JP2000080460A - Soldered wire - Google Patents

Soldered wire

Info

Publication number
JP2000080460A
JP2000080460A JP10222765A JP22276598A JP2000080460A JP 2000080460 A JP2000080460 A JP 2000080460A JP 10222765 A JP10222765 A JP 10222765A JP 22276598 A JP22276598 A JP 22276598A JP 2000080460 A JP2000080460 A JP 2000080460A
Authority
JP
Japan
Prior art keywords
wire
tin
copper
silver
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10222765A
Other languages
Japanese (ja)
Inventor
Hidenori Harada
秀則 原田
Yoichi Okada
洋一 岡田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Totoku Electric Co Ltd
Original Assignee
Totoku Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Totoku Electric Co Ltd filed Critical Totoku Electric Co Ltd
Priority to JP10222765A priority Critical patent/JP2000080460A/en
Publication of JP2000080460A publication Critical patent/JP2000080460A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To obtain soldered wire in which a thermal creep phenomenon is hard to be generated even in a high temp. environment, excellent in heat resisting strength, also free from the generation of whiskers and contg. no harmful lead by providing the outer circumference of a metallic elemental wire with a soldering layer having a compsn. in which specified amounts of silver and copper are incorporated into tin. SOLUTION: Tin-silver-copper alloy soldered wire 1 is composed of metallic elemental wire 2 such as copper wire, copper alloy wire or the like and a hot dip soldering layer 3 composed of, by weight, 0.5 to 10.0% silver, 0.01 to 2.0% copper, and the balance tin formed on the outer circumference. In the case the soldered wire 1 is joined to a through hole 15 in a printed circuit board 14 by a brazing filler metal 5, the soldered wire 1 is soldered with a copper- applied layer 16 in the substrate 14. In the case, e.g. tin-lead alloy solder is used as the brazing filler metal 5, the plating layer 3 starts to melt, silver and tin therein respectively disperse and elute into the brazing filler metal 5 in the joined part A, and on the joined part A, a layer 4 increased in the contents of silver and tin and reduced in the content of lead deteriorating its heat resisting strength is thickly formed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、はんだめっき線に関す
るもので、特にはんだ接続部の耐熱強度を改善した鉛成
分を含有しないはんだめっき線に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder-plated wire, and more particularly to a lead-free solder-plated wire having improved heat resistance of a solder joint.

【0002】[0002]

【従来の技術】従来から、はんだめっき線としては、金
属素線の外周に錫ー鉛合金はんだめっき層を設けたもの
が、はんだめっき作業性やはんだ接続作業性に優れるこ
とから電気機器や電子機器部材に一般に広く使用されて
いる。しかし、近時、電気機器や電子機器の小型化、高
性能化に伴い機器内が高温環境となることが多くなり、
高温環境下における機器の信頼性を高める観点からはん
だ接続部の耐熱強度の向上が求められるようになり、は
んだめっき線についても耐熱強度の優れるものが要求さ
れるようになっている。また、電気機器や電子機器の生
産の急増に伴い、電気機器や電子機器が産業廃棄物とし
て処分される数量も増大し、これら廃棄処分された機器
から有害物質が散失することによる環境汚染の問題が指
摘され、有害物質を含有しないはんだめっき線が求めら
れるようにもなってきた。
2. Description of the Related Art Conventionally, a solder-plated wire provided with a tin-lead alloy solder plating layer on the outer periphery of a metal wire has been used for electrical equipment and electronic devices because of its excellent workability of solder plating and solder connection. Generally used widely for equipment members. However, recently, with the miniaturization and high performance of electric and electronic equipment, the inside of the equipment often becomes high temperature environment,
From the viewpoint of improving the reliability of equipment in a high-temperature environment, it is required to improve the heat resistance of the solder connection part, and a solder plated wire having an excellent heat resistance is also required. In addition, with the rapid increase in the production of electrical and electronic equipment, the quantity of electrical and electronic equipment that is disposed of as industrial waste has increased, and the problem of environmental pollution due to the loss of harmful substances from these disposed equipment has been increasing. It has been pointed out that solder plated wires that do not contain harmful substances have been required.

