TWI558847B - Method and device of manufacturing solder plating wire - Google Patents

Description

Method and device for manufacturing soldered wire

The present invention relates to a method and a device for manufacturing a soldering wire applied to an electric or electronic device or a communication device, and more particularly to a wire for use in a solar cell, and a method and a device for manufacturing a plated solder wire having appropriate low endurance characteristics .

Among the dip coating lines used for electronic components, it is required to have a low endurance characteristic of 0.2% proof value. For example, a wire for a solar cell is also an example.

In order to achieve the low cost of the material constituting the solar cell or to alleviate the influence of insufficient material supply, the solar cell energy unit is seeking to be thinner.

However, when the solar cell is thinned, the strength thereof is weak, and the connection portion of the solar cell wires for soldering the solar cell unit has a problem that the solar cell is easily bent or damaged due to the difference in expansion ratio between the solar cells.

Therefore, the connection portion between the solar cell lead wire and the solar cell unit must be deformed with the solar cell unit, and it is important to reduce the 0.2% proof stress. Therefore, as a wire for a solar cell, a plated solder wire having low endurance characteristics is used.

Regardless of whether or not it has low endurance characteristics, the plated solder wire disclosed in Patent Document 1 is formed by a plating process to form a immersion plating layer.

In the plating soldering process disclosed in Patent Document 1, a metal wire to be plated is passed through a metal wire inlet, and introduced into a plating liquid portion to be injected into a molten immersion solder liquid, and then exported from a solder wire lead. Thereafter, the metal wire is subjected to a step of immersion plating by air cooling or the like.

Further, in the manufacturing process of the plated solder wire, in addition to the above-described plating process, the surface of the metal wire is subjected to a pre-plating process such as cleaning or annealing, and the post-plating process is performed by coiling and dipping. The coiling process of the plating line.

Further, when such a process is continuously performed on the to-be-plated wire having low endurance, the to-be-plated wire is easily subjected to a load, and thus continuous processing becomes difficult, and even if continuous processing is possible, it is difficult to obtain a desired quality immersion plating line.

For example, if the load on the wire to be plated which has been low in endurance is excessively emphasized, the surface of the wire to be plated cannot be sufficiently washed, and the surface is left with an impurity or an oxide layer.

In the subsequent plating step, when the immersion plating layer is formed on the surface to be plated, the immersion plating layer is easily peeled off, and it is difficult to obtain a desired quality immersion plating line.

In other respects, in order to reduce the endurance of the immersion plating line (the line to be plated), the traveling speed of the immersion plating line cannot be increased, and the manufacturing time is greatly spent, and the continuous processing is performed to produce manufacturing efficiency. The disadvantage of reducing the situation.

As a method of producing a plated solder wire having low endurance characteristics, for example, a method of manufacturing a flat-angle conductor for a solar cell proposed in Patent Document 2 is known.

The method for producing a flat-angle conductor for a solar cell according to Patent Document 2 is formed into a rectangular shape by a step of rolling a conductor or the like, and then a 0.2% proof stress value is lowered by a heat treatment step, and a solder film is applied to the surface of the conductor. method.

However, Citation 2 does not specifically describe the temperature setting for heat treatment or the gas composition of the internal environment of the reduction furnace (softening annealing furnace), or a step other than the heat treatment step, for example, a washing step, etc., and does not specifically mention and.

Therefore, even if it is assumed that the respective steps of the heat treatment step, the cleaning step, or the immersion step are independent production lines, or if the plurality of steps are continuously performed, it is not clear which process is performed. .

That is, as described above, the cited document 2 reduces the 0.2% proof stress value of the rectangular conductor, and it is difficult to ensure the quality of the solar cell lead, and on the other hand, in order to ensure the quality of the immersion plating line with a 0.2% proof endurance value, The two opposite problems of reducing manufacturing efficiency are not invented in Citation 2.

[Practical Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-80460

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2006-54355

Accordingly, an object of the present invention is to provide a method and a device for manufacturing a solder wire, which can obtain a plating wire having a 0.2% proof endurance value and a desired quality, which can be obtained by setting such a immersion plating line. Improve product yield and, in turn, increase manufacturing efficiency.

The apparatus for manufacturing a soldering wire of the present invention may be configured by a pre-dip coating processing mechanism, a dip plating mechanism and a winding mechanism, wherein the pre-plating processing mechanism performs pre-dip plating treatment on the copper wire. The immersion plating mechanism applies plating solder to the surface of the copper wire, and the winding mechanism winds the copper wire which has been immersed on the surface. Wherein the pre-etching treatment mechanism has a softening annealing mechanism that softens and anneals the copper wire to make the copper wire low endurance; by the winding mechanism, and is wound up below the endurance of the copper wire The copper wire having low endurance is wound up, and the softening annealing mechanism, the immersion plating mechanism, and the winding mechanism are arranged in series from the upstream side in the traveling direction of the copper wire.

Here, the configuration in which the winding mechanism is wound up with a low take-up force lower than the endurance of the copper wire is not limited to the winding of the copper wire only by the winding mechanism, and includes, for example, the conveying winch arrangement. On the upstream side of the take-up mechanism, it assists in the winding of the take-up mechanism, and the take-up mechanism and the transport winch are configured to take up the copper wire.

The copper wire is not limited in shape and size, but is preferably a flat line. The copper wire is formed by a pure copper-based conductor material in a rectangular line, and is subjected to a immersion plating treatment on the surface thereof to serve as a connection wire for connecting a predetermined region of the germanium crystal wafer (矽 unit), that is, for use as a solar cell. Soldering with solder wire.

The series of configurations are shown from the upstream side in the traveling direction to the downstream side, regardless of whether they are continuously or intermittently arranged, that is, arranged in series.

As a aspect of the present invention, the copper wire may be formed of a pure copper-based material; the softening annealing mechanism is configured by a softening annealing furnace, and the inside thereof reduces a reducing gas atmosphere of the oxide layer on the surface of the copper wire; The furnace is disposed obliquely, and the position of the downstream end portion in the traveling direction of the copper wire is lower than the position of the upstream end portion in the traveling direction of the copper wire; in the softening annealing furnace, the downstream side portion of the traveling direction of the copper wire A reducing gas supply unit is provided which allows supply of a reducing gas to the softening annealing furnace.

The pure copper-based material is not particularly limited as long as it has less impurities, and the pure copper-based conductor material having high conductivity is preferably, for example, oxygen-free copper (OFC), tough pitch copper, and Phosphorus Deoxidized Copper. It does not contain impurities such as oxides and has a purity of 99.9% or more.

Further, as a aspect of the present invention, the reducing gas may be formed by a mixed gas of a nitrogen gas and a hydrogen gas.

Further, as a aspect of the present invention, the volume ratio of the nitrogen gas to the hydrogen gas may be set to 4:1.

Moreover, as a aspect of the present invention, the pre-dip plating treatment mechanism may have a heat treatment mechanism that heats the copper wire; and the heat treatment mechanism is disposed in the copper wire traveling direction. The upstream side.

Moreover, as a aspect of the present invention, the copper wire may be formed of a pure copper-based material; the immersion plating treatment mechanism has a cleaning mechanism for cleaning the copper wire; and the cleaning mechanism is disposed in the copper wire traveling direction. The upstream side of the softening annealing mechanism.

Moreover, as a aspect of the present invention, the pre-dip plating treatment mechanism may have a heat treatment mechanism that heat-treats the copper wire and is disposed on the upstream side of the softening annealing mechanism in the traveling direction of the copper wire. The heat treatment mechanism is disposed on the upstream side of the cleaning mechanism in the traveling direction of the copper wire.

Moreover, as an aspect of the present invention, the cleaning mechanism may be configured by an acid cleaning mechanism and a water cleaning mechanism, and the heat treatment mechanism, the acid cleaning mechanism, and the water cleaning mechanism may be used as the pre-dip plating treatment mechanism. And the softening annealing mechanism is arranged in sequence along the traveling direction of the copper wire.

Moreover, as a aspect of the present invention, the copper wire may be a rectangular copper wire having a width of a vertical section of 0.8 to 10.0 mm and a thickness of 0.05 to 0.5 mm, and the vertical section is opposite to the length direction thereof. In the vertical cross section, the traveling speed of the copper wire was set to about 4.0 m/min, the acid washing time in the acid cleaning mechanism was set to about 12.8 seconds, and the water washing time in the water washing mechanism was set to about 13.5 seconds.

Further, as an aspect of the present invention, the copper wire may be formed of a pure copper-based material; in the traveling direction of the copper wire, the upstream side of the winding mechanism has a copper wire auxiliary mechanism that assists the winding mechanism Coiling of copper wire.

Moreover, as a aspect of the present invention, the copper wire conveyance assisting mechanism may be disposed on the upstream side of the softening annealing mechanism in the traveling direction of the copper wire.

Moreover, as a aspect of the present invention, the copper wire conveyance assisting mechanism may be disposed on the downstream side of the cleaning mechanism in the traveling direction of the copper wire.

Moreover, as a aspect of the present invention, the immersion plating mechanism may be configured by a molten immersion solder bath for storing the molten immersion solder bath; the direction changing roller for converting the traveling direction of the copper wire, and the roller in the groove direction The structure is formed inside the molten dip solder bath, and the traveling direction of the copper wire is converted before and after the copper wire passes through the solder dipping solder bath; and the copper wire feeding auxiliary mechanism constitutes a direction change in the groove Roller.

Further, as a aspect of the present invention, the copper wire may be formed of a pure copper-based material; the immersion plating mechanism may be formed by a molten immersion solder bath for storing the molten immersion solder liquid; and the direction of the traveling direction of the copper wire will be changed. The conversion roller is formed by a groove-up direction changing roller, and is disposed above the molten immersion solder bath, and after the copper wire passes through the molten immersion solder bath, the traveling direction of the copper wire is converted to the winding mechanism One side; the fixed roller disposed on the upstream side of the winding mechanism of the winding mechanism, and the fixed roller disposed on the upstream side is configured by a roller disposed on the upstream side of the winding mechanism, and the roller is turned by the groove upward direction The copper wire is guided to the downstream side of the take-up mechanism; the groove-up direction change roller is disposed at a height higher than the arrangement of the roller disposed on the upstream side of the take-up mechanism.

Moreover, as an aspect of the present invention, the groove upward direction switching roller may be disposed at a position where the height of the liquid surface of the molten immersion solder liquid stored in the molten immersion solder bath is about 3 m.

Moreover, as a aspect of the present invention, the immersion plating mechanism may be configured by a molten immersion solder bath for storing the molten immersion solder bath; the direction changing roller for converting the traveling direction of the copper wire, and the roller in the groove direction And configured to be inside the molten immersion solder bath, and to switch the traveling direction of the copper wire before and after the copper wire passes through the molten immersion solder bath; and the copper wire feeding auxiliary mechanism forms a direction in the groove A transfer roller that assists the take-up mechanism in winding the copper wire.

Further, as a aspect of the present invention, the copper wire may be formed of a pure copper-based material; and the immersion plating mechanism may be performed by any one of a thin immersion plating setting and a thick immersion plating setting. The copper wire is immersed by thin immersion plating, and the thick immersion plating is thicker than the immersion plating thickness set by the thin immersion plating to form a thick immersion plating thickness; the thin immersion plating setting is such that the traveling speed of the copper wire is low speed Setting the immersion plating on the copper wire under the walking speed; the thick immersion plating setting is such that the traveling speed of the copper wire is below the high speed running speed of the low speed walking speed, and the copper wire is immersed The setting of the plating; in the high-speed traveling speed, the copper wire is subjected to the immersion plating setting according to the immersion plating thickness corresponding to the solder temperature according to the specified relationship between the solder temperature and the immersion plating thickness.

Moreover, as an aspect of the present invention, a preheating mechanism may be provided between the cleaning mechanism and the softening annealing mechanism, which heats the copper wire before passing through the softening annealing mechanism; the immersion plating mechanism is in the thick dipping In the setting of the plating setting, the copper wire which has passed through the preheating means and the softening annealing means is subjected to immersion plating.

Moreover, the method for producing a plated solder wire according to the present invention may be configured by a pre-coating treatment step, a immersion plating step, and a coiling step, and the pre-dip plating treatment step is performed on the copper wire before immersion plating. The immersion plating process applies a solder to the surface of the copper wire, and the winding process winds the copper wire which has been subjected to immersion plating on the surface. Wherein, in the pre-dip plating treatment step, a softening annealing step of softening and annealing the copper wire to reduce the endurance of the copper wire is performed; and the winding step is lower than the endurance of the copper wire having low endurance The winding force is performed in the winding step; during the winding step, the softening annealing step and the immersion plating step are continuously performed.

Further, in the aspect of the present invention, the copper wire may be formed of a pure copper-based material, and the softening annealing step may be supplied from a reducing gas supply unit provided on a downstream side portion in the traveling direction. Reductive gas to a softening annealing furnace, the softening annealing furnace is arranged obliquely, and the position of the downstream end portion in the traveling direction is lower than the position of the upstream end portion in the traveling direction, and the reducing gas system restores the copper wire An oxide layer on the surface; the interior of the softening annealing furnace is a reducing gas atmosphere, and the copper wire is allowed to travel in the softening annealing furnace.

Further, as a aspect of the present invention, the reducing gas may be formed by a mixed gas of a nitrogen gas and a hydrogen gas.

Further, as a aspect of the present invention, the volume ratio of the nitrogen gas to the hydrogen gas may be set to 4:1.

Moreover, as an aspect of the present invention, in the pre-dip plating treatment step, the copper wire may be subjected to a heat treatment step before the softening annealing step.

Moreover, as a aspect of the present invention, the copper wire may be formed of a pure copper-based material; in the pre-dip pretreatment process, a cleaning of the copper wire is performed before the softening annealing process. Process.

Moreover, the aspect of the present invention may include a heat treatment step of heat-treating the copper wire before the softening annealing step, and performing the heat treatment step before the cleaning step. .

Moreover, as an aspect of the present invention, the cleaning step may include an acid washing step and a water washing step, and in the pre-plating treatment step, the heat treatment step, the acid washing step, and the water may be sequentially performed. a washing step and the softening annealing step.

Moreover, as a aspect of the present invention, the copper wire may be a rectangular copper wire having a width of a vertical section of 0.8 to 10.0 mm and a thickness of 0.05 to 0.5 mm, and the vertical section is opposite to the length direction thereof. Vertical section. The traveling speed of the copper wire was set to about 4.0 m/min, the acid washing time in the acid washing step was set to about 12.8 seconds, and the water washing time in the water washing step was set to about 13.5 seconds.

Moreover, as a aspect of the present invention, the copper wire may be formed of a pure copper-based material; during the winding process, a copper wire conveyance assisting step may be performed to assist the winding process. Coiling of copper wire.

Moreover, as a aspect of the present invention, the copper wire may be formed of a pure copper-based material; after the immersion plating process, a groove-up direction change roller is disposed above the molten-dip solder bath; Passing the direction of travel of the copper wire after the melt-dip solder bath to the side of the upstream side of the winding mechanism, the groove-aligning roller is disposed on the surface to be immersed The upstream side of the winding mechanism for winding the copper wire is disposed higher than the arrangement height of the roller disposed on the upstream side of the winding mechanism, and the upstream side of the winding mechanism is disposed with the roller to guide the copper wire to the winding mechanism Downstream side.

Further, as a aspect of the present invention, the copper wire may be formed of a pure copper-based material, and the immersion plating process may be performed by any one of a thin immersion plating setting and a thick immersion plating setting. The thin immersion plating is performed by dipping the copper wire by thin immersion plating, and the thick immersion plating is thicker than the immersion plating thickness set by the thin immersion plating to form a thick immersion plating thickness; the thin immersion plating setting is to make the copper wire The walking speed is lower than the low speed walking speed, and the copper wire is subjected to immersion plating setting; the thick immersion plating setting is such that the traveling speed of the copper wire is lower than the high speed walking speed of the low speed walking speed, The copper wire is subjected to the setting of the immersion plating. In the high-speed traveling speed, the copper wire is subjected to the immersion plating setting according to the immersion plating thickness corresponding to the solder temperature according to the specified relationship between the solder temperature and the immersion plating thickness.

