KR20130040899A - Process and apparatus for producing solder-plated wire - Google Patents

Abstract

Plating wire of desired quality can be obtained by sufficiently reducing the 0.2% yield value, and by obtaining such a plating wire stably, the product yield can be improved and the manufacturing method and apparatus of the solder plating wire which can improve manufacturing efficiency For the purpose of providing Plating pretreatment means 2 for pre-plating the copper wire 1a, plating means 61 for soldering the surface of the copper wire 1a, and copper wires 1a and 1b for which the surface is plated. The manufacturing apparatus 10 comprised by the winding-up means 71 WHEREIN: The plating pretreatment means 2 consists of the softening annealing means 51 which softens and hardens the copper wire 1a, and makes it low-resistant, 1a, 1b is configured to be wound by the winding means 71 with a winding force lower than the strength of the copper wires 1a, 1b, and softening annealing means 51, plating means 61 and winding means 71 Were sequentially arranged in this order from the upstream side of the traveling direction of the copper wires 1a and 1b.

Description

Manufacturing method and apparatus for solder plating wire {PROCESS AND APPARATUS FOR PRODUCING SOLDER-PLATED WIRE}

BACKGROUND OF THE INVENTION Field of the Invention [0001] The present invention relates to a method for manufacturing a solder plated wire and an apparatus for use in electrical and electronic equipment, and more particularly, to a method for manufacturing a solder plated wire having a low load resistance property suitable for use as a lead wire of a solar cell. And a manufacturing apparatus.

Among the plating wire used for an electronic component, the thing of the low strength characteristic with a 0.2% yield strength value may be calculated | required. For example, one of the lead leads for solar cells.

The solar cell is required to be thin in order to reduce the cost of the silicon material constituting the solar cell and to reduce the effect of the shortage of materials.

However, when the solar cell becomes thinner, the strength becomes weaker, and the connection portion in which the solar cell lead wires are solder-connected in the solar cell has a problem in that the solar cell is liable to bend or break due to the difference in mutual expansion rate.

Therefore, in the lead wire for a solar cell, the connection part with a solar cell needs to follow a deformation | transformation of a solar cell, and it is important to lower a 0.2% yield value. As a result, a solder plated wire having low withstand characteristics is used as a lead for solar cells.

Such a solder plating line is formed by forming a plating layer on a to-be-plated wire through the solder plating process disclosed in patent document 1, regardless of whether it has a low withstand characteristic.

The solder plating process disclosed in Patent Literature 1 introduces a metal element wire as a plated wire into a plating solution portion containing a molten solder plating solution through a metal element wire introduction port, and draws it out of the solder plating wire outlet port to cool it to the atmosphere. It is a process to apply plating on.

In addition, in the manufacturing process of the solder plating wire, in addition to the above-described solder plating process, a solder plating pretreatment process such as cleaning or annealing is performed on the surface of the metal element wire, or the winding of winding the plating wire in a subsequent process of the solder plating process. The process is performed.

In the case where the process is to be continuously performed on the low-bearing to-be-plated wire, the load is easily applied to the to-be-plated wire, which makes it difficult to continuously process the plated wire of the desired quality even if it can be continuously processed. It was difficult to get stable.

For example, there is a case where the surface of the plated wire is not sufficiently cleaned and the impurities and the oxide layer remain on the surface while focusing on suppressing the load on the low-bearing plated wire.

As a result, it was difficult to stably obtain a plated wire of desired quality such that the plated layer was easily peeled off when the plated layer was formed on the surface of the plated wire in a subsequent solder plating step.

In addition, since the strength of the plated wire (coated wire) during the production of the plated wire is low, the running speed of the plated wire may not be increased, and a lot of manufacturing time is required, and if the continuous processing is attempted, the manufacturing efficiency may be lowered. .

As a manufacturing method of the solder plating wire which has a low load capacity characteristic, the manufacturing method of the flat conductor for solar cells is proposed by patent document 2, for example.

In the method of manufacturing a flat conductor for solar cells in Patent Document 2, the conductor is molded into a flat shape by a rolling process or the like, and then a 0.2% proof strength value is reduced by a heat treatment step or a solder plating film is applied to the surface of the conductor. It is a manufacturing method.

However, in Reference Document 2, specific descriptions, such as the temperature setting and the components of the atmosphere gas inside the reduction furnace (soft annealing furnace), and the specific mention of processes other than the heat treatment process such as, for example, the cleaning process, are not made. not.

For this reason, even if a cleaning process is performed, whether each process, such as a heat treatment process, a cleaning process, or a plating process, is performed in an independent production line, or in what order of processes, even if a plurality of these processes are performed continuously, not sure.

That is, as described above, the reference 2 decreases the 0.2% yield value of the flat conductor, making it difficult to secure the quality as a lead wire of the solar cell, while increasing the manufacturing efficiency to secure the quality of the plated wire having the 0.2% yield value reduced. No idea has been made regarding the two conflicting manufacturing challenges of deterioration.

Japanese Patent Laid-Open No. 2000-80460 Japanese Patent Laid-Open No. 2006-54355

Therefore, the present invention can obtain a plated wire of desired quality sufficiently lowering the 0.2% yield value, it is possible to obtain this plated wire stably to improve the product yield, and also to improve the soldering efficiency of the solder plating An object of the present invention is to provide a manufacturing method and a manufacturing apparatus of a ship.

The present invention provides a solder plating wire comprising a plating pretreatment means for pre-plating a copper wire, a plating means for solder plating on the surface of the copper wire, and a winding means for winding the copper wire with plating on the surface of the copper wire. An apparatus, comprising: softening annealing means for softening and annealing copper wire to the plating pretreatment means to reduce the strength of the copper wire, and applying the low-bearing copper wire to the winding means with a lower winding force than that of the copper wire. The softening annealing means, the plating means, and the winding means are arranged in this order from the upstream side of the traveling direction of the copper wire.

At this time, the configuration of winding by the winding means at a winding force lower than the strength of the above-described copper wire is not limited to the configuration of winding the copper wire with only the winding means, for example, to assist winding by the winding means. It is also intended to include a configuration in which the transfer capstan is disposed upstream of the winding means and the copper wire is wound around the winding means and the transfer capstan.

The copper wire is not limited in shape and size, but is preferably a flat wire. The copper wire is formed into a flat line by the pure copper-based conductor material described above to apply a plating treatment to the surface, and as a lead wire for connection to a predetermined region of a silicon crystal wafer (Si cell), that is, solder plating for solar cells. This is because it can be used as a line.

The said serial arrangement means that it arrange | positioned in what is called tandem, lined up continuously or intermittent along the downstream side from the upstream side of a travel direction.

As an aspect of the present invention, the copper wire is formed of a pure copper-based material, and the softening annealing means is constituted by a softening annealing furnace, which is a reducing gas atmosphere in which an oxide layer on the surface of the copper wire is reduced. Reduction gas which inclines the annealing furnace so that the downstream side is lower than the upstream side of the copper running direction, and allows the supply of reducing gas to the softening annealing furnace in the downstream side of the copper running direction in the softening annealing furnace. Supply section can be provided.

The pure copper material is not particularly limited as long as it is a pure copper conductor material having low impurities and high electrical conductivity. For example, the pure copper material has a purity of 99.9% or more that does not contain impurities such as anoxic copper (OFC), tough pitch copper, and copper phosphate oxide. desirable.

Moreover, as an aspect of this invention, the said reducing gas can be comprised with the mixed gas of nitrogen gas and hydrogen gas.

Moreover, as an aspect of this invention, the volume ratio of the said nitrogen gas and the said hydrogen gas can be set to 4: 1.

Moreover, as an aspect of this invention, the said plating preprocessing means is equipped with the heat processing means which heat-processes with respect to copper wire, and the said heat processing means can be arrange | positioned more upstream of the copper wire running direction than the said softening annealing means.

In addition, as an aspect of the present invention, the copper wire is formed of a pure copper-based material, and the plating pretreatment means is provided with cleaning means for cleaning the copper wire, and the cleaning means may be disposed on the upstream side of the copper wire running direction more than the softening annealing means. Can be.

Moreover, as an aspect of this invention, the said plating preprocessing means is equipped with the heat processing means which heat-processes with respect to copper wire upstream in the copper wire traveling direction more than the said softening annealing means, and the said heat processing means is carried out more than the said washing means. It can be arrange | positioned upstream of a copper wire traveling direction.

In addition, as an aspect of the present invention, the cleaning means is constituted by an acid cleaning means and a water cleaning means, and the heat treatment means, the acid cleaning means, the water cleaning means and the softening annealing means are used as the plating pretreatment means. Therefore, it can arrange in this order.

In addition, as an aspect of this invention, as a copper wire, the width | variety in the orthogonal cross section orthogonal to a longitudinal direction exists in the range of 0.8-10 mm, and it uses the flat copper wire which is the size within the range of 0.05-0.5 mm, and runs a copper wire. The speed is set to about 4.0 m / min, the acid washing time in the acid washing means is set to about 12.8 seconds, and the water washing time in the water washing means can be set to about 13.5 seconds.

Moreover, as an aspect of this invention, the copper wire conveyance assistance means which forms the said copper wire from the pure copper system material, and assists the copper wire winding by the said winding means can be provided on the upstream side of a copper wire running direction rather than the said winding means.

Moreover, as an aspect of this invention, the said copper wire conveyance assistance means can be arrange | positioned rather than the said softening annealing means in the upstream side of a copper wire running direction.

Moreover, as an aspect of this invention, the said copper wire conveyance assistance means can be arrange | positioned downstream of the copper line running direction rather than the said washing | cleaning means in a copper line running direction.

In addition, as an aspect of the present invention, the plating means is constituted by a molten solder plating bath in which a molten solder plating solution is stored, and a turning roller is provided inside the molten solder plating bath to switch the traveling direction of the copper wire. It is possible to configure the direction change roller in the tank by the copper wire transfer assisting means by configuring the direction of the roller in the tank to change the running direction of the copper wire before and after the solder plating bath.

Moreover, as an aspect of this invention, the direction change roller which forms the said copper wire from the pure copper system material, and consists of a molten solder plating tank in which the said molten solder plating liquid was stored, and which changes the traveling direction of copper wire is located above the said molten solder plating tank. And a fixing roller disposed on an upstream side of the fixing roller which is arranged at the upstream side of the fixing roller which is arranged at the winding means and converts the traveling direction of the copper wire after passing through the molten solder plating bath toward the winding means. A position in which the copper wire after passing through the tank upper direction turning roller is configured by a winding means upstream arrangement roller that guides the downstream side from the winding means, and the tank upper direction turning roller is higher than an arrangement height of the winding means upstream arrangement roller. Can be placed on.

Moreover, as an aspect of this invention, the said tank upper side turning roller can be arrange | positioned in the position which becomes about 3 m in height with respect to the liquid level of the molten solder plating liquid stored in the said molten solder plating bath.

In addition, as the aspect of the present invention, the molten solder plating bath can be provided inside the molten solder plating bath while the plating means is constituted by a molten solder plating bath in which a molten solder plating solution is stored so as to include a turning roller for changing the traveling direction of the copper wire. It may be configured with a steering direction turning roller for switching the running direction of the copper wire before and after the passage, and the steering direction turning roller may be configured as a copper wire transport assistance means for assisting the winding of the copper wire by the winding means.

In addition, as an aspect of the present invention, the copper wire is formed of a pure copper-based material, and in the plating means, a plating thickness thicker than the plating thickness in the case of the thin plating setting and the plating thickness in the case of the thin plating setting, The post-plating setting is set to any one of the following settings, and the thin plating setting is set to set the speed at which the copper wire is driven to be plated for copper wire under a low traveling speed, and the post-plating setting runs the copper wire. At the high speed traveling speed, the plating thickness is set according to the solder temperature based on the predetermined relationship between the solder temperature and the plating thickness at the high speed traveling speed. It can be set to apply plating to copper wire.

In addition, as an aspect of the present invention, a pre-heating means is provided between the cleaning means and the softening annealing means to heat the copper wire immediately before passing through the softening annealing means, and the setting in the plating means is performed in the post-plating setting. The plating means may perform plating on the copper wire after passing through the pre-heating means and the softening annealing means.

In addition, the present invention provides a method for producing a solder plated wire produced through a plating pretreatment step of pre-plating a copper wire, a plating step of applying solder plating to the surface of the copper wire, and a winding process of winding the copper wire plated on the surface of the copper wire. In the plating pretreatment step, the softening annealing of the copper wire is carried out to perform a softening annealing step of lowering the strength, and the winding step comprises a step of winding the coiling force at a lower winding force than the strength of the copper wire having a low bearing capacity. The softening annealing process and the plating process are performed continuously during the process.

Moreover, as an aspect of this invention, the copper wire formed with the pure copper system material is used, and in the said softening annealing process, the downstream side of a traveling direction to the softening annealing furnace which was inclined arrange | positioned so that it might become a position lower downstream than the upstream side of a traveling direction. A reducing gas for reducing the oxide layer on the surface of the copper wire can be supplied from the reducing gas supply unit provided in the above, and the inside of the softening annealing furnace can be made into a reducing gas atmosphere, and the softening annealing furnace can run the copper wire.

Moreover, as an aspect of this invention, the said reducing gas can be comprised with the mixed gas of nitrogen gas and hydrogen gas.

Moreover, as an aspect of this invention, the volume ratio of the said nitrogen gas and the said hydrogen gas can be set to 4: 1.

Moreover, as an aspect of this invention, in the said plating pretreatment process, a heat processing process can be performed with respect to copper wire before the said softening annealing process.

Moreover, as an aspect of this invention, the copper wire formed with the pure copper type material can be used as the said copper wire, and the washing | cleaning process which wash | cleans copper wire before the said softening annealing process in the said plating pretreatment process can be performed.

Moreover, as an aspect of this invention, the said plating pretreatment process includes the heat processing process of heat-processing about copper wire before the said softening annealing process, and the said heat processing process can be performed before the said washing process.

Moreover, as an aspect of this invention, the said washing process is equipped with the acid washing process and the water washing process, The said heat processing process, the said acid washing process, the said water washing process, and the said softening annealing process in the said plating pretreatment process Can be performed in this order.

Moreover, as an aspect of this invention, the traveling speed of a copper wire is used for copper wire using the flat copper wire of the width in the orthogonal cross section orthogonal to a longitudinal direction in the range of 0.8-10 mm, and the thickness in the range of 0.05-0.5 mm. Can be set to about 4.0 m / min to set the acid washing time in the acid washing step to about 12.8 seconds and the water washing time in the water washing step to about 13.5 seconds.

