JPS6182994A - Solder alloy having excellent fatigue resistance characteristic - Google Patents
Solder alloy having excellent fatigue resistance characteristicInfo
- Publication number
- JPS6182994A JPS6182994A JP20349084A JP20349084A JPS6182994A JP S6182994 A JPS6182994 A JP S6182994A JP 20349084 A JP20349084 A JP 20349084A JP 20349084 A JP20349084 A JP 20349084A JP S6182994 A JPS6182994 A JP S6182994A
- Authority
- JP
- Japan
- Prior art keywords
- solder alloy
- solder
- soldering
- alloy
- fatigue resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 60
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 44
- 239000000956 alloy Substances 0.000 title claims abstract description 44
- 238000005476 soldering Methods 0.000 abstract description 23
- 229910052709 silver Inorganic materials 0.000 abstract description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 8
- 239000004332 silver Substances 0.000 abstract description 8
- 238000007747 plating Methods 0.000 abstract description 7
- 230000008018 melting Effects 0.000 abstract description 6
- 238000002844 melting Methods 0.000 abstract description 6
- 229910052797 bismuth Inorganic materials 0.000 abstract description 5
- 238000009792 diffusion process Methods 0.000 abstract description 4
- 230000006866 deterioration Effects 0.000 abstract description 2
- 229910052718 tin Inorganic materials 0.000 abstract 2
- 238000005275 alloying Methods 0.000 abstract 1
- 230000003252 repetitive effect Effects 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 239000000203 mixture Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910020159 Pb—Cd Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910009038 Sn—P Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、Ｓｎ−Ｐｂ−Ｂ１−Ａｇ系のはんだ合金に
関し、とくに、各種電子回路基板、半導体部品等の電子
部品のはんだ付けに際し、銀くわれを防止するとともに
、はんだ接合部の繰り返し応力に対する耐疲労特性を向
上させるものである。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a Sn-Pb-B1-Ag based solder alloy, and in particular, when soldering electronic components such as various electronic circuit boards and semiconductor components, silver This prevents cracking and improves the fatigue resistance of the solder joint against repeated stress.
一般に、各種電子回路基板等の電子部品においては、ガ
ラス、セラミック、合成樹脂等の基板の表面に銀めっき
を施して導電パターンを形成し、この導電パターンにリ
ード線の端子や個別部品等をはんだ付けしたものが使用
されている。これらの電子部品のはんだ付けに５ｎ−Ｐ
ｂ系の一般はんだ合金を用いると、基板上の恨めつき膜
がはんだ合金中に拡散溶解して、いわゆる銀くわれ現象
が発生し、接合部のはんだ付は強度が著しく低下する。In general, for electronic components such as various electronic circuit boards, the surface of the substrate made of glass, ceramic, synthetic resin, etc. is plated with silver to form a conductive pattern, and lead wire terminals and individual components are soldered to this conductive pattern. The one attached is used. 5n-P for soldering these electronic components
When a general b-based solder alloy is used, the grating film on the substrate diffuses and dissolves into the solder alloy, resulting in a so-called silver cracking phenomenon, which significantly reduces the soldering strength of the joint.
また、融点の高いはんだ合金を用いて、薄型の電子回路
基板のような耐熱性の低い電子部品のはんだ付けを行な
うと、熱による亀裂ができて製品の品質を損なうことに
なる。Furthermore, if a solder alloy with a high melting point is used to solder electronic components with low heat resistance, such as thin electronic circuit boards, cracks will form due to heat, impairing the quality of the product.
このような問題を解決するはんだ合金として、従来から
各種の提案がなされており、たとえばＳｎ−Ｐｂ−Ｃｄ
系（特公昭４９−２１０２８号）、ＳｎＰｂ−Ｃｄ−Ａ
ｇ系（特公昭４９−２３９８６号）、Ｂ ｉ−Ｐ ｂ系
、Ｂ１−３ｂ ／Ａｇ−Ｐｂ系（特開昭５３−１１３２
４５号） 、Ｂ１−３ｎ−Ｐｂ系、Ｂ ｉ−Ｓ ｎ−５
ｂ ／Ａｇ−Ｐｂ系（特開昭５４−１２５４号、特開昭
５４−７２７３８号） 、Ｓｎ−Ａｇ−３ｂ−Ｐｂ系（
特開昭５６−１４４８９３号） 、５ｎ−Ｃｄ−Ｐ−Ｐ
ｂ系（特公昭５７−３９８８０号） 、Ｓｎ’−Ｐｂ−
ＲＥＭ系、Ｓｎ−Ｐｂ−Ａｇ−ＲＥＭ系（特開昭５７−
１６０５９４号） 、Ｂ１−Ｐｂ−５ｎ系（特開昭５８
−２１８３９４号）等が知られている。Various proposals have been made as solder alloys to solve these problems, such as Sn-Pb-Cd.
