TWI559514B - 減低畫素區域影像感測器 - Google Patents

減低畫素區域影像感測器 Download PDF

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Publication number
TWI559514B
TWI559514B TW102139161A TW102139161A TWI559514B TW I559514 B TWI559514 B TW I559514B TW 102139161 A TW102139161 A TW 102139161A TW 102139161 A TW102139161 A TW 102139161A TW I559514 B TWI559514 B TW I559514B
Authority
TW
Taiwan
Prior art keywords
column
pixels
transistors
transistor
output
Prior art date
Application number
TW102139161A
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English (en)
Chinese (zh)
Other versions
TW201407759A (zh
Inventor
克里斯多夫 帕克斯
Original Assignee
豪威科技股份有限公司
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Application filed by 豪威科技股份有限公司 filed Critical 豪威科技股份有限公司
Publication of TW201407759A publication Critical patent/TW201407759A/zh
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Publication of TWI559514B publication Critical patent/TWI559514B/zh

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/813Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/778Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/802Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
TW102139161A 2007-03-15 2008-03-14 減低畫素區域影像感測器 TWI559514B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/686,573 US7915702B2 (en) 2007-03-15 2007-03-15 Reduced pixel area image sensor

Publications (2)

Publication Number Publication Date
TW201407759A TW201407759A (zh) 2014-02-16
TWI559514B true TWI559514B (zh) 2016-11-21

Family

ID=39491702

Family Applications (2)

Application Number Title Priority Date Filing Date
TW102139161A TWI559514B (zh) 2007-03-15 2008-03-14 減低畫素區域影像感測器
TW097109186A TWI418021B (zh) 2007-03-15 2008-03-14 減低畫素區域影像感測器

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW097109186A TWI418021B (zh) 2007-03-15 2008-03-14 減低畫素區域影像感測器

Country Status (7)

Country Link
US (2) US7915702B2 (enExample)
EP (1) EP2118930B1 (enExample)
JP (1) JP5357063B2 (enExample)
KR (1) KR101398767B1 (enExample)
CN (2) CN102623474B (enExample)
TW (2) TWI559514B (enExample)
WO (1) WO2008115331A1 (enExample)

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JP5408954B2 (ja) * 2008-10-17 2014-02-05 キヤノン株式会社 撮像装置、及び撮像システム
GB2466213B (en) * 2008-12-12 2013-03-06 Cmosis Nv Pixel array with shared readout circuitry
JP5029624B2 (ja) * 2009-01-15 2012-09-19 ソニー株式会社 固体撮像装置及び電子機器
JP2010206173A (ja) 2009-02-06 2010-09-16 Canon Inc 光電変換装置およびカメラ
JP2010206172A (ja) * 2009-02-06 2010-09-16 Canon Inc 撮像装置およびカメラ
JP2010206174A (ja) 2009-02-06 2010-09-16 Canon Inc 光電変換装置およびその製造方法ならびにカメラ
JP5564874B2 (ja) * 2009-09-25 2014-08-06 ソニー株式会社 固体撮像装置、及び電子機器
JP5537172B2 (ja) * 2010-01-28 2014-07-02 ソニー株式会社 固体撮像装置及び電子機器
JP5377549B2 (ja) * 2011-03-03 2013-12-25 株式会社東芝 固体撮像装置
EP2733483B1 (en) * 2011-07-14 2020-04-29 National University Corporation Toyohashi University of Technology Method for detecting chemical or physical phenomenon and device therefor
DE102011120099B4 (de) 2011-12-02 2024-05-29 Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg Bildsensor und Verfahren zum Auslesen eines Bildsensors
CN103208501B (zh) 2012-01-17 2017-07-28 奥林巴斯株式会社 固体摄像装置及其制造方法、摄像装置、基板、半导体装置
JP5953087B2 (ja) * 2012-01-17 2016-07-13 オリンパス株式会社 固体撮像装置、撮像装置および固体撮像装置の製造方法
WO2014002366A1 (ja) * 2012-06-27 2014-01-03 パナソニック株式会社 固体撮像装置
JP5962533B2 (ja) * 2013-02-13 2016-08-03 ソニー株式会社 固体撮像素子、駆動方法、および撮像装置
US9319613B2 (en) * 2013-12-05 2016-04-19 Omnivision Technologies, Inc. Image sensor having NMOS source follower with P-type doping in polysilicon gate
CN105100654B (zh) * 2015-09-18 2018-02-23 中国科学院高能物理研究所 一种像素单元电路及像素读出芯片
KR102701855B1 (ko) 2016-12-28 2024-09-02 삼성전자주식회사 이미지 센서
JP7467061B2 (ja) * 2019-10-09 2024-04-15 株式会社ジャパンディスプレイ 検出装置
KR20210114786A (ko) * 2020-03-11 2021-09-24 에스케이하이닉스 주식회사 이미지 센서
US20220328541A1 (en) 2021-04-08 2022-10-13 Quantum-Si Incorporated Integrated circuit having mirrored pixel configuration
WO2023137680A1 (en) * 2022-01-21 2023-07-27 Huawei Technologies Co.,Ltd. Imaging device array

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Also Published As

Publication number Publication date
JP2010521812A (ja) 2010-06-24
EP2118930B1 (en) 2015-01-14
TWI418021B (zh) 2013-12-01
HK1171870A1 (en) 2013-04-05
TW201407759A (zh) 2014-02-16
US20080225148A1 (en) 2008-09-18
KR101398767B1 (ko) 2014-05-27
WO2008115331A1 (en) 2008-09-25
CN102623474A (zh) 2012-08-01
TW200903789A (en) 2009-01-16
EP2118930A1 (en) 2009-11-18
US20110122307A1 (en) 2011-05-26
US7915702B2 (en) 2011-03-29
JP5357063B2 (ja) 2013-12-04
CN102623474B (zh) 2015-08-05
US8294187B2 (en) 2012-10-23
CN101647118A (zh) 2010-02-10
KR20090121322A (ko) 2009-11-25
CN101647118B (zh) 2012-06-27

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