Moreover, as an aspect of this invention, the copper wire formed with the pure copper system material can be used, and the copper wire conveyance assistance process which assists the winding of the copper wire performed by the winding process can be performed during the said winding process.

Moreover, as an aspect of this invention, the copper wire formed from the pure copper system material is used, and after the said plating process, it is arrange | positioned upstream of the said winding means as the upper side of the said molten solder plating bath, and the upper side of the tank. The copper wire after passing through the said molten solder plating bath by the tank upper side turning roller arrange | positioned at the position higher than the arrangement height of the winding means upstream arrangement roller which guides the copper wire after passing through the redirection roller to the downstream side in the said winding means. The traveling direction can be diverted to the winding-up-upstream arrangement roller side.

In addition, as the aspect of the present invention, the copper wire is formed of a pure copper-based material, and in the plating step, a thin plating setting for plating copper wire with thin plating, and a post plating that becomes thicker than the plating thickness in the case of thin plating setting. The thin-plating setting is a setting for plating copper wire at a low speed traveling speed, and the post-plating setting is a speed for driving copper wire. The plating is performed at a high traveling speed which is higher than the speed, and the plating is performed on copper wire at the plating thickness according to the solder temperature based on a predetermined relationship between the solder temperature and the plating thickness at the high traveling speed. It can be set.

Moreover, as an aspect of this invention, the said low speed traveling speed can be set to about 4 m / min, and the high speed traveling speed can be set to about 13 m / min.

Moreover, as an aspect of this invention, the said solder temperature can be set to about 240 degreeC at the said high speed traveling speed.

Moreover, as an aspect of this invention, when performing the said plating process by the said post-plating setting, the pre heating process which heats the copper wire immediately before performing the soft annealing process between the said washing process and the said soft annealing process is performed, The said plating process can be performed about the copper wire which performed the said softening annealing process after a heating process.

According to the present invention, it is possible to obtain a plated wire of a desired quality with a sufficiently low 0.2% yield value, and to obtain a stable plated wire such that the product yield can be improved and the production efficiency can be improved. It is possible to provide a manufacturing method and an apparatus for producing a line.

1 is a schematic diagram of an apparatus for manufacturing a solder plating wire,
2 is an explanatory diagram of a softening annealing furnace,
3 is an explanatory diagram of a bobbin traverse winding machine,
4 is a graph showing a relationship between a softening annealing temperature and a 0.2% yield value in a softening annealing furnace when the heat treatment temperature is 100 ° C.
5 is a graph showing the relationship between the heat treatment temperature and the 0.2% yield value;
6 is a graph showing a 0.2% yield strength value of the plated wire in the case of using reducing gas according to the presence or absence of hydrogen in the softening annealing process,
7 is a graph showing the relationship between the hydrogen mixing ratio of the reducing gas and the 0.2% yield value;
8 is a schematic view showing a part of an apparatus for manufacturing a solder plating wire of another embodiment,
9 is a schematic view showing a part of an apparatus for manufacturing a solder plating wire of another embodiment,
10 is a schematic view of a cleaning apparatus;
11 is a graph showing the relationship between the 0.2% yield value of the plating wire according to the installation state of the transfer capstan and the direction turning roller in the tank,
12 is a schematic view showing a part of an apparatus for manufacturing a solder plated wire of another embodiment,
13 is an explanatory view of the operation of the apparatus for manufacturing a solder plating wire,
14 is a schematic view of the manufacturing apparatus used in the roller batch height verification experiment on the plating bath,
15 is a graph showing an experimental result of an apparatus for manufacturing a solder plating wire,
16 is a schematic view showing a part of a conventional apparatus for manufacturing a solder plating wire.
It is a schematic diagram which shows a part of manufacturing apparatus of the solder plating line of other embodiment.

One embodiment of this invention is described using the following drawings.

As shown in FIG. 1, the apparatus 10 for manufacturing a solder plated wire of the present embodiment has a plated pretreatment means 2 for performing plating pretreatment on the plated wire 1a and the surface of the plated wire 1a. It consists of the plating means 61 which implements this, and the winding means 71 which winds the plating wire 1b which plated on the surface.

Oxygen-free copper (OFC) was 0.05 to 0.5 mm thick and 0.8 to 10 mm wide, more preferably 0.08 to 0.24 mm thick, using a flat wire maker (not shown) provided separately. The flat copper wire rolled in the width of 1-2 mm is used.

The plating pretreatment means 2 is mainly composed of a supplier 12, a heat treatment furnace 22, an acid washing tank 31, an ultrasonic water washing tank 41, and a softening annealing furnace 51.

The supply 12 supplies the to-be-wired wire 1a wound on the drum to the production line while the drum rotates to release the plated wire 1a. The supply 12 may be a structure with a dancer function as needed, and the structure 12 may be fed by normal horizontal feeding.

The heat treatment furnace 22 is substantially the same structure as the softening annealing furnace 51 mentioned later, and is comprised by the external shape which made the rectangular parallelepiped shape long in the running direction with respect to the thickness direction. The heating process furnace 22 is inclined arrange | positioned so that the downstream edge part of a traveling direction may become lower than an upstream edge part along a travel direction. The interior of the heat treatment furnace 22 is a steam atmosphere with a set temperature of 200 ° C.

Moreover, the cooling water tank 23 which cools the to-be-plated wire 1a which passed the inside of the heat processing furnace 22 in the downstream of a running direction with respect to the heat processing furnace 22 is provided. The downstream end of the heat treatment furnace 22 and the cooling water tank 23 are connected to the cooling water tank 23 so that the plated wire 1a derived from the heat treatment furnace 22 does not come into contact with the air 24. Are connected to each other.

The acid cleaning tank 31 as the cleaning means 30 stores a phosphoric acid-based cleaning liquid 32 for acid cleaning the surface of the plated wire 1a.

The ultrasonic water cleaning tank 41 serving as the cleaning means 30 stores water 43 for cleaning using an ultrasonic water cleaner equipped with a water-soluble lubricant or other impurities attached to the surface of the plated wire 1a. have. The ultrasonic diaphragm 42a which comprises a part of the ultrasonic water washer 42 is arrange | positioned along the running direction of the to-be-plated wire 1a in the bottom face of the ultrasonic water washing tank 41. As shown in FIG. Moreover, the air wiper 45 which blows air toward the to-be-plated line 1a is provided above the ultrasonic water washing tank 41 from the side on the track | orbit which a to-be-plated line 1a runs.

The softening annealing path 51 is inclined so that the downstream end part may become a position lower gradually than the upstream end part of a travel direction like FIG. The soft annealing furnace 51 is arranged so as to pass through the soft annealing furnace body 52 having a rectangular parallelepiped shape like the heat treatment furnace 22 and the soft annealing furnace body 52 to insert the plated wire 1a. It consists of a sheath pipe (53) in the form of a pipe having an inner diameter to allow the heater 54 for heating the interior of the softening annealing furnace body 52.

The sheath tube 53 is disposed in the inner space of the soft annealing furnace body 52 along the running direction, and protrudes from both ends of the soft annealing furnace body 52 in the longitudinal direction (the running direction), that is, the upper end and the lower end of the longitudinal direction. It is. The upper opening part 55u is formed in the upper end of the sheath tube upper protrusion part 55 which protrudes from the upper end part of the softening annealing main body 52 in the sheath tube 53.

The upper opening 55u allows introduction of the plated wire 1a into the inside of the sheath tube 53 and simultaneously discharges the reducing gas G filled in the inside of the sheath tube 53. The lower end opening part 55d is formed in the lower end of the sheath tube lower protrusion part 56 which protrudes from the lower end part of the softening annealing main body 52 in the sheath tube 53.

The lower opening 55d allows the plated wire 1a to be drawn out of the sheath tube 53. The sheath tube lower protrusion 56 is connected in series with the connector tube 55. In addition, a branch portion is formed in the middle portion of the lower projection 56 of the sheath tube, and the branch portion is configured as a reducing gas supply unit 57 for supplying the reducing gas G into the sheath tube 53.

In addition, although not shown, the reducing gas supply part 57 is provided with a pressure control valve, a pressure gauge, etc., and the reducing gas supply part 57 is provided according to the density | concentration of the reducing gas G in the said softening annealing furnace 51. It is possible to adjust the flow rate of the reducing gas (G).

The inside of the sheath pipe 53 introduces the reducing gas G from the reducing gas supply part 57 to make the interior into a reducing gas atmosphere.

The heater 54 is provided with a plurality of straight rods, and is spaced upwardly with respect to the sheath pipe 53 so as to face each other with the sheath pipe 53 interposed therebetween in the internal space of the softening annealing main body 52. In the lower and lower spaces. The heater 54 is provided in a direction orthogonal to the traveling direction of the plated wire 1a, in detail, in a direction corresponding to a direction perpendicular to the ground of FIG. 2 when viewed in front of the ground of FIG. Heaters 54 are arranged in parallel at predetermined intervals along the traveling direction in the upper space and the lower space, respectively.

The interior of the softening annealing furnace 51 is set to a temperature setting of 800 ° C. or higher by the heater 54.

By connecting the lower sheath 56 of the sheath tube in series with the connecting tube 55, the plated wire 1a passing through the softening annealing path 51 is not contacted with air until it enters into the molten solder plating solution 63. Can be run so that

The plating means 61 is composed of a molten solder plating bath 62 in which a molten solder plating solution 63 is stored. The molten solder plating solution 63 has a set temperature of 260 ° C., and molten tin (Sn-3.0Ag-0.5Cu). ).

Inside the molten solder plating bath 62, the direction turning roller 64 in a tank which changes the traveling direction of the plating line 1b with the molten solder plating liquid 63 on the surface perpendicularly upward is arrange | positioned.

And vertically above the in-row direction turning roller 64 is provided with the tank top direction turning roller 65 which changes the plating line 1b to the direction toward the winding means 71 in the running direction to a vertical upward direction.

The tank inner direction turning roller 64 and the tank upper direction turning roller 65 are comprised by the roller of about 100 mm, for example, whose diameter is larger than the normal roller of about 20 mm. In addition, the jaw turning roller 64 and the jaw top turning roller 65 each have a dancer roller 74 or a bobbin 76 to be described later provided in the winding means 71 by a driving motor (not shown). Actively rotates itself actively at a rotational speed approximately equal to the rotational speed of, and performs the redirection of the plating line 1b to synchronize with the winding speed by the winding means 71.

Next, the winding means 71 will be described.

The winding means 71 is composed of a winding tension regulator 72 and a bobbin traverse winding machine 75.

The winding tension regulator 72 is provided with a dancer roller 74 which moves up and down according to the tension applied to the plating wire 1b across the fixing roller 73 to adjust the state of the tension. And although not shown, the tension detection sensor which detects the tension of the spread plating line 1b, the control part which controls tension to be stabilized according to the tension which the tension detection sensor detected, and the dancer roller 74 based on the command of the control part. It is composed of a roller mover for operating.

The bobbin traverse winding machine 75 includes the bobbin 76 which is widely configured with respect to the width of the plating line 1b as shown in Fig. 3 (a), and the bobbin 76 along the axial direction of the bobbin 76. And a transmission means 78 such as a ball screw for transmitting the drive of the motor 77 and a swinging motor 77. Furthermore, the bobbin traverse winding machine 75 has a winding force detection sensor 79 for detecting the winding force by the bobbin 76 and a tension of the bobbin traverse winding machine 75 according to the winding force detected by the winding tension detection sensor 79. The control part 81 to control, and the motor 82 which rotates the bobbin 76 based on the command of the control part 81 are comprised.

The apparatus 10 for manufacturing a solder plating wire configured as described above includes a supplier 12 as a plating pretreatment means 2, a heat treatment furnace 22, an acid washing tank 31, an ultrasonic water washing tank 41, and a softening annealing furnace. Each of the 51 and the molten solder plating bath 62 and the winding means 71 as the plating means 61 is tandem in this order from the upstream side of the traveling direction of the plated wire 1a and the plating wire 1b. Place it in series.

Further, the apparatus 10 for manufacturing a solder plated wire lowers the 0.2% yield value of the plated wire 1a before plating, and thereafter, the low-bearing plated wire 1a. Plating is carried out, and the coiling means 71 is wound by the winding means 71 with a winding force lower than the strength of the plated wire 1b.

Specifically, as the winding means 71, the above-mentioned winding tension regulator 72 and the bobbin traverse winding machine 75 are employed, and at the same time, the first transfer capstan 91 and the auxiliary to assist the winding of the winding means 71 are made. 2 Install the transfer capstan (92). Both the 1st conveyance capstan 91 and the 2nd conveyance capstan 92 are provided in the upstream side of the softening annealing path 51 so that the conveyance of the traveling of the to-be-plated line 1a may be assisted before it becomes low-bearing.

Specifically, the first transfer capstan 91 is provided between the heat treatment furnace 22 and the acid washing tank 31, while the second transfer capstan 92 is the ultrasonic water washing tank 41 and the softening annealing furnace 51. ) Between.

And if the winding speed of the plating line 1b is too slow or too fast, the load on the plating line 1b will become large. In particular, if the take-up speed is too fast, the line is also shaken. Therefore, in the first transfer capstan 91 and the second transfer capstan 92, a speed slightly higher than the take-up speed in the take-up means 71, for example, The plated wire 1a and the plated wire 1b are sent to the downstream side at a feed speed as fast as about +1 m / min with respect to the winding speed.

Further, the winding means 71 is suitably provided with a plurality of fixing rollers 73 extending over the plating line 1b in the vicinity of the curling tension regulator 72 and the bobbin traverse winding machine 75 described above.

Of the plurality of fixing rollers 73 arranged on the winding means 71, the fixing roller 73 provided on the most upstream side in the traveling direction is set as the winding means upstream side arrangement roller 73A. The winding means upstream side arrangement roller 73A first applies the plating wire 1b that has traveled toward the winding means 71 after the change of direction by the jaw upper direction change roller 65 on the winding means 71 side. It is a roller.

The tank upper side turning roller 65 is arranged at a position higher than the winding means upstream side placing roller 73A.

Next, the manufacturing method of a solder plating wire is demonstrated.

The manufacturing method of the solder plating wire includes the plating pretreatment step of performing plating pretreatment on the plated wire 1a, the plating step of applying solder plating to the surface of the plated wire 1a, and the plating wire having plated on the surface ( It manufactures through the winding process which winds up 1b).

The plating pretreatment step is a step of performing a heat treatment step, an acid washing step, a water washing step and a softening annealing step in this order.

In a heat processing process, it is a process of steam-cleaning the surface of the to-be-plated line 1a by running the to-be-plated line 1a in the inside of the heat processing furnace 22 which became a vapor atmosphere. By this steam washing, the water-soluble lubricant adhering to the surface of the plated wire 1a and other impurities can be separated from the surface to facilitate removal.