system (Special Publication No. 49-21028), SnPb-Cd-A
g system (Japanese Patent Publication No. 49-23986), B i-P b system, B1-3b/Ag-Pb system (Japanese Patent Publication No. 53-1132)
No. 45), B1-3n-Pb system, B i-S n-5
b/Ag-Pb system (JP-A-54-1254, JP-A-54-72738), Sn-Ag-3b-Pb system (JP-A-54-1254, JP-A-54-72738)
5n-Cd-P-P
b series (Special Publication No. 57-39880), Sn'-Pb-
REM system, Sn-Pb-Ag-REM system (JP-A-57-
No. 160594), B1-Pb-5n system (Japanese Patent Application Laid-open No. 16058)
-218394) etc. are known.
これらの従来のはんだ合金は、銀くわれが防止され、低
温度でのはんだ付けが可能である点では、すぐれた効果
を有しているが、その反面、経済性、作業性、衛生面の
ほか、ぬれ性の点において一長一短があるだけでなく、
とくに、はんだ接合部の機械的強度については、なお、
改善すべき問題が残されていた。These conventional solder alloys have excellent effects in terms of preventing silver corrosion and allowing soldering at low temperatures, but on the other hand, they have poor economic efficiency, workability, and hygiene. In addition, there are advantages and disadvantages in terms of wettability.
In particular, regarding the mechanical strength of solder joints,
There were still issues that needed to be improved.
すなわち、半導体パワーデバイスのように、金属フレー
ムにシリコンペレットをはんだ付けする構造のものでは
、金属フレームとシリコンとの熱膨張率の差によって生
ずる歪が接合部のはんだによって吸収されるため、はん
だ接合部には、機械的性質として引張り、クリープ、曲
げなどの繰り返し応力に耐えられる接合強度が要求され
る。しかし、従来のはんだ合金では、接合部が繰り返し
応力を受けると、疲労によりはんだ材の特性が劣化して
、接合部が早期に剥離することが多く、半導体部品の信
頼性に大きな影響を与えるという問題があった。In other words, in semiconductor power devices that have a structure in which silicon pellets are soldered to a metal frame, the strain caused by the difference in thermal expansion coefficient between the metal frame and silicon is absorbed by the solder at the joint, so the solder joint The mechanical properties of these parts require joint strength that can withstand repeated stresses such as tension, creep, and bending. However, with conventional solder alloys, when the joints are subjected to repeated stress, the properties of the solder material deteriorate due to fatigue, and the joints often peel off early, which has a significant impact on the reliability of semiconductor components. There was a problem.
この発明者らは、上記の問題を解決するため、種々の実
験と検討とを重ねた結果、Ｓ ｎ−Ｐ ｂ−Ｂ ｉ系は
んだ合金に、一定範囲のＡｇを添加することにより、従
来のはんだ合金の有する銀くわれ防止効果を損なうこと
なく、しかも繰り返し応力に対する耐疲労特性にすぐれ
たはんだ合金が得られることを見出して、この発明を完
成するに至ったのである。In order to solve the above problem, the inventors conducted various experiments and studies, and found that by adding a certain range of Ag to the Sn-P b-Bi solder alloy, the conventional The present invention was completed by discovering that a solder alloy with excellent fatigue resistance against repeated stress can be obtained without impairing the silver corrosion prevention effect of the solder alloy.
この発明のはんだ合金は、Ｓｎが２０〜４７重景％、重
量が２〜１２重景％重量ｇが０．０１５〜１．５重量％
、残部Ｐｂの組成からなることを特徴とする。The solder alloy of this invention has a Sn content of 20 to 47% by weight, a weight of 2 to 12% by weight, and a weight of 0.015 to 1.5% by weight.
, the balance being Pb.
各成分を上記の組成範囲に限定する理由は、次に述べる
通りである。The reason why each component is limited to the above composition range is as follows.