【0003】[0003]

【発明が解決しようとする課題】ところが、錫ー鉛合金
はんだめっき線は、上述のように、めっき作業性、はん
だ接続作業性に優れるなど使用上の利点を多く備えてい
る反面、特性上の問題としてはんだ接続部の耐熱強度の
点で信頼性に劣り、殊に高温環境で使用した場合に錫ー
鉛合金はんだめっき線と他の部材とのはんだ接続部にお
いて熱的クリープ現象を生じ易く、はんだめっき線がは
んだ接続部から抜け落ちるという大きな欠点があった。
また、更に環境上の問題として、産業廃棄物として処分
された錫ー鉛合金はんだめっき線から鉛が酸性雨等によ
って地下水中に溶出して環境を汚染し、更にはこれが人
体内に摂取される危険性が指摘されるようになった。鉛
は体内に摂取されると、貧血、腹部疝痛、急性脳症、末
梢神経障害、腎障害といった中毒症状を引き起こす。従
って、人体に有害な鉛を含有しないはんだめっき線の開
発が急務となっていた。
As described above, tin-lead alloy solder-plated wires have many advantages in use, such as excellent plating workability and solder connection workability, as described above. As a problem, the solder joints are inferior in reliability in terms of heat resistance, especially when used in a high temperature environment, and tend to cause a thermal creep phenomenon at a solder joint between a tin-lead alloy solder plated wire and another member, There was a major drawback in that the solder plated wire fell off the solder connection.
Further, as an environmental problem, lead elutes from the tin-lead alloy solder plating wire disposed as industrial waste into groundwater due to acid rain and the like, polluting the environment, and furthermore, it is ingested into the human body. The danger came to be pointed out. When lead is taken into the body, it causes toxic symptoms such as anemia, abdominal colic, acute encephalopathy, peripheral neuropathy, and kidney damage. Therefore, there is an urgent need to develop a solder plated wire that does not contain lead harmful to the human body.

【0004】有害な鉛を含有しないめっき線として、錫
金属単体をめっきした錫めっき線があり、耐熱強度も比
較的高いことから広く使用されている。しかし、錫めっ
き線にはめっき加工後に錫めっき層から錫の髭状単結
晶、ウイスカーが発生するという性質があり、しかも、
このウイスカーは高温雰囲気に置かれるほどまためっき
厚さが厚くなるほど長く成長する傾向がみられた。この
ため、錫めっき線を高温雰囲気となる電子機器に使用し
たとき、ウイスカーの発生が原因で短絡事故を引き起こ
す危険性があって、高温雰囲気となる電子機器に使用す
るには問題があった。
[0004] As a plating wire containing no harmful lead, there is a tin plating wire obtained by plating tin metal alone, and it is widely used because of its relatively high heat resistance. However, tin-plated wires have the property that tin-bearing single crystals and whiskers are generated from the tin-plated layer after plating.
This whisker tended to grow longer as it was placed in a high-temperature atmosphere and as the plating thickness increased. Therefore, when the tin-plated wire is used in an electronic device having a high-temperature atmosphere, there is a risk of causing a short circuit accident due to generation of whiskers, and there is a problem in using the tin-plated wire in an electronic device having a high-temperature atmosphere.

【0005】そこで本発明の目的は、高温環境下におい
ても熱的クリープ現象を生じ難く耐熱強度に優れ、ウイ
スカーを発生することもない、有害な鉛を含有しないは
んだめっき線を提供することにある。
Accordingly, an object of the present invention is to provide a solder-plated wire which does not easily generate a thermal creep phenomenon even in a high temperature environment, has excellent heat resistance, does not generate whiskers, and does not contain harmful lead. .

【0006】[0006]

【課題を解決するための手段】上記目的を達成するた
め、本発明のはんだめっき線は、銀が0.5〜10.0
重量%、銅が0.01〜2.0重量%、残部が錫および
不可避的不純物からなる組成のはんだめっき層を金属素
線外周に設けたことを構成上の特徴とするものである。
In order to achieve the above-mentioned object, the solder plating wire of the present invention has a silver content of 0.5 to 10.0.
The present invention is characterized in that a solder plating layer having a composition consisting of 0.01% to 2.0% by weight of copper, 0.01% to 2.0% by weight of copper, and the balance of tin and inevitable impurities is provided on the outer periphery of the metal wire.