In the heat treatment step, the annealing temperature in the heat treatment furnace 22 is set to 200 ° C. which is lower than the general annealing temperature of about 650 ° C., and the inside of the heat treatment furnace 22 set at this low temperature is made into a vapor atmosphere, Water vapor cleaning is performed with respect to the to-be-plated line 1a by running to-be-plated line 1a.

In the heat treatment step, as described above, in addition to performing steam cleaning on the plated wire 1a, it is also possible to lower the yield strength by annealing the plated wire 1a. However, in the heat treatment step, the annealing temperature is set to a low temperature such as 200 ° C. to suppress the degree to which the plated wire 1a becomes low.

The plated wire 1a after passing through the heat treatment furnace 22 is cooled to a predetermined temperature by running the coolant stored in the cooling water tank 23 after passing through the connecting pipe 24.

In the acid washing step, the surface of the to-be-plated wire 1a which traveled through this inside is run by traveling in the phosphate cleaning liquid 32 stored in the acid washing tank 31.

In the water washing step, ultrasonic water washing is performed on the surface of the plated wire 1a in the ultrasonic water washing tank 41 to remove the water-soluble lubricant or other impurities adhering to the surface of the plated wire 1a.

In the softening annealing process, the to-be-plated wire 1a is made to run inside the soft-annealed furnace 51 which made the inside into a reducing gas atmosphere, softening-annealed and low-bearing the to-be-plated wire 1a, and at the same time, the to-be-plated wire 1a. It is a process of reducing the oxide layer of the surface of the.

In detail, in the soft annealing process as shown in FIG. 2, the sheath tube lower protrusion part 56 is provided inside the sheath tube 53 of the soft annealing path 51 which is inclined so as to be a position lower than the upstream side in the traveling direction. In the reducing gas supply section 57 provided as a reducing gas (G), for example, a mixed gas in which hydrogen gas is mixed with nitrogen gas is supplied, and the inside of the sheath tube 53 is made into a reducing gas atmosphere. The inner space of the softening annealing furnace body 52 is heated by the heater 54 to about 800 ° C.

The downward direction which is opposite to the direction d1 in which reducing gas G rises in the to-be-plated wire 1a introduce | transduced in the upper opening 55u in the inside of the sheath tube 53 which becomes such a reducing gas atmosphere. The vehicle is driven toward (D) (see arrow d1 and arrow D shown in the partially enlarged view in FIG. 2).

In the subsequent plating process, the molten tin is adhered to the surface of the to-be-plated wire 1a by traveling through the molten solder plating liquid 63 stored in the molten solder plating tank 62.

The plated wire 1a derived from the lower end opening 55d of the softening annealing furnace 51 travels inside the connecting pipe 55 until it is submerged into the molten solder plating solution 63 without being contacted with air. You are guided.

The to-be-plated wire 1a immersed in the molten solder plating liquid 63 becomes the plating wire 1b by which the molten solder plating liquid 63 was affixed on the surface, and the whole surface was coat | covered with the molten solder plating liquid 63. FIG. The plating line 1b travels the molten solder plating bath 62 by the in-direction turning roller 64 provided in the molten solder plating bath 62 while traveling in the molten solder plating bath 62. In the vertical direction, and is directed toward the vertical direction in the molten solder plating bath 62.

After the plating wire 1b is led out of the molten solder plating bath 62, the plating wire 1b is turned by the tank upper direction turning roller 65 and travels toward the winding means 71. As shown in FIG.

In the winding-up process, while performing the above-mentioned pre-plating process and plating process for the to-be-plated wire 1a, the plating wire 1b which passed through these processes was controlled by the dancer roller 74 of the winding tension regulator 72. FIG. While adjusting the tension of the plated wire 1b, the bobbin traverse winding machine 75 is rolled up in alignment with the bobbin 76 provided.

Specifically, as shown in FIGS. 3A and 3B, the plating line 1b is rotated by swinging the bobbin 76 of the bobbin traverse winding machine 75 around the axis while rotating in the axial direction of the bobbin 76. ) Can be wound in parallel along the axial direction of the bobbin 76 and can be wound up so as to overlap several layers.

The apparatus 10 and the manufacturing method of the solder plating wire mentioned above can acquire various actions and effects as follows.

The apparatus 10 for manufacturing a solder plating wire includes a suppleer 12 as a plating pretreatment means 2, a heat treatment furnace 22, an acid cleaning tank 31, an ultrasonic water cleaning tank 41, and a softening annealing furnace 51. ), The molten solder plating bath 62 as the plating means 61, and the winding means 71 are sequentially arranged in this order from the upstream side to the downstream side in the traveling direction of the plating line 1b.

Thus, by arranging each means in series, it is possible to prevent the plated wire 1b having low yield strength during manufacture from running unnecessarily at a distance, thereby reducing the load on the plated wire 1b during traveling.

Therefore, the plating wire 1b of the desired quality which fully reduced the 0.2% yield strength value can be obtained, and this plating wire 1b can be obtained stably, and a product yield can be improved and manufacturing efficiency can be improved.

Moreover, in the manufacturing method of a solder plating wire, each process of a heat processing process, an acid washing process, a water washing process, a softening annealing process, a plating process, and a winding process as a plating pretreatment process is performed continuously.

Thus, by performing each process continuously, for example, whenever running through a predetermined process, the running of the plating line 1b (plating line 1a) is interrupted, and plating is performed on another traveling line in order to perform the next process. Since no trouble is required, such as transferring the wire 1b (plated wire 1a), the load on the plated wire 1b can be considerably alleviated, so that the plated wire 1b of desired quality can be stably obtained. have.

Therefore, the plating wire 1b of desired quality which fully reduced the 0.2% yield strength value can be obtained, this plating wire 1b can be obtained stably, a product yield can be improved, and manufacturing efficiency can be improved.

Further, since the plated wire 1b of desired quality can be efficiently produced with a sufficiently low 0.2% yield value, mass production of the low yielded plated wire 1b which is very suitable as a lead wire for solar cells can be achieved. Can be.

Further, the apparatus 10 for manufacturing a solder plated wire is inclined so as to position the softening annealing furnace 51 so as to be a lower side than an upstream side in the running direction, and downstream of the running direction in the softening annealing furnace 51. It is the structure which provided the reducing gas supply part 57 which allows supply of reducing gas G with respect to the sheath pipe 53 which permits running in the state in which the to-be-plated wire 1a was inserted in the inside.

In the method of manufacturing the solder plating wire, in the softening annealing step, after the lowering portion (downstream portion) of the sheath pipe 53 is installed inside the softening annealing furnace 51, the reducing gas ( It is a manufacturing method which supplies G to the inside of the sheath pipe 53, and runs the to-be-plated wire 1a toward the downstream side from the upstream of a travel direction in the sheath pipe 53 made into reducing gas atmosphere.

As shown in FIG. 2 by the above-mentioned solder plating line manufacturing apparatus 10 and a manufacturing method, the direction opposite to the direction d1 in which the reducing gas G rises in the sheath tube 53 made into the reducing gas atmosphere The to-be-plated wire 1a can drive | work toward the downward direction D. FIG.

Thereby, since the to-be-plated wire 1a which travels inside the sheath pipe 53 can be actively exposed to the atmosphere of the reducing gas G which is going to raise, the reduction of the oxide layer of the surface of the to-be-plated wire 1a is carried out. And low yield strength of the plated wire 1a can be efficiently promoted.

In addition, a lower end portion (downstream portion) in the longitudinal direction of the plated wire 1a traveling inside the sheath tube 53 is newly supplied into the sheath tube 53 through the reducing gas supply unit 57. It can be exposed to the atmosphere of the reducing gas G immediately after being finished (see Fig. 2).

That is, in the sheath tube 53, the closer the plated wire 1a traveling is to the reducing gas supply portion 57, the more actively the reduction of the tolerated wire 1a and the reduction of the oxide layer on the surface are performed. While the plated wire 1a is led out of the softening annealing furnace 51 through the reducing gas supply unit 57, it is possible to reliably reduce the resistance of the plated wire 1a and the surface under heating by the heater 54. The oxide layer can be reduced.

In addition, since it is possible to reliably and efficiently carry out the reduction in the resistance of the plated wire 1a and the reduction of the oxide layer on the surface in this way, the traveling distance of the plated wire 1a traveling inside the softening annealing furnace 51. In addition, the traveling speed of the plated wire 1a can be improved at the same time.

In addition, in the plating pretreatment step, the low-bearing strength of the plated wire 1a and the removal of the oxide layer on the surface are simultaneously performed in the softening annealing step by using the softening annealing furnace 51, thereby the plated wire 1a. The reduction process of reducing the oxide film which has on the surface of and the softening annealing process of carrying out the softening annealing of the to-be-plated wire 1a are shortened compared with the case where it performs in series at another process, and shortens the travel distance of the to-be-plated wire 1a. can do.

Therefore, the load applied to the low-bearing to-be-plated wire 1a can be reduced, and the high quality solder plating wire 1b can be manufactured.

Moreover, in the heat processing process performed before a softening annealing process, in the heat processing furnace 22, the deposit adhered to the surface of the to-be-plated wire 1a can be removed by heating. For example, when the deposit is a liquid deposit such as oil, it can be vaporized. In this way, the deposit can be removed from the surface of the plated wire 1a irrespective of the property of the deposit, such as a solid shape or a liquid phase.

In particular, by performing the heat treatment step immediately before the acid washing step, the to-be-plated wire 1a is heated in the heat treatment step, and acid cleaning can be performed on the to-be-plated wire 1a heated in the acid cleaning step. As a result, the acid cleaning effect can be further enhanced.

In addition, in the heat treatment furnace 22, the annealing effect with respect to the to-be-plated wire 1a can also be acquired according to heating temperature.

However, according to the manufacturing apparatus 10 and the manufacturing method of the solder plating wire mentioned above, a 0.2% yield value is predetermined value in the heat processing furnace 22 arrange | positioned upstream of the softening annealing furnace 51 in a heat processing process. Rather than softening annealing with respect to the to-be-plated wire 1a until it fully falls, it is left by the softening annealing of hardness. Then, in the cleaning step after the heat treatment step, the required cleaning is completed for the plated wire 1a, and then, until the 0.2% yield value falls to a predetermined value in the softening annealing step performed immediately before the plating step. Soft annealing is performed with respect to the plating wire 1a.

Thereby, since it is not necessary to perform a washing | cleaning process with respect to the low-bearing to-be-plated wire 1a, the load on the to-be-plated wire 1a can be reduced.

Specifically, the heat treatment furnace 22 is a steam atmosphere set at a low temperature of about 200 ° C., for example, although the set temperature at the time of annealing in the normal heat treatment furnace is about 650 ° C. do.

In addition, the soft annealing furnace 51 is set to a high temperature of about 800 ° C, for example, as described above, although the temperature setting in the normal softening annealing furnace is about 530 ° C.

As a result, in the heat treatment step, the lowering resistance of the plated wire 1a is suppressed and the softening annealing furnace 51 is used in the softening annealing step performed after the cleaning step such as acid cleaning and ultrasonic water cleaning thereafter. The to-be-plated wire 1a is made into low yield strength until the 0.2% proof value falls to predetermined value.

Therefore, by performing acid washing and ultrasonic water washing on the to-be-plated wire 1a before it becomes low, for example, when performing these processes with respect to the to-be-plated wire 1a after low load like conventionally, In comparison, the influence of the load on the plated wire 1a can be reduced, and the quality of the plated wire 1b can be improved accordingly.

In addition, since the inside of the heat treatment furnace 22 is a vapor atmosphere, softening annealing of the plated wire 1a is possible depending on the heating temperature, but a steam cleaning effect can also be expected. Therefore, in the heat treatment furnace 22, the surface of the to-be-plated wire 1a can be easily removed by steam cleaning at the same time as the to-be-plated wire 1a. Therefore, the water-soluble lubricant and other impurities adhering to the surface of the plated wire 1a can be reliably removed in the subsequent acid washing step and water washing step.

Therefore, the high quality plating wire 1b coated by the uniform plating thickness can be manufactured.

Hereinafter, an effect confirmation experiment is demonstrated.

(Effect check experiment)

First, two experiments of the annealing effect confirmation experiments A and B which were performed as an effect confirmation experiment regarding a heat treatment process and a softening annealing process are demonstrated.

(Annealing Effect Confirmation Experiment A)

Annealing Effect Confirmation In Experiment A, the heat treatment step was performed under a low temperature setting of 100 ° C., and then softening annealing was performed under various annealing temperatures in the soft annealing step. In this case, the relationship between the setting of the annealing temperature and the low load resistance value of the copper wire after the winding step is made clear, and on the basis of this relationship, the annealing temperature to be set in the softening annealing step to obtain the desired low strength value is obtained. It was confirmed about.

In addition, the annealing effect confirmation experiment A was performed on the experiment conditions shown in Table 1 using the manufacturing apparatus 10 mentioned above.

Experimental condition
Plated wire (used copper wire) OFC, flat line (0.2 x 0.1 mm)
Heat treatment temperature… 100 ℃
Solder temperature ... 260 ℃
Ship speed… 16m / min
Winding tension… 2.8N

In addition, the result of the annealing effect confirmation experiment A is shown in Table 2 and FIG.

Heat treatment temperature ℃ 100 100 100 100 100 100 100 100 Softening annealing temperature ℃ 550 600 650 700 750 800 850 900 Tensile property: 0.2% strength value MPa 99 64 64 58 57 53 54 55

Here, in Table 2, the softened annealing furnace 51 performs annealing of the plated wire under a predetermined setting for each annealing temperature, and shows a 0.2% yield value which is one of the tensile properties of the plated wire 1b after the winding in the winding step. The result of the measurement is shown. 4 is a graph of the relationship between the 0.2% yield value of the plated wire 1b after winding and the softening annealing temperature based on Table 2. FIG.

As the result shown in Table 2 and FIG. 4, when the heat processing process is performed under the low temperature of 100 degree | times in the heat processing process, the annealing temperature in a softening annealing process is low as for example about 550 degreeC. In the case of temperature, the annealing with respect to the to-be-plated wire 1a became inadequate and the result which showed the tendency for a 0.2% yield value to become a high value was brought.

However, even if the heat treatment temperature in the heat treatment step is as low as 100 degrees, if the annealing temperature in the softening annealing step is from 800 ° C. to 900 ° C., the 0.2% yield value of the plating wire 1b after the odor is desired to be 55 MPa or less. It can be confirmed that the low strength value can be surely converged.