Ｓｎは、２０重量％未満の含有量では、固相線温度が１
８３°Ｃ以上となり、融点が高（なって過熱による酸化
が著しく促進され、耐熱性の低い電子部品に悪影響を与
えるから適当でない。また、４７重量％を超えて含有す
ると、Ａｇとの金属間化合物の生成が促進されるため、
硬くて脆い接合部が形成され易く、電子回路基板上のＡ
ｇめっき膜の溶解防止効果が減少するだけでなく、はん
だ合金の製造コストが高くなるので好ましくない。When the content of Sn is less than 20% by weight, the solidus temperature is 1.
It is not suitable because the temperature exceeds 83°C and the melting point is high (which significantly accelerates oxidation due to overheating and has a negative effect on electronic components with low heat resistance. Also, if the content exceeds 47% by weight, the metal Because the formation of compounds is promoted,
Hard and brittle joints are likely to form, and A
This is not preferable because it not only reduces the dissolution prevention effect of the plating film but also increases the manufacturing cost of the solder alloy.
Ｂｉは、Ａｇの溶解を抑制するのに有効な元素であるだ
けでなく、はんだ自体の融点を低下させる効果がある。Bi is not only an effective element for suppressing the dissolution of Ag, but also has the effect of lowering the melting point of the solder itself.
しかし、この発明のはんだ合金の場合、２重量％未満の
含有量では、この効果が十分に得られず、また１２重量
％を超えて含有すると、はんだの融点が下がりすぎるだ
けでなく、はんだ自体の粘性が減少して脆くなるので機
械的強度が低下する。また、溶融はんだの表面酸化が著
しくなってはんだ付は作業性を害するので好ましくない
。However, in the case of the solder alloy of the present invention, if the content is less than 2% by weight, this effect cannot be sufficiently obtained, and if the content is more than 12% by weight, not only the melting point of the solder decreases too much, but also the solder itself The viscosity of the material decreases and it becomes brittle, resulting in a decrease in mechanical strength. Further, the surface oxidation of the molten solder becomes significant, which impairs soldering workability, which is not preferable.
Ａｇは、この発明のはんだ合金の特徴を与える重要元素
であって、微量の添加によって機械的強度を著しく向上
させることができる。しかし、この発明のはんだ合金に
おいては、Ｂｉ との配合関係から０．０１５重量％未
満の添加では十分な改善が得られないので、最低０．０
１５重量％は必要である。Ag is an important element that provides the characteristics of the solder alloy of the present invention, and addition of a small amount can significantly improve mechanical strength. However, in the solder alloy of this invention, sufficient improvement cannot be obtained with addition of less than 0.015% by weight due to the composition relationship with Bi.
15% by weight is required.
しかし、１．５重量％を超えて添加すると融点が高くな
り、また、はんだ接合部の機械的強度を低下させ、流動
性にも悪影響を与えるので適当でない。However, if it is added in an amount exceeding 1.5% by weight, the melting point will increase, the mechanical strength of the solder joint will decrease, and the fluidity will be adversely affected, so it is not suitable.
この発明のはんだ合金の機械的強度について試験した結
果を、従来の５ｎ−Ｐｂ系はんだ合金と対比して第１表
に示す。Table 1 shows the results of testing the mechanical strength of the solder alloy of the present invention in comparison with a conventional 5n-Pb solder alloy.
試験用試料は、ＪＩＳＳ号に規定する試験片（厚さ１ｍ
）を調整し、インストロン型万能試験機により引張り強
さと伸びとを測定した。引張り速度はｌＱ１ｍ／ｍｌｎ
％試験温度は２０℃である。The test sample was a test piece (1 m thick) specified in JISS No.
), and the tensile strength and elongation were measured using an Instron universal testing machine. The pulling speed is lQ1m/mln
% test temperature is 20°C.
この発明のはんだ合金の成分組成（重量％）は、実施例
ｆｉｌが５ｎ４６％、Ｂｉ ８％、Ａｇ Ｏ，５％、
Ｐｂ残部であり、実施例（２）が５ｎ４６％、Ｂｉ
８％、Ａｇ １．０％、Ｐｂ残部である。The composition (weight %) of the solder alloy of this invention is as follows: Example fil is 5N46%, Bi 8%, Ag O, 5%,
The remainder is Pb, and Example (2) is 5n46%, Bi
8%, Ag 1.0%, balance Pb.
