木利机械设计有限公司 一种屏幕擦拭装置
EP3931160A1 (en) * 2019-03-01 2022-01-05 Zygo Corporation Method for figure control of optical surfaces
TWI718794B (zh) * 2019-10-08 2021-02-11 辛耘企業股份有限公司 濕製程裝置
WO2021167787A1 (en) * 2020-02-18 2021-08-26 Corning Incorporated Etching of glass surfaces to reduce electrostatic charging during processing

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374130A (en) * 1962-12-26 1968-03-19 Pittsburgh Plate Glass Co Etching solution and process for producing a non-reflective surface on transparent glass
US5846444A (en) * 1995-10-03 1998-12-08 Corning Incorporated Surface treatment of glass
US6228211B1 (en) * 1998-09-08 2001-05-08 Lg. Philips Lcd Co., Ltd. Apparatus for etching a glass substrate
US20070194145A1 (en) * 2006-02-17 2007-08-23 Gi-Won Lee Apparatus of thinning a glass substrate

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2411298A (en) * 1945-02-12 1946-11-19 Philips Corp Piezoelectric crystal
US3649509A (en) * 1969-07-08 1972-03-14 Buckbee Mears Co Electrodeposition systems
US3798056A (en) * 1972-04-05 1974-03-19 Bell Telephone Labor Inc Electroless plating process
JP2807238B2 (ja) * 1988-09-13 1998-10-08 古河電気工業株式会社 ガラス母材の表面処理方法
JP3122857B2 (ja) * 1992-01-20 2001-01-09 株式会社日立製作所 半導体基体のエッチング装置およびエッチング方法
US5277715A (en) * 1992-06-04 1994-01-11 Micron Semiconductor, Inc. Method of reducing particulate concentration in process fluids
US5308447A (en) * 1992-06-09 1994-05-03 Luxtron Corporation Endpoint and uniformity determinations in material layer processing through monitoring multiple surface regions across the layer
US5499733A (en) * 1992-09-17 1996-03-19 Luxtron Corporation Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
US5891352A (en) * 1993-09-16 1999-04-06 Luxtron Corporation Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
JP2912538B2 (ja) 1993-12-08 1999-06-28 大日本スクリーン製造株式会社 浸漬型基板処理装置
DE4405278C1 (de) * 1994-02-19 1995-05-04 Berthold Lab Prof Dr Verfahren und Vorrichtung zum Polieren oder Mattieren von Glasflächen in einem Säurebad
WO1998048252A1 (en) * 1997-04-22 1998-10-29 The Regents Of The University Of California Laser detection of material thickness
WO1999004249A1 (fr) * 1997-07-17 1999-01-28 Hoya Corporation Procede de verification de l'inegalite d'une substance emettrice de lumiere, dispositif concu a cet effet, et procede de triage de substrats transparents
US6028669A (en) * 1997-07-23 2000-02-22 Luxtron Corporation Signal processing for in situ monitoring of the formation or removal of a transparent layer
US6103096A (en) * 1997-11-12 2000-08-15 International Business Machines Corporation Apparatus and method for the electrochemical etching of a wafer
US6690473B1 (en) * 1999-02-01 2004-02-10 Sensys Instruments Corporation Integrated surface metrology
JP3525830B2 (ja) * 1999-11-16 2004-05-10 株式会社デンソー エッチング装置
US6203412B1 (en) * 1999-11-19 2001-03-20 Chartered Semiconductor Manufacturing Ltd. Submerge chemical-mechanical polishing
US6547937B1 (en) * 2000-01-03 2003-04-15 Semitool, Inc. Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
US6454916B1 (en) * 2000-01-05 2002-09-24 Advanced Micro Devices, Inc. Selective electroplating with direct contact chemical polishing