Further, as a aspect of the present invention, it is preferable to set the low speed traveling speed to about 4 m/min; preferably, the high speed running speed is set to about 13 m/min.

Further, as a aspect of the present invention, the solder temperature can be set to about 240 ° C at a high speed traveling speed.

Further, in the aspect of the present invention, when the immersion plating step is performed by the thick immersion plating, a preheating step is performed during the cleaning step and the softening annealing step, and the copper before passing through the softening annealing step is performed. Wire heating; after the softening annealing process, the copper wire which has been subjected to the softening annealing step is subjected to a immersion plating step.

According to the present invention, it is possible to provide a method and a manufacturing apparatus for a soldered wire, which can obtain a dip plating line 1b having a 0.2% sufficient endurance value and a desired quality, which can be obtained by setting such a dip plating line 1b. Product yield, in turn, can increase manufacturing efficiency.

An embodiment of the present invention will be described using the following drawings.

As shown in Fig. 1, the apparatus for manufacturing a plated solder wire according to the present embodiment is constituted by a pre-coating treatment mechanism 2, a dip plating mechanism 61, and a winding mechanism 71, and the pre-dip plating treatment mechanism 2 is a plating line. 1a is subjected to pre-dip plating treatment, and the dip plating mechanism 61 applies plating solder to the surface of the plating line 1a, and the winding mechanism 71 winds the dip plating line 1b on which the surface has been subjected to immersion plating.

The to-be-plated wire 1a is made of a flat-angle copper wire, and the flat-angle copper wire is calendered to a thickness of 0.05 to 0.5 by a separately prepared flat square wire manufacturing machine (not shown). Mm, width 0.8~10mm, preferably thickness 0.08~0.24mm, width 1~2mm.

The pre-dip pretreatment mechanism 2 is mainly composed of a supply unit 12, a heat treatment furnace 22, an acid cleaning tank 31, an ultrasonic water washing tank 41, and a softening annealing furnace 51.

The supply device 12 is supplied to the manufacturing line while being sequentially unwound by rotating the wire 1a to be plated which is curled in the state of the drum. The supply device 12 may be provided with a rotation function as needed, or may be configured to be continuously conveyed in a lateral direction.

The configuration of the heat treatment furnace 22 is similar to that of the softening annealing furnace 51 described later, and is configured to have a long rectangular parallelepiped appearance shape in the thickness direction and in the traveling direction. The heat treatment furnace 22 is disposed obliquely along the traveling direction, and the position of the downstream end portion in the traveling direction is lower than the position of the upstream end portion in the traveling direction. The inside of the heat treatment furnace 22 is set to a vapor atmosphere at a set temperature of 200 °C.

Further, a cooling water tank 23 is provided on the downstream side of the heat treatment furnace 22 in the traveling direction, and the cooling water tank 23 cools the wire to be plated 1a passing through the inside of the heat treatment furnace 22. The downstream end portion of the heat treatment furnace 22 and the cooling water tank 23 are connected to each other by a connection pipe 24, and the connection pipe 24 guides the wire 1a to be plated which is led out from the heat treatment furnace 22 to the cooling water tank 23 so that the wire 1a to be plated is not Contact with air.

The acid cleaning tank 32 as the cleaning mechanism 30 stores the phosphate-based cleaning liquid 32, and the phosphate-based cleaning liquid 32 pickles the surface of the to-be-plated wire 1a.

The ultrasonic water washing tank 41 as the cleaning mechanism 30 stores water 43 for washing, and washes the water-soluble lubricant or other impurities attached to the surface of the wire 1a to be plated by a separately prepared ultrasonic water washing machine. . An ultrasonic vibration plate 42a is disposed on the bottom surface of the ultrasonic water washing tank 41, and the ultrasonic vibration plate 42a constitutes a part of the ultrasonic water washing machine 42 along the traveling direction of the wire 1a to be plated. Further, an air wiper 45 is disposed above the ultrasonic water washing tank 41, and the air wiper 45 blows air from the side on the traveling rail of the line to be plated 1a toward the to-be-plated line 1a.

As shown in FIG. 2, the softening annealing furnace 51 is disposed obliquely, and the position of the downstream end portion in the traveling direction is gradually lower than the position of the upstream end portion in the traveling direction. The softening annealing furnace 51 is configured by softening the annealing furnace main body 52, the sheath tube 53, and the heater 54, and the softening annealing furnace main body 52 is formed in a rectangular parallelepiped shape similarly to the heating processing furnace 22, and the sheath tube 53 has a tubular shape and has a tolerance The inner diameter of the plating wire 1a is inserted through the softening annealing furnace body 52, and the heater 54 heats the inside of the softening annealing furnace body 52.

The sheath tube 53 is disposed in the inner space of the softening annealing furnace main body 52 along the traveling direction, and protrudes at both end portions in the longitudinal direction (traveling direction) of the softening annealing furnace main body 52, that is, the upper end portion and the lower end portion in the longitudinal direction. In the softened annealing furnace body 52 of the sheath tube 53, an upper end opening portion 55u is formed at the upper end of the sheath upper side protruding portion 55 which protrudes at the upper end portion thereof.

The upper end opening portion 55u allows the to-be-plated wire 1a to be introduced into the inside of the sheath tube 53, and the reducing gas G filled in the inside of the sheath tube 53 is discharged as will be described later. The lower end opening 55d is formed in the lower end of the sheath lower protruding portion 56 which protrudes from the lower end portion of the softened annealing furnace body 52 of the sheath tube 53.

The lower end opening portion 55d allows the wire 1a to be plated to be led out from the sheath tube 53. The sheath lower protruding portion 56 is coupled to the connecting tube 55 in series. Further, the intermediate portion of the lower projection portion 56 of the sheath constitutes a branch portion which is configured as the reducing gas supply portion 57, and the reducing gas supply portion 57 supplies the supply of the reducing gas G to the inside of the sheath 53 .

Further, although not shown, the reducing gas supply unit 57 includes a pressure regulating valve, a pressure gauge, and the like, and the reducing gas supply unit 57 adjusts the inflow of the reducing gas G in accordance with the concentration of the reducing gas G inside the softening annealing furnace 51. the amount.

The reducing gas G flows into the inside of the sheath tube 53 from the reducing gas G supply portion 57, and the inside thereof serves as a reducing gas atmosphere.

The heater 54 has a plurality of rods formed in a straight line, and is disposed in the upper side space and the lower side space with respect to the sheath tube 53, and is opposed to the sheath tube 53 with the inside of the softening annealing furnace body 52 interposed therebetween. The heater 54 is disposed in a direction perpendicular to the traveling direction of the to-be-plated wire 1a. Specifically, when it is the paper surface of the front view 2, it corresponds to a direction perpendicular to the paper surface of FIG. 2, and the plurality of heaters 54 are respectively The upper side space and the lower side space are arranged side by side at every specified interval along the traveling direction.

The inside of the softening annealing furnace 51 is set by the heater 54 to a temperature of 800 ° C or higher.

By connecting the sheath lower protruding portion 56 and the connecting tube 55 in series, the wire 1a to be plated through the softening annealing furnace 51 can be moved without coming into contact with the air before being immersed in the molten immersion solder liquid 63.

The immersion plating mechanism 61 is configured by a molten immersion solder bath 62 in which the molten immersion solder liquid 63 is stored, and the molten immersion solder liquid 63 is set at a set temperature of 260 ° C, and molten tin (Sn-3.0Ag- is used). 0.5Cu).

In the molten dip solder bath 62, a groove direction direction changing roller 64 is disposed, and the groove direction direction changing roller 64 converts the traveling direction of the dip plating line 1b to which the molten dip solder liquid 63 adheres to the direction vertically upward. .

Further, the in-slot direction changing roller 64 has a groove upward direction changing roller 65 vertically upward, and the groove up direction switching roller 65 converts the dip plating line 1b from the vertically upward traveling direction to the direction toward the winding mechanism 71.

The in-slot direction changing roller 64 and the in-slot direction changing roller 65 are larger than a roller having a diameter of about 20 mm, for example, a roller having a diameter of about 100 mm. Further, the in-slot direction changing roller 64 and the in-slot direction changing roller 65 are similar to those of the winding mechanism 71, which will be described later, by a drive motor not shown in the drawings. The rotation speed of the roller 74 or the bobbin is actively and actively rotated to make the same direction as the take-up speed of the take-up mechanism 71, and the direction of the dip plating line 1b is switched. In addition, according to the standard described in Japanese Industrial Standards (JIS) JIS Z8317-1, "ψ" is a symbol indicated in front of the diameter value of an arc or a full circle.

Next, the winding mechanism 71 will be described.

The take-up mechanism 71 is a take-up tension adjusting machine 72 and a traverse wire frame (bobbin traverse) is constructed by the winding machine 75.

The take-up tension adjusting machine 72 has a tension swinging wheel 74, and the tension swinging wheel 74 is movable in the vertical direction to adjust the tension state in response to the tension applied to the dip plating line 1b of the fixed roller 73. Although not shown, the take-up tension adjuster 72 is further configured by a tension detecting sensor, a control unit, and a roller actuator. The tension detecting sensor detects the tension of the immersion plating line 1b, and the control unit corresponds to the tension detecting sensor. The detected tension is controlled so that the tension is stabilized, and the roller actuator is made to move the tension swinging wheel 74 in accordance with an instruction from the control unit.

As shown in Fig. 3 (a), the traverse bobbin winding machine 75 is constituted by a bobbin 76, a motor 77, and a transmission mechanism 78, and the bobbin 76 is formed to be thick and wide corresponding to the width of the dip plating line 1b. The motor 77 swings the wire frame 76 in the axial direction of the wire frame 76, and the transmission mechanism 78 transmits a ball screw or the like that drives the motor 77. The traverse bobbin winding machine 75 is configured by a winding force detecting sensor 79, a control unit 81, and a motor 82. The winding force detecting sensor 79 detects the winding force of the bobbin 76, and the control unit 81 is used. The winding force is detected by the winding force detected by the tension detecting sensor 79 so that the tension is stabilized, and the motor 82 rotates the wire frame 76 in accordance with an instruction from the control unit 81.

The apparatus for manufacturing a plated solder wire 10 configured as described above is a step of immersing the pre-coating treatment mechanism 2, the dip plating mechanism 61, and the winding mechanism 71 from the upstream side of the traveling direction of the to-be-plated wire 1a and the dip plating line 1b. A series of arrangements in which the supply device 12, the heat treatment furnace 22, the acid cleaning tank 31, the ultrasonic water washing tank 41, and the softening annealing furnace 51 are used as the pre-dip processing mechanism 2, and are melted. The immersion plating solder bath 62 serves as the immersion plating mechanism 61.

Further, the structure of the soldering wire manufacturing apparatus 10 is such that the 0.2% proof stress of the wire 1a to be plated before the immersion plating is lowered, and thereafter, the line to be plated 1a having low endurance is used. The immersion plating is performed, and during the process, the winding mechanism 71 is used to wind up at a winding force lower than the endurance of the immersion plating line 1b.

Specifically, as the take-up mechanism 71, the above-described take-up tension adjusting machine 72 and the traverse bobbin type winding machine 75 are used, and a first conveying winch 91 and a second conveying winch 92 are provided, which are auxiliary winding. The winding of the mechanism 71. The first conveying winch 91 and the second conveying winch 92 are both disposed on the upstream side of the softening annealing furnace 51 to assist in the conveyance of the to-be-plated wire 1a before the low endurance.

Specifically, the first transfer winch 91 is disposed between the heat treatment furnace 22 and the pickling tank 31, and the second feed winch 92 is disposed between the ultrasonic water washing tank 41 and the softening annealing furnace 51.

Further, when the winding speed of the dip plating line 1b is too slow or too fast, the load on the dip plating line 1b becomes large. In particular, when the take-up speed is too fast, the problem of line offset is also generated. Therefore, the speeds of the first transport winch 91 and the second transport winch 92 are only slightly faster than the take-up speed of the take-up mechanism 71, for example, a relative roll. The take-up speed is faster than the transport speed of about +1 m/min, and the to-be-plated line 1a and the dip-plating line 1b are sent out to the downstream side.

The winding mechanism 71 appropriately has a plurality of fixed rollers 73 that are immersed in the immersion plating line 1b in the vicinity of the winding tension adjusting device 72 and the traverse bobbin winding machine 75.

Among the plurality of fixed rollers 73 disposed in the winding mechanism 71, the fixed roller 73 provided on the most upstream side in the traveling direction is set as the upstream side arrangement roller 73A of the winding mechanism. The roller 73A is disposed on the upstream side of the winding mechanism, and the dip plating line 1b is firstly wound on the side of the winding mechanism 71 by the direction of the groove direction switching roller 65. Roller.

The groove direction changing roller 65 is disposed at a position higher than the roller 73A on the upstream side of the winding mechanism.

Next, a method of manufacturing a plating solder wire will be described.

The method of manufacturing the plated solder wire is produced by a pre-dip plating process, a dip plating process, and a coiling process, and the pre-dip plating process is performed on the plating line 1a before the immersion plating process, and the immersion plating process is performed on the surface of the to-be-plated wire 1a. The soldering is performed, and the coiling process is performed on the surface of which the immersion plating line 1b has been subjected to immersion plating.

The pre-dip plating treatment step is a step of sequentially performing a heat treatment step, an acid washing step, a water washing step, and a softening annealing step.

The heat treatment step is a step of washing the surface vapor of the wire 1a to be plated by the inside of the heat treatment furnace 22 as a vapor atmosphere by the wire 1a to be plated. By the vapor cleaning, the water-soluble lubricant or other impurities adhering to the surface of the wire 1a to be plated can be separated from the surface thereof, and the water-soluble lubricant or other impurities adhering to the surface of the wire 1a to be plated can be easily removed.

In the heat treatment step, the annealing temperature in the heat treatment furnace 22 is set to be lower than the annealing temperature of 200 ° C which is generally about 650 ° C, and the inside of the heat treatment furnace 22 set to the low temperature is used as a vapor atmosphere, and the wire to be plated 1a is moved to The plating line 1a is subjected to steam cleaning.

As described above, in the heat treatment step, the plating wire 1a is subjected to steam cleaning, and the wire to be plated 1a is annealed to have low endurance. However, the heat treatment step suppresses the degree of low endurance of the to-be-plated wire 1a by setting the annealing temperature to a low temperature setting such as 200 °C.

Moreover, the wire 1a to be plated after the heat treatment furnace 22 is heated is cooled to a predetermined temperature by the connection pipe 24 and then by the cooling water stored in the inside of the cooling water tank 23.

In the acid washing step, the surface of the wire to be plated 1a on which the wire to be plated 1a is stored is acid-washed by the phosphate-based cleaning liquid 32 stored in the acid cleaning tank 31 to be plated.

The water washing step is to wash the surface of the to-be-plated wire 1a by ultrasonic water in the ultrasonic cleaning tank 41, and remove the water-soluble lubricant or other impurities attached to the surface of the wire 1a to be plated.

The softening annealing step is performed by softening and annealing the wire to be plated 1a, lowering the endurance, and reducing the oxide layer on the surface of the wire to be plated 1a by the inside of the softening annealing furnace 51 in which the wire 1a to be plated is to be used as a reducing gas atmosphere.

Specifically, as shown in FIG. 2, the softening annealing step is to supply the reducing gas G to the inside of the sheath tube 53 of the softening annealing furnace 51 from the reducing gas supply unit 57 provided in the lower projection portion 56 of the sheath tube, and to soften the annealing furnace 51. The inclined arrangement is such that the position of the downstream end portion in the traveling direction is lower than the position of the upstream side end portion in the traveling direction, and the reducing gas G is, for example, a mixture of hydrogen gas and nitrogen gas. The gas, the inside of the sheath tube 53 serves as a reducing gas atmosphere. Further, the inside of the softening annealing furnace body 52 is made by the heater 54 The space is heated to about 800 °C.