(Annealing Effect Confirmation Experiment B)

In the annealing effect confirming experiment B, the heat treatment step is performed under various heat treatment temperatures, and the relationship between the 0.2% proof strength value of the plated wire 1a and the heat treatment temperature after the heat treatment process is clarified, and at the same time, About 1a), the softening annealing process was performed under the setting of the constant annealing temperature of 850 degreeC, and the relationship between the 0.2% yield value after a softening annealing process and heat processing temperature was made clear.

In addition, this effect confirmation experiment B was made into the experiment conditions shown in Table 3 using the manufacturing apparatus 10 mentioned above.

Experimental condition
Plated wire (used copper wire) OFC, flat line (0.2 x 0.1 mm)
Softening annealing temperature ... 850 ℃
Solder temperature ... 260 ℃
Ship speed… 16m / min
Winding tension… 2.8N

Results of Annealing Effect Confirmation Experiment B are shown in Table 4 and FIG. 5.

Here, Table 4 (a) shows the 0.2% proof strength value of the to-be-plated wire 1a before performing a heat treatment with respect to the to-be-plated wire 1a in a heat treatment process, and performing a softening annealing process. The measurement result by each setting is shown.

Table 4 (b) performs annealing on each of the to-be-plated wires 1a subjected to the heat treatment step for each of the predetermined heat treatment temperatures described above under a common setting of 850 degrees in the annealing temperature in the softening annealing step, The result of having measured the 0.2% yield strength value of the solder plating wire 1b after winding up is shown.

FIG. 5 shows the relationship between the 0.2% yield value of the plated wire 1a after passing through the heat treatment furnace 22 and the temperature of the heat treatment furnace based on the results shown in Table 4 (a), and simultaneously shows the softening annealing furnace. It is a graph which shows the relationship between the 0.2% proof strength value and the annealing temperature of the to-be-plated wire 1a after passing through based on the result shown to 4 (b).

As shown to Table 4 (a), (b) and FIG. 5, when heat processing temperature is low in a heat processing process, the annealing effect is small and 0.2% yield value did not fall. However, the annealing effect in the softening annealing process was increased by that amount, and the 0.2% yield value could be lowered.

On the other hand, when heat processing temperature is high in a heat processing process, the annealing effect can fully be obtained also in the heat processing process, and the annealing effect in a softening annealing process has become small by that much.

That is, by setting the annealing temperature in the softening annealing process to a high temperature of 850 ° C. irrespective of the heat treatment temperature in the heat treatment step, the 0.2% yield value can be reliably lowered to a low value of approximately 55 Mpa or less. I could confirm it.

In this way, regardless of the heat treatment temperature in the heat treatment step, in the softening annealing step performed after the heat treatment step, the annealing temperature is set to 850 ° C. to sufficiently lower the plated wire 1a for performing the softening annealing step. The result was possible. On the contrary, from the heat treatment process side, it is not necessary to set heat processing temperature high, but it can also be said that it can set arbitrarily according to the objective.

Specifically, in the heat treatment step, by setting the heat treatment temperature at a low temperature of, for example, about 100 to 300 degrees, the reduction in the yield strength of the plated wire 1a in the heat treatment furnace 22 can be suppressed. As a result, in the washing step performed after the heat treatment step and before the softening annealing step, even if a load is applied to the plated wire 1a, the load-bearing wire 1a becomes low enough to not unexpectedly stretch or break. It was confirmed that it is possible in the treatment process.

Even when the heat treatment temperature is set at, for example, about 100 ° C to 300 ° C in the heat treatment step, it is possible to promote to a certain extent the reduction in resistance of the plated wire 1a in the heat treatment step.

That is, in the heat treatment step, by setting the heat treatment temperature, for example, 100 to 300 degrees, the heat treatment process can function as preliminary annealing in lowering the load-bearing wire 1a, and the softening annealing process In the present invention, the annealing time required for full-scale annealing performed to sufficiently lower the plated wire 1a to a level of about 55 MPa or less can be shortened.

For this reason, even when the wire speed of the plated wire 1a is increased to increase the productivity of the solder plating wire for solar cells, the softening annealing furnace 51 is not required to have a long length. have.

Subsequently, in the softening annealing process, annealing furnace hydrogen concentration verification experiment as an experiment for verifying the influence of the 0.2% proof strength value according to the difference in the concentration of hydrogen gas contained in the reducing gas G supplied into the softening annealing furnace 51 in the softening annealing process 51. Two experiments, A and annealing furnace hydrogen verification test B, were carried out.

(Annealing furnace hydrogen concentration verification experiment A)

In the annealing furnace hydrogen concentration verification experiment A, the plating wire 1b of the example of this invention and the plating line of a comparative example were created through the manufacturing process mentioned above as a specimen.

The plating wire 1b of the example of this invention and the plating wire of a comparative example differ only in a softening annealing process, and all other processes were each created through the same process.

In the softening annealing step performed to prepare the plating line 1b of the example of the present invention and the plating line of the comparative example, the inside of the softening annealing furnace 51 is a reducing gas atmosphere, but the components of the reducing gas G are different.

That is, the reducing gas G in the case of preparing the plating line of the comparative example is made of only nitrogen gas, whereas the reducing gas G in the case of preparing the plating line 1b of the example of the present invention is made of nitrogen gas and hydrogen gas. It consists of mixed gas.

In this experiment, the size of the plated wire 1a was 0.16 × 2 mm using oxygen-free copper (OFC) as the plated wire 1a when the plated wire 1b of the example of the present invention and the plated wire of the comparative example were manufactured. The temperature setting of the heat treatment furnace 22 was 200 degreeC, and each winding line speed in the 1st conveyance capstan 91 and the 2nd conveyance capstan 92 was made into + 1m / min.

In addition, at the time of manufacture of these plating wire 1b, the acid washing process and the ultrasonic water washing process were performed with respect to the to-be-plated wire 1a before a softening annealing process. In addition, in the acid washing | cleaning process, the preset temperature of the phosphate type washing | cleaning liquid was 50 degreeC. In the plating process, the set temperature of the molten solder plating liquid 63 is set to 260 ° C, and molten tin (Sn-3.0Ag-0.5Cu) is used as the molten solder plating liquid 63. In addition, the winding means 71 is not provided with the winding tension regulator 72, and consists of the structure wound directly by the bobbin traverse system winding machine 75. As shown in FIG.

The plating wire 1b of the example of this invention and the plating wire of a comparative example were created with three types of plating thickness of 20 micrometers, 30 micrometers, and 40 micrometers under the above-mentioned setting, respectively, and compared with respect to the 0.2% yield value, respectively. The same result as the graph shown in FIG.

As shown in the graph shown in FIG. 6, the plating wire 1b of the example of the present invention had a 0.2% yield strength lower than that of the comparative example in any of the thicknesses of 20 μm, 30 μm, and 40 μm. Especially, when the plating thickness was 40 micrometers, it was confirmed that the plating line 1b of the example of this invention had the highest fall rate of 0.2% yield strength value compared with the plating line of a comparative example.

Therefore, in the annealing step, it is possible to more efficiently promote the low resistance of the plated wire 1a by running the plated wire 1a inside the softening annealing furnace 51 made of a reducing gas atmosphere containing hydrogen gas. I could confirm it.

(Annealing furnace hydrogen concentration verification experiment B)

In the annealing furnace hydrogen concentration verification experiment B, the reducing gas G supplied from the reducing gas supply unit 57 to the inside of the softening annealing furnace 51 is a mixed gas with hydrogen containing at least nitrogen, and the mixed gas is The experiment for verifying the influence of the 0.2% proof strength value of the plating line 1b (the plated line 1a) according to the difference in the mixing ratio represented by the volume fraction occupied by the hydrogen gas using the manufacturing apparatus 10 described above is shown. It carried out under the experimental conditions shown in 5.

Experimental conditions
Plated wire (used copper wire) OFC, flat (0.16 × 2.0mm)
Heat treatment temperature… 250 ℃
Softening annealing temperature ... 850 ℃
Mixing ratio of reducing atmosphere gas H ₂ / (H ₂ + N ₂ ) [%]
Solder temperature ... 260 ℃
Ship speed… 14m / min
Winding tension… 2.8N

The results of the annealing furnace hydrogen concentration verification test B are shown in Table 6 and FIG. 7.

Mixing ratio H ₂ / (H ₂ + N ₂ ) % 0 10 20 30 40 50 Exterior OK OK OK OK OK OK Tensile property: 0.2% yield strength Mpa 56 55 53 53 53 52

Here, Table 6 shows the flow rate of the reducing gas at 4.0 l / min in the case where the mixing ratio of the hydrogen gas to the reducing gas consisting of at least nitrogen gas is 0, 10, 20, 30, 40, 50%, respectively. The result of having measured the 0.2% yield strength value of the plating line 1b after the winding process at the time of performing an annealing process, supplying into the softening annealing furnace 51 inside is shown.

FIG. 7 is a graph showing the relationship between the mixing ratio of hydrogen gas in the mixed gas as the reducing gas and the 0.2% yield value of the solder plating wire 1b after the winding process, based on Table 6. FIG.

As shown in FIG. 7 and Table 6, as the hydrogen gas mixing ratio was increased, the 0.2% yield value was found to be equal or lower. From this, it was confirmed that the higher the hydrogen gas mixing ratio tends to at least lower the 0.2% yield value.

Therefore, it was confirmed that the hydrogen gas does not remain in the effect of reducing the oxide film on the surface of the plated wire 1a but can increase the degree of the effect of lowering the 0.2% yield value according to the concentration of the hydrogen gas in the reducing gas. .

Then, based on the relationship shown in FIG. 7 between the concentration of hydrogen gas in the reducing gas and the 0.2% yield value of the solder plating line 1b, the to-be-plated wire 1a has a low yield strength by controlling the concentration of hydrogen gas for the reducing gas. It was possible to find the possibility of controlling the degree of ignition.

In addition, the manufacturing apparatus of the solder plating line of this invention, and the manufacturing method of a solder plating line are not limited to the structure of the manufacturing apparatus 10 of the solder plating line mentioned above, and the manufacturing method of a solder plating line, It can comprise in various structures.

For example, in the manufacturing apparatus 10A in another embodiment, as shown in FIGS. 8A and 8B, the preheating furnace 51P is provided between the ultrasonic water cleaning tank 41 and the softening annealing furnace 51. ) Can be prepared.

As shown in Fig. 8B, the preheating furnace 51P is configured to increase the temperature of the plated line 1a rapidly even when the traveling time and the traveling distance of the plated line 1a are short.

Specifically, the preheat furnace 51P includes a sheath tube 53L in the preheat furnace body 52P. The sheath pipe 53L is a hollow pipe constructed in a straight line along the running direction of the plated wire 1a. When the plated wire 1a passes through the pre-heating furnace 51P and the softening annealing furnace 51, In order to prevent the to-be-plated wire 1a from contacting air and being oxidized, it is arrange | positioned in communication with the inside of the pre-heating furnace main body 52P and the softening annealing furnace main body 52, respectively.

Although the preheater 51P is provided with the heater 54P of several lines along the longitudinal direction of the sheath pipe 53L in the preheater main body 52P like the soft annealing furnace 51, the soft annealing furnace 51P is provided. It is arrange | positioned at the pitch narrower than the arrangement | positioning interval of the heater 54 arrange | positioned in the furnace 51. In addition, the heater 54P is not limited to increasing the arrangement number more than the number of the heaters 54P of the softening annealing furnace 51, and may increase the amount of power (wattage).

Thereby, even if the wire speed is accelerated and the plated wire 1a is driven, the plated wire 1a can be heated in the preheating furnace 51P as a preheating step immediately before the soft annealing step, and the plated wire in the heated state. (1a) can be supplied to the softening annealing furnace 51.

Therefore, in the softening annealing step, the plated wire 1a can be reliably and sufficiently low withstand in response to the higher speed of the wire of the plated wire 1a.

Further, in the portion between the softening annealing furnace 51 and the pre-heating furnace 51P in the sheath tube 53L, the sheath tube 53L corresponds to the portion corresponding to the pre-heating furnace 51P in the longitudinal direction. The pre-reduction gas supply part 57P to supply is comprised.

In the above-described reducing gas supply unit 57, a mixed gas of hydrogen and nitrogen as the reducing gas G is supplied to the sheath pipe 53L to provide an internal space corresponding to the softening annealing furnace 51 of the sheath pipe 53L. Although it was set as the atmosphere, the pre-reduction gas supply part 57P supplies nitrogen gas or steam gas (steam gas) as reducing gas G to the internal space corresponding to the pre-heating furnace 51P of the sheath pipe 53L, and internally. The space is made into a nitrogen gas atmosphere or a steam gas atmosphere.

As a result, the surface of the plated wire 1a can be prevented from being oxidized when passing through the pre-heating furnace 51P, and at the same time, the pre-heating furnace 51P does not use hydrogen gas as the reducing gas G, but does not use nitrogen gas. Alternatively, the use of steam gas is safe and the gas is easy to handle.

In detail, in the case where the line speed at the time of travel of the to-be-plated wire 1a is 4 m / min which is a normal setting, as shown in Table 7 (a), even after passing through a plating process in any flat size and temperature setting, a plating line will pass. It can be seen that the 0.2% yield value of (1b) can be set as low as 45 Mpa or less.

Other conditions: Annealer temperature 100 ℃ Reduction furnace 850 ℃

※ Appearance roughness (small convex part occurs in flat plane part)

In addition, Table 7 (a) uses three types of flat wires having sizes of 0.2 mm x 1.0 mm, 0.16 mm x 2.0 mm, and 0.2 mm x 2.0 mm as the plated wire 1a, and these plated wires 1a. It shows the value of 0.2% yield strength and plating thickness when the plating wire 1b was produced under the conditions set to three types of wire velocity of 4 m / min and solder temperature of 240 degreeC, 260 degreeC, and 280 degreeC, respectively about each. Table.

On the other hand, in the case where the line speed at the time of the run of the to-be-plated wire 1a is 13 m / min which is a high speed setting, as shown in Table 7 (b), the 0.2% yield strength value of the plated wire 1b will be changed in any flat size and temperature setting. In most settings, the value was 50 Mpa or more, and the value was higher than in the case of the normal setting in which the ship speed was 4 m / min.

By setting the ship speed of the to-be-plated wire 1a to high speed, it will pass through the soft-annealed path 51 before making the to-be-plated wire 1a low enough in the softening annealing path 51, and it will become low enough. This is because a situation where an unplated plating line 1b is created.

Table 7 (b) shows a high speed setting of 13m / min, and the 0.2% yield value and plating when the plated line 1b was prepared under the same flat size and solder temperature as those of Table 7 (a). Table showing values with thickness.

That is, when the ship speed of the to-be-plated wire 1a was simply set to high speed, it was not able to fully carry out low load resistance, and there existed a problem which cannot cope with speed-up of ship speed.