【0007】[0007]

【作用】本発明のはんだめっき線の錫ー銀ー銅合金めっ
き層の作用、効果を図3により説明する。図3(a)
は、本発明のはんだめっき線1をプリント基板14のス
ルホール15へろう材5で接合した状態を示す断面説明
図で、スルホール15へ挿入された錫ー銀ー銅合金はん
だめっき線1はプリント基板14の銅張り層16とろう
材5によりはんだ付けされる。図3(b)ははんだめっ
き線1の錫ー銀ー銅合金めっき層3とろう材5との接合
部分Aの拡大断面図である。例えば、ろう材5に錫ー鉛
合金はんだを用いた場合の例を図3(b)により説明す
る。ろう接過程ではんだめっき線1の錫ー銀ー銅合金め
っき層3が融けだし、めっき層3中の銀が接合部分Aの
ろう材5中へ拡散するとともにめっき層3中の錫が接合
部分Aのろう材5中へ溶出し、接合部分Aには耐熱強度
を向上させる銀と錫の含有量が増加し、耐熱強度を低下
させる鉛の含有量の減少した層4が形成される。この結
果、錫ー銀ー銅合金はんだめっき線1とろう材5との接
合部Aは、銀と錫成分リッチの耐熱強度の向上した層が
厚く形成され、耐熱クリープ特性も向上する。更に、ろ
う材5に本発明のはんだめっき線1のめっき層3と同じ
組成の錫ー銀ー銅合金ろう材を用いれば、接合部分Aは
耐熱強度を低下させる鉛成分の含有されない層が形成さ
れ、錫ー銀ー銅合金はんだめっき線1とろう材5との接
合部Aの耐熱強度は一層高まりクリープ特性も一段と向
上することになる。
The function and effect of the tin-silver-copper alloy plating layer of the solder plated wire of the present invention will be described with reference to FIG. FIG. 3 (a)
Is a cross-sectional explanatory view showing a state in which the solder plating wire 1 of the present invention is joined to the through hole 15 of the printed board 14 with the brazing material 5, and the tin-silver-copper alloy solder plated wire 1 inserted into the through hole 15 is a printed board. The copper clad layer 16 and the brazing material 5 are soldered. FIG. 3B is an enlarged cross-sectional view of a joint A between the tin-silver-copper alloy plating layer 3 of the solder plating wire 1 and the brazing material 5. For example, an example in which a tin-lead alloy solder is used for the brazing material 5 will be described with reference to FIG. During the brazing process, the tin-silver-copper alloy plating layer 3 of the solder plating wire 1 begins to melt, and the silver in the plating layer 3 diffuses into the brazing material 5 at the joining portion A and the tin in the plating layer 3 joins the joining portion. A is eluted into the brazing material 5 of A, and a layer 4 in which the content of silver and tin for increasing the heat resistance is increased and the content of lead for decreasing the heat resistance is reduced is formed at the joint A. As a result, in the joint A between the tin-silver-copper alloy solder-plated wire 1 and the brazing material 5, a layer rich in silver and tin components having improved heat resistance is formed thickly, and heat creep resistance is also improved. Furthermore, if a tin-silver-copper alloy brazing material having the same composition as the plating layer 3 of the solder-plated wire 1 of the present invention is used as the brazing material 5, a layer containing no lead component that reduces heat resistance is formed at the joint A. Thus, the heat resistance of the joint A between the tin-silver-copper alloy solder plated wire 1 and the brazing material 5 is further increased, and the creep characteristics are further improved.