In the inside of the sheath tube 53 as the reducing gas atmosphere, the wire 1a to be plated introduced from the upper end opening 55u is moved in the opposite direction to the rising direction d1 of the reducing gas G, that is, in the lower direction D (refer to a partial enlarged view in FIG. 2). Arrows d1, D) are shown.

In the subsequent immersion plating step, the molten immersion plating liquid 63 stored in the molten immersion solder bath 62 is to be adhered to the surface of the line to be plated 1a by the molten immersion plating liquid 63 stored in the molten immersion solder bath 62.

The wire 1a to be plated, which is led out from the lower end opening 55d of the softening annealing furnace 51, is guided by the inside of the connecting pipe 55 without being in contact with the air, and before being immersed in the molten immersion soldering liquid 63.

The wire 1a to be plated which is immersed in the molten immersion solder liquid 63 is adhered to the surface of the molten immersion soldering liquid 63, and the immersion plating line 1b which is covered with the molten immersion soldering liquid 63 is formed on the entire surface. The process of walking the inside of the molten dip solder bath 62 by the dip plating line 1b is carried out by the in-slot direction changing roller 64 provided in the molten dip solder bath 62 while walking in the molten dip solder bath 62. The direction is shifted to the vertical direction and is led out from the molten dip solder bath 62 toward the vertical direction.

The dip plating line 1b is led out from the molten dip solder bath 62, and is direction-shifted by the groove up direction switching roller 65, and travels toward the winding mechanism 71 side.

In the winding-up process, the tension of the immersion plating line 1b which has passed through these processes is controlled by the tension oscillation wheel 74 of the winding tension adjusting machine 72 during the immersion plating process and the immersion plating process in the to-be-plated wire 1a. Adjusting, rolling the dip plating line 1b to the traverse line frame winding machine 75 in a row The configured wire rack 76.

As shown in detail in Fig. 3 (a) and (b), while the wire frame 76 of the traverse bobbin type winding machine 75 is pivoted, the wire frame 76 is swung in the axial direction, and the dip plating line 1b can be along The axial direction of the wire frame 76 is rolled up side by side, and the plurality of layers may be overlapped and taken up.

The above-described various functions and effects of the above-described various types of the soldering wire manufacturing apparatus 10 and the manufacturing method can be obtained.

In the manufacturing apparatus 10 for the soldering wire, the immersion plating pretreatment mechanism 2, the immersion plating mechanism 61, and the winding mechanism 71 are arranged in series from the upstream side in the traveling direction of the immersion plating line 1b, wherein the supply device 12 and the heating are provided. The processing furnace 22, the acid cleaning tank 31, the ultrasonic water washing tank 41, and the softening annealing furnace 51 are used as the pre-dip plating treatment mechanism 2, and the molten dip solder bath 62 is used as the dip plating mechanism 61.

By arranging the respective mechanisms in this series, it is possible to prevent the immersion plating line 1b having low endurance from walking an unnecessary distance during manufacture, and to reduce the load on the immersion plating line 1b during traveling.

Therefore, the dip plating line 1b having a 0.2% sufficient endurance value and a desired quality can be obtained, and by obtaining such a dip plating line 1b, the product yield can be improved and the manufacturing efficiency can be improved.

Furthermore, the method for producing a plated solder wire is to continuously perform a heat treatment step, an acid cleaning step, an ultrasonic water washing step, a softening annealing step, a dip plating treatment step, and a winding step, and a heat treatment step, The acid washing step, the water washing step, and the softening annealing step are used as a pre-dip plating treatment step.

By continuously performing the respective steps in this manner, it is not necessary to spend the time of moving the dip plating line 1b (the line to be plated 1a) to another traveling line or the like, for example, every time a predetermined process is passed, the immersion plating line 1b is interrupted for the next process. Walking of (to be plated 1a). Therefore, the load applied to the immersion plating line 1b can be greatly alleviated, and the immersion plating line 1b of a desired quality can be stabilized and obtained.

Therefore, the dip plating line 1b having a 0.2% sufficient endurance value and a desired quality can be obtained, and by obtaining such a dip plating line 1b, the product yield can be improved and the manufacturing efficiency can be improved.

Further, the dip plating line 1b having a 0.2% proof endurance value and a desired quality can be efficiently produced, and therefore, a dip plating line 1b suitable for mass production and low endurance can be obtained as a lead wire for a solar cell.

Further, in the apparatus for manufacturing a solder wire, the softening annealing furnace 51 is disposed obliquely, and the position of the downstream end portion in the traveling direction is lower than the position of the upstream end portion in the traveling direction, and the softening is performed. The downstream side of the traveling direction of the furnace 51 is provided with a reducing gas supply portion 57 that allows the reducing gas G to be supplied to the sheath tube 53, and the sheath tube 53 allows the wire to be plated 1a to travel while being inserted into the inside.

The method of producing the soldering wire is in the softening annealing step, and inside the softening annealing furnace 51, the reducing gas G is supplied from the reducing gas supply portion 57 provided through the lower end side portion (downstream side portion) of the sheath tube 53. The inside of the sheath tube 53 is supplied, and the wire to be plated 1a is moved inside the sheath tube 53 as a reducing gas atmosphere from the upstream side in the traveling direction toward the downstream side.

As shown in FIG. 2, in the inside of the sheath tube 53 as a reducing gas atmosphere, the apparatus for manufacturing a plating wire and the manufacturing method thereof are to be plated. The line 1a can travel in a direction opposite to the direction d1 in which the reducing gas G rises, that is, in the downward direction D.

Thereby, the to-be-plated wire 1a which walks inside the sheath tube 53 can be actively exposed to the environment in which the reducing gas G rises, and therefore, the reduction of the oxide layer on the surface of the to-be-plated wire 1a can be efficiently promoted. Low endurance of plating line 1a.

Further, in the inside of the sheath tube 53, the lower end side portion (downstream side portion) in the longitudinal direction of the to-be-plated wire 1a during traveling is exposed to the inside of the sheath tube 53 by the reducing gas supply portion 57. The environment in which the gas G is reduced (refer to Fig. 2).

In other words, in the inside of the sheath tube 53, when the to-be-plated line 1a while walking is close to the reducing gas supply unit 57, the low endurance of the to-be-plated wire 1a and the reduction of the oxide layer on the surface can be actively promoted, and the plating line 1a is restored. During the derivation of the gas supply unit 57 from the softening annealing furnace 51, under the heating of the heater 54, the low endurance of the to-be-plated wire 1a and the reduction of the oxide layer on the surface can be surely performed.

Further, in this way, the low endurance of the to-be-plated wire 1a and the reduction of the oxide layer on the surface can be reliably and efficiently performed, so that the walking distance of the wire to be plated 1a traveling inside the softening annealing furnace 51 can be shortened, and The traveling speed of the wire 1a to be plated is increased.

Further, in the pre-dip plating treatment step, the softening annealing furnace 51 is used in the softening annealing step to simultaneously perform the low endurance of the to-be-plated wire 1a and the removal of the oxide layer on the surface thereof, and in series with the respective processes. The reduction step of reducing the oxide film on the surface of the line to be plated 1a, and the softening annealing step of softening annealing of the line to be plated 1a, the former can be shortened to be plated The walking distance of line 1a.

Therefore, it is possible to reduce the load on the line to be plated 1a which is low in endurance, and to manufacture a high-quality immersion plating line 1b.

Further, the heat treatment step performed before the softening annealing step is to remove the adhering matter adhering to the surface of the wire to be plated 1a by heating in the heat treatment furnace 22. For example, when the deposit is a liquid deposit such as oil, it can be vaporized. Accordingly, the deposit can be removed from the surface of the wire 1a to be plated regardless of the nature of the adhering substance such as solid or liquid.

In particular, by performing the heat treatment step before the acid washing step, the line to be plated 1a is previously heated in the heat treatment step, and the line to be plated 1a in the heated state can be acid washed in the acid washing step, and therefore, Improve the acid cleansing effect.

Further, in the heat treatment furnace 22, the annealing effect of the plating wire 1a can be obtained according to the heating temperature.

However, according to the above-described soldering wire manufacturing apparatus 10 and the manufacturing method, in the heat treatment process, the heat treatment furnace 22 disposed on the upstream side of the softening annealing furnace 51 is completely lowered to 0.2% of the endurance value to be plated 1a. Before the value, the plating line 1a is not subjected to softening annealing, but is left in a mild softening annealing. Next, in the washing step after the heat treatment step, the plating line 1a is subjected to necessary washing, and then the softening annealing step is performed before the immersion plating step, and the plating line 1a is soft-annealed to lower the 0.2% proof value. To the specified value.

Thereby, it is not necessary to perform the washing process for the to-be-plated wire 1a which has low endurance, and it can reduce the load which the to-be-plated wire 1a can bear.

Specifically, the set temperature at the time of annealing in a general heat treatment furnace is about 650 ° C, and the heat treatment furnace 22 is set to a low temperature of about 200 ° C as a vapor atmosphere as described above.

Further, the temperature of the general softening annealing furnace is set to about 530 ° C, and the softening annealing furnace 51 is set to, for example, a high temperature of about 800 ° C as described above.

In this way, in the heat treatment step, the low-endurance of the to-be-plated wire 1a is suppressed, and the softening annealing process performed after the subsequent washing step such as acid washing or ultrasonic water washing uses the softening annealing furnace 51 to be plated. The 0.2% endurance value of the line 1a is lowered to a specified value and the endurance is low.

Therefore, the acid to be plated 1a before the low endurance is washed by the ultrasonic wave and the ultrasonic wave is washed, and the former can be lightened, for example, in the case where the process is performed on the to-be-plated wire 1a after the low endurance. The effect of the load of the plating line 1a is such that the quality of the immersion plating line 1b can be improved.

Further, since the inside of the heat treatment furnace 22 serves as a vapor atmosphere, the plating line 1a may be soft-annealed depending on the heating temperature, and the effect of steam washing may be expected. Therefore, in the heat treatment furnace 22, the plating line 1a is subjected to vapor cleaning, and the adhering matter adhering to the surface of the to-be-plated wire 1a is easily removed by the vapor to be surface-formed, and therefore, the acid cleaning process is performed thereafter. And the water washing step, which can surely remove the water-soluble lubricant or other impurities attached to the surface of the wire 1a to be plated.

Therefore, it is possible to manufacture a high-quality immersion plating line 1b which is covered with a uniform immersion plating thickness.

Hereinafter, an effect confirmation experiment will be described.

(Effect confirmation experiment)

First, as an effect confirmation test related to the heat treatment step and the softening annealing step, two experiments of the experiments A and B for confirming the annealing effect were described.

(annealing effect confirmation experiment A)

Annealing effect confirmation Experiment A was subjected to a heat treatment step at a low temperature setting of a heat treatment temperature of 100 degrees, and then soft annealing was performed in a softening annealing step under various annealing temperatures. In this case, the relationship between the setting of the annealing temperature and the low endurance value of the copper wire after the winding step is made clear, and based on this relationship, the annealing temperature to be set in the softening annealing step in order to obtain a desired low endurance value is confirmed. .

Further, the annealing effect confirmation experiment A was carried out using the above-described manufacturing apparatus 10 under the experimental conditions shown in Table 1.

Further, the results of the annealing effect confirmation experiment A are shown in Table 2 and FIG.

Here, Table 2 shows that one of the tensile properties of the dip plating line 1b after winding up in the winding step, and the result of 0.2% proof stress, is in the softening annealing furnace. Under the setting of each of the specified annealing temperatures in 51, the plating line 1a is annealed, and the 0.2% proof stress value of the immersion plating line 1b after the winding step is taken. Fig. 4 is a graph showing the relationship between the 0.2% proof stress value and the softening annealing temperature after the dip plating line 1b is taken up in the winding step according to Fig. 2 .

As shown in Table 2 and FIG. 4, the heat treatment process is performed at a low temperature of 100 degrees in the heat treatment process, and the annealing temperature in the softening annealing process is, for example, a low temperature of about 550 °C. The annealing of the plating line 1a was insufficient, and the 0.2% proof stress value was a tendency to be high.

However, even if the heat treatment temperature in the heat treatment step is a low temperature of 100 degrees, if the annealing temperature in the softening annealing step is 800 ° C to 900 ° C, it can be confirmed that the 0.2% proof stress value of the dip plating line 1b after winding is surely converged to 55 MPa. Hereinafter, it is a desired low endurance value.

(annealing effect confirmation experiment B)

Annealing effect confirmation experiment B is performed under various heat treatment temperatures, and the heat treatment process is performed so that the relationship between the 0.2% proof stress value of the to-be-plated wire 1a and the heat treatment temperature after the heat treatment process is clear, and is fixed at 850 ° C. Under the annealing temperature setting, the softening annealing step is performed on the to-be-plated wire 1a, and the relationship between the 0.2% proof stress value after the softening annealing step and the heat treatment temperature is made clear.

Further, this effect confirmation experiment B was carried out by applying the above-described manufacturing apparatus 10 and under the experimental conditions shown in Table 3.

Further, the results of the annealing effect confirmation experiment B are shown in Table 4 and FIG.

Here, Table 4(a) shows the result of setting the 0.2% proof stress of the to-be-plated line 1a before the softening annealing process, and setting the heat-treatment process to the plating line 1a heat-heating process. And, for each setting of the specified heat treatment temperature, the 0.2% proof stress value of the to-be-plated wire 1a before the softening annealing process was measured.

Table 4(b) shows the results of measuring the 0.2% proof stress value of the dip plating line 1b after coiling, setting the temperature of each of the above specified heat treatment temperatures, and setting the same annealing temperature at 850 ° C in the softening annealing step. Next, each of the to-be-plated wires 1a which have been subjected to the heat treatment step is annealed, and the 0.2% proof stress value of the dip-plating line 1b after winding is measured.

5 is a graph showing the relationship between the 0.2% proof stress value of the wire 1a to be plated after passing through the heat treatment furnace 22 and the temperature of the heat treatment furnace according to the results shown in Table 4 (a), and according to Table 4 (b). As a result, a curve showing the relationship between the 0.2% proof stress value and the annealing temperature of the wire 1a to be plated after softening the annealing furnace is drawn. Figure.

As shown in Tables 4(a), (b) and 5, in the heat treatment step, when the heat treatment temperature is low, the annealing effect is small, and the 0.2% proof stress value is not lowered. However, the annealing effect in the softening annealing step becomes large, and the 0.2% proof stress value can be lowered.

On the other hand, in the heat treatment step, if the heat treatment temperature is high, a sufficient annealing effect can be obtained in the heat treatment step, and the annealing effect in the softening annealing step can be reduced to the extent.

In other words, the heat treatment temperature in the heat treatment step was set to a high temperature of 850 ° C in the softening annealing step, and it was confirmed that the 0.2% proof value was reliably lowered to a low value of about 55 MPa or less.

According to this, irrespective of the heat treatment temperature of the heat treatment step, the annealing temperature of the softening annealing step performed after the heat treatment step is set to 850 ° C, and as a result, the line to be plated 1 a subjected to the softening annealing step can be sufficiently low-resistance. . As a result, on the contrary, from the side of the heat treatment process, the heat treatment temperature is not necessarily set to a high temperature, and can be arbitrarily set in accordance with the purpose.

Specifically, in the heat treatment process, by setting the heat treatment temperature to a low temperature of, for example, about 100 to 300 degrees, it is possible to suppress low endurance of the wire to be plated 1a in the heat treatment furnace 22. Therefore, it is confirmed that the degree of endurance of the to-be-plated wire 1a can be reduced in the heat treatment process, and even after the heat treatment process and the cleaning process performed before the softening annealing process, even if a load is applied to the wire 1a to be plated, As for the extent of sudden elongation or destruction.

In the heat treatment process, even if the heat treatment temperature is set to, for example, In the case of about 100 to 300 degrees, the low endurance of the to-be-plated wire 1a can be promoted to some extent in the heat treatment process.