On the other hand, the manufacturing apparatus 10A mentioned above is the structure which provided the pre heating furnace 51P between the softening annealing furnace 51 and the ultrasonic water washing tank 41. As shown in FIG.

Immediately before the plated wire 1a is supplied to the softening annealing furnace 51 by the pre-heating furnace 51P, the plated wire 1a can be heated to a high temperature for a short time, and the blood The plating wire 1a can be supplied to the softening annealing furnace 51.

Therefore, even when the ship speed is made into the said high speed travel speed and the to-be-plated line 1a passes through the softening annealing path 51 at high speed, it can reliably lower the to-be-plated line 1a in the said softening annealing process. Can be.

Specifically, as described above, the pre-heating process is performed by installing the pre-heating furnace 51P, and the plated wire (to Since the 0.2% yield value of 1a) can be reduced, the high quality plated wire 1b having a low 0.2% yield value can be obtained with excellent production efficiency.

In addition, even when the wire to be plated 1a runs at a high speed of 13 m / min, the oxidation layer on the surface of the plated wire 1a can be reliably reduced in the softening annealing path 51.

The preheating furnace 51P provided near the upstream side of the softening annealing furnace 51 has the structure specialized in the heating performance of the to-be-plated wire 1a as above-mentioned, and safety which supplied nitrogen gas or water vapor gas inside The gas atmosphere is easy to handle. Therefore, as a means for securing the softening annealing time in the softening annealing furnace 51, for example, a design utilizing existing equipment without increasing the installation space or cost as compared to the configuration in which the softening annealing furnace 51 is only lengthened. By adding a simple configuration of the degree of change, the speed of the ship can be increased.

In addition, as another embodiment, the heat treatment furnace 22 is not an essential structure, and as a manufacturing apparatus of another embodiment, as shown in Fig. 9A, between the supply 12 and the acid cleaning tank 31 in the traveling direction. The heat treatment furnace 22 may not be provided. In addition, the heat processing furnace 22 is not limited to providing between the supply 12 and the acid washing tank 31 in a running direction, and may be provided in another site as long as it is upstream from the softening annealing path 51.

For example, as the reducing gas supplied only to the fryer heating furnace 51P mentioned above without installing the heat treatment furnace 22 in the upstream of the acid washing tank 31, and supplying it to the fryer heating furnace 51P inside. It is good also as a structure which used the steam gas.

With this configuration, in the preheating furnace 51P, as described above, in addition to the function of performing preheating immediately before the softening annealing furnace 51, both of the functions performed by the above-described heat treatment furnace 22 can be provided.

Therefore, the installation cost can be reduced, and the traveling distance of the plated wire 1a can be further shortened, and a high quality plated wire 1b having a low 0.2% yield value can be produced. .

In addition, as described above, the inside of the softening annealing furnace 51 is a reducing gas atmosphere. However, the reducing gas G is not limited to nitrogen gas or a mixed gas of nitrogen gas and hydrogen gas as described above. You may contain it. Moreover, you may comprise with reducing gas other than nitrogen gas and hydrogen gas.

Further, since the cleaning means 30 is disposed on the upstream side in the travel direction than the softening annealing furnace 51, the cleaning means 30 is applied to the plated wire 1a before being softened by the softening annealing furnace 51. It is possible to wash with. Therefore, the load applied to the to-be-plated line 1a can be reduced compared with the case where it wash | cleans with the washing | cleaning means 30 with respect to the to-be-plated line 1a made low by the softening annealing path 51. FIG.

Therefore, the plating wire 1b of desired quality which fully reduced the 0.2% yield value can be obtained, and the plating wire 1b which is especially suitable as a solder plating wire for solar cells can be obtained.

In addition, the load applied to the plated wire 1a can be reduced compared to the case where the plated wire 1a lowered by the softening annealing furnace 51 is cleaned by the cleaning means 30 in this way. Therefore, in order to reduce the load at the time of the to-be-plated wire 1a, it is not necessary to reduce the number of installation of a transfer capstan, and to reduce a ship speed more than necessary.

Therefore, since the countermeasure for reducing the load applied to the to-be-plated wire 1a can be simplified in a structure surface, a control surface, and a condition setting surface, the manufacturing efficiency of the plating wire 1b can be improved. have.

Further, by providing the cleaning means 30 in the above-described arrangement, the impurities attached to the surface of the plated wire 1a are removed by the cleaning means, and the plating means 61 disposed downstream thereof. The solder plating wire 1b of the outstanding quality with a uniform plating thickness with respect to the surface of the to-be-plated wire 1a can be formed.

In addition, the plating pretreatment means 2 is provided with the heat processing furnace 22 which heat-processes the to-be-plated wire 1a upstream rather than the softening annealing furnace 51, and the heat processing furnace 22 Can be cleaned in the cleaning means 30 after the heat treatment step is performed on the plated wire 1a in the heat treatment furnace 22 by arranging the electrode on the upstream side of the traveling direction rather than the cleaning means 30.

As a result, when the deposit adhered to the surface of the plated wire 1a is heated by the heat treatment furnace 22, even when residues such as soot burned on the deposit remain on the surface of the plated wire 1a. The residue can be reliably removed by washing in the washing means 30 passing later.

Further, the cleaning means 30 is composed of an acid washing tank 31 and an ultrasonic water washing tank 41, and as the plating pretreatment means 2, the heat treatment furnace 22, the acid washing tank 31, and ultrasonic water washing. The heat treatment furnace 22 with respect to the to-be-plated wire 1a before low-bearing by the softening annealing furnace 51 by arrange | positioning the tank 41 and the softening annealing furnace 51 in this order along a running direction, A series of processes performed with the acid washing tank 31 and the ultrasonic water washing tank 41 can be completed.

That is, by arranging the heat treatment furnace 22 and the washing | cleaning means 30 as the plating preprocessing means 2 which is an upstream side of the softening annealing furnace 51 in this way, the to-be-plated wire 1a in the softening annealing furnace 51 is made The plating treatment process can be performed in the plating means 61 immediately after lowering the yield strength and lowering the load-bearing wire 1a.

For this reason, it is possible to avoid the application of the maximum load to the low yield strength plated wire 1b, and to obtain the plated wire 1b excellent in quality.

In particular, by arranging the acid cleaning tank 31 downstream of the heat treatment furnace 22, the to-be-plated wire 1a is heated in the heat-treatment furnace 22 and the state which became warm with respect to the to-be-plated wire 1a. Acid cleaning can be performed in the acid cleaning tank 31 with phosphorus, and the acid cleaning effect can be significantly improved as compared with the case where the plated wire 1a at room temperature is carried out, and an excellent acid cleaning effect can be obtained.

In addition, the cooling water tank 23 is provided between the heat treatment furnace 22 and the acid washing tank 31 as described above. The plated wire 1a that has passed through the heat treatment furnace 22 is cooled by the cooling water tank 23 and then travels to the acid cleaning tank 31.

Thus, the to-be-plated wire 1a of the state heated by the heat-processing furnace 22 is cooled by cooling the to-be-plated wire 1a immediately after passing through the heat-processing furnace 22 by the cooling water tank 23, and surface temperature is increased. It is possible to prevent the formation of an oxide film on the surface of the plated wire 1a again, such as when traveling between the heat treatment furnace 22 and the acid cleaning tank 31 while being in a high state.

However, the plated wire 1a in the cooling bath 23 is not cooled until the surface of the plated wire 1a heated by the heat treatment furnace 22 by the cooling bath 23 reaches room temperature. ) Cooling is preferably such that the surface temperature of the plated wire 1a is at least about 50 degrees.

Thereby, since acid pickling can be performed with respect to the to-be-plated wire 1a which has the surface temperature of at least 50 degree | times in the acid wash tank 31, the acid wash effect by the phosphoric acid type cleaning liquid 32 can be exhibited further. And since acid washing can be performed efficiently in this way, an acid washing effect can be reliably acquired also when the run of the to-be-plated wire 1a speeds up.

In addition, according to the manufacturing apparatus 10 of the solder plating wire and the manufacturing method of the solder plating wire mentioned above, the to-be-plated wire 1a exists in the range of 0.8-10.0 mm in the orthogonal cross section orthogonal to a longitudinal direction, The traveling speed of the plated wire 1a is set to about 4.0 m / min using a flat copper wire having a thickness in the range of 0.05 to 0.5 mm, and the acid cleaning time in the acid cleaning tank 31 is about 12.8 seconds. By setting the ultrasonic water washing time in the ultrasonic water washing tank 41 at the same time as about 13.5 seconds, excellent washing effect can be obtained.

In particular, according to the above-described apparatus 10 for manufacturing a solder plated wire and a method for producing a solder plated wire, the width of the plated wire 1a is in the range of 1.0 to 2.0 mm, and the thickness is in the range of 0.16 to 0.2 mm. In the case of using a phosphorus flat copper wire, setting of the traveling speed of the to-be-plated wire 1a, the acid washing time in the acid washing tank 31 and the ultrasonic water washing time in the ultrasonic water washing tank 41 and As the cleaning was carried out under the same setting, even better results were obtained in the results of the cleaning effect confirmation experiment 1 described later.

Next, the cleaning effect confirmation experiment is demonstrated.

(Cleaning effect confirmation experiment 1)

In the cleaning effect confirmation experiment 1, as shown in Table 8 at the time of manufacturing the plating wire 1b by the manufacturing apparatus and manufacturing method mentioned above, about the to-be-plated wire 1a below two setting examples of this invention example and a comparative example. An experiment was conducted to verify the difference in the cleaning effect when the heat treatment step, the acid washing step and the water washing step were performed in this order.

Speed ratio size
(Vertical X side) mm Conversion
(φD)
Length
Ship speed
Transit time
Length
Effective length
Ship speed
Transit time
Length
Effective length
Ship speed
Transit time Mm Cm m / min sec Cm Cm m / min sec Cm Cm m / min sec
example
Honor

One
Evaluation
bracket
line 0.2 × 2.0
0.72
230
4
34.5
150
85
4
12.8
115
90
4
13.5 0.16 × 2.0 0.66 〃 〃 〃 〃 〃 〃 〃 〃 〃 〃 〃 0.2 × 1.0 0.52 〃 〃 〃 〃 〃 〃 〃 〃 〃 〃 〃
Comparative Example
5
Round-trip 0.76 〃 20 6.9 〃 〃 20 2.6 〃 〃 20 2.7 0.65 〃 〃 〃 〃 〃 〃 〃 〃 〃 〃 〃  0.53  〃   〃   〃  〃  〃   〃  〃  〃  〃   〃  〃

In the example of the present invention, the ship speed is set to one fifth of the comparative example. That is, as shown in Table 8, in the example of the present invention, by setting the ship speed to one fifth of the conventional example, the respective parts of the heat treatment furnace 22, the acid washing tank 31, and the ultrasonic water washing tank 41 Set the pass time to be 5 times.

In the comparative example, three types of rounded wires having a diameter of 0.76 mm, 0.65 mm, and 0.53 mm were used as the to-be-plated wire 1a. ) And a horizontal line having three sizes of 0.2 mm x 2.0 mm, 0.16 mm x 2.0 mm, and 0.2 mm x 1.0 mm.

In addition, in the washing | cleaning effect confirmation experiment, setting other than the shape of a to-be-plated wire 1a and a ship speed is made the same setting in the example of this invention and a comparative example.

Here, the washing | cleaning apparatus 10 used by this experiment is the heat processing furnace 22 which performs a heat processing process, the acid washing tank 31 in an acid washing process, and the ultrasonic water washing tank in a water washing process. It is the structure which arrange | positioned 41 in the tandem, and heat-processing furnace 22, the acid washing tank 31, and the ultrasonic water washing tank 41 are comprised by the dimension of each part shown in FIG.

10 schematically shows the washing apparatus used in the present experiment and its peripheral portion.

In the heat treatment furnace 22, steam is used as the cleaning agent, and in particular, a cleaning effect can be expected against contamination caused by oil. In the acid cleaning tank 31, an acid cleaning liquid is used as the cleaning agent, and a cleaning effect on oxides and the like can be expected. In the ultrasonic water cleaning tank 41, water is used as the cleaning agent, and in particular, the cleaning effect can be expected with respect to the acid liquid remaining on the surface of the plated wire 1a in the acid cleaning step.

In the heat treatment step, since the inside of the heat treatment furnace 22 is a vapor atmosphere, the heat treatment furnace 22 also functions as a steamer. For this reason, in the heat processing process, since the effect of heat-removing the deposit adhered to the surface of the to-be-plated wire 1a by heating can also be anticipated, the heat processing process is considered to be a part of washing | cleaning process, and is included in this experiment object.

Evaluation of the cleaning effect confirmation experiment was carried out in accordance with a predetermined criterion by visually seeing the surface state of the plated wire 1a after the water washing step and the surface state of the plating line 1b after the winding step in each of the Examples and Comparative Examples. By comparing and confirming.

As a result of the above-described conditions, first, as to the surface state of the plated wire 1a after the water washing step, in the setting of the flux of the present invention, unlike the setting of the flux of the comparative example, the surface of the plated wire 1a No deposits such as oils attached to a wide range such as traces or membranes, or dusts attached in discrete or spot form can be confirmed at all, and the surface of the plated wire 1a can be cleaned. I could confirm that there is.

Furthermore, finally, as a result of confirming the plating state of the surface of the plating wire 1b after the winding-up process according to a predetermined criterion by visual observation, the setting of the flux of the present invention differs from that of the setting of the flux of the comparative example, It was confirmed that the thickness of the plating was uniform in the longitudinal direction and the circumferential direction of the plating line without this being confirmed.

In this way, a sufficient washing effect can be obtained by setting the speed of the ship to 4 m / min, which is a fifth of the speed, compared to the speed of the comparative example. It is also conceivable to set the ship speed at a lower speed than 4 m / min in anticipation of obtaining an excellent cleaning effect.

However, the same experiment was attempted under the setting of the speed lower than 4m / min, but the effect was not obtained more than the cleaning effect at the speed setting of 4m / min. The lower the speed, the better the cleaning effect. It became clear that it was not.

In addition, when the line speed of the to-be-plated wire 1a is set to a speed lower than 4 m / min, the passage time which the to-be-wired wire 1a passes through each process becomes that long, and the fall of productivity is concerned. Therefore, from the viewpoint of the cleaning effect and the production efficiency in terms of the cleaning process, the ship speed was preferably set to about 4 m / min under the above-described experimental conditions.