ATE396497T1 (de) * 2000-01-21 2008-06-15 Hamamatsu Photonics Kk Dickenmessvorrichtung, dickenmessverfahren und nassätzvorrichtung und nassätzverfahren, die diese verwenden
JP2002087844A (ja) * 2000-09-14 2002-03-27 Sony Corp 表示パネルの製造方法
US6558238B1 (en) * 2000-09-19 2003-05-06 Agere Systems Inc. Apparatus and method for reclamation of used polishing slurry
KR100712472B1 (ko) * 2000-12-16 2007-04-27 엘지.필립스 엘시디 주식회사 식각장치 및 식각방법
US7365860B2 (en) * 2000-12-21 2008-04-29 Sensory Analytics System capable of determining applied and anodized coating thickness of a coated-anodized product
KR100380844B1 (ko) * 2001-04-12 2003-04-18 니시야마 스테인레스 케미컬 가부시키가이샤 액정유리기판의 화학연마 방법 및 화학연마장치
KR100813018B1 (ko) * 2001-06-02 2008-03-13 삼성전자주식회사 세정액 형성장치
US7090750B2 (en) * 2002-08-26 2006-08-15 Micron Technology, Inc. Plating
US6955747B2 (en) * 2002-09-23 2005-10-18 International Business Machines Corporation Cam driven paddle assembly for a plating cell
US6875322B1 (en) * 2003-01-15 2005-04-05 Lam Research Corporation Electrochemical assisted CMP
US7691279B2 (en) * 2003-03-27 2010-04-06 Hoya Corporation Method of producing a glass substrate for a mask blank and method of producing a mask blank
KR20050003759A (ko) * 2003-07-04 2005-01-12 비오이 하이디스 테크놀로지 주식회사 유리기판 수납용 카세트
TWI310850B (en) * 2003-08-01 2009-06-11 Foxsemicon Integrated Tech Inc Substrate supporting rod and substrate cassette using the same
JP4003882B2 (ja) * 2003-09-26 2007-11-07 シャープ株式会社 基板移載システム
WO2007062114A2 (en) * 2005-11-23 2007-05-31 Semitool, Inc. Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces
JP5016351B2 (ja) 2007-03-29 2012-09-05 東京エレクトロン株式会社 基板処理システム及び基板洗浄装置
KR100928050B1 (ko) * 2007-08-24 2009-11-24 (주)지원테크 유리기판 식각 방법 및 유리기판 식각 장치
US20090065478A1 (en) * 2007-09-11 2009-03-12 Dockery Kevin P Measuring etching rates using low coherence interferometry
KR100908936B1 (ko) * 2007-11-21 2009-07-22 에이스하이텍 주식회사 디스플레이 유리기판의 침지형 식각장치
US8177944B2 (en) * 2007-12-04 2012-05-15 Ebara Corporation Plating apparatus and plating method
KR20090070792A (ko) * 2007-12-27 2009-07-01 주식회사 디에스티 유리기판의 식각장치
WO2009119826A1 (ja) * 2008-03-28 2009-10-01 古河電気工業株式会社 板材の製造方法および板材
JP2009290169A (ja) * 2008-06-02 2009-12-10 Canon Inc 振動子の製造方法
US8133097B2 (en) * 2009-05-07 2012-03-13 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374130A (en) * 1962-12-26 1968-03-19 Pittsburgh Plate Glass Co Etching solution and process for producing a non-reflective surface on transparent glass
US5846444A (en) * 1995-10-03 1998-12-08 Corning Incorporated Surface treatment of glass
US6228211B1 (en) * 1998-09-08 2001-05-08 Lg. Philips Lcd Co., Ltd. Apparatus for etching a glass substrate
US20070194145A1 (en) * 2006-02-17 2007-08-23 Gi-Won Lee Apparatus of thinning a glass substrate

Also Published As

Publication number Publication date
JP2012092001A (ja) 2012-05-17
EP2455350B1 (en) 2016-10-26
CN102557465B (zh) 2015-07-22
KR101233687B1 (ko) 2013-02-15
EP2455350A1 (en) 2012-05-23
US20120103520A1 (en) 2012-05-03
CN102557465A (zh) 2012-07-11
KR20120044746A (ko) 2012-05-08
TW201218266A (en) 2012-05-01
JP5872221B2 (ja) 2016-03-01
US9598310B2 (en) 2017-03-21

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