【0008】次に、発明の錫ー銀ー銅合金はんだめっき
線1において、合金はんだめっき層3の銀の含有量を
0.5%〜10.0%に限定した理由は、銀の含有量が
0.5%未満では耐熱クリープ特性向上の効果が見られ
ない上、合金はんだの融点がさほど下がらず溶融めっき
性に劣るためである。また、銀の含有量が10.0%よ
り多くなると、耐熱クリープ特性は向上するものの合金
はんだの融点が高くなりすぎて溶融めっき性に劣る上、
めっき線1の材料コストが高くなる欠点があるためであ
る。また、本合金はんだめっき層3に銅成分を添加する
のは、合金はんだめっき線1の光沢や表面滑らかさ等の
めっき外観特性を向上させるためと合金はんだの溶融温
度を下げ溶融めっき作業をし易くするためである。銅の
含有量を0.01%〜2.0%に限定する理由は、銅の
含有量が0.01%未満ではめっき外観特性向上の効果
が少なく、合金はんだの溶融温度も下がらないためであ
り、また銅の含有量が2.0%より多くなると溶融めっ
き浴中に銅ー錫合金が沈澱してきて、これがめっき層3
の表面に付着してめっき外観を悪化させる原因となるた
めである。
Next, in the tin-silver-copper alloy solder plating wire 1 of the invention, the reason why the silver content of the alloy solder plating layer 3 is limited to 0.5% to 10.0% is that the silver content If it is less than 0.5%, the effect of improving the heat-resistant creep characteristics is not seen, and the melting point of the alloy solder does not decrease so much and the hot-dipability is poor. When the silver content is more than 10.0%, the heat-resistant creep property is improved, but the melting point of the alloy solder becomes too high and the hot-dipability is deteriorated.
This is because there is a disadvantage that the material cost of the plated wire 1 increases. The reason why the copper component is added to the present alloy solder plating layer 3 is to improve the plating appearance characteristics such as the gloss and surface smoothness of the alloy solder plating wire 1 and to reduce the melting temperature of the alloy solder and perform the hot dip plating operation. This is to make it easier. The reason for limiting the copper content to 0.01% to 2.0% is that if the copper content is less than 0.01%, the effect of improving plating appearance characteristics is small, and the melting temperature of the alloy solder does not decrease. When the copper content exceeds 2.0%, a copper-tin alloy precipitates in the hot-dip plating bath, and this is
This is because they adhere to the surface of the metal and cause deterioration of plating appearance.

【0009】また、本発明のはんだめっき線1は、めっ
き層3が錫ー銀ー銅合金で形成されているので、錫単体
めっき線に見られるウイスカーの発生は全くなくなる。
Further, in the solder plated wire 1 of the present invention, since the plating layer 3 is formed of a tin-silver-copper alloy, whiskers as seen in a tin-only plated wire are completely eliminated.

【0010】また、本発明のはんだめっき線1は、めっ
き層3に鉛を含有していないので、健康面や環境面に有
害な影響を及ぼすことがない。
[0010] Further, since the solder plating wire 1 of the present invention does not contain lead in the plating layer 3, there is no harmful effect on health and environment.

【0011】[0011]

【実施例】以下、本発明を実施例に基づいて説明する。
なお、これにより本発明が限定されるものではない。図
1は、本発明のはんだめっき線1の断面図である。はん
だめっき線1は、銅線或いは銅合金線等の金属素線2
と、金属素線2の外周に形成した銀が0.5〜10.0
重量%、銅が0.01〜2.0重量%、残部が錫および
不可避的不純物からなる組成の溶融はんだめっき層3と
からなる。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments.
Note that the present invention is not limited by this. FIG. 1 is a sectional view of a solder plating wire 1 of the present invention. The solder plating wire 1 is a metal wire 2 such as a copper wire or a copper alloy wire.
And the silver formed on the outer periphery of the metal strand 2 is 0.5 to 10.0.
% By weight, 0.01 to 2.0% by weight of copper, and the balance being a molten solder plating layer 3 having a composition of tin and unavoidable impurities.

