TWI559835B - 電子機器 - Google Patents

電子機器 Download PDF

Info

Publication number
TWI559835B
TWI559835B TW102135493A TW102135493A TWI559835B TW I559835 B TWI559835 B TW I559835B TW 102135493 A TW102135493 A TW 102135493A TW 102135493 A TW102135493 A TW 102135493A TW I559835 B TWI559835 B TW I559835B
Authority
TW
Taiwan
Prior art keywords
substrate
metal cover
electronic device
electronic component
top plate
Prior art date
Application number
TW102135493A
Other languages
English (en)
Chinese (zh)
Other versions
TW201427544A (zh
Inventor
明石知也
柳澤毅
高木涼太
吉村悠紀
Original Assignee
新電元工業股份有限公司
本田技研工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業股份有限公司, 本田技研工業股份有限公司 filed Critical 新電元工業股份有限公司
Publication of TW201427544A publication Critical patent/TW201427544A/zh
Application granted granted Critical
Publication of TWI559835B publication Critical patent/TWI559835B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW102135493A 2012-10-03 2013-10-01 電子機器 TWI559835B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/075719 WO2014054145A1 (ja) 2012-10-03 2012-10-03 電子機器

Publications (2)

Publication Number Publication Date
TW201427544A TW201427544A (zh) 2014-07-01
TWI559835B true TWI559835B (zh) 2016-11-21

Family

ID=50434504

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102135493A TWI559835B (zh) 2012-10-03 2013-10-01 電子機器

Country Status (7)

Country Link
JP (1) JP5528641B1 (it)
CN (1) CN104718804B (it)
BR (1) BR112013028804B1 (it)
IT (1) ITTO20130777A1 (it)
MY (1) MY166727A (it)
TW (1) TWI559835B (it)
WO (1) WO2014054145A1 (it)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6287595B2 (ja) * 2014-06-03 2018-03-07 株式会社デンソー 電子装置
WO2017056727A1 (ja) * 2015-09-29 2017-04-06 日立オートモティブシステムズ株式会社 電子制御装置
DE102016224083A1 (de) * 2016-12-02 2018-06-07 Robert Bosch Gmbh Elektrische Baugruppe
US10834827B2 (en) * 2017-09-14 2020-11-10 HELLA GmbH & Co. KGaA System for potting components using a cap
JP7366676B2 (ja) * 2019-09-27 2023-10-23 メイコーエンベデッドプロダクツ株式会社 電子機器
US11330734B2 (en) * 2020-05-28 2022-05-10 Htc Corporation Case assembly and electronic device
CN111988936A (zh) * 2020-08-17 2020-11-24 中国兵器工业集团第二一四研究所苏州研发中心 一种电子模块抗高过载加固结构及方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6282092B1 (en) * 1998-06-12 2001-08-28 Shindengen Electric Manufacturing Co., Ltd. Electronic circuit device and method of fabricating the same
JP2007081047A (ja) * 2005-09-13 2007-03-29 Toshiba Lighting & Technology Corp 電子機器、点灯装置、及び照明器具
TW200921867A (en) * 2007-09-21 2009-05-16 Panasonic Corp Electronic component package and method for producing the same
JP2010133400A (ja) * 2008-11-10 2010-06-17 Sanden Corp インバータ一体型電動圧縮機
JP2011216652A (ja) * 2010-03-31 2011-10-27 Toshiba Lighting & Technology Corp 電気機器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1123515A (zh) * 1994-11-24 1996-05-29 三菱电机株式会社 树脂模压的电子电路装置
JP3858801B2 (ja) * 2002-10-10 2006-12-20 株式会社日立製作所 車載ミリ波レーダ装置，ミリ波レーダモジュールおよびその製造方法
EP2149903B1 (en) * 2007-05-18 2019-10-30 Sansha Electric Manufacturing Company, Limited Semiconductor module for electric power
JP2009146953A (ja) * 2007-12-11 2009-07-02 Toshiba Lighting & Technology Corp 電子機器及び照明器具
JP4948613B2 (ja) * 2010-02-25 2012-06-06 三菱電機株式会社 樹脂封止形電子制御装置、及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6282092B1 (en) * 1998-06-12 2001-08-28 Shindengen Electric Manufacturing Co., Ltd. Electronic circuit device and method of fabricating the same
JP2007081047A (ja) * 2005-09-13 2007-03-29 Toshiba Lighting & Technology Corp 電子機器、点灯装置、及び照明器具
TW200921867A (en) * 2007-09-21 2009-05-16 Panasonic Corp Electronic component package and method for producing the same
JP2010133400A (ja) * 2008-11-10 2010-06-17 Sanden Corp インバータ一体型電動圧縮機
JP2011216652A (ja) * 2010-03-31 2011-10-27 Toshiba Lighting & Technology Corp 電気機器

Also Published As

Publication number Publication date
ITTO20130777A1 (it) 2014-04-04
JPWO2014054145A1 (ja) 2016-08-25
TW201427544A (zh) 2014-07-01
BR112013028804A2 (pt) 2017-01-31
BR112013028804B1 (pt) 2020-11-17
MY166727A (en) 2018-07-18
JP5528641B1 (ja) 2014-06-25
WO2014054145A1 (ja) 2014-04-10
CN104718804B (zh) 2018-10-23
CN104718804A (zh) 2015-06-17

Similar Documents

Publication Publication Date Title
TWI559835B (zh) 電子機器
JP6848802B2 (ja) 半導体装置
JP6813259B2 (ja) 半導体装置
JP2010279137A (ja) 回転電機
KR101930391B1 (ko) 전자기기
JP2003243609A (ja) 電力半導体装置及びその製造方法
JP6335815B2 (ja) 放熱構造体
JP2010034346A (ja) 回路装置
JP4624775B2 (ja) 半導体装置
JP5523597B1 (ja) 電力変換装置
JP2011035106A (ja) 電子制御装置
JP6267616B2 (ja) 電子制御装置の取り付け構造
CN103515328A (zh) 半导体封装件
JP2007067067A (ja) 樹脂注型形電力用回路ユニット
JP5644078B2 (ja) インバータ装置
JP5870777B2 (ja) 半導体装置およびその製造方法
JP2011155147A (ja) 半導体装置
KR20170095681A (ko) 파워 모듈 및 그 제조 방법
JP6075470B2 (ja) 半導体装置およびその製造方法
JP2008187145A (ja) 回路装置
JPH09246433A (ja) モジュールの放熱構造
JP2006041199A (ja) 電子装置
JP5663298B2 (ja) 蓄電池モジュールの製造方法
JP5446454B2 (ja) 半導体装置の実装構造
JP2013172093A (ja) 半導体装置、及び、その製造方法