従来のはんだ合金は、ＪＩＳ−Ｚ−３２８２に規定され
たＡ等級に属する製品である。Conventional solder alloys are products belonging to grade A specified in JIS-Z-3282.
第 Ｉ 表
第１表の数値から明らかなように、この発明のはんだ合
金の引張り強さは、従来のはんだ合金のうち５ｎ６２−
Ｐｂ３８と同等であるが、伸びは従来の４種のはんだ合
金の何れよりも大きい値を示し、高い粘性を有している
ことがわかる。したがって、この発明のはんだ合金は、
繰り返し応力を受けても劣化し難く、破断に至るまでの
時間が長く、従来のはんだ合金よりもすぐれた耐疲労特
性を備えていることになる。Table I As is clear from the values in Table 1, the tensile strength of the solder alloy of the present invention is higher than that of conventional solder alloys.
Although it is equivalent to Pb38, its elongation is larger than any of the four conventional solder alloys, indicating that it has high viscosity. Therefore, the solder alloy of this invention is
It is resistant to deterioration even when subjected to repeated stress, takes a long time to break, and has better fatigue resistance than conventional solder alloys.
また、この発明のはんだ合金のはんだ付は強さとはんだ
付は時間との関係について試験した結果を、従来の銀く
われ防止用はんだ合金と対比して第１図に示す。同図に
おいて実′ａＡがこの発明のはんだ合金、破＆’ｉＢが
従来のはんだ合金である。Further, the results of testing the relationship between the soldering strength and soldering time of the solder alloy of the present invention are shown in FIG. 1 in comparison with a conventional solder alloy for preventing silver corrosion. In the same figure, the solder alloy of the present invention is shown as A, and the conventional solder alloy is shown as B.
この発明のはんだ合金の成分組成（重量％）は、５ｎ４
６％、Ｂｉ ８％、Ａｇ ０．１％、Ｐｂ残部であり、
従来のはんだ合金の成分組成（重量％）は５ｎ６２％、
Ｐｂ３６％、Ａｇ ２％である。The composition (weight %) of the solder alloy of this invention is 5n4
6%, Bi 8%, Ag 0.1%, balance Pb,
The composition (weight %) of conventional solder alloy is 5n62%,
Pb: 36%, Ag: 2%.
この試験は、アルミナ基板（３０ｆｌＸ３０ｎＸ１．０
鶴）の表面に、Ａｇ−Ｐｄのめっき膜（厚さ２０μｍ×
直径２鶴）を形成して、その上にリード線（りん青銅め
っきを施した直径１．０１ｍの銅線）の端部をはんだ付
けしたもの（塗布厚さ０．３ ｔｍ）を試料として、イ
ンストロン型万能試験機により引張り試験（引張り速度
Ｉ Ｑ ｆｌ／ｍ１ｎ）を行った。This test was performed on an alumina substrate (30 fl x 30 n x 1.0
Ag-Pd plating film (thickness 20 μm x
As a sample, a lead wire (copper wire with a diameter of 1.01 m plated with phosphor bronze) was soldered to the end (coating thickness: 0.3 tm). A tensile test (tensile speed IQ fl/m1n) was conducted using an Instron type universal testing machine.
はんだ付は温度は、各試料とも２５０℃である。The soldering temperature was 250°C for each sample.
同図から明らかなように、この発明のはんだ合金のはん
だ付は強さは、従来のはんだ合金に比べて、はんだ付は
時間に関係なく高い値を示していることかわかる。なお
、はんだ付は強さは、はんだ付は温度によっても異なる
から、この試験のはんだ付は温度（２５０℃）よりも低
い温度ではんだ付けをすれば、さらに高いはんだ付は強
さが得られるものと判断される。As is clear from the figure, the soldering strength of the solder alloy of the present invention is higher than that of conventional solder alloys, regardless of soldering time. Note that the strength of soldering varies depending on the temperature, so if soldering is performed at a temperature lower than the soldering temperature (250°C) in this test, even higher soldering strength will be obtained. It is judged as a thing.