【0012】次に、本発明のはんだめっき線1の製造実
施態様を図2の製造工程図に沿って説明する。溶融はん
だめっき浴槽6は、溶融はんだめっき液7の入っためっ
き液部と、溶融はんだめっき液7の液面より上部に設け
た金属素線2の導入口11と不活性ガス導入口10と、
溶融はんだめっき液7の液面垂直上方に設けたはんだめ
っき線1の導出口12とを有し、溶融はんだめっき液7
の液面上方全体が不活性ガス8の雰囲気層で覆われた構
成となっている。かかる構成の溶融はんだめっき浴槽6
内に、銀3.5%、銅0.5%、残部錫からなる組成の
溶融はんだめっき液7を液温250°Cに保持し、また
不活性ガス導入口10から不活性ガス8として窒素ガス
を導入し、溶融はんだめっき液7の液面上方全体を窒素
ガス雰囲気層で覆う。次に、外径0.5mmの軟銅線2
を銅線導入口11より溶融はんだめっき液7中に導入
し、溶融はんだめっき液7内にて滑車13で走行方向を
転換し溶融はんだめっき液7の液面から垂直上方へと引
き出し、はんだめっき線導出口12から導出、大気冷却
して、めっき厚さ10μm、仕上り外径0.52mmの
はんだめっき線1を得た。なお、この溶融はんだめっき
浴槽6では、はんだめっき線1を溶融はんだめっき液7
から垂直上方へ引き出すことにより、仕上りダイスを用
いることなく、めっき線速を制御するだけで所望のめっ
き厚さに調整することができる。
Next, an embodiment of manufacturing the solder plated wire 1 of the present invention will be described with reference to the manufacturing process diagram of FIG. The molten solder plating bath 6 includes a plating solution portion containing the molten solder plating solution 7, an inlet 11 for the metal element wire 2 provided above the liquid surface of the molten solder plating solution 7, and an inert gas inlet 10.
An outlet 12 for the solder plating wire 1 provided vertically above the molten solder plating solution 7;
Is entirely covered with an inert gas 8 atmosphere layer. Hot-dip plating bath 6 with such a configuration
Inside, a molten solder plating solution 7 having a composition of 3.5% silver, 0.5% copper, and the balance of tin is maintained at a liquid temperature of 250 ° C. A gas is introduced, and the entire upper surface of the molten solder plating solution 7 is covered with a nitrogen gas atmosphere layer. Next, a soft copper wire 2 having an outer diameter of 0.5 mm
Is introduced into the molten solder plating solution 7 from the copper wire inlet 11, the running direction is changed by the pulley 13 in the molten solder plating solution 7, and the molten solder plating solution 7 is drawn vertically upward from the liquid surface of the molten solder plating solution 7. The solder-plated wire 1 was drawn out from the wire outlet 12 and cooled in the air to obtain a solder-plated wire 1 having a plating thickness of 10 μm and a finished outer diameter of 0.52 mm. In this molten solder plating bath 6, the solder plating wire 1 is connected to the molten solder plating solution 7.
By vertically pulling out from above, it is possible to adjust to a desired plating thickness only by controlling the plating linear velocity without using a finished die.

【0013】上記実施態様では、金属素線2に断面円状
の軟銅線を用いたが、金属素線2の形状は、用途に応じ
断面長方形状或いは断面正方形状の軟銅線であってよ
く、また金属素線2の材質は銅合金であっても、何ら本
発明を逸脱するものでないことは勿論である。
In the above embodiment, a soft copper wire having a circular cross section is used for the metal wire 2, but the shape of the metal wire 2 may be a soft copper wire having a rectangular cross section or a square cross section depending on the application. Even if the material of the metal element wire 2 is a copper alloy, it is a matter of course that the present invention does not depart from the present invention.

【0014】上記により製造した本発明のはんだめっき
線1について、耐熱クリープ特性の評価試験およびウイ
スカー発生試験を行った結果を以下に記す。
The results of an evaluation test of heat-resistant creep characteristics and a whisker generation test performed on the solder-plated wire 1 of the present invention manufactured as described above are described below.

【0015】−耐熱クリープ特性試験− 本発明の実施例試料には、上記の実施例態様により製造
しためっき厚さ10μm、仕上り外径10.52mmの
はんだめっき銅線1を用いた。なお、従来例試料とし
て、外径0.5mmの軟銅線に鉛37%−錫63%合金
をめっき厚さ10μmに溶融めっきした仕上り外径0.
52mmの錫ー鉛合金はんだめっき銅線を用いた。試料
は実施例試料、従来例試料とも各5本を用意した。試験
方法は、図4に図示するように、銅張りプリント基板1
4の穴径1mmのスルホール15に試料Wを通し、鉛3
7%−錫63%合金ろう材17にて各試料Wをプリント
基板14にはんだ付けした後、試料Wの端末に1kgの
荷重を吊るした状態で温度130°Cの恒温槽内に入れ
る。そして、恒温槽に入れてから試料Wがプリント基板
14のスルホール15から抜け落ちるまでの経過時間を
測定した。この経過時間をもって耐熱クリープ特性の評
価とした。試験結果を表1に示す。なお、表1の測定時
間は試料5本の平均値である。この結果から明らかなよ
うに、本発明の錫ー銀ー銅合金はんだめっき線1は、耐
熱クリープ特性に優れ、はんだ接続部の耐熱強度が向上
していることが分かる。
-Heat-resistant creep property test- As an example of the present invention, a solder-plated copper wire 1 having a plating thickness of 10 µm and a finished outer diameter of 10.52 mm manufactured by the above embodiment was used. In addition, as a conventional sample, a finished outer diameter of 0.1 mm was formed by hot-dip plating a 37% lead-63% tin alloy on a soft copper wire having an outer diameter of 0.5 mm to a plating thickness of 10 μm.
A 52 mm tin-lead alloy solder plated copper wire was used. Five samples were prepared for each of the example sample and the conventional example sample. The test method is as shown in FIG.
The sample W was passed through the through hole 15 having a hole diameter of 1 mm and
After soldering each sample W to the printed circuit board 14 with a 7% -63% tin alloy brazing material 17, the sample W is placed in a thermostat at a temperature of 130 ° C. with a load of 1 kg suspended from the end of the sample W. Then, the elapsed time from when the sample W was put in the thermostat to when the sample W dropped out from the through hole 15 of the printed circuit board 14 was measured. The elapsed time was used to evaluate the heat-resistant creep characteristics. Table 1 shows the test results. In addition, the measurement time of Table 1 is an average value of five samples. As is apparent from these results, the tin-silver-copper alloy solder-plated wire 1 of the present invention has excellent heat-resistant creep characteristics and improved heat-resistant strength of the solder joint.