In other words, in the heat treatment step, by setting the heat treatment temperature to, for example, 100 to 300 degrees, the heat treatment step can be performed as a function of preliminary annealing when the line to be plated 1a is low in endurance, and in order to make the line to be plated 1a is sufficiently low-resistance to about 55 MPa or less, and the annealing time required for the main annealing in the softening annealing step can be shortened.

Therefore, in order to improve the productivity of the solder wire for solar cells and increase the line speed of the wire 1a to be plated, it is not necessary to form the length of the softening annealing furnace 51, and the line speed can be smoothly improved. .

Next, in the softening annealing step, two experiments of the annealing furnace hydrogen concentration verification experiment A and the annealing furnace hydrogen concentration verification experiment B are performed to verify the difference in the hydrogen gas concentration contained in the reducing gas G supplied to the softening annealing furnace 51. , the impact on the 0.2% endurance value.

(Annealed furnace hydrogen concentration verification experiment A)

In the annealing furnace hydrogen concentration verification experiment A, the immersion plating line 1b of the present invention example and the plating line of the comparative example were used as test samples, which were produced through the above-described manufacturing process.

The immersion plating line 1b of the present invention example and the immersion plating line of the comparative example differ only in the softening annealing process, and others are formed through the same process.

In order to form the immersion plating line 1b of the present invention and the softening annealing process performed by the immersion plating line of the comparative example, both of the softening annealing furnace 51 are used as a reducing gas atmosphere, but the composition of the reducing gas G is different.

That is, in the case where the immersion plating line of the comparative example is produced, the reducing gas G is only In the case of the immersion plating line 1b of the present invention, the reducing gas G is a mixed gas of a nitrogen gas and a hydrogen gas.

Further, in the present experiment, in the production of the immersion plating line 1b of the present invention and the immersion plating line of the comparative example, oxygen-free copper was used as the wire 1a to be plated, and the size of the wire 1a to be plated was 0.16 × 2 mm, and the heat treatment furnace 22 was used. The temperature was set to 200 ° C, and the respective take-up wire speeds of the first conveying winch 91 and the second conveying winch 92 were +1 m/min.

Moreover, when these immersion plating lines 1b are manufactured, the plating line 1a is subjected to an acid washing step and an ultrasonic water washing step before the softening annealing step. Further, the acid washing step was carried out by setting the set temperature of the phosphate-based cleaning liquid to 50 °C. In the immersion plating step, the set temperature of the molten immersion solder liquid 63 is 260 ° C, and the molten immersion solder liquid 63 is made of molten tin (Sn-3.0Ag-0.5Cu). Further, the winding mechanism 71 does not have the take-up tension adjusting device 72, but is directly wound by the traverse bobbin winding machine 75.

In the immersion plating line 1b of the present invention and the immersion plating line of the comparative example, respectively, three immersion plating thicknesses of 20 μm, 30 μm, and 40 μm were generated, and the respective 0.2% proof values were compared, and the results are shown in FIG. The graph.

As shown in the graph of Fig. 6, in the case where the thickness of the immersion plating was 20 μm, 30 μm, or 40 μm, the immersion plating line 1b of the present invention and the immersion plating line of the comparative example were compared, and the 0.2% proof stress values were all low. When it was confirmed that the thickness of the immersion plating was 40 μm, the rate of decrease in the 0.2% proof stress value of the immersion plating line 1b of the present invention was the highest as compared with the immersion plating line of the comparative example.

Therefore, it can be confirmed that in the annealing step, the wire to be plated 1a is moved inside the softening annealing furnace 51, and the inside of the softening annealing furnace 51 is a reducing gas atmosphere containing hydrogen gas, and the wire to be plated 1a is more efficiently promoted. Low endurance.

(Annealed furnace hydrogen concentration verification experiment B)

In the annealing furnace hydrogen gas concentration verification test B, the reducing gas G supplied from the reducing gas supply unit 57 to the inside of the softening annealing furnace 51 is a mixed gas containing at least nitrogen gas and hydrogen gas, and the volume ratio of the hydrogen gas to the mixed gas is occupied. The experiment of verifying the difference in the mixing ratio indicated by the influence of the 0.2% proof stress value of the immersion plating line 1b (to be plated wire 1a) was applied to the above-mentioned manufacturing apparatus 10, and under the experimental conditions shown in Table 5. get on.

The results of the annealing furnace hydrogen concentration verification experiment B are shown in Table 6 and Figure 7.

Here, Table 6 shows the result of measuring the 0.2% proof stress value of the dip plating line 1b after the coiling step, and the mixing ratio of the hydrogen gas to the reducing gas composed of at least nitrogen gas is set to 0, 10, and 20, respectively. , 30, 40, At 50%, the reducing gas was supplied to the inside of the softening annealing furnace 51 at a flow rate of 4.0 l/min, and the annealing step was performed to measure the 0.2% proof stress value of the immersion plating line 1b after the winding step.

Fig. 7 is a graph showing the relationship between the ratio of the mixing ratio of the hydrogen gas to the mixed gas as the reducing gas and the 0.2% proof value of the dip plating line 1b after the winding step, according to Table 6.

As a result of the results shown in Fig. 7 and Table 6, it was confirmed that the 0.2% proof value was the same or lower as the mixing ratio of the hydrogen gas was increased. From this point of view, it can be confirmed that the mixing ratio of the hydrogen gas is high, and the 0.2% proof stress value tends to be at least low.

Therefore, it was confirmed that the hydrogen gas has an effect of reducing the oxide film on the surface of the to-be-plated wire 1a, and the effect of lowering the 0.2% proof stress value can be improved in accordance with the concentration of the hydrogen gas in the reducing gas.

Next, according to the relationship between the concentration of the hydrogen gas in the reducing gas shown in FIG. 7 and the 0.2% proof value of the immersion plating line 1b, by controlling the concentration of the hydrogen gas relative to the reducing gas, it can be seen that the control of the to-be-plated line 1a is low in endurance. The possibility of degree.

Moreover, the apparatus for manufacturing a plated solder wire and the method for producing a plated solder wire according to the present invention are not limited to the configuration of the above-described plating solder wire manufacturing apparatus 10 and the method of manufacturing a solder wire, and can be formed by various configurations. And constitute.

For example, in the manufacturing apparatus 10A of another embodiment, as shown in FIGS. 8(a) and 8(b), the preheating furnace 51P can be disposed between the ultrasonic water washing tank 41 and the softening annealing furnace 51.

As shown in Fig. 8(b), even in the walking time and line of the wire 1a to be plated When the walking distance is short, the preheating furnace 51P also sharply raises the temperature of the to-be-plated wire 1a, and is a special structure.

Specifically, the preheating furnace 51P has a sheath tube 53L in the preheating furnace body 52P. The sheath tube 53L is a hollow tube that is linearly formed along the traveling direction of the wire 1a to be plated, and the inside of each of the preheating furnace body 52P and the softening annealing furnace body 52 is placed in communication with each other to pass the wire 1a to be plated. When the furnace 51P and the softening annealing furnace 51 are preheated, the wire 1a to be plated is oxidized without being exposed to air.

The inside of the preheating furnace 51P is the same as the softening annealing furnace 51, and the inside of the furnace main body 52P is preliminarily heated, and the heaters 54P are provided along the longitudinal direction of the sheath tube 53L, and are narrower than the heater of the softening annealing furnace 51. The configuration of 54 is configured by the distance of the interval. Further, the number of the heaters 54P is not limited to the number of the heaters 54 of the softening annealing furnace 51, and the amount of electric power (wattage) or the like may be increased.

Thereby, even if the speed line is allowed to walk the wire 1a to be plated, the wire 1a to be plated can be heated in the preheating furnace 51P before the softening annealing process, and the wire 1a to be plated in a heated state can be supplied to the softening annealing furnace 51. Take the preheating process.

Therefore, in response to the increase in the linear velocity of the wire 1a to be plated, in the softening annealing step, the wire 1a to be plated can be surely in a state of being sufficiently low in endurance.

Further, a portion between the softening annealing furnace 51 of the sheath tube 53L and the preheating furnace 51P is configured with a pre-reduction gas supply portion 57P that supplies a reducing gas to a portion corresponding to the preheating furnace 51P in the longitudinal direction of the sheath tube 53L.

The reducing gas supply unit 57 supplies a mixed gas of hydrogen and nitrogen as the reducing gas G to the sheath tube 53L, and the internal space of the softening annealing furnace 51 corresponding to the sheath tube 53L is used as a mixed gas atmosphere, and the reducing gas supply is performed in advance. The portion 57P supplies a nitrogen gas or a steam gas as the reducing gas G to the internal space of the preheating furnace 51P corresponding to the sheath tube 53L, and the internal space is a nitrogen gas atmosphere or a water vapor gas atmosphere.

Thereby, it is possible to prevent the surface of the to-be-plated wire 1a from being oxidized when it passes through the preheating furnace 51P, and the preheating furnace 51P does not use hydrogen gas as the reducing gas G, but uses nitrogen gas or steam gas to be safe. It is easy to handle.

Specifically, when the line speed at the time of the to-be-plated line 1a is 4 m/min, as shown in Table 7 (a), it can confirm that the immersion plating line 1b is dip by any flat angle size and temperature setting. After the plating process, the 0.2% proof stress value can be lowered to a low value below 45 MPa.

Further, Table 7(a) shows the values of the 0.2% proof stress value and the immersion plating thickness at the time of forming the immersion plating line 1b, and three kinds of flat angles of 0.2 mm × 1.0 mm, 0.16 mm × 2.0 mm, and 0.2 mm × 2.0 mm were used. A flat square wire is used as the to-be-plated wire 1a, and a line speed of 4 m/min is set for each of the to-be-plated wires 1a, and three kinds of soldering temperatures are set at 240 ° C, 260 ° C, and 280 ° C to form a dip plating line. 1b.

On the other hand, when the line speed at which the to-be-plated wire 1a is traveling is 13 m/min, as shown in Table 7 (b), the setting of the dip plating line 1b is mostly set at any of the flat angle dimensions and temperature. The 0.2% endurance value is a value of 50 MPa or more, and the former is a higher value than the case where the general set line speed is 4 m/min.

This is because, by setting the line speed of the wire 1a to be plated at a high speed, in the softening annealing furnace 51, the wire 1a to be plated is not sufficiently filled with low endurance, that is, by softening the annealing furnace 51, resulting in insufficiently low endurance. The condition of the generation of the immersion plating line 1b.

Further, Table 7(b) shows the values of the 0.2% proof stress value and the immersion plating thickness when the immersion plating line 1b is formed, and is set at a high speed of 13 m/min at the line speed, and the flat angle size and the solder temperature are the same as in Table 7(a). Under the setting, the immersion plating line 1b is formed.

In other words, when the linear velocity of the to-be-plated wire 1a is simply set to a high speed, the sufficient low endurance cannot be achieved, and there is a problem that the linear velocity cannot be increased.

On the other hand, in the above-described manufacturing apparatus 10A, a preheating furnace 51P is provided between the softening annealing furnace 51 and the ultrasonic water washing tank 41.

Before the to-be-plated wire 1a is supplied to the softening annealing furnace 51, the wire 1a to be plated can be heated to a high temperature in a short time by the preheating furnace 51P, and the wire 1a to be plated in a high temperature state can be supplied to the softening annealing furnace. 51.

Therefore, by setting the line speed to the above-described high-speed traveling speed, even when the to-be-plated wire 1a passes through the softening annealing furnace 51 at a high speed, the to-be-plated wire 1a can be reliably made low in the softening annealing process.

Specifically, as described above, the preheating step is performed by providing the preheating furnace 51P, and even if the line speed is set to a high speed setting of 13 m/min, the line speed can be set to the same level as the generally set 4 m/min. Since the 0.2% proof stress value of the plating line 1a is lowered, it is possible to obtain a low-quality, high-quality immersion plating line 1b having a low endurance value of 0.2% by good production efficiency.

Further, even if the to-be-plated wire 1a is set to travel at a high speed of 13 m/min, the oxide layer on the surface of the to-be-plated wire 1a can be surely reduced in the softening annealing furnace 51.

As described above, the preheating furnace 51P provided in the vicinity of the upstream side of the softening annealing furnace 51 is configured to be specialized in the heating performance of the wire 1a to be plated, and supplies nitrogen gas or steam gas to the inside thereof as a safety. A gas environment that is easy to handle. Therefore, in the softening annealing furnace 51 as a mechanism for securing the softening annealing time, for example, the configuration in which only the softening annealing furnace 51 is elongated, the former does not have a problem of installation space or cost increase, and by utilizing existing equipment, The simple configuration of additional design changes can be used to speed up the line speed.

Further, as another embodiment, the heat treatment furnace 22 is not necessarily required, and as shown in FIG. 9(a), the configuration of the manufacturing apparatus of another embodiment may not be such that the heat treatment furnace 22 is not provided. The supply device 12 in the direction is between the acid cleaning tank 31. Further, the heat treatment furnace 22 is not limited to being disposed between the supply device 12 and the pickling tank 31 in the traveling direction, and may be provided at another portion as long as the upstream side of the annealing furnace 51 is softened.

For example, the heat treatment furnace 22 is not provided on the upstream side of the acid cleaning tank 31, and only the preheating furnace 51P is provided, and the steam gas is used as the reducing gas, and may be supplied to the inside of the preheating furnace 51P.

According to this configuration, as described above, the preheating furnace 51P can have both functions, and the function of the heating processing furnace 22 is added in addition to the function of preheating before the softening annealing furnace 51.

Therefore, it is needless to say that the reduction in equipment cost can be achieved, and the walking distance of the to-be-plated wire 1a can be further shortened, and the dip plating line 1b having a low-resistance value of 0.2% and high quality can be produced.

Further, as described above, the inside of the softening annealing furnace 51 serves as a reducing gas atmosphere, and as described above, the reducing gas G is not limited to a nitrogen gas or a mixed gas of a nitrogen gas and a hydrogen gas, and may contain other components. Further, it may be configured by a reducing gas other than a nitrogen gas or a hydrogen gas.

Further, by arranging the cleaning mechanism on the upstream side of the softening annealing furnace 51 in the traveling direction, the wire 1a to be plated before the low endurance is softened by the softening annealing furnace 51 can be cleaned by the cleaning mechanism 30. Therefore, compared with the wire 1a to be plated which has been low in endurance by the softening annealing furnace 51, the cleaning mechanism 30 is used. In the case of washing, the former can alleviate the load applied to the wire 1a to be plated.

Therefore, a dip plating line 1b having a 0.2% proof endurance value and a desired quality can be obtained, and in particular, a suitable dip plating line 1b can be obtained as a solder wire for solar cells.

In addition, in comparison with the case where the wire 1a to be plated which is low in endurance by the softening annealing furnace 51 is cleaned by the cleaning mechanism 30, the load applied to the wire 1a to be plated can be reduced, and therefore, in order to reduce the load When the plating line 1a is running, it is not necessary to reduce the number of the conveying winches or to reduce the line speed.

Therefore, in order to reduce the load applied to the to-be-plated wire 1a, the countermeasure can be simplified in terms of configuration and control, and the condition setting can be simplified. Therefore, the manufacturing efficiency of the dip plating line 1b can be improved.

Further, by having the cleaning mechanism 30 as described above, the impurities adhered to the surface of the to-be-plated wire 1a are removed by the cleaning mechanism 30, and the immersion plating mechanism 61 disposed on the downstream side thereof can treat the plating line. The surface of 1a is formed into a uniform immersion plating thickness to form a good quality plating solder wire 1b.

Further, the pre-dip pretreatment mechanism 2 is provided with a heat treatment furnace 22 for heat-treating the plating wire 1a in the upstream direction of the softening annealing furnace 51 in the traveling direction, and the heat treatment furnace 22 is disposed in the cleaning direction of the cleaning mechanism 30. On the upstream side, after the heat treatment process is performed on the plating wire 1a in the heat treatment furnace 22, the wire 1a to be plated is washed in the cleaning mechanism 30.