(Cleaning effect confirmation experiment 2)

In the cleaning effect confirmation experiment 2, when the plated wire 1b was manufactured in accordance with the manufacturing apparatus 10 and the manufacturing method described above, the pickled wire 1a was pickled under two setting examples of the present invention and the comparative example, respectively. The experiment which verified the difference of the washing | cleaning effect at the time of performing a process and a water washing process was performed.

In the comparative example, the acid washing step and the water washing step are performed in this order without performing the heat treatment step. In the present invention, the heat treatment step is performed immediately before the acid washing step, followed by the acid washing step and the water washing step. This is a washing step performed in this order.

Evaluation of the cleaning effect confirmation experiment was carried out according to a predetermined standard based on visual observation of the surface state of the plated wire 1a after the water washing step and the surface state of the plated wire 1b after the winding step in each of the Examples and Comparative Examples. The comparison was confirmed.

As a result of checking the to-be-plated wire 1a after performing the washing | cleaning process under the setting of the comparative example, the oxide layer remained on the surface. Moreover, as a result of checking the plating state of the plating wire surface, it was confirmed that the surface of the plating wire 1b was rough.

On the other hand, as a result of confirming the to-be-plated wire after performing the washing | cleaning process under the setting of the example of this invention, contamination, such as an oil stain, was not recognized on the surface, and the oxide layer did not remain either. Furthermore, as a result of checking the plating state of the surface of the plating wire, it was confirmed that there was no irregularities on the surface and a uniform plating thickness was formed.

By performing the heat treatment step immediately before the acid washing step as described above, the acid washing effect can be significantly improved as compared with the case where the acid washing step is performed on the plated wire 1a at room temperature, and it is confirmed that an excellent acid washing effect is obtained. Could.

The manufacturing apparatus 10 of the solder plating wire and the manufacturing method of the solder plating wire mentioned above are not limited to the structure and manufacturing method mentioned above, It can comprise with various structures and a manufacturing method.

As another embodiment, the cooling water tank 23 provided between the heat processing furnace 22 and the acid washing tank 31 is not an essential structure, as shown in FIG. 9 (b), these heat treatment furnace 22 and the acid. It is not necessary to provide the cooling water tank 23 between the washing tanks 31.

In the case where the cooling water tank 23 is not provided, the plated wire 1a whose surface is heated by the heat treatment furnace 22 can be driven in the acid cleaning tank 31 with its surface temperature being high. The acid cleaning effect can be obtained more effectively.

Moreover, according to the manufacturing apparatus 10 of the solder plating wire mentioned above, and the manufacturing method of a solder plating wire, the winding by the winding means 71 is assisted by the transfer capstans 91 and 92 by carrying it upstream in the running direction, and winding up. The winding force applied to the plated line 1a by the means 71 can be distributed to the upstream side and the downstream side in the traveling direction with respect to the transfer capstans 91 and 92, and is wound by the winding means 71. The load on the to-be-plated wire 1a can be reduced.

Thereby, while the 0.2% yield value of the plating wire 1b can fully be reduced, elongation rate can be suppressed and the plating wire of desired quality can be obtained.

In addition, according to the above-described apparatus 10 for manufacturing a solder plating wire, the transfer capstans 91 and 92 are disposed at an upstream side in the traveling direction rather than the softening annealing path 51 to reduce the load bearing capacity in the softening annealing path 51. The previous plated wire 1a can be transported.

For this reason, for example, a load such as tension is not applied to the to-be-plated wire 1a which has been reduced in strength when assisting the plated wire 1a to be transferred by an actively rotating feed capstan. It is possible to reliably transport and secure the quality of the plating wire 1b.

In particular, as the second transfer capstan 92 is provided on the downstream side of the traveling direction than the cleaning means 30 and upstream from the softening annealing path 51, the softened annealing path 51 allows the plated line 1a to be plated. Immediately before lowering the load resistance, the plated wire 1a can be transported. As a result, it is possible to efficiently assist the traveling of the to-be-plated line 1a (plated line 1b) passing through the softening annealing path 51 without burdening the to-be-plated line 1a. .

Moreover, among the direction change rollers which switch the running direction of the plating wire 1b, the direction change roller 64 in the tank provided in the molten solder plating tank 62 is moved like the transfer capstan 91 and 92. The roller may be actively rotated by the motor drive, and may be configured as a feed capstan for feeding assistance of the plating wire 1b.

By setting the direction turning roller 64 in the tank as the transfer capstan, the direction turning roller 64 in the tank is plated when the running direction of the plating wire 1b is switched before and after passing through the molten solder plating bath 62. Since it actively rotates at a rotation speed approximately equal to the traveling speed of the line 1b, it is possible to assist the running of the plated line 1b while switching the traveling direction of the plated line 1b.

Therefore, as the plating line 1b comes into contact with the direction turning roller 64 in the tank, the plating line 1b can be smoothly discharged without a load applied to the plating line 1b due to the frictional resistance in the rotational direction. Can be.

In detail, when the plating line 1b changes its running direction, a load is applied in particular, so that the switching direction of the plating line 1b increases the 0.2% yield value of the plating line 1b. It becomes a factor. And when taking out the plating wire 1b in the state immersed in the molten solder plating liquid 63, it is necessary to change such a running direction in the molten solder plating tank 62. FIG.

For this reason, when the plating wire 1b changes direction while traveling while being immersed in the molten solder plating solution 63, the molten solder plating solution 63 receives viscous resistance, so that the load applied when the traveling direction is changed is applied. Furthermore, the amount of increase of the 0.2% yield strength becomes remarkable.

For this reason, as mentioned above, by setting the direction turning roller 64 in a tank as a feed capstan, even if it turns the direction of the plating line 1b in the state submerged in the molten solder plating liquid 63, it applies to the plating line 1b. The loss of load can be suppressed as much as possible, so that the plated wire 1b having a 0.2% yield value can be manufactured.

Next, as an effect confirmation experiment, the tension verification experiment which verifies the tension applied to the plating wire 1b just before winding-up is demonstrated.

(Tension verification experiment)

In the tension verification experiment, the tension applied to the plating line 1b while the plating line 1b reaches the winding means 71 (the winding means upstream side arrangement roller 73A) from the tank upper direction turning roller 65 The effect of the 0.2% proof strength value was verified according to the addition degree, ie, the extent to which the plating line 1b became loose.

Since it is difficult to quantify the addition degree of the tension applied to the plating line 1b until reaching the winding means upstream side arrangement roller 73A, the addition degree of the tension affects the application degree of the tension. This parameter is set by setting the number of the transfer capstans 91 and 92 and the rotation of the shaft inside the molten solder plating bath 62 (the direction turning roller 64 in the tank) to active rotation or manual rotation. Accordingly, 0.2% yield strength characteristics were verified.

In detail, as shown in Table 9, the degree of addition of the tension to the plating line 1b until reaching the winding-up-upstream arrangement roller 73A in four steps from the first tension setting to the fourth tension setting is shown. Set.

Tension setting 1st Second Third Fourth Number of transfer capstans One One 2 2 Directional rollers in the jaw
Driven rolling roller
Driven rotary roller
Driven rolling roller
Driven rotary roller

In the first tension setting, only one number of the first transfer capstans 91 is provided, and this is a setting in the case where the direction turning roller 64 in the tank is constituted by a driven rotary roller. In addition, a driven rotary roller is a free rotation free roller which rotates manually, without providing the motor etc. which drive a roller. In the first tension setting, the tension is the strongest of the four stages, and the plating wire 1b is in a taut state.

In the 2nd tension setting, only the 1st conveyance capstan 91 is set in the number of installation of the conveyance capstan, and it is the setting in the case where the direction turning roller 64 in a tank is comprised by the drive rotary roller.

In addition, a drive rotation roller is a roller which rotates actively by the drive of a motor. The second tension setting is such that the tension is slightly weaker with respect to the first tension setting.

In the third tension setting, the number of installation of the transfer capstan is set when the first transfer capstan 91 and the second transfer capstan 92 are two, and the direction turning roller 64 in the tank is configured by the driven rotating roller. It is slightly weak with respect to the second tension setting.

In the fourth tension setting, the number of installation of the transfer capstan is set when the first transfer capstan 91 and the second transfer capstan 92 are two, and the direction turning roller 64 in the tank is constituted by the driving rotary roller. Slightly weak with respect to the third tension setting, the weakest of the four stages, resulting in the loosest plating line 1b.

The load characteristics of the plated line 1b including the 0.2% yield strength characteristics of the plated line 1b and the like resulted in the results shown in Table 10 and FIG. 11 in the case of each setting of the fourth tension setting in the above-described first tension setting. .

Copper wire specifications Tensile Properties Tension setting Item unit 1st Second Third Fourth Flat line
(0.16 × 2.0 mm)
OFC
0.2%
MPa
54
53
52
51 Flat line
(0.2 x 1.0 mm)
OFC
0.2%
MPa
54
52
50
50

In addition, all to-be-plated wires 1a are OFC, and each of two types of flat wires of 0.16 mm x 2.0 mm and 0.2 mm x 1.0 mm sizes was implemented.

In the results of Table 10 and FIG. 4, in any case of the two kinds of to-be-plated wires 1a, the number of installation of the transfer capstan was more than one could set the 0.2% yield value lower. Thereby, the validity of two cases compared with the case where the installation number of the transfer capstan was one was confirmed.

In addition, when the number of installation of the transfer capstan is two, that is, in the case of the fourth tension setting and the third tension setting, when the plated wire 1a is a flat line having a size of 0.2 mm × 1.0 mm, FIG. 11 (b) As shown in Fig. 2, the 0.2% yield value became the same value regardless of whether the direction turning roller 64 in the tank was a driving rotary roller or a driven rotary roller. On the other hand, in all other settings, the case where the direction turning roller 64 in a tank was comprised by the drive rotary roller became 0.2 value with a low value of 0.2% compared with the case where it was comprised by the driven rotary roller.

Therefore, it becomes clear that the case in which the direction turning roller 64 in the tank is constituted by the drive rotating roller shows a tendency to decrease the 0.2% yield strength value compared with the case in which the direction turning roller 64 is constituted by the driven rotating roller. The effectiveness of constructing the drive rotating roller could be confirmed.

In particular, in the results of Table 10 and FIG. 11, during the fourth tension setting, that is, during the fourth tension setting, that is, in the fourth tension setting, that is, the plating line 1b is the winding means 71 (the winding means upstream arrangement roller 73A). It can be seen that the load on the plated line 1b can be reduced by winding the plated line 1b in the state where the wire is loosened most until it reaches)), and the 0.2% yield value is particularly reduced. there was.

Furthermore, the winding of the to-be-plated wire 1a (plating wire 1b) is made into at least any one of the structure which provided two feed capstans, and the structure which comprised the drive rotation roller 64 in the tank. The conveyance assisting can be made into the state which loosened the plating line 1b until the plating line 1b reaches the winding means 71 (73A of winding means upstream arrangement rollers), and is 0.2% yield strength. It was confirmed that the value was effective in obtaining the plated wire 1b of excellent quality in which the value was lowered to a predetermined value.

The manufacturing apparatus 10 of the solder plating wire and the manufacturing method of the solder plating wire mentioned above are not limited to the structure and manufacturing method mentioned above, It can comprise with various structures and a manufacturing method.

For example, the 1st conveyance capstan 91 and the 2nd conveyance capstan 92 are not limited to what is arrange | positioned at the arrangement position mentioned above, and may be arrange | positioned in any position in a travel direction. Moreover, the structure which provided only either one of the 1st conveyance capstan 91 and the 2nd conveyance capstan 92 may be sufficient as a conveyance capstan.

Specifically, for example, as shown in FIG. 12, the second transfer capstan 92 may be provided without being provided.

In addition, a plurality of transfer capstans other than the first transfer capstan 91 and the second transfer capstan 92 may be provided, and may be provided at appropriate places.

Further, as described above, the inner direction turning roller 64 is not limited to the one configured as the driving rotation roller to be actively rotated, and the tank upper direction turning roller 65 is also configured as the driving rotation roller to be active. It may be configured to rotate.

In addition, as described above, the apparatus 10 for manufacturing a solder plating wire arranges the winding means upstream side arrangement roller 73A on the winding means 71.

The tank upper direction turning roller 65 provided above the molten solder plating tank 62 is arrange | positioned at the position higher than the arrangement height of the winding-up | upstream arrangement roller 73A. It is characterized by the above-mentioned.

In other words, the manufacturing method of the solder plating wire mentioned above lowers the plating wire 1b which traveled to the winding-up means 71 side after the change of direction by the tank top side turning roller 65 lower than the tank top side turning roller 65. It winds first in the winding means 71 by the winding means upstream arrangement roller 73A arrange | positioned at the position. It is characterized by the above-mentioned.

By the manufacturing apparatus 10 and the manufacturing method of such an inverted solder plating line, the plating line 1b of the desired quality which fully reduced the 0.2% yield value can be obtained, and by obtaining such plating line 1b stably, Product yield can be improved and manufacturing efficiency can also be improved.

In addition, since the plated wire 1b of desired quality having a sufficiently low 0.2% yield value can be efficiently produced, mass production of the low yielding plated wire 1b which is very suitable as a lead wire for solar cells can be realized. .

In detail, for example, as shown in Fig. 16 (a), in the case of the conventional configuration in which the tank upper direction turning roller 65 and the winding means upstream side arrangement roller 73A are arranged at substantially the same height, Fig. 16. As in the enlarged view of the portion X in (a), the gravity g acting on the plated line 1b acts only in a direction substantially perpendicular to the traveling direction.

In addition, as shown in FIG. 16 (b), in the conventional case in which the tank upper side turning roller 65 is arranged in a position lower than the height of the winding-upstream arrangement roller 73A, the portion X in FIG. As shown in the enlarged view, in the gravity g acting on the plating line 1b, the component g2 in the direction opposite to the traveling direction of the plating line 1b acts on the plating line 1b.

In any of the cases described above, the plating wire 1b is subjected to a load by gravity g acting on the plating line 1b itself while the plating wire 1b is driven to the winding-upstream arrangement roller 73A. It becomes easy, and it becomes necessary to set large the gripping force on the winding tension regulator 72 side, and the problem that the load applied to the plating line 1b becomes that much larger also arises.

On the other hand, in the case of the relative height relationship which arrange | positioned the tank upper side turning roller 65 at the position higher than the arrangement height of the winding means upstream arrangement roller 73A, as shown in FIG. 13, the plating line 1b is fusion solder plating. After passing through the tank 62, the plated wire 1b turned by the tank upper direction turning roller 65 is inclined to descend as it proceeds to the downstream side in the travel direction while traveling to the winding means upstream side arrangement roller 73A. Can drive while losing.