【0016】 [0016]

【0017】−ウイスカー発生試験− 本発明の実施例試料には、上記耐熱クリープ特性試験に
用いたと同じ構造のめっき厚さ10μm、仕上り外径
0.52mmのはんだめっき銅線1を用いた。また、比
較例試料として、外径0.5mmの銅線に錫をめっき厚
さ10μmに溶融めっきした仕上り外径0.52mmの
錫めっき銅線を用いた。試料は実施例試料、比較例試料
とも各5本を用意した。ウイスカー発生試験は、各試料
を温度50°Cの恒温槽に入れ、恒温槽に入れてから各
試料にウイスカーが発生するまでの時間を測定した。ウ
イスカーの発生確認は、走査型電子顕微鏡を用い倍率2
000倍にて観察した。試験結果を表2に示す。なお、
表2の測定時間は試料5本の平均値である。
-Whisker generation test-As a sample of the present invention, a solder-plated copper wire 1 having a plating thickness of 10 µm and a finished outer diameter of 0.52 mm having the same structure as that used in the above-mentioned heat creep property test was used. As a comparative sample, a tin-plated copper wire having a finished outer diameter of 0.52 mm obtained by hot-dipning tin on a copper wire having an outer diameter of 0.5 mm to a plating thickness of 10 μm was used. Five samples were prepared for each of the example sample and the comparative example sample. In the whisker generation test, each sample was placed in a thermostat at a temperature of 50 ° C., and the time from when the sample was placed in the thermostat to when whiskers were generated in each sample was measured. The occurrence of whiskers was confirmed using a scanning electron microscope at a magnification of 2
Observed at 000x. Table 2 shows the test results. In addition,
The measurement time in Table 2 is an average value of five samples.

【0018】 表2の結果から明らかなように、本発明の錫ー銀ー銅合
金はんだめっき線1は短絡事故の原因となるウイスカー
の発生が全く見られないことが確認された。
[0018] As is clear from the results in Table 2, it was confirmed that the tin-silver-copper alloy solder-plated wire 1 of the present invention did not show any whiskers which could cause a short circuit accident.

【0019】[0019]

【発明の効果】本発明の錫ー銀ー銅合金はんだめっき線
は、電子機器等の接続線として用いたとき次のような効
果を奏する。(1) はんだ付け部における耐熱強度が向上
し、高温雰囲気に置かれた場合にも熱的クリープ現象を
生じ難くなるので、はんだめっき線がはんだ付け部から
脱落する事故がなくなり、はんだ接続部の信頼性が向上
する。(2) ウイスカーの発生がないので、ウイスカーを
原因とした短絡事故の危険性がなくなる。(3) 人体に有
害な鉛成分を含有していないので、健康面、環境面の安
全性が確保される。
The tin-silver-copper alloy solder-plated wire of the present invention has the following effects when used as a connection wire for electronic equipment and the like. (1) The heat resistance of the soldered part is improved, and the thermal creep phenomenon does not easily occur even when the soldered part is placed in a high-temperature atmosphere. Reliability is improved. (2) Since there is no whisker, there is no danger of a short circuit accident caused by the whisker. (3) Since it does not contain lead components that are harmful to the human body, health and environmental safety are ensured.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のはんだめっき線の1実施例を示す断面
図である。
FIG. 1 is a sectional view showing one embodiment of a solder plating wire of the present invention.