Therefore, when the adhering matter adhering to the surface of the wire 1a to be plated is heated by the heat treatment furnace 22, even if the deposit is a residue such as charred coal remaining on the surface of the wire 1a to be plated, thereafter, Cleaning mechanism Washed with 30 and surely removes the residue.

Further, the acid cleaning tank 31 and the ultrasonic water washing tank 41 constitute the cleaning mechanism 30, and the heat treatment furnace 22, the acid cleaning tank 31, the ultrasonic water washing tank 41, and the softening annealing furnace 51 are used as the immersion plating pretreatment mechanism. 2, and sequentially arranged along the traveling direction, whereby the to-be-plated wire 1a to be subjected to the low endurance of the softening annealing furnace 51 in the heat treatment furnace 22, the pickling tank 31, and the ultrasonic water washing tank 41 can be performed. A series of processes are completed.

In other words, the heat treatment furnace 22 or the cleaning mechanism 30 is disposed on the upstream side of the softening annealing furnace 51 as the immersion plating pretreatment mechanism 2, and the resistance to be plated 1a is low in the softening annealing furnace 51. On the other hand, shortly after the endurance of the to-be-plated wire 1a is low, the immersion plating process is performed in the immersion plating mechanism 61.

Therefore, it is possible to avoid the application of a load to the immersion plating line 1b which has been low in endurance, and to obtain a immersion plating line 1b of good quality.

In particular, by disposing the acid cleaning tank 31 on the downstream side of the heat treatment furnace 22, the wire 1a to be plated is heated in the heat treatment furnace 22, and the wire to be plated 1a is warmed to the acid cleaning tank 31. When the acid is washed, compared with the case where the line to be plated 1a at normal temperature is pickled, the former can particularly improve the acid washing effect, and a good acid washing effect can be obtained.

Further, as described above, the cooling water tank 23 is provided between the heat treatment furnace 22 and the pickling tank 31. The line to be plated 1a of the heat treatment furnace 22 is cooled by the cooling water tank 23, and then travels to the acid cleaning tank 31.

Accordingly, the wire 1a to be plated after the heat treatment furnace 22 is cooled by the cooling water tank 23, and the wire 1a to be plated in a heated state is heated by the heat treatment furnace 22, and the surface thereof is maintained in a high temperature state and travels to the heat treatment furnace. twenty two Between the acid cleaning tank 31, an oxide film can be prevented from being formed on the surface of the to-be-plated wire 1a.

However, the cooling water tank 23 does not cool the surface of the wire 1a to be plated heated by the heat treatment furnace 22 to a normal temperature, and the cooling of the wire 1a to be plated in the cooling water tank 23 is preferably at least the surface temperature of the plating wire 1a. At around 50 degrees.

Thereby, in the acid cleaning tank 31, the wire 1a to be plated having a surface temperature of at least 50 degrees can be acid-washed, so that the phosphate-based cleaning liquid 32 can exhibit a better acid cleaning effect. According to this, the acid washing can be performed efficiently, and therefore, even if the plating line 1a is to be moved at a high speed, the acid washing effect can be surely obtained.

Further, according to the manufacturing apparatus 10 for solder plating and the method of manufacturing a solder wire, the to-be-plated line 1a is a rectangular copper wire having a width of a vertical section of 0.8 to 10.0 mm and a thickness of 0.05 to 0.5 mm. A vertical section is a section perpendicular to its length. The traveling speed of the to-be-plated wire 1a is set to about 4.0 m/min, the acid cleaning time of the acid cleaning tank 31 is set to about 12.8 seconds, and the ultrasonic water washing time of the ultrasonic water washing tank 41 is set to about 13.5. In seconds, a good cleaning effect can be obtained.

In particular, according to the above-described method for manufacturing the solder wire and the method of manufacturing the solder wire, the wire to be plated 1a is a rectangular copper wire having a width in the range of 1.0 to 2.0 mm and a thickness in the range of 0.16 to 0.2 mm. The cleaning is performed under the same setting as the traveling speed of the to-be-plated wire 1a, the pickling time of the pickling tank 31, and the ultrasonic water washing time of the ultrasonic water washing tank 41, and the washing effect is confirmed later. experiment A clear result of 1 can obtain a better washing effect.

Next, the washing effect confirmation experiment will be described.

(Washing effect confirmation experiment 1)

The cleaning effect confirmation experiment 1 is an experiment for verifying the difference in the cleaning effect when the plating line 1a is sequentially subjected to the heat treatment step, the acid washing step, and the water washing step, as shown in Table 8, by the above-described manufacturing apparatus and The manufacturing method produces the dip plating line 1b, and is performed under the two setting examples of the present invention example and the comparative example.

The line speed of the inventive example relative to the comparative example was set to one-fifth. That is, as shown in Table 8, the present invention is set at a line speed of one-fifth of that of the conventional example, and the time period of each of the heat treatment furnace 22, the pickling tank 31, and the ultrasonic water washing tank 41 is set to five times.

Further, in the comparative example, round wires of three sizes of 0.76 mm, 0.65 mm, and 0.53 mm in diameter were used as the to-be-plated wire 1a. In contrast, the present invention used longitudinal (thickness) and transverse (width) of 0.2 mm × 2.0 mm. A three-dimensional flat line of 0.16 mm × 2.0 mm and 0.2 mm × 1.0 mm is used as the to-be-plated wire 1a.

Further, the cleaning effect confirmation test is a setting other than the shape and the line speed of the to-be-plated wire 1a of the present invention example and the comparative example, and the other settings are the same as each other.

Here, the configuration of the cleaning device used in the present experiment is a heat treatment furnace 22 that performs a heat treatment process, an acid cleaning tank 31 that is subjected to an acid washing step, and an ultrasonic water washing tank 41 that is subjected to a water washing step. The heat treatment furnace 22, the acid cleaning tank 31, and the ultrasonic water washing tank 41 are configured to have the dimensions of the respective portions shown in FIG.

Moreover, FIG. 10 is a schematic view showing the washing apparatus used in this experiment and its peripheral part.

In the heat treatment furnace 22, steam is used as a detergent, and the cleaning effect on oil stains and the like can be particularly expected. An acid cleaning solution is used as the detergent in the acid cleaning tank 31, and the effect of cleaning the oxide or the like can be expected. In the ultrasonic water washing tank 41, water is used as a detergent, and in the acid washing step, the cleaning effect of the acid liquid or the like remaining on the surface of the plating wire 1a can be particularly expected.

Further, in the heat treatment step, the inside of the heat treatment furnace 22 is used as a vapor atmosphere. Therefore, even if the heat treatment furnace 22 is a steam engine, it can function. Therefore, in the heat treatment step, the effect of removing the adhering matter adhering to the surface of the line to be plated 1a by heating is expected. Therefore, the heat treatment step is included in the test object as a part of the washing step.

The evaluation of the cleaning effect confirmation experiment was carried out by visually observing the surface state of the wire 1a to be plated after the respective water washing steps and the surface state of the immersion plating wire 1b after the winding process in the present invention example and the comparative example. Specify the benchmark and compare and identify it.

As a result of the above conditions, first, the line speed setting and comparative example of the example of the present invention for the surface state of the to-be-plated line 1a after the water washing step. When the line speed setting is different, it is impossible to recognize that a large amount of oil such as a spot or a film adheres to the surface of the to-be-plated wire 1a, or a dust or the like in a discrete shape or a dot shape, and it can be confirmed that the wire to be plated 1a can be obtained. Clean the surface.

Further, when the visual immersion plating line 1b is in accordance with the designation standard generated by the immersion plating state of the surface after the last winding step, the linear velocity setting of the example of the present invention is different from the linear velocity setting of the comparative example. The unevenness of the surface was not recognized, and it was confirmed that the thickness of the immersion plating line in the longitudinal direction and the outer peripheral direction was uniform.

Further, the line speed is set to 20 m/min with respect to the comparative example, and the example of the present invention is set to one-fifth with respect to the speed setting of the comparative example, that is, the speed is 4 m/min, and a sufficient washing effect can be obtained. A better cleaning effect is expected, and it is conceivable to set the line speed to a low speed of less than 4 m/min.

However, under the low speed setting where the line speed is lower than 4m/min, the same experiment is tried, but the effect of cleaning at a speed setting of 4m/min cannot be obtained. It is obvious that the line speed is set to be lower and the speed can be improved. effect.

Further, when the line speed of the to-be-plated wire 1a is set to a low speed of less than 4 m/min, the passage time of the to-be-plated wire 1a by each process becomes long, and it has the fall of productivity. According to this, from the viewpoint of the washing effect obtained by the washing step and the production efficiency, under the above experimental conditions, a result that the line speed is preferably set to about 4 m/min can be obtained.

(Washing effect confirmation experiment 2)

The cleaning effect confirmation experiment 2 is a pickling process for the plating line 1a, In the water washing step, the experiment for verifying the difference in the washing effect was carried out under the above-described manufacturing examples and comparative examples, when the immersion plating line 1b was produced by the above-described manufacturing apparatus 10 and the manufacturing method.

In the comparative example, the washing step is performed in the order of the acid washing step and the water washing step. However, in the present invention, the heat treatment step is performed before the acid washing step, and then the acid washing step and the water washing are performed. The order of the steps is performed in a washing step.

The evaluation of the cleaning effect confirmation test was carried out according to the surface state of the to-be-plated wire 1a after the respective water washing process and the surface state of the dip plating line 1b after the winding process, according to the present invention example and the comparative example. And compare and confirm.

Under the setting of the comparative example, the wire 1a to be plated after the cleaning step was identified, and the acidified layer remained on the surface. Further, the state of the immersion plating on the surface of the immersion plating line 1b was recognized, and it was confirmed that the surface of the immersion plating line 1b became thick.

On the other hand, in the setting of the example of the present invention, the line to be plated after the cleaning step was confirmed, and the dirt such as oil stain on the surface could not be recognized, and the oxide layer did not remain. Furthermore, the state of the immersion plating of the surface of the immersion plating line was confirmed, and the surface was not uneven, and it was confirmed that the uniform immersion plating thickness was formed.

According to the above, when the heat treatment step is performed before the acid cleaning step, and the acid-washing step is performed on the line to be plated at normal temperature, it is confirmed that the acid cleaning effect can be particularly enhanced by the example of the present invention, and a good acid cleaning effect can be obtained.

The manufacturing apparatus 10 for solder plating and the manufacturing method of the soldering wire are not limited to the above-described configuration and manufacturing method, and can be configured by various configurations and manufacturing methods.

As another embodiment, the cooling water tank 23 is not necessarily provided between the heat treatment furnace 22 and the pickling tank 31. As shown in FIG. 9(b), the cooling water tank 23 may not be provided in the heat treatment furnace 22. Between the acid cleaning tank 31 and the acid cleaning tank 31.

When the cooling water tank 23 is not provided, the surface 1a to be plated which is heated by the heat treatment furnace 22 is maintained at a high temperature and travels in the acid cleaning tank 31, whereby a more effective acid cleaning effect can be obtained.

Further, according to the above-described method of manufacturing the plated solder wire and the method of manufacturing the solder wire, the winding of the take-up reeling mechanism 71 is assisted by the conveyance winches 91 and 92 on the upstream side in the traveling direction, whereby the winding mechanism 71 is used. The take-up force applied to the to-be-plated wire 1a can be dispersed on the upstream side and the downstream side in the traveling direction with respect to the conveying winches 91 and 92, thereby reducing the application of the wire to be plated 1a by the winding of the take-up mechanism 71. The load.

Thereby, the 0.2% proof value of the dip plating line 1b can be sufficiently reduced, and the elongation rate can be suppressed, and a dip plating line of a desired quality can be obtained.

Further, according to the above-described apparatus for manufacturing a plated solder wire 10, the transporting winches 91 and 92 are disposed on the upstream side of the softening annealing furnace in the traveling direction, and the softening annealing furnace 51 can assist in transporting the to-be-plated wire 1a before the low endurance.

Therefore, for example, when the to-be-plated wire 1a is assisted by the actively rotating conveying winch, a load such as tensile tension is not applied to the to-be-plated wire 1a having low endurance, and the quality of the dip-plating wire 1b can be ensured. Conveniently assist in delivery.

In particular, the second conveying winch 92 is disposed on the downstream side of the cleaning mechanism 30 in the traveling direction and on the upstream side of the softening annealing furnace 51, and can assist in conveying the to-be-plated wire 1a before the softening annealing furnace 51 lowers the endurance to be plated 1a. . borrow Therefore, the to-be-plated wire 1a is not burdened, and it is possible to efficiently assist the traveling of the to-be-plated wire 1a (the immersion plating line 1b) which has low endurance by the softening annealing furnace 51.

Further, among the direction changing rollers that change the traveling direction of the dip plating line 1b, the groove direction changing roller 64 disposed inside the molten immersion solder bath 62 is the same as the transfer winches 91 and 92, and the molten immersion solder bath is formed. The inside of the 62 is driven by a motor to actively rotate the roller to serve as a conveying winch for assisting the conveyance of the dip plating line 1b.

By forming the groove direction changing roller 64 as a conveying winch, the traveling speed of the dip plating line 1b is changed before and after the dip plating line 1b passes through the molten dip solder bath 62, and the traveling speed of the dip plating line 1b is used. The rotation speed is actively rotated by the same rotation speed. Therefore, the groove direction direction changing roller 64 converts the traveling direction of the dip plating line 1b, and also assists the walking of the dip plating line 1b.

Therefore, by the contact of the groove direction direction changing roller 64 with the dip plating line 1b, the load generated by the frictional resistance in the rotational direction is not applied to the dip plating line 1b, and the dip plating line 1b can be smoothly sent out.

Specifically, when the traveling direction is switched, a load is particularly applied to the dip plating line 1b. Therefore, the transition of the traveling direction of the dip plating line 1b is particularly a factor that increases the 0.2% proof value of the dip plating line 1b. When the dip plating line 1b is taken out from the state of being immersed in the molten immersion solder liquid 63, it is necessary to perform such a traveling direction conversion in the molten immersion solder bath 62.

Therefore, the dip plating line 1b travels in a state of being immersed in the molten dip solder liquid 63, and is subjected to the viscous resistance from the molten immersion solder liquid 63 when the direction is changed. Therefore, the load is further increased during the switching of the traveling direction. 0.2% The increase in the endurance value becomes apparent.

Therefore, as described above, the groove intermediate direction changing roller 64 is configured as a conveying winch, and even if the dip plating line 1b is immersed in the molten immersion plating liquid 63, the direction is switched, and the immersion plating line 1b can be suppressed as much as possible. The load can be made to have a dip plating line 1b with a low 0.2% endurance value.

Next, a tension verification test for verifying the tension applied before the coiling line 1b was taken up was described as an effect confirmation experiment.

(Tension verification experiment)

The tension verification test verifies the influence of the degree of relaxation of the immersion plating line 1b on the 0.2% proof value, and the immersion plating line 1b is switched from the groove up direction to the take-up mechanism 71 (the upstream side arrangement roller 73A of the take-up mechanism). The degree of application of the tension applied to the immersion plating line 1b and the degree of slack of the immersion plating line 1b were verified.

Before the immersion plating line 1b reaches the upstream side roller 73A of the winding mechanism, the degree of application of the tension applied to the immersion plating line 1b is difficult to be quantified, and therefore, the degree of application of the tension is the conveying winch 91, 92 which affects the degree of application of the tension. The number of the set, and the shaft (the direction change roller 64 in the groove) inside the molten dip solder bath 62 are parameterized as passive rotation or active rotation, and the setting of these parameters is set to verify the 0.2% endurance characteristic.

Specifically, as shown in Table 9, before the dip plating line 1b reaches the upstream side arrangement roller 73A of the winding mechanism, the degree of tension applied to the dip plating line 1b is set to four stages from the first tension setting to the fourth tension setting. .

[Table 9]

In the first tension setting, the number of the conveying winches is only one of the first conveying winches 91, and the setting of the direction changing roller 64 in the groove is formed by the following rotating rollers. Further, the follower rotating roller is a motor that does not have a drive roller, and is a roller that is freely rotatable. The first tension setting system has the strongest tension in the four stages, and the dip plating line 1b is in a state of being stretched and stretched.