なお、上記のはんだ付は強さ試験に用いたアルミナ基板
上のＡｇ−Ｐｄめっき膜のはんだ合金中への拡散状態を
調べるため、はんだ付は時間が２０秒および１６０秒の
ものについて、はんだ接合部断面の組織を顕微鏡下で観
察したところ、はんだ付は時間が２０秒のものでは、め
っき膜の拡散は殆んど見られず、はんだ付は時間が１６
０秒のものでも、僅かに拡散層が判別できる程度であっ
て、めっき膜がほぼ完全に近い状態で残存していること
が確認された。これにより、この発明のはんだ合金は、
恨くわれ防止の点についても、すぐれた効果を発揮する
ことが判明した。Note that the above soldering was performed for 20 seconds and 160 seconds in order to investigate the diffusion state of the Ag-Pd plating film on the alumina substrate used for the strength test into the solder alloy. When we observed the structure of the cross section under a microscope, we found that there was almost no diffusion of the plating film when the soldering time was 20 seconds, and when the soldering time was 16 seconds.
Even after 0 seconds, the diffusion layer was only slightly discernible, and it was confirmed that the plating film remained in a nearly perfect state. As a result, the solder alloy of this invention
It was also found to be highly effective in preventing resentment.
以上、説明したように、この発明のはんだ合金は、従来
のはんだ合金よりも大きな伸びを有し、粘性がすぐれて
いるので、はんだ接合部に繰り返し応力が作用しても疲
労による特性の劣化が生ぜず、しかも銀くわれ防止効果
についても、従来のこの種のはんだ合金よりもすぐれた
特性を有しているから、電子回路基板、半導体部品等の
電子部品のはんだ付は用として成型品はんだやクリーム
はんだに適用して、高信頼性および安定性が得られるだ
けでなく、その他の電気機器部品および一般工作品用の
棒状はんだ、板状はんだ、やに入りはんだ等にも広く適
用することができる。As explained above, the solder alloy of the present invention has greater elongation and superior viscosity than conventional solder alloys, so even if repeated stress is applied to the solder joint, the properties will not deteriorate due to fatigue. It also has better properties than conventional solder alloys in terms of preventing silver corrosion, so molded product solder is suitable for soldering electronic components such as electronic circuit boards and semiconductor components. It can be applied not only to high reliability and stability when applied to or cream solder, but also widely applicable to rod-shaped solder, plate-shaped solder, flux-cored solder, etc. for other electrical equipment parts and general workpieces. I can do it.
第１図は、はんだ付は強さとはんだ付は時間との関係を
示す図表である。FIG. 1 is a chart showing the relationship between soldering strength and soldering time.
Claims (1)
０１５〜１．５重量％のＡｇ、残部Ｐｂからなることを
特徴とする耐疲労特性にすぐれたはんだ合金。20-47% by weight of Sn, 2-12% by weight of Bi, 0.
A solder alloy with excellent fatigue resistance characterized by comprising 0.15 to 1.5% by weight of Ag and the balance Pb.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20349084A JPS6182994A (en) | 1984-09-28 | 1984-09-28 | Solder alloy having excellent fatigue resistance characteristic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20349084A JPS6182994A (en) | 1984-09-28 | 1984-09-28 | Solder alloy having excellent fatigue resistance characteristic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6182994A true JPS6182994A (en) | 1986-04-26 |
Family
ID=16475017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20349084A Pending JPS6182994A (en) | 1984-09-28 | 1984-09-28 | Solder alloy having excellent fatigue resistance characteristic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6182994A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994020257A1 (en) * | 1993-03-03 | 1994-09-15 | Nihon Almit Co., Ltd. | High-strength soldering alloy |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5390138A (en) * | 1977-01-20 | 1978-08-08 | Senju Metal Industry Co | Soldering alloy for al and al alloy |
| JPS5472738A (en) * | 1977-11-24 | 1979-06-11 | Senju Metal Industry Co | Low temperature brazing alloy for silver electrode |
| JPS5550995A (en) * | 1978-10-11 | 1980-04-14 | Tasuku Okazaki | Delustered solder |
-
1984
- 1984-09-28 JP JP20349084A patent/JPS6182994A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5390138A (en) * | 1977-01-20 | 1978-08-08 | Senju Metal Industry Co | Soldering alloy for al and al alloy |
| JPS5472738A (en) * | 1977-11-24 | 1979-06-11 | Senju Metal Industry Co | Low temperature brazing alloy for silver electrode |
| JPS5550995A (en) * | 1978-10-11 | 1980-04-14 | Tasuku Okazaki | Delustered solder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994020257A1 (en) * | 1993-03-03 | 1994-09-15 | Nihon Almit Co., Ltd. | High-strength soldering alloy |
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