【図2】本発明のはんだめっき線の製造工程の1実施例
を示す説明図である。
FIG. 2 is an explanatory view showing one embodiment of a manufacturing process of the solder plated wire of the present invention.

【図3】本発明のはんだめっき線をプリント基板へろう
接した状態の説明図である。同図(a) は接合状態を示す
断面説明図であり、同図(b) は接合部の部分拡大断面説
明図である。
FIG. 3 is an explanatory view showing a state where a solder plating wire of the present invention is soldered to a printed circuit board. FIG. 3A is a cross-sectional explanatory view showing a joined state, and FIG. 3B is a partially enlarged cross-sectional explanatory view of a joined portion.

【図4】耐熱クリープ特性試験の試験方法を示す説明図
である。
FIG. 4 is an explanatory view showing a test method of a heat resistance creep property test.

【符号の説明】[Explanation of symbols]

1 錫ー銀ー銅合金はんだめっき線 2 金属素線 3 錫ー銀ー銅合金めっき層 4 錫、銀拡散層 5 ろう材 6 はんだめっき浴槽 7 はんだめっき液 8 不活性ガス 9 不活性ガス雰囲気層 10 不活性ガス導管 11 金属素線導入口 12 はんだめっき線導出口 13 滑車 14 プリント基板 15 スルホール 16 銅張り層 DESCRIPTION OF SYMBOLS 1 Tin-silver-copper alloy solder plating wire 2 Metal wire 3 Tin-silver-copper alloy plating layer 4 Tin and silver diffusion layer 5 Brazing material 6 Solder plating bath 7 Solder plating solution 8 Inert gas 9 Inert gas atmosphere layer DESCRIPTION OF SYMBOLS 10 Inert gas conduit 11 Metal wire inlet 12 Solder plating wire outlet 13 Pulley 14 Printed circuit board 15 Through hole 16 Copper clad layer

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 銀が0.5〜10.0重量%、銅が0.
01〜2.0重量%、残部が錫および不可避的不純物か
らなるはんだめっき層を金属素線外周に設けたことを特
徴とするはんだめっき線。
(1) 0.5 to 10.0% by weight of silver and 0.1% by weight of copper.
A solder-plated wire characterized in that a solder-plated layer comprising from 0.01 to 2.0% by weight, the balance consisting of tin and unavoidable impurities, is provided on the outer periphery of the metal strand.
JP10222765A 1998-06-29 1998-08-06 Soldered wire Pending JP2000080460A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10222765A JP2000080460A (en) 1998-06-29 1998-08-06 Soldered wire

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10-182902 1998-06-29
JP18290298 1998-06-29
JP10222765A JP2000080460A (en) 1998-06-29 1998-08-06 Soldered wire

Publications (1)

Publication Number Publication Date
JP2000080460A true JP2000080460A (en) 2000-03-21

Family

ID=26501521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10222765A Pending JP2000080460A (en) 1998-06-29 1998-08-06 Soldered wire

Country Status (1)

Country Link
JP (1) JP2000080460A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1284301A1 (en) * 2001-08-14 2003-02-19 Marjan, Inc. Tin-silver coatings
KR20150055098A (en) 2010-06-11 2015-05-20 후루카와 덴키 고교 가부시키가이샤 Process and apparatus for producing solder-plated wire
CN111979507A (en) * 2020-08-28 2020-11-24 杭州远鸿科技有限公司 Superfine twisted wire tinning device and tinning process

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1284301A1 (en) * 2001-08-14 2003-02-19 Marjan, Inc. Tin-silver coatings
US6924044B2 (en) * 2001-08-14 2005-08-02 Snag, Llc Tin-silver coatings
US7147933B2 (en) 2001-08-14 2006-12-12 Snag, Llc Tin-silver coatings
CN1325689C (en) * 2001-08-14 2007-07-11 玛加公司 Tin-silver coating
KR20150055098A (en) 2010-06-11 2015-05-20 후루카와 덴키 고교 가부시키가이샤 Process and apparatus for producing solder-plated wire
TWI558847B (en) * 2010-06-11 2016-11-21 古河電氣工業股份有限公司 Method and device of manufacturing solder plating wire
CN111979507A (en) * 2020-08-28 2020-11-24 杭州远鸿科技有限公司 Superfine twisted wire tinning device and tinning process
CN111979507B (en) * 2020-08-28 2022-09-30 杭州远鸿科技有限公司 Superfine twisted wire tinning device and tinning process

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