In the second tension setting, the number of the conveying winches is only one of the first conveying winches 91, and the setting of the direction changing roller 64 in the groove is formed by driving the rotating rollers.

Further, the driving rotary roller is a roller that can be actively rotated by a motor or the like. The second tension setting is a state in which the tension is slightly weaker than the first tension.

In the third tension setting, the number of the conveying winches is two, that is, the first conveying winch 91 and the second conveying winch 92, and the setting of the direction changing roller 64 in the groove is formed by the following rotating roller, and the tension is set with respect to the second tension. It is a weaker state.

In the fourth tension setting, the number of the delivery winches is two for the first conveying winch 91 and the second conveying winch 92, and the setting of the direction changing roller 64 is formed by driving the rotating roller, and the tension is set relatively with respect to the third tension. It is weak and is the weakest in the four stages, and the immersion plating line 1b is in the most relaxed state.

The load characteristics of the dip plating line 1b include 0.2% proofurance characteristics and the like, and the results shown in Table 10 and FIG. 11 in the case of the respective settings of the first tension setting to the fourth tension setting.

Further, the wires 1a to be plated were all oxygen-free copper, and the sizes were 0.16 mm × 2.0 mm and 0.2 mm × 1.0 mm, respectively.

From the results of Table 10 and Fig. 4, in either case of the two sizes of the to-be-plated wire 1a, the number of the delivery winches is set to be two more than one, and the 0.2% proof value is set to be slightly lower. Therefore, it can be confirmed that the number of the setting of the conveying winch is two more effective than one.

Moreover, when the number of the transport winches is two, that is, the fourth tension setting and the third tension setting, as shown in FIG. 11(b), when the to-be-plated line 1a is a rectangular line of a size of 0.2 mm × 1.0 mm The groove direction direction changing roller 64 has the same value of 0.2% of the endurance value regardless of whether the driving rotating roller or the following rotating roller. On the other hand, in all the other settings, the comparison is made by driving the rotating roller to form the in-slot direction changing roller 64, and the following rotating roller is used to form the groove-in-direction switching roller 64. The former has a low 0.2% proof value. value.

Therefore, in comparison with the case where the groove rotating direction direction changing roller 64 is driven by the driving rotating roller, and the groove turning direction changing roller 64 is formed by the following rotating roller, it is clear that the former 0.2% proof force value tends to be low, and it can be confirmed that the driving is driven. The rotating roller constitutes the effectiveness of the direction changing roller 64 in the groove.

In particular, from the results of Table 10 and FIG. 11, the first tension is set to the fourth tension setting, and the fourth tension is set, that is, the dip plating line 1b reaches the winding mechanism 71 (the winding mechanism upstream side arrangement roller 73A) When the immersion plating line 1b is wound up in a state where the immersion plating line 1b is most slack, the load of the immersion plating line 1b can be reduced, and it can be confirmed that the 0.2% proof stress value is particularly lowered.

Further, at least one of the arrangement of the two conveying winches and the configuration of the direction changing roller 64 in the groove by the driving rotating roller, the auxiliary conveying of the to-be-plated wire 1a (the immersion plating line 1b) can be carried out. Before the dip plating line 1b reaches the winding mechanism 71 (the upstream side arrangement roller 73A of the winding mechanism), the immersion plating line 1b is relaxed, and the immersion plating having a 0.2% proof endurance value reduced to a specified value and good quality can be obtained. On line 1b, it can be confirmed that it is valid.

The manufacturing apparatus 10 and the method of manufacturing the plating solder wire of the above-described plating solder wire are not limited to the above-described configuration and manufacturing method, and may be configured by various configurations and manufacturing methods.

For example, the first transport winch 91 and the second transport winch 92 are not limited to being disposed at the above-described arrangement position, and may be disposed at any position in the traveling direction. Further, the transport winch may have only one of the first transport winch 91 and the second transport winch 92.

Specifically, for example, as shown in FIG. 12, the second transport winch 92 may not be provided.

Furthermore, it is also possible to provide a plurality of conveying winches provided at appropriate positions other than the first conveying winch 91 and the second conveying winch 92.

Further, the configuration of the groove direction direction changing roller 64 is not limited to the above, and the driving roller is driven to rotate actively. Alternatively, the groove direction changing roller 65 may be configured to drive the rotating roller to actively rotate.

Moreover, as described above, the coiling mechanism 71 is provided with the winding mechanism upstream side arrangement roller 73A.

The groove-direction direction changing roller 65 provided above the molten-dip solder bath 62 is characterized in that it is disposed at a position higher than the roller 73A on the upstream side of the winding mechanism.

In other words, the method of manufacturing the above-described plated solder wire is characterized in that the immersion plating line 1b is changed in direction by the groove direction switching roller 65, and then travels to the side of the winding mechanism 71, and is further lower than the groove. The roller 73A is disposed on the upstream side of the winding mechanism disposed at the lower position of the direction changing roller 65, and the dip plating line starts to be placed on the winding mechanism 71.

According to the manufacturing apparatus 10 and the manufacturing method of the solder wire, the 0.2% proof stress value can be sufficiently reduced, and the desired immersion plating line 1b can be obtained by setting such a immersion plating line 1b to improve the product yield. It can also improve manufacturing efficiency.

Further, the dip plating line 1b having a 0.2% proof endurance value and a desired quality can be efficiently produced, and therefore, a dip plating line 1b suitable for mass production and low endurance can be obtained as a lead wire for a solar cell.

As described in detail, for example, as shown in FIG. 16(a), the conventional configuration is such that the groove upward direction switching roller 65 is disposed at the same height as the winding mechanism upstream side arrangement roller 73A, as shown in FIG. 16(a). As shown in the enlarged view of the X portion, the gravity g acting on the dip plating line 1b acts only in a direction slightly perpendicular to the traveling direction.

Further, as shown in Fig. 16 (b), the groove upper direction changing roller 65 is disposed so as to be lower than the height of the roller 73A on the upstream side of the winding mechanism, as shown in Fig. 16(b). As shown in the figure, the gravity g acting on the dip plating line 1b acts on the dip plating line 1b by the component g2 which is opposite to the traveling direction of the dip plating line 1b.

In any of the above cases, while the dip plating line 1b is moved to the upstream side of the winding mechanism to arrange the roller 73A, the dip plating line 1b is easily subjected to the load generated by the gravity g acting on the main body, and the setting winding must be increased. The necessity of the winding force on the tension adjuster 72 side is caused by the problem that the load applied to the dip plating line 1b becomes larger.

On the other hand, when the groove-up direction changing roller 65 is disposed in a relative height relationship higher than the position at which the arrangement height of the upstream side of the winding mechanism 73A is arranged, the immersion plating line 1b is melt-dip soldered as shown in FIG. After the 62, the dip plating line 1b which is direction-converted by the groove direction switching roller 65 can be moved while being inclined so that the dip plating line 1b travels to the downstream side of the traveling direction during the upstream side of the winding mechanism 73A. Advance and decline.

By setting the dip plating line 1b in such a manner, as shown in the enlarged view of the X portion in FIG. 13, the groove is applied to the immersion plating line 1b while the groove direction switching roller 65 and the upstream side of the winding mechanism are disposed with the roller 73A. Among the gravitational g, the traveling direction component g2 of the dip-plated wire 1b functions as an auxiliary force for arranging the roller 73A toward the upstream side of the winding mechanism and transporting the immersion plating wire 1b.

Accordingly, the gravity g acting on the body of the dip plating line 1b is applied evenly along the longitudinal direction of the dip plating line 1b, and does not have a local load on the dip plating line 1b, and functions as a conveying assisting force. Further, an element for assisting conveyance such as a roller or a conveyor belt does not assist the conveyance while physically contacting the dip plating line 1b. Therefore, friction resistance is not applied to the dip plating line 1b, and the load can be efficiently and without load. Auxiliary delivery.

Further, the gravity g acting on the main body of the dip plating line 1b can assist the conveyance of the main body of the immersion plating line 1b, and the winding force on the side of the winding tension adjusting machine 72 can be set minutely, which can be a simple configuration. .

Therefore, the dip plating line 1b having a 0.2% proof endurance value in the softening annealing step is maintained in a state where the 0.2% proof value is low, and can be obtained by arranging the roller 73A on the upstream side of the winding mechanism, and the uniform immersion plating thickness can be ensured.

Therefore, the dip plating line 1b having a 0.2% proof endurance value and a desired quality can be obtained.

Further, when the immersion plating line 1b having a 0.2% reduction in the endurance value is wound up on the side of the winding tension adjuster 72, the immersion plating line 1b can be wound without being wound up, so that the immersion plating line 1b is not broken or the like. The product yield can be improved and the manufacturing efficiency can be improved.

In particular, the groove up direction switching roller 65 is preferably disposed at a position where the height of the liquid surface of the molten immersion solder liquid 63 stored in the molten immersion solder bath 62 is about 3 m.

By arranging the groove up direction switching roller 65 at a height of about 3 m with respect to the liquid surface of the molten immersion solder liquid 63, the immersion plating line 1b can be walked only while the molten immersion solder bath 62 reaches the groove up direction change roller 65. Since the height is 3 m, the molten immersion solder liquid 63 adhering to the surface of the immersion plating line 1b can be surely solidified (solidified).

Therefore, when the dip plating line 1b is changed in the direction of the groove direction changing roller 65, the dip plating line 1b comes into contact with the groove direction changing roller 65, and the thickness of the immersion plating is not caused, and the uniform immersion plating thickness can be ensured.

On the other hand, when the arrangement height of the groove-up direction changing roller 65 is, for example, higher than the height of 3 m, the dip plating line 1b inadvertently walks a long distance in the groove direction direction changing roller 65, so that the burden of the immersion plating line 1b is Increase while walking. Further, the higher the arrangement height of the groove direction changing roller 65, the sharper the angle between the running direction of the dip plating line 1b before the direction switching and the traveling direction after the direction switching, so that the direction is changed when the direction is changed. The length of contact of the plating line 1b with respect to the groove upward direction changing roller 65 becomes long, and the load is applied to the dip plating line 1b, which is unfavorable.

Therefore, from the viewpoint of ensuring the uniform immersion plating thickness of the immersion plating line 1b and the reduction of the load applied to the immersion plating line 1b, the arrangement height of the groove up direction switching roller 65 is preferably set to about 3 m.

Further, a groove middle direction changing roller 64 is disposed inside the molten dip solder bath 62, and the direction changing roller 64 is actively rotated to shift the traveling direction of the dip plating line 1b vertically upward, thereby actively assisting the conveyance. The immersion plating line 1b is on the downstream side.

With such a groove-in-direction direction changing roller 64, after the direction change by the direction changing roller 64 in the groove, the load applied to the dip plating line 1b which is raised toward the groove-up direction switching roller 65 can be greatly reduced, and Suppresses an increase in the 0.2% endurance value.

Next, a height verification experiment was performed on the roller on the immersion plating tank to perform an effect confirmation experiment.

(The height verification experiment of the roller on the immersion plating tank)

This experiment is an experiment for verifying the influence of the 0.2% proof stress value of the dip plating line 1b after the coiling step is taken up, and the solder stored in the molten dip solder bath 62 is based on the arrangement height of the groove up direction changing roller 65. The difference in the liquid level of the liquid is carried out.

Specifically, as shown in Fig. 14, in the case of the present invention, the arrangement height of the groove upper direction changing roller 65 (hereinafter referred to as "top sprocket 65") is relative to the molten immersion stored in the molten immersion solder bath 62. The liquid level of the plating solder liquid 63 was set to 3 m (h1), and as a conventional example, it was set to 1 m (h2) to verify the 0.2% endurance after the coiling line 1b was taken up in the winding process. The relationship of values.

Further, Fig. 14 is a schematic view showing a part of the apparatus used in the present experiment, and the traveling path indicated by a two-dot chain line in Fig. 14 indicates the traveling path of the dip plating line 1b in the example of the present invention, and a point in Fig. 14 The traveling path indicated by the chain line indicates the traveling path of the immersion plating line 1b in the conventional example. Further, in the present invention and the conventional example, the arrangement height of the upstream side arrangement roller 73A of the winding mechanism is set to 0.9 m (H) with respect to the liquid surface of the solder liquid.

Under the experimental conditions shown in Table 11, the dip-plating line 1b was carried out in accordance with the cross-sectional dimensions, using two kinds of rectangular lines of the cross-section A and the cross-section B, respectively. Further, the rectangular angles (length × width) of the respective sections of the section A and the section B were 0.2 × 1.0 mm and 0.16 × 2 mm, respectively.

The results of this experiment are shown in Table 12 and Figure 15.

If the angle is the section A, the conventional sprocket 65 has a height of 1 m. Before and after passing the top sprocket 65, the 0.2% endurance value rises from 38 MPa to 42 MPa, and is taken up in the winding process. After that, the 0.2% endurance value rose to 50 MPa.

On the other hand, in the example of the present invention, the arrangement height of the top sprocket 65 is 3 m, and the 0.2% endurance value is increased from 36 MPa to 38 MPa before and after passing through the top sprocket 65, and the increase in the 0.2% endurance value can be suppressed, and the winding process is performed. After taking it, the 0.2% endurance value rises to 45 MPa, which suppresses an increase in the 0.2% endurance value. Therefore, when the rectangular angle is the cross section A, the height of the top sprocket 65 of the conventional example is 1 m, and it can be confirmed that the example of the present invention can suppress the increase of the 0.2% proof stress value.

Next, when the flat angle dimension is the cross section B, the conventional example of the top sprocket 65 has a height of 1 m, and the 0.2% endurance value does not change before and after passing through the top sprocket 65, both of which are 39 MPa, but after the winding process is taken up The 0.2% endurance value rose to 47 MPa.

On the other hand, in the example of the present invention, the top sprocket 65 has a height of 3 m, and the 0.2% endurance value does not change before and after passing through the top sprocket 65, and is 39 MPa, which is the same value as the conventional example, but in the winding process. After the coiling, the 0.2% endurance value rose to 44 MPa, which suppressed the increase in the 0.2% endurance value. Therefore, when the rectangular angle is the cross-sectional dimension B, the arrangement height of the top sprocket 65 of the conventional example is 1 m, and it can be confirmed that the example of the present invention can also suppress the increase of the 0.2% endurance value at the last winding.

According to the above, when the arrangement height of the top sprocket 65 of the present invention is 3 m, and the arrangement height of the top sprocket 65 of the conventional example is 1 m, it can be confirmed that the example of the present invention does not increase the 0.2% endurance value. Roughly lower.

Further, according to the manufacturing apparatus 10 and the manufacturing method of the plating solder wire, the dip plating mechanism 61 can be performed by any of the settings of the thin immersion plating and the thick immersion plating, and the thin immersion plating is performed by the thin immersion plating. In the line 1a, the thick immersion plating is thicker than the immersion plating thickness set by the thin immersion plating to form a thick immersion plating thickness.

Here, in the thin dip plating setting, when the traveling speed of the to-be-plated wire 1a is a low-speed traveling speed, the plating line 1a is set by immersion plating.

On the other hand, the thick immersion plating is characterized in that the galvanizing line 1a is subjected to immersion plating when the traveling speed of the to-be-plated wire 1a is a high-speed traveling speed higher than the low-speed traveling speed, and according to the soldering temperature and The specified relationship of the immersion plating thickness is set to the immersion plating of the plating line 1a by the determined immersion plating thickness.

Here, the specified relationship between the solder temperature and the immersion plating thickness is established only in the high-speed traveling speed, and depending on the relationship, the immersion plating thickness corresponding to the solder temperature can be selected.

According to the manufacturing apparatus 10 and the manufacturing method of the above-described plating solder wire 1b, it is possible to obtain a 0.2% proof stress value which is sufficiently reduced, and the desired immersion plating line 1b can be obtained by setting such a immersion plating line 1b, thereby improving the product production. Rate, which can increase manufacturing efficiency.

Further, the dip plating line 1b having a 0.2% proof endurance value and a desired quality can be efficiently produced, and therefore, a dip plating line 1b suitable for mass production and low endurance can be obtained as a lead wire for a solar cell.

Specifically, for example, by the winding mechanism 71 or the conveying winches 91, 92, the winding speed of the immersion plating line 1b is adjusted, and in the immersion plating process, the traveling line 1a is moved at a low speed or a high speed. At any line speed, the plating line 1a can be formed to have a thick immersion plating thickness or a thin immersion plating thickness.

Specifically, when the low-speed traveling speed is set, the thin immersion plating thickness setting is set, and the immersion plating thickness of the thin immersion plating film can be formed for the plating line 1a. When the high-speed traveling speed is set, the thick immersion plating thickness setting is set, and the immersion plating thickness of the thick immersion plating film can be formed by the plating line 1a.

Accordingly, the dip plating line 1b can be formed into a thick immersion plating setting or a immersion plating thickness of any of the thin immersion plating settings in accordance with the purpose and use of the immersion plating line 1b.

In particular, when the high-speed traveling speed is set, since the specified relationship between the solder temperature and the immersion plating thickness is seen, the solder temperature can be changed by this relationship, and thicker or thinner immersion can be performed even in thick immersion plating. Fine adjustment of thickness such as plating thickness.

According to the above, according to the setting of the line speed or the solder temperature, the dip plating line 1b having a 0.2% proof endurance value which is sufficiently reduced and uniform and having a desired immersion plating thickness can be obtained, and by obtaining such a high-quality immersion plating line 1b, Therefore, the product yield can be improved and the manufacturing efficiency can be improved.

Further, the low speed traveling speed is preferably set to about 4 m/min.

Accordingly, by setting the low-speed traveling speed to about 4 m/min, a dip plating line 1b having a thin immersion plating thickness of, for example, about 14.0 to 24.0 μm can be obtained.

On the other hand, the high speed running speed is preferably set to about 13 m/min.

Accordingly, by setting the high-speed traveling speed to about 13 m/min, it is possible to form the immersion plating line 1b having a thickness of about 28.5 to 67 μm.

That is, the corresponding line speed is set to any of the low speed traveling speed or the high speed traveling speed, and the degree of the immersion plating thickness can be greatly different. Therefore, it is possible to generate a dip having a desired immersion plating thickness corresponding to the application and specifications. Plating line 1b.

Further, by performing the immersion plating process at a high speed traveling speed and a thick immersion plating setting, the surface of the wire 1a to be plated can be formed into a thick immersion plating thickness, but when the soldering temperature of the immersion plating process is high, In the case of thin immersion plating, the former tends to have a rough appearance on the surface of the immersion plating line 1b.

Therefore, by setting the soldering temperature in the immersion plating step to about 240 ° C, the immersion plating film on the surface of the immersion plating line 1b can be made free from irregularities and the like, and the immersion plating line 1b having a smooth and uniform immersion plating thickness can be obtained. .

Next, as an effect confirmation experiment, the confirmation test of the low endurance characteristic by the difference of the conditions of a soldering process is demonstrated.

(Confirmation test of low endurance characteristics due to differences in conditions of the soldering process)

In this experiment, the relationship between the solder temperature and the immersion plating thickness and the tensile characteristics was confirmed, and the effectiveness of the manufacturing method of the present embodiment was confirmed, in which the solder temperature was set as the condition for the thin immersion plating setting and the thick immersion plating setting.

Thin immersion plating setting and thick immersion plating setting Each setting soldering temperature is 240 °C, 260 °C, 280 °C, and copper wire is made of oxygen-free copper, three sizes are 0.2mm × 1.0mm, 0.16mm × 2.0mm, 0.2mm × 2.0mm square line.

In the case of the thin immersion plating, the immersion plating process is performed under the low speed traveling speed, and the low speed traveling speed is set at a low speed of 4 m/min. On the other hand, in the case of thick immersion plating, the immersion plating process is performed under the high-speed traveling speed, and the high-speed traveling speed is set at a high speed of 13 m/min.

As a result of the experiment, the relationship between the solder temperature, the immersion thickness, and the tensile characteristics of the conditions of the thin immersion plating setting and the thick immersion plating setting under the above setting is shown in Tables 13(a) and (b).

Further, Table 13(a) shows the relationship between the soldering temperature and the immersion plating thickness and the tensile characteristics under the thin immersion plating setting, and Table 13(b) shows the soldering temperature and immersion plating under the thick immersion plating setting. Thickness, and the relationship between the tensile properties.

When the line speed is set to a low speed traveling speed of 4 m/min, the immersion plating process is performed, and the line speed is set to a high speed running speed of 13 m/min, the immersion plating process is performed for each of the flat angle dimensions. The temperature conditions are compared for the thickness of the immersion plating.

As a result, it was confirmed that the low-speed traveling speed was a thinner immersion plating thickness than the high-speed traveling speed, and the immersion plating film was formed in the plating line 1a.

If the result of the thin immersion plating is set, the three flat angle dimensions or temperature settings will not be affected, but as described above, the thickness of the immersion plating can be made thinner, and the thickness of the immersion plating can be set. Reduce the 0.2% endurance value.

Further, in any of the combinations of the three flat-angle dimensions or the temperature setting, it was confirmed that the surface appearance of the immersion coating film was not rough, and a high-quality immersion plating line 1b was obtained.

On the other hand, if the result of the thick immersion plating is set, the three flat angle sizes or temperature settings are not affected, and the 0.2% proof stress value is lowered, which is about 50 MPa.

Regarding the thickness of the immersion plating set by the thick immersion plating, for example, a rectangular wire having a size of 0.2 mm × 1.0 mm, and a soldering temperature of 280 ° C, the immersion plating thickness is 29.5 to 32.0 μm. On the other hand, when the solder temperature is 240 ° C, the thickness of the immersion plating is 31.5 to 38.0 μm.

Further, when the size is 0.16 mm × 2.0 mm, and the solder temperature is 280 ° C, the thickness of the immersion plating is 44.0 to 47.0 μm. On the other hand, when the solder temperature is 240 ° C, the thickness of the immersion plating is 47.5 to 73.5 μm.

As a result of this, particularly in the case of thick immersion plating, it is shown that the immersion plating temperature tends to be thicker as the immersion plating temperature is lower, and the relationship between the solder temperature and the immersion plating thickness can be seen.

Therefore, by the relationship between the solder temperature and the immersion plating thickness, even in the thick immersion plating setting, it can be confirmed that the immersion plating thickness can be finely adjusted in accordance with the setting of the solder temperature.

For example, in a thick immersion plating setting, when the thickness of the immersion plating is thinner, the soldering temperature is set to 280 ° C. Conversely, in the thick immersion plating setting, When it is desired to increase the thickness of the immersion plating, the solder temperature may be set to 240 ° C. If the thickness is to be set between these, the solder temperature may be set to 260 ° C.

Further, in the case of a rectangular wire having a size of 0.16 mm × 2.0 mm, when the solder temperature is set to 260 ° C or 280 ° C, the surface appearance of the dip plating line 1 b is rough. Therefore, in order to avoid such a situation, the solder temperature is set to 240. °C can be.

Accordingly, according to the specified relationship between the solder temperature and the immersion plating thickness, by setting the solder temperature, the immersion plating line 1b having a desired immersion plating thickness and a high appearance quality can be obtained.

Moreover, the apparatus for manufacturing the above-described plating solder wire and the method for producing the soldering wire are not limited to the above-described configuration, and may be configured by various configurations.

For example, in the manufacturing apparatus 10A of another embodiment, as shown in FIGS. 17(a) and 17(b), the preheating furnace 51P can be disposed between the ultrasonic water washing tank 41 and the softening annealing furnace 51.

As shown in Fig. 17 (b), even in the case where the traveling time and the walking distance of the to-be-plated wire 1a are short, the preheating furnace 51P sharply raises the temperature of the to-be-plated wire 1a, and is a special structure.

Specifically, the preheating furnace 51P has a sheath tube 53L in the preheating furnace body 52P. The sheath tube 53L is a hollow tube which is linearly formed along the traveling direction of the to-be-plated wire 1a. When the to-be-plated wire 1a passes through the preheating furnace 51P and the softening annealing furnace 51, the preheating furnace body 52P and the softening annealing furnace body are used. Each of the 52s is in a state of being connected to each other so that the to-be-plated wire 1a is oxidized without coming into contact with air.

The inside of the preheating furnace 51P is the same as the softening annealing furnace 51, and the inside of the furnace main body 52P is preheated, and the heater 54P is provided along the longitudinal direction of the sheath tube 53L, and is narrower than the heater of the softening annealing furnace 51. The configuration of 54 is configured by the distance of the interval.

Thereby, even if the accelerated speed line causes the wire to be plated 1a to travel, before the softening and annealing process, the wire 1a to be plated is heated in the preheating furnace 51P as a preheating process, and the wire 1a to be plated in a heated state can be supplied to the softening and retreating. Stove 51.

Therefore, in accordance with the high speed of the line speed of the to-be-plated wire 1a, in the softening annealing process, the to-be-plated wire 1a can be made into a state of a low endurance reliably and fully.

Therefore, according to the above-described method for manufacturing the plated solder wire 10A and the method of manufacturing the solder wire, the dip plating line 1b manufactured under the setting of the thick immersion plating or the thin immersion plating can also be used as a low endurance characteristic. Solar cell wires are used.

Further, a pre-reduced gas supply unit 57P is provided between the softening annealing furnace 51 of the sheath tube 53L and the preheating furnace 51P, and supplies a reducing gas to a portion corresponding to the preheating furnace 51P in the longitudinal direction of the sheath tube 53L.

The reducing gas supply unit 57 supplies a mixed gas of hydrogen and nitrogen as the reducing gas G to the sheath tube 53L, and the internal space of the softening annealing furnace 51 corresponding to the sheath tube 53L is used as a mixed gas atmosphere, and the reducing gas supply is performed in advance. The portion 57P supplies a nitrogen gas or a steam gas as the reducing gas G to the internal space of the preheating furnace 51P corresponding to the sheath tube 53L, and the internal space is a nitrogen gas atmosphere or a water vapor gas atmosphere.

Thereby, it is possible to prevent the surface of the to-be-plated wire 1a from being oxidized when it passes through the preheating furnace 51P, and the preheating furnace 51P does not use hydrogen gas as the reducing gas G, and uses nitrogen gas or steam gas, that is, it is safe and easy to handle.

Specifically, when the 0.2% proof value in Table 13 (a) and (b) of the low endurance characteristic confirmation test is noted, the thick immersion plating is set to any flat angle size, compared with the case of the thin immersion plating setting. Temperature, 0.2% endurance values are all high results.

The reason is that, when the line speed is a high-speed traveling speed, thick immersion plating can be set in the immersion plating process, and the line speed is accelerated. Therefore, the softening annealing process performed before the immersion plating process is performed on the plating line 1a. Before the completion of the softening annealing, the dip plating line 1b passes through the softening annealing furnace 51, and as a result, the plating line 1a cannot be sufficiently soft-annealed.

In this case, by performing the immersion plating step by thick immersion plating, even if a thick immersion plating thickness can be formed on the surface of the line to be plated 1a, since the line speed is also a high-speed traveling speed, compared with the case of the thin immersion plating setting, The former generates a dip plating line 1b having a 0.2% high endurance value.

On the other hand, as described above, in the manufacturing apparatus 10A, as shown in Figs. 17(a) and (b), the preheating furnace 51P is provided between the ultrasonic water washing tank 41 and the softening annealing furnace 51, and is heated in advance. In the step, the plating line 1a is sufficiently heated by the preheating furnace 51P, and then the softening annealing step is performed.

Therefore, even if the wire 1a to be plated is traveling at a high speed, the softening annealing process can be performed to reliably reduce the endurance of the wire 1a to be plated.

Therefore, it is finally possible to obtain a dip plating line 1b having a low 0.2% endurance value and a thick immersion plating thickness corresponding to the thick immersion plating setting.

The preheating furnace 51P provided in the vicinity of the upstream side of the softening annealing furnace 51 increases the number of electric heaters or the amount of electric power, and further, the inside is not a hydrogen gas, but supplies a nitrogen gas or a steam gas which is safe and easy to handle. The gas atmosphere or the like is a more specific structure than the softening annealing furnace 51 in the heating performance of the to-be-plated wire 1a.

Therefore, even if the wire to be plated 1a is moved at a high speed, the softening annealing furnace 51 serves as a mechanism for securing the softening annealing time. For example, it is not necessary to seek to increase the length of the softening annealing furnace 51, and the shape is longer than that of the softening annealing furnace 51. In the configuration, the preheating furnace 51P is placed on the upstream side of the softening annealing furnace 51, and the installation space or cost is not increased.

Therefore, by using a simple configuration that utilizes existing equipment and additional design changes, it is possible to achieve a higher speed of the line speed and a dip plating line 1b manufactured under any setting of thick immersion plating or thin immersion plating. It is sufficiently low-endurance and can be applied as a solar cell wire that requires low endurance characteristics.

Further, the heat treatment furnace 22 is not limited to being disposed between the supply device 12 and the pickling tank 31 in the traveling direction, and may be provided at another portion as long as it is on the upstream side of the softening annealing furnace 51.

For example, in the manufacturing apparatus of another embodiment, the heat treatment furnace 22 is not provided, and only the preheating furnace 51P is provided, and the steam gas is used as the reducing gas, and is supplied to the inside of the preheating furnace 51P.

According to this configuration, as described above, the preheating furnace 51P can have both functions, and the function of the heating processing furnace 22 is added in addition to the function of preheating before the softening annealing furnace 51.

Therefore, it is needless to say that the reduction in equipment cost can be achieved, and the walking distance of the to-be-plated wire 1a can be further shortened, and the dip plating line 1b having a low-resistance value of 0.2% and high quality can be produced.

Corresponding to the configuration of the present invention, the copper wire corresponds to the to-be-plated wire 1a and the dip-plating wire 1b of the present invention. Hereinafter, the heat treatment mechanism corresponds to the heat treatment furnace 22, and the acid cleaning mechanism corresponds to the acid. The cleaning tank 31, the water washing mechanism corresponds to the ultrasonic water washing tank 41, the copper wire conveying auxiliary process corresponds to the auxiliary line to be plated, and the copper wire conveying auxiliary mechanism corresponds to the first conveying winch 91, the second conveying winch 92 and the active The rotating groove direction changing roller 64 and the preheating mechanism correspond to the preheating furnace 51P. The present invention is not limited to the configuration of the above embodiment, and many embodiments can be obtained.

[Industrial availability]

The present invention is applied as a wire of a solar cell, and can be utilized in a method and a manufacturing apparatus for a plated solder wire having appropriate low endurance characteristics.

