ITTO20130777A1 - Dispositivo elettronico, in particolare avente una migliorata resistenza al calore - Google Patents

Dispositivo elettronico, in particolare avente una migliorata resistenza al calore

Info

Publication number
ITTO20130777A1
ITTO20130777A1 IT000777A ITTO20130777A ITTO20130777A1 IT TO20130777 A1 ITTO20130777 A1 IT TO20130777A1 IT 000777 A IT000777 A IT 000777A IT TO20130777 A ITTO20130777 A IT TO20130777A IT TO20130777 A1 ITTO20130777 A1 IT TO20130777A1
Authority
IT
Italy
Prior art keywords
electronic device
heat resistance
improved heat
improved
resistance
Prior art date
Application number
IT000777A
Other languages
English (en)
Inventor
Tomoya Akashi
Ryota Takagi
Takeshi Yanagisawa
Yuki Yoshimura
Original Assignee
Honda Motor Co Ltd
Shindengen Electric Mfg C O Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd, Shindengen Electric Mfg C O Ltd filed Critical Honda Motor Co Ltd
Publication of ITTO20130777A1 publication Critical patent/ITTO20130777A1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IT000777A 2012-10-03 2013-09-27 Dispositivo elettronico, in particolare avente una migliorata resistenza al calore ITTO20130777A1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/075719 WO2014054145A1 (ja) 2012-10-03 2012-10-03 電子機器

Publications (1)

Publication Number Publication Date
ITTO20130777A1 true ITTO20130777A1 (it) 2014-04-04

Family

ID=50434504

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000777A ITTO20130777A1 (it) 2012-10-03 2013-09-27 Dispositivo elettronico, in particolare avente una migliorata resistenza al calore

Country Status (7)

Country Link
JP (1) JP5528641B1 (it)
CN (1) CN104718804B (it)
BR (1) BR112013028804B1 (it)
IT (1) ITTO20130777A1 (it)
MY (1) MY166727A (it)
TW (1) TWI559835B (it)
WO (1) WO2014054145A1 (it)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6287595B2 (ja) * 2014-06-03 2018-03-07 株式会社デンソー 電子装置
US20180220539A1 (en) * 2015-09-29 2018-08-02 Hitachi Automotive Systems, Ltd. Electronic Control Device
DE102016224083A1 (de) 2016-12-02 2018-06-07 Robert Bosch Gmbh Elektrische Baugruppe
US10834827B2 (en) 2017-09-14 2020-11-10 HELLA GmbH & Co. KGaA System for potting components using a cap
JP7366676B2 (ja) 2019-09-27 2023-10-23 メイコーエンベデッドプロダクツ株式会社 電子機器
US11330734B2 (en) * 2020-05-28 2022-05-10 Htc Corporation Case assembly and electronic device
CN111988936A (zh) * 2020-08-17 2020-11-24 中国兵器工业集团第二一四研究所苏州研发中心 一种电子模块抗高过载加固结构及方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1123515A (zh) * 1994-11-24 1996-05-29 三菱电机株式会社 树脂模压的电子电路装置
JP4121185B2 (ja) * 1998-06-12 2008-07-23 新電元工業株式会社 電子回路装置
JP3858801B2 (ja) * 2002-10-10 2006-12-20 株式会社日立製作所 車載ミリ波レーダ装置，ミリ波レーダモジュールおよびその製造方法
JP4682762B2 (ja) * 2005-09-13 2011-05-11 東芝ライテック株式会社 電子機器、点灯装置、及び照明器具
US7994635B2 (en) * 2007-05-18 2011-08-09 Sansha Electric Manufacturing Co., Ltd. Power semiconductor module
CN101803477B (zh) * 2007-09-21 2011-11-16 松下电器产业株式会社 电子部件封装体及其制造方法
JP2009146953A (ja) * 2007-12-11 2009-07-02 Toshiba Lighting & Technology Corp 電子機器及び照明器具
JP5413829B2 (ja) * 2008-11-10 2014-02-12 サンデン株式会社 インバータ一体型電動圧縮機
JP4948613B2 (ja) * 2010-02-25 2012-06-06 三菱電機株式会社 樹脂封止形電子制御装置、及びその製造方法
JP2011216652A (ja) * 2010-03-31 2011-10-27 Toshiba Lighting & Technology Corp 電気機器

Also Published As

Publication number Publication date
TWI559835B (zh) 2016-11-21
WO2014054145A1 (ja) 2014-04-10
CN104718804A (zh) 2015-06-17
MY166727A (en) 2018-07-18
JP5528641B1 (ja) 2014-06-25
JPWO2014054145A1 (ja) 2016-08-25
BR112013028804B1 (pt) 2020-11-17
TW201427544A (zh) 2014-07-01
BR112013028804A2 (pt) 2017-01-31
CN104718804B (zh) 2018-10-23

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