By setting the plating line 1b in such a traveling mode, as shown in the enlarged view of the X portion in FIG. 13, the plating line 1b is placed between the bath upper side turning roller 65 and the winding means upstream side arrangement roller 73A. The running direction component g2 of the plating wire 1b can be acted as an auxiliary force which sends out the plating wire 1b toward the winding-up | upstream arrangement roller 73A among the gravity g which acts.

In this way, the gravity g acting on the plating line 1b itself is applied approximately evenly along the longitudinal direction of the plating line 1b, and the transfer aid is performed without a local load acting on the plating line 1b. The frictional resistance is applied to the plated wire 1b because it can act as a force to act, and furthermore, the material does not support the plated wire 1b while being physically in contact with the plated wire 1b, such as a roller or belt. There is no loss, and the plating wire 1b can be efficiently transported and assisted without applying a load.

In addition, the winding force on the winding tension regulator 72 side can be set small so that the plating wire 1b can be fed out by using the gravity g acting on the plating line 1b itself. You can do

Therefore, the plating wire 1b which reduced the 0.2% yield value in the softening annealing process can be taken over by the winding means upstream arrangement roller 73A, and the uniform plating thickness is ensured while maintaining the low 0.2% yield value. can do.

Therefore, the plating wire 1b of the desired quality which fully reduced the 0.2% yield strength value can be obtained.

And when winding the plating wire 1b which reduced the 0.2% yield value on the winding tension regulator 72 side, it can wind up without load to the plating wire 1b, and the plating wire 1b is cut off. It is possible to improve the product yield while improving the manufacturing efficiency.

In particular, it is preferable to arrange | position the tank upper side turning roller 65 in the position where the height with respect to the liquid level of the molten solder plating liquid 63 stored in the molten solder plating tank 62 will be about 3 m.

While the bath upper side turning roller 65 is disposed at a height that is about 3 m with respect to the liquid level of the molten solder plating solution 63, while the bath upper side turning roller 65 is reached from the molten solder plating bath 62, Since the plating wire 1b can be driven by a sufficient height of 3m, the molten solder plating solution 63 adhered to the surface of the plating wire 1b can be solidified (solidified) properly.

Therefore, when the plating line 1b changes direction by the tank top side turning roller 65, the plating line 1b contacts the tank top side turning roller 65, and it causes a change with respect to plating thickness. It is possible to secure a uniform plating thickness without.

On the other hand, when the arrangement height of the tank top direction turning roller 65 is arrange | positioned higher than 3 m, for example, the plating line 1b will drive the unnecessarily long distance on the tank top direction turn roller 65, and plating The burden by running the line 1b increases. In addition, the higher the arrangement height of the tank top direction turning roller 65 is, the more the angle between the traveling direction before the direction change of the plating line 1b and the traveling direction after the direction change becomes an acute angle shape. The load is applied to the plating wire 1b such that the length of the contact with the tank top side turning roller 65 becomes long, which is undesirable.

Therefore, setting the arrangement height of the tank top side turning roller 65 to about 3 m is preferable from the viewpoint of ensuring a uniform plating thickness on the plating line 1b and from the viewpoint of reducing the burden on the plating line 1b. Do.

In addition, the inside direction turning roller 64 is arrange | positioned inside the molten solder plating tank 62, The direction turning roller 64 in the inside direction turns the traveling direction of the plating line 1b to vertically upwards. It actively rotates so as to actively transfer the plating wire 1b to the downstream side.

The load applied to the plating line 1b rising toward the tank upper direction turning roller 65 after the direction change along the direction turning roller 64 in the tank by such an inner direction turning roller 64 is large width | variety Can be reduced, and an increase in the 0.2% yield value can be suppressed.

Next, the experiment of verifying the height of the roller placement height of the plating tank conducted as the effect confirmation experiment will be described.

(Experimental experiment of roller placement height above plating tank)

In this experiment, 0.2% yield strength of the plating line 1b after winding in the winding process is due to the difference in the arrangement height of the tank upper direction turning roller 65 provided vertically above the solder liquid level stored in the molten solder plating tank 62. An experiment was conducted to verify the influence of the value.

In detail, as shown in FIG. 14, arrangement of the tank-side turning roller 65 (hereinafter referred to as the “ceiling roller 65”) with respect to the liquid level of the molten solder plating solution 63 stored in the molten solder plating bath 62. In the case where the height is set to 3 m (h1) as an example of the present invention and when it is set to 1 m (h2) as a conventional example, in each case, with the 0.2% yield value of the plating wire 1b after winding in a winding process. The relationship was verified.

FIG. 14 is a schematic view showing a part of the apparatus used in this experiment, and the travel route indicated by the two-dot chain lines in FIG. 14 shows the travel route of the plating line 1b in the example of the present invention, and the dashed-dotted line in FIG. The travel route shown represents the travel route of the plating line 1b in the conventional example. In any of the examples of the present invention and the conventional example, the arrangement height of the winding-upstream-side arrangement roller 73A is set to 0.9 m (H) with respect to the solder liquid surface.

Under the experimental conditions shown in Table 11, the plating wire 1b was used using two kinds of flat wires, each of the cross-section A and the cross-section B, depending on the cross-sectional size. In addition, the flat dimensions (vertical x horizontal) of each cross section of cross section A and cross section B are 0.2 * 1.0 mm and 0.16 * 2 mm, respectively.

Experimental conditions
Plated wire (used copper wire) OFC, flat
Heat treatment temperature… 100 ℃
Softening annealing temperature ... 850 ℃
Solder temperature ... 250 ℃
Ship speed… 4 m / min (line speed of 20 µm plating target)
Winding tension… 1.5N

The results of this experiment are shown in Table 12 and FIG. 15.

Copper wire size
(Horizontal dimension)

Correspondence notation in Fig. 6 Height of ceiling roller 3 m
(Example of the present invention) 1m height of ceiling roller
(Conventional example) 0.2% strength value 0.2% yield value Before roller pass After roller pass After winding Before passing the roller After passing the roller After winding Mpa Mpa Mpa Mpa Mpa Mpa Section A
(0.2 × 1.0) ○ 36 38 45 38 42 50 Section B
(0.16 × 2.0) △ 39 39 44 39 39 47

Note that in the case where the flat dimension is the cross section A, in the conventional example in which the placement height of the ceiling roller 65 is 1 m, the 0.2% yield value increases from 38 MPa to 42 MPa before and after the passage of the ceiling roller 65, and winds up. After winding in the step, the 0.2% yield strength value further increased to 50 MPa.

On the other hand, in the case of the example of this invention whose arrangement height of the ceiling roller 65 is 3 m, the rise of a 0.2% proof strength value can be suppressed by the rise from 36 MPa to 38 MPa before and after the passage of the ceiling roller 65, and a winding process The increase in the 0.2% yield strength value after the winding was suppressed to 45 MPa. Therefore, when the flat dimension was the cross section A, it was confirmed that the increase in the 0.2% yield value could be significantly suppressed as compared with the case of the conventional example in which the arrangement height of the ceiling roller 65 was 1 m.

Subsequently, when the flat dimension is the cross-section B, in the conventional example in which the placement height of the ceiling roller 65 is 1 m, the 0.2% yield value did not change to 39 MPa before and after the passage of the ceiling roller 65, but in the winding step After winding, the 0.2% yield value rose to 47 MPa.

On the other hand, in the case of the example of the present invention in which the arrangement height of the ceiling roller 65 is 3 m, the 0.2% yield value values before and after the passage of the ceiling roller 65 did not change to 39 MPa but were the same values as in the conventional example, but the winding step The increase of the 0.2% yield strength value after winding at can be suppressed to 44 MPa. Therefore, even when the flat dimension is the cross-section B, it can be confirmed that the increase in the 0.2% yield strength value can be suppressed after the final winding compared with the conventional example in which the placement height of the ceiling roller 65 is 1 m.

In the case of the present invention example in which the placement height of the ceiling roller 65 is 3 m, the size of 0.2% yield strength is not increased as compared with the conventional example in which the placement height of the ceiling roller 65 is 1 m. It was confirmed that the lowering.

In addition, according to the manufacturing apparatus 10 and the manufacturing method of a solder plating line, in the plating means 61, the plating set in which the to-be-plated wire 1a is plated with thin plating, and the plating in the case of thin plating set-up In post-plating setting which becomes plating thickness thicker than thickness, it can carry out by setting of either.

At this time, the thin plated setting is set to perform plating on the plated line 1a when the speed at which the plated line 1a travels is a low speed traveling speed.

On the other hand, the post-plating setting is a setting for plating the to-be-plated line 1a when the speed at which the plated line 1a is traveling is a high speed traveling speed that becomes higher than the low-speed traveling speed, and the solder temperature and It is set as setting to apply plating to the to-be-plated wire 1a by the plating thickness determined based on the predetermined relationship of plating thickness.

At this time, the predetermined relationship between the solder temperature and the plating thickness is established only at a high traveling speed, and the plating thickness according to the solder temperature can be selected based on this relationship.

By the manufacturing apparatus 10 and the manufacturing method of the solder plating wire 1b mentioned above, the plating wire 1b of the desired quality which fully reduced the 0.2% yield value can be obtained, and this plating wire 1b is obtained stably. As a result, product yield can be improved and manufacturing efficiency can be improved.

And since the plating wire 1b of desired quality which fully reduced the 0.2% yield value can be manufactured efficiently, the mass production of the low-bearing plating wire 1b which is suitable as a lead wire for solar cells can also be realized. .

In more detail, for example, the winding speed of the plating wire 1b is adjusted by the winding means 71 or the transfer capstans 91 and 92, and the low speed travel of the plated wire 1a in the plating process is performed. It is possible to form a thick or thin plating thickness with respect to the to-be-plated wire 1a according to which speed | rate or speed of a high speed travels.

Specifically, when it is set at a low traveling speed, thin plating thickness is set, and a plating film having a thin plating thickness can be formed on the plated wire 1a. In the case of setting at a high traveling speed, post-plating thickness is set, and a plating film having a thick plating thickness can be formed on the plated wire 1a.

Thereby, it becomes possible to comprise the plating line 1b of any plating thickness set to post-plating setting or thin plating setting according to the use purpose and use of the plating line 1b.

In particular, when it is set at a high traveling speed, it has been found that the solder temperature and the plating thickness have a predetermined relationship. Therefore, by changing the solder temperature based on this relationship, the plating thickness can be made thicker or thinner even during post plating. It becomes possible to perform delicate thickness adjustment, such as back.

By the above, according to the setting of the ship speed and the solder temperature, the 0.2% yield value sufficiently decreases and the plating wire 1b having a desired plating thickness can be obtained uniformly. And since such high quality plating wire 1b can be obtained stably, product yield can be improved and manufacturing efficiency can be improved.

In addition, the low speed traveling speed is preferably set at about 4 m / min.

By setting the low speed traveling speed at about 4 m / min in this manner, for example, the plating wire 1b having a thin plating thickness of about 14.0 to 24.0 µm can be obtained.

On the other hand, it is preferable to set the high speed traveling speed at about 13 m / min.

Thus, by setting the high speed traveling speed to about 13 m / min, the plating line 1b of the thick plating thickness of about 28.5-67 micrometers can be formed, for example.

That is, since the degree of plating thickness can be greatly varied depending on which of the above-mentioned low speed travel speeds or high speed travel speeds is set, plating having a desired plating thickness corresponding to the use and specification of the plating wire 1b. Line 1b can be created.

Further, the plating thickness formed on the surface of the plated wire 1a can be thickened by performing the plating process under the post-plating setting at a high speed at the ship speed, but when the solder temperature in the plating process is high, thin plating There exists a tendency for the external appearance of the surface of the plating line 1b to become rough easily compared with the case of setting.

Therefore, by setting the solder temperature in the plating step to about 240 ° C., unevenness or the like does not occur in the plated film on the surface of the plated line 1b, and the plated line 1b having a smooth and uniform plating thickness can be obtained. have.

The following is a description of the low load capacity verification test according to the difference in the conditions of the solder process performed as an effect verification experiment.

(Low strength characteristic verification test according to the difference of solder process condition)

In this experiment, the relationship between the solder temperature, the plating thickness, and the tensile property in the case of the thin plating setting and the post plating setting was confirmed, and the effectiveness of the manufacturing method of the present embodiment was confirmed.

In each of the thin plating setting and the thickness plating setting, the solder temperature is set to three kinds of 240 ° C, 260 ° C, and 280 ° C, and the copper wires are all OFC, and the size is 0.2mm × 1.0mm, 0.16mm × 2.0mm, Three types of flat wires of 0.2 mm x 2.0 mm were used.

In the case of the thin plating setting, the plating process was performed at a low traveling speed at which the ship speed was set at a low speed of 4 m / min. On the other hand, in the case of post-plating setting, the plating process was performed at a high traveling speed at which the ship speed was set at a high speed of 13 m / min.

As a result of this experiment, Table 13 (a) and (b) show the relationship between the solder temperature, the plating thickness, and the tensile property under the conditions described above under the above-described setting.

Other conditions: Annealing temperature 100 ℃ Reduction furnace 850 ℃

※ Appearance roughness (small convex part occurs in flat plane part)

In addition, Table 13 (a) shows the relationship between the solder temperature under the thin plating setting, the plating thickness and the tensile properties, and Table 13 (b) shows the relationship between the solder temperature under the post plating setting, the plating thickness and the tensile properties. .

When the plating process is performed at a low speed traveling speed of 4m / min and the plating process is performed at a high speed running speed of 13m / min. The comparison was made.

As a result, it was ascertained that the plated film can be formed on the plated wire 1a so that the lower traveling speed becomes thinner than the high speed traveling speed.

Note that the result of the thin plating setting is not affected by the three types of flat size and temperature setting, and the plating thickness can be thinned as described above, and the 0.2% yield value compared with the case of the post plating setting. Could be lowered.

In addition, it was confirmed that the combination of the three types of flat sizes and the solder temperature did not cause the appearance of roughening on the surface of the plated film, and the high quality plated wire 1b could be obtained.

On the other hand, paying attention to the result in the case of the post-plating setting, the 0.2% yield value can be lowered to the values before and after 50 MPa without being influenced by the type of flat size and the setting of the temperature.

Regarding the plating thickness in the case of post-plating setting, for example, when the solder temperature is 280 ° C. in a flat line having a size of 0.2 mm × 1.0 mm, the plating thickness is 29.5 to 32.0 μm. On the other hand, when solder temperature is other than 240 degreeC, plating thickness became 31.5-38.0 micrometers.

And when the size is 0.16 mm x 2.0 mm flat wire, when solder temperature is 280 degreeC, plating thickness became 44.0-47.0 micrometers. On the other hand, when solder temperature was 240 degreeC, plating thickness became 47.5-73.5 micrometers.