1a. . . To be plated

1b. . . Immersion plating line

2. . . Immersion plating treatment mechanism

10. . . Plating solder wire manufacturing device

10A. . . Other embodiments of the manufacturing device

12. . . Supply device

twenty two. . . Heat treatment furnace

twenty three. . . Cooling sink

twenty four. . . Connecting tube

30. . . Cleaning mechanism

31. . . Acid cleaning tank

32. . . Phosphate-based cleaning solution

41. . . Ultrasonic water washing tank

42. . . Ultrasonic water washing machine

42a‧‧‧Supersonic vibrating plate

43‧‧‧ water

45‧‧‧Air wiper

51‧‧‧softening annealing furnace

51P‧‧‧Preheating furnace

52‧‧‧Softening annealing furnace body

52P‧‧‧Preheating furnace body

53, 53L‧‧‧ sheath

54, 54P‧‧‧ heater

55‧‧‧The upper part of the sheath

55d‧‧‧Bottom opening

55u‧‧‧Upper opening

56‧‧‧The lower part of the sheath

57‧‧‧Reducing gas supply department

57P‧‧‧Pre-reduction gas supply department

61‧‧‧Dip plating mechanism

62‧‧‧Solid immersion solder bath

63‧‧‧Solid immersion solder bath

64‧‧‧Slot change direction wheel

65‧‧‧Slot-up direction change wheel

71‧‧‧Winning agency

72‧‧‧Winding tension adjuster

73‧‧‧Fixed roller

73A‧‧‧ Rolling mechanism upstream side of the winding mechanism

74. . . Tension swing wheel

75. . . Traverse wire rack type coiler

76. . . Wire rack

77, 82. . . motor

78. . . Communication agency

79. . . Winding force detection sensor

81. . . Control department

91. . . First conveying winch

92. . . Second conveying winch

D1. . . The rising direction of the reducing gas G

D. . . The opposite direction of the rising direction of the reducing gas G

g. . . gravity

G1, g2. . . Gravity component

G. . . Reduction gas

1 is a schematic view of a manufacturing apparatus for a soldered wire;

Figure 2 is an explanatory view of a softening annealing furnace;

Figure 3 is an explanatory view of a traverse bobbin winding machine;

Figure 4 is a graph showing the relationship between the softening annealing temperature of the softening annealing furnace and the 0.2% proof stress at a heat treatment temperature of 100 °C;

Figure 5 is a graph showing the relationship between the heat treatment temperature and the 0.2% proof stress value;

6 is a graph showing a case where a 0.2% proof stress value of a to-be-plated line is in a softening annealing process in a case where a reducing gas containing hydrogen gas is used;

Figure 7 is a graph showing the relationship between the hydrogen mixture ratio of the reducing gas and the 0.2% proof stress value;

8 is a schematic view showing a part of a device for manufacturing a solder wire in another embodiment;

Fig. 9 is a schematic view showing a part of a device for manufacturing a solder wire in another embodiment;

Figure 10 is a schematic view of a washing device;

Figure 11 is a graph showing the relationship between the 0.2% proof force value of the dip coating line and the corresponding arrangement of the conveying winch and the direction changing roller in the groove;

Figure 12 is a schematic view showing a part of a device for manufacturing a solder wire in another embodiment;

Figure 13 is an explanatory view of the operation of the apparatus for manufacturing a soldered wire;

Figure 14 is a schematic view showing a manufacturing apparatus used in a verification experiment of the height of the roller arrangement on the immersion plating tank;

Figure 15 is a graph showing experimental results of a device for manufacturing a soldered wire;

Figure 16 is a schematic view showing a part of a conventional apparatus for manufacturing a solder wire; and

Fig. 17 is a schematic view showing a part of a device for manufacturing a plated solder wire according to another embodiment.

1a‧‧‧To be plated

1b‧‧‧ dip plating line

2‧‧‧Dip plating treatment mechanism

10‧‧‧Manufacturing device for plating solder wire

12‧‧‧Supply device

22‧‧‧heating furnace

23‧‧‧Cooling trough

24‧‧‧Connected tube

30‧‧‧ Washing agency

31‧‧‧ Acid wash tank

32‧‧‧phosphoric acid cleaning solution

41‧‧‧Supersonic water washing tank

42‧‧‧Supersonic water washing machine

42a‧‧‧Supersonic vibrating plate

43‧‧‧ water

45‧‧‧Air wiper

51‧‧‧softening annealing furnace

52‧‧‧Softening annealing furnace body

53‧‧‧sheath

55‧‧‧The upper part of the sheath

56‧‧‧The lower part of the sheath

57. . . Reduction gas supply

61. . . Dip plating mechanism

62. . . Molten dip solder bath

63. . . Molten dip solder bath

64. . . Slot change direction wheel

65. . . In-slot direction change wheel

71. . . Coiling mechanism

72. . . Take-up tension adjuster

73. . . Fixed roller

73A. . . Roller on the upstream side of the take-up mechanism

74. . . Tension swing wheel

75. . . Traverse wire rack type coiler

76. . . Wire rack

91. . . First conveying winch

92. . . Second conveying winch

Claims (33)

The invention relates to a device for manufacturing a soldering wire, which is composed of a pre-plating processing mechanism, a dip coating mechanism and a winding mechanism. The pre-plating processing mechanism performs a immersion plating treatment on a copper wire, and the immersion plating The mechanism performs immersion soldering on the surface of the copper wire, and the winding mechanism winds the copper wire which has been immersed on the surface, wherein the immersion plating processing mechanism has a softening annealing mechanism, and the copper wire is Softening and annealing to make the copper wire low in endurance; the copper wire having low endurance is taken up by the winding mechanism and a winding force lower than the endurance of the copper wire; and the softening annealing mechanism, The immersion plating mechanism and the winding mechanism are arranged in series from the upstream side in the traveling direction of the copper wire. The apparatus for manufacturing a soldering wire according to claim 1, wherein the copper wire is formed of a pure copper-based material; the softening annealing mechanism is configured by a softening annealing furnace, and the inside thereof reduces oxidation of the surface of the copper wire. a reducing gas atmosphere of the layer; the softening annealing furnace is disposed obliquely such that a position of the downstream end portion in the traveling direction of the copper wire is lower than a position of the upstream end portion in the traveling direction of the copper wire; A downstream portion of the furnace in the traveling direction of the copper wire is provided with a reducing gas supply portion that allows supply of a reducing gas to the softening annealing furnace. A manufacturing apparatus for a soldering wire as described in claim 2, Among them, the reducing gas system is composed of a mixed gas of a nitrogen gas and a hydrogen gas. The apparatus for manufacturing a solder wire according to the third aspect of the invention, wherein the volume ratio of the nitrogen gas to the hydrogen gas is set to 4:1. The apparatus for manufacturing a soldering wire according to any one of claims 1 to 4, wherein the pre-dip plating treatment mechanism has a heat treatment mechanism that heats the copper wire; The heat treatment mechanism is disposed on the upstream side of the softening annealing mechanism in the traveling direction of the copper wire. The apparatus for manufacturing a soldering wire according to the first aspect of the invention, wherein the copper wire is made of a pure copper-based material; the pre-plating treatment mechanism has a cleaning mechanism for cleaning the copper wire; The cleaning mechanism is disposed on the upstream side of the softening annealing mechanism in the traveling direction of the copper wire. The apparatus for manufacturing a soldering wire according to the sixth aspect of the invention, wherein the pre-dip plating processing mechanism has a heat treatment mechanism that heats the copper wire and is disposed in the traveling direction of the copper wire. The upstream side of the softening annealing mechanism; and the heat treatment mechanism disposed in the copper wire traveling direction The upstream side of the structure. The apparatus for manufacturing a soldering wire according to claim 7, wherein the cleaning mechanism is constituted by an acid cleaning mechanism and a water washing mechanism, and the heat treatment mechanism is used as the pre-plating processing mechanism. The acid cleaning mechanism, the water cleaning mechanism, and the softening annealing mechanism are arranged in this order along the traveling direction of the copper wire. The apparatus for manufacturing a soldering wire according to the seventh or eighth aspect of the invention, wherein the copper wire has a width of a vertical section of 0.8 to 10.0 mm and a thickness of 0.05 to 0.5 mm. The rectangular copper wire has a vertical cross section perpendicular to the longitudinal direction thereof, the traveling speed of the copper wire is set to about 4.0 m/min, and the acid cleaning time of the acid cleaning mechanism is set to about 12.8 seconds, and the water cleaning mechanism is used. The water wash time was set to approximately 13.5 seconds. The apparatus for manufacturing a soldering wire according to the first aspect of the invention, wherein the copper wire is made of a pure copper-based material; and a copper wire conveying auxiliary mechanism is provided on an upstream side of the winding mechanism in the traveling direction of the copper wire; , which assists the take-up mechanism in winding the copper wire. The apparatus for manufacturing a soldering wire according to claim 10, wherein the copper wire feeding auxiliary mechanism is disposed on an upstream side of the softening annealing mechanism in the traveling direction of the copper wire. The apparatus for manufacturing a soldering wire according to claim 10, wherein the copper wire feeding assisting mechanism is disposed on a downstream side of the cleaning mechanism in the traveling direction of the copper wire. The apparatus for manufacturing a soldering wire according to any one of claims 10 to 12, wherein the immersion plating mechanism is formed by a molten immersion solder bath for storing a molten immersion solder liquid; The direction changing roller of the traveling direction of the wire is formed by a groove-direction direction changing roller which is inside the molten immersion soldering bath, and the copper wire is walked before and after the copper wire passes through the molten immersion soldering bath Direction conversion; the copper wire conveying auxiliary mechanism constitutes a direction changing roller in the groove. The apparatus for manufacturing a soldering wire according to the first aspect of the invention, wherein the copper wire is made of a pure copper-based material; the immersion plating mechanism is formed by a molten-dip solder bath for storing the molten immersion solder liquid; The direction changing roller of the traveling direction of the copper wire is formed by a groove upward direction changing roller which is above the molten immersion soldering groove, and after the copper wire passes through the molten immersion soldering groove, the copper wire is The traveling direction is switched to the side of the winding mechanism; the fixing roller disposed on the upstream side of the winding mechanism of the winding mechanism is formed by a roller disposed on the upstream side of a winding mechanism. The copper wire after the roller is turned in the direction of the groove Leading to the downstream side of the take-up mechanism; and arranging the groove-up direction change roller at a height higher than the arrangement of the rollers on the upstream side of the take-up mechanism. The apparatus for manufacturing a soldering wire according to claim 14, wherein the groove upward direction switching roller is disposed at a height of a liquid level of the molten immersion solder liquid stored in the molten immersion solder bath. It is about 3m. The apparatus for manufacturing a soldering wire according to claim 14 or 15, wherein the immersion plating mechanism is formed by a molten immersion solder bath for storing the molten immersion solder liquid; and the copper wire is switched. The direction-direction change roller is formed by a groove-in-direction change roller, which is inside the molten-dip solder bath, and converts the traveling direction of the copper wire before and after the copper wire passes through the melt-dip solder bath; And the copper wire conveying auxiliary mechanism constitutes the groove middle direction changing roller, which assists the winding mechanism to wind up the copper wire. The apparatus for manufacturing a soldering wire according to the first aspect of the invention, wherein the copper wire is made of a pure copper material; and the dipping mechanism is set by any of a thin immersion plating setting and a thick immersion plating setting. Performing the thin immersion plating, the copper wire is immersed by thin immersion plating, and the thick immersion plating is thicker than the immersion plating thickness set by the thin immersion plating to immerse the copper wire; The thin dip plating is set such that the traveling speed of the copper wire is lower than the low speed traveling speed, and the copper wire is subjected to the immersion plating setting; the thick immersion plating setting is such that the traveling speed of the copper wire is higher than the Under the high-speed walking speed of the low-speed walking speed, the copper wire is set by immersion plating; in the high-speed traveling speed, the copper is immersed according to the specified relationship of the soldering temperature and the immersion plating thickness to the copper The line is immersed in the setting. The apparatus for manufacturing a soldering wire according to claim 17, wherein the cleaning mechanism and the softening annealing mechanism have a preheating mechanism for heating the copper wire before the softening annealing mechanism; In the setting of the thick immersion plating setting, the immersion plating means performs immersion plating on the copper wire which has passed through the preheating means and the softening annealing means. A method for manufacturing a soldering wire, comprising a pre-coating treatment step, a immersion plating step, and a winding step, wherein the immersion plating treatment step etches the copper wire before the immersion plating step The surface of the copper wire is plated with a solder, and the winding process winds the copper wire which has been immersed on the surface, wherein the copper wire is soft-annealed to make the copper wire low-resistance during the pre-plating treatment process. a softening annealing step; the winding step is a step of winding up at a winding force lower than the endurance of the copper wire having low endurance; and The softening annealing step and the immersion plating step are continuously performed during the winding step. The method for producing a soldering wire according to claim 19, wherein the copper wire is formed of a pure copper-based material; and the softening annealing step is provided from a downstream side portion of the traveling direction. a reducing gas supply unit that supplies a reducing gas to a softening annealing furnace, wherein the softening annealing furnace is disposed obliquely such that a position of the downstream end portion in the traveling direction is lower than a position of the upstream end portion in the traveling direction. The reducing gas system reduces the oxide layer on the surface of the copper wire; and the inside of the softening annealing furnace is a reducing gas atmosphere, and the copper wire is allowed to travel in the softening annealing furnace. The method for producing a solder wire according to claim 20, wherein the reducing gas system is composed of a mixed gas of a nitrogen gas and a hydrogen gas. The method of producing a solder wire according to claim 21, wherein a volume ratio of the nitrogen gas to the hydrogen gas is set to 4:1. The method for producing a soldering wire according to any one of the items 19 to 22, wherein the copper wire is subjected to a heat treatment process before the softening annealing step in the pre-dip plating treatment step. . The method for manufacturing a soldered wire according to claim 19, wherein The copper wire is formed of a pure copper-based material; in the pre-dip plating treatment step, a cleaning step of washing the copper wire is performed before the softening annealing step. The method for producing a soldering wire according to claim 24, wherein the pre-plating treatment step includes a heat treatment step of heat-treating the copper wire before the softening annealing step; This heat treatment process is performed before the process. The method for producing a soldering wire according to claim 25, wherein the cleaning step has an acid cleaning step and a water washing step; and the heat treatment is sequentially performed in the pre-plating treatment step. a step, the acid washing step, the water washing step, and the softening annealing step. The method for manufacturing a soldering wire according to the 25th or 26th aspect of the invention, wherein the copper wire is used in a range of a width of 0.8 to 10.0 mm and a thickness of 0.05 to 0.5 mm in a vertical section. A rectangular copper wire having a vertical cross section perpendicular to the longitudinal direction thereof, a traveling speed of the copper wire is set to about 4.0 m/min, and an acid washing time in the acid washing step is set to about 12.8 seconds, and the water is used in the water. The water washing time in the washing step was set to about 13.5 seconds. The method for producing a soldering wire according to claim 19, wherein the copper wire is formed using a pure copper-based material; During the winding up process, a copper wire transfer assisting step is performed to assist in the winding of the copper wire by the winding process. The method for producing a soldering wire according to claim 19, wherein the copper wire is formed of a pure copper-based material; and after the immersion plating step, above the molten immersion soldering bath, The direction of the traveling direction of the copper wire passing through the molten-dip solder bath is switched to the side of the upstream side of the winding mechanism by a groove-up direction switching roller, and the groove-up direction switching roller is disposed on An upstream side of the winding mechanism that winds the copper wire on which the surface has been immersed, and is disposed above the arrangement height of the roller disposed on the upstream side of the winding mechanism, and the roller is disposed on the upstream side of the winding mechanism The wire is guided to the downstream side of the take-up mechanism. The method for producing a soldering wire according to claim 19, wherein the copper wire is formed of a pure copper material; and the immersion plating step is set by thin immersion plating and thick immersion plating. In any setting, the thin immersion plating is performed by dipping the copper wire by thin immersion plating, and the thick immersion plating is thicker than the immersion plating thickness set by the thin immersion plating to immerse the copper wire; The plating setting is such that the traveling speed of the copper wire is lower than the low speed traveling speed, and the copper wire is set by immersion plating; the thick immersion plating setting is such that the traveling speed of the copper wire is higher than the low speed walking speed. Under the high speed walking speed, the copper wire is dipped Setting of plating; in the high-speed traveling speed, the copper wire is immersed in accordance with the specified relationship of the soldering temperature and the immersion plating thickness in accordance with the immersion plating thickness corresponding to the solder temperature. The method for producing a plated solder wire according to claim 30, wherein the low speed traveling speed is set to about 4 m/min; and the high speed running speed is set to about 13 m/min. The method for producing a solder wire according to claim 30, wherein the solder temperature is set to about 240 ° C at a high speed traveling speed. The method for producing a soldering wire according to any one of the items 30 to 32, wherein the immersion plating step is performed by the thick immersion plating, during the cleaning step and the softening annealing step, A preheating step is performed to heat the copper wire before the softening annealing step. After the softening annealing step, the copper wire subjected to the softening annealing step is subjected to a immersion plating step.