From these results, especially in the case of post-plating setting, the lower plating temperature was found to be the relationship between the solder temperature and the plating thickness, which tend to be thicker.

Therefore, it was confirmed by the relationship between the solder temperature and the plating thickness that subtle adjustment of the plating thickness can be performed in accordance with the setting of the solder temperature even during post-plating setting.

For example, in a flat line having a size of 0.2 mm x 1.0 mm, when the plating thickness is to be set relatively thin even during post plating setting, the solder temperature may be set to 280 ° C. What is necessary is just to set a solder temperature to 240 degreeC, when it wants to set thick. What is necessary is just to set solder temperature to 260 degreeC, when setting it as thickness between these.

In addition, in a flat line having a size of, for example, 0.16 mm x 2.0 mm, when the solder temperature is set to 260 ° C or 280 ° C, the appearance of the surface of the plating line 1b becomes rough, thus avoiding such a situation. What is necessary is just to set solder temperature to 240 degreeC.

In this way, by setting the solder temperature based on the predetermined relationship between the solder temperature and the plating thickness, a high quality plating line 1b having a desired plating thickness and appearance can be obtained.

In addition, the manufacturing apparatus of a solder plating wire mentioned above and the manufacturing method of a solder plating line are not limited to the above-mentioned structure, It can comprise in various structures.

For example, in the manufacturing apparatus 10A in another embodiment, as shown in FIGS. 17A and 17B, the preheating furnace 51P is provided between the ultrasonic water cleaning tank 41 and the softening annealing furnace 51. ) Can be prepared.

As shown in Fig. 17B, the preheating furnace 51P is configured to specialize in rapidly raising the temperature of the plated line 1a even when the traveling time and the traveling distance of the plated line 1a are short. .

Specifically, the preheat furnace 51P includes a sheath tube 53L in the preheat furnace body 52P. The sheath tube 53L is a hollow tube formed in a straight line along the running direction of the plated line 1a. When the plated line 1a passes through the pre-heating furnace 51P and the softening annealing furnace 51, In order to prevent the plated wire 1a from contacting with air and oxidizing, the preheating furnace body 52P and the softened annealing furnace body 52 are arranged in communication with each other.

Similarly to the soft annealing furnace 51, the preheating furnace 51P is provided with a plurality of heaters 54P in the preheating furnace body 52P along the longitudinal direction of the sheath tube 53L. It is arrange | positioned at the pitch narrower than the arrangement | positioning interval of the heater 54 arrange | positioned in 51).

Accordingly, even when the wire speed is slowed and the plated wire 1a is driven, the plated wire 1a can be heated in the preheating furnace 51P as a preheating step immediately before the soft annealing step, and thus the bleeding in the heated state. The gold wire 1a can be supplied to the softening annealing furnace 51.

Therefore, in the softening annealing process, in response to the high speed of the wire speed of the plated wire 1a, the plated wire 1a can be reliably and sufficiently low withstand strength.

Therefore, according to the manufacturing apparatus 10A and the manufacturing method mentioned above, even if the plating wire 1b manufactured under either setting of the thick plating setting or the thin plating setting, it can be used as a lead wire of the solar cell which requires low withstand characteristic.

Further, in the portion between the softening annealing furnace 51 and the preheating furnace 51P in the first tube 53L, the reducing tube is applied to the portion corresponding to the preheating furnace 51P in the longitudinal direction. The pre-reduction gas supply part 57P to supply is comprised.

In the above-described reducing gas supply unit 57, a mixed gas of hydrogen and nitrogen is supplied as the reducing gas G to the sheath pipe 53L, and the internal space corresponding to the softening annealing furnace 51 of the sheath pipe 53L is mixed. Although it was set as the gas atmosphere, in the pre-reduction gas supply part 57P, nitrogen gas or steam gas (steam gas) is supplied as reducing gas G to the internal space corresponding to the pre-heating furnace 51P of the sheath pipe 53L, The internal space was made into nitrogen gas atmosphere or steam gas atmosphere.

As a result, the surface of the plated wire 1a can be prevented from being oxidized when passing through the pre-heating furnace 51P, while the pre-heating furnace 51P does not use hydrogen gas as the reducing gas G, but does not use nitrogen. By using gas or steam gas, it is safe and gas handling becomes easy.

In detail, attention is paid to the 0.2% yield values in Tables 13 (a) and (b) used in the low load-bearing characteristics confirmation test described above. Also, the result of having a high 0.2% yield value was high also in temperature.

For this reason, when the ship speed is set at a high traveling speed, the post-plating setting can be made in the plating process and the ship speed is increased. This is because the plating wire 1b passes through the softening annealing path 51 before the complete processing is performed, resulting in a situation in which the softening annealing cannot be sufficiently performed on the plated wire 1a.

In this case, even if a thick plating thickness can be formed on the surface of the plated wire 1a by performing the plating process with post-plating setting, since the ship speed is a high traveling speed, the 0.2% yield value is compared with that of the thin plating setting. High plating line 1b is created.

On the other hand, like the manufacturing apparatus 10A mentioned above, ie, as shown to FIG. 17 (a), (b), the pre heating furnace 51P is between the ultrasonic water washing tank 41 and the softening annealing furnace 51. FIG. By carrying out the structure provided with this, after a sufficient heating with respect to the to-be-plated wire 1a by the pre heating furnace 51P in a pre heating process, a softening annealing process can be performed.

Therefore, even when the plated wire 1a is driven at high speed, the plated wire 1a can be reliably reduced in the softening annealing step.

Accordingly, the plating line 1b having a low 0.2% yield value and having a thick plating thickness corresponding to the post plating setting can be obtained.

The preheating furnace 51P provided near the upstream side of the softening annealing furnace 51 increases the number of arrangements and the amount of electric power of the heater 54, and is safe to supply nitrogen gas or steam gas instead of hydrogen gas. It is a structure specialized in the heating performance of the to-be-plated wire 1a rather than the softening annealing furnace 51, for example, as a gas atmosphere which is easy to handle.

For this reason, even when the plated wire 1a is driven at high speed, it is necessary to take measures, for example, to make the softening annealing furnace 51 long as a means for securing the softening annealing time in the softening annealing furnace 51. The structure in which the preheating furnace 51P is provided immediately before the upstream side of the softening annealing furnace 51 does not increase the installation space or the cost compared with the configuration in which the softening annealing furnace 51 is lengthened.

Therefore, the speed of the ship can be increased by the addition of a simple configuration of the design change level utilizing existing equipment, and sufficient low load-bearing strength can be achieved even in the plating wire 1b manufactured under any setting of post-plating or thin plating. It can be used and can be used as a lead wire of a solar cell which requires low withstand characteristics.

The heat treatment furnace 22 is not limited to being installed between the supply 12 and the acid cleaning tank 31 in the traveling direction, and is provided at a different portion if it is upstream from the softening annealing furnace 51. You may be.

For example, as a manufacturing apparatus of another embodiment, without providing the heat treatment furnace 22 described above, only the preheat furnace 51P described above is provided, and as a reducing gas supplied into the preheat furnace 51P, steam gas. It is good also as a structure using.

With this configuration, in the pre-heating furnace 51P, as described above, in addition to the function of pre-heating just before the softening annealing furnace 51, both of the functions performed by the above-described heat treatment furnace 22 can be provided. have.

Therefore, not only the cost of equipment can be reduced, but also the travel distance of the plated wire 1a can be further shortened, and a high quality plated wire 1b having a low 0.2% yield value can be produced. .

In correspondence between the configuration of the present invention and the above-described embodiment, the copper wire corresponds to the plated wire 1a and the plating wire 1b of the present invention, and the heat treatment means corresponds to the heat treatment furnace 22 as follows. , The acid washing means corresponds to the acid washing tank 31, the water washing means corresponds to the ultrasonic water washing tank 41, the copper wire transport assist process corresponds to the plated wire transport assist process, and the copper wire transport assist means Corresponding to the first feed capstan 91, the second feed capstan 92, and the actively rotating in-direction turning roller 64, the fryer heating means corresponds to the fryer heating furnace 51P, and the present invention has been described above. Many embodiments can be obtained without being limited only to the configuration of the embodiments.

[Industrial Availability]

INDUSTRIAL APPLICABILITY The present invention can be used for a method and apparatus for manufacturing a solder plated wire having low withstand characteristics that are very suitable for use as a lead wire of a solar cell.

Claims (33)

Plating pretreatment means for performing plating pretreatment on copper wire,
Plating means for performing solder plating on the surface of the copper wire;
An apparatus for manufacturing a solder plated wire comprising a winding means for winding a copper wire coated with a surface,
The plating pretreatment means is provided with a softening annealing means for softening and annealing the copper wire to lower the strength.
The low-bearing copper wire is wound by the winding means with a winding force lower than that of the copper wire,
An apparatus for producing a solder plated wire in which the softening annealing means, the plating means and the winding means are arranged in this order from the upstream side in the traveling direction of the copper wire in this order. The method of claim 1, wherein the copper wire is formed of a pure copper-based material,
The softening annealing means is constituted by a softening annealing furnace, the inside of which is a reducing gas atmosphere for reducing an oxide layer on the surface of the copper wire,
The softening annealing path is disposed to be inclined so that the downstream side is lower than the upstream side in the copper moving direction,
An apparatus for producing a solder plating wire, comprising a reducing gas supply portion that allows supply of reducing gas to the softening annealing furnace in a downstream portion in the copper wire traveling direction in the softening annealing furnace. 3. The apparatus for producing a solder plated wire according to claim 2, wherein the reducing gas comprises a mixed gas of nitrogen gas and hydrogen gas. 4. The apparatus for producing a solder plated wire according to claim 3, wherein the volume ratio of said nitrogen gas and said hydrogen gas is set to 4: 1. The said plating preprocessing means is equipped with the heat processing means of any one of Claims 1-4 which heat-processes with respect to copper wire,
An apparatus for producing a solder plated wire, wherein said heat treatment means is arranged at an upstream side in the copper wire traveling direction than said softening annealing means. The method of claim 1, wherein the copper wire is formed of a pure copper-based material,
The plating pretreatment means is provided with cleaning means for cleaning the copper wire,
An apparatus for producing a solder plated wire, wherein said cleaning means is disposed at an upstream side in the copper wire traveling direction than said softening annealing means. The method of claim 6, wherein the plating pretreatment means,
It is provided with the heat processing means which heat-processes with respect to copper wire upstream in the copper wire traveling direction rather than the said softening annealing means,
An apparatus for producing a solder plated wire, wherein said heat treatment means is disposed at an upstream side in the copper wire traveling direction than said cleaning means. 8. The cleaning apparatus according to claim 7, wherein said washing means comprises an acid washing means and a water washing means,
An apparatus for producing a solder plating wire, wherein the heat treatment means, the acid washing means, the water washing means, and the softening annealing means are arranged in this order along the copper wire traveling direction as the plating pretreatment means. The copper wire according to claim 7 or 8, wherein a flat copper wire having a width in an orthogonal cross section orthogonal to the longitudinal direction is in the range of 0.8 to 10 mm, and has a thickness in the range of 0.05 to 0.5 mm. Set the traveling speed to about 4.0 m / min,
An apparatus for producing a solder plating wire, wherein the acid cleaning time in the acid cleaning means is set to 12.8 seconds and the water cleaning time in the water cleaning means is set to 13.5 seconds. The method of claim 1, wherein the copper wire is formed of a pure copper-based material,
An apparatus for producing a solder plated wire, comprising a copper wire conveyance assisting means for assisting the winding of the copper wire by the winding means, on the upstream side of the copper wire traveling direction than the winding means. 11. The apparatus for producing a solder plated wire according to claim 10, wherein the copper wire feed aid is disposed more upstream in the copper wire traveling direction than the softening annealing means. 12. The apparatus for producing a solder plated wire according to claim 10 or 11, wherein said copper wire conveyance assistance means is disposed on a downstream side of the copper line traveling direction than said cleaning means in the copper line traveling direction. The plating means according to any one of claims 10 to 12, wherein the plating means comprises a molten solder plating bath in which a molten solder plating solution is stored.
A turning roller for switching the running direction of the copper wire is provided inside the molten solder plating bath, and the molten solder plating bath is constituted by an in-row turning roller for switching the running direction of the copper wire before and after passing. ,
An apparatus for producing a solder plated wire comprising the direction turning roller in the bath as the copper wire transporting aid. The method of claim 1, wherein the copper wire is formed of a pure copper-based material,
The plating means is composed of a molten solder plating tank in which a molten solder plating solution is stored,
The direction change roller which switches the running direction of the copper wire,
It is comprised above the said molten solder plating tank, Comprising: It consists of the tank upper direction turning roller which switches the traveling direction of the copper wire after passing through the said molten solder plating tank to the said winding means side,
The fixing roller arranged upstream of the fixing roller which catches a copper wire in the said winding means is comprised by the winding means upstream arrangement roller which guides the copper wire after passing through the said tank upper direction turning roller to the downstream side from the said winding means, ,
An apparatus for producing a solder plated wire, wherein said bath-side turning roller is disposed at a position higher than a placement height of said winding-up-upstream arrangement roller. 15. The apparatus for producing a solder plating wire according to claim 14, wherein the tank upper direction change roller is disposed at a position at which the height of the molten solder plating liquid stored in the molten solder plating bath becomes about 3 m. 16. The method according to claim 14 or 15,
The plating means is composed of a molten solder plating tank in which a molten solder plating solution is stored,
The direction change roller which switches the running direction of a copper wire is comprised in the said molten solder plating tank, and consists of the direction turning roller in a tank which switches the running direction of a copper wire before and after passing the said molten solder plating tank,
An apparatus for producing a solder plated wire, wherein the direction turning roller in the tank comprises a copper wire transfer aid that assists winding of the copper wire by the winding means. The method of claim 1, wherein the copper wire is formed of a pure copper-based material,
In the plating means
It is performed by either setting among the thin plating settings which plate copper wire by thin plating, and the post-plating setting which becomes plating thickness thicker than the plating thickness in the case of thin plating settings,
The thin plated setting is set to set the speed at which the copper wire is driven to be plated on the copper wire at a low speed traveling speed,
At the same time, the thin plating is set to perform plating on the copper wire at a high speed at which the copper wire is driven at a higher speed than the low speed.
An apparatus for manufacturing a solder plated wire, characterized in that the plating is performed on copper wire at a plating thickness corresponding to the solder temperature based on a predetermined relationship between the solder temperature and the plating thickness at the high speed travel speed. 18. The apparatus according to claim 17, further comprising pre heating means for heating the copper wire immediately before passing the soft annealing means between the cleaning means and the soft annealing means.
In the post-plating setting,
And the plating means performs plating on the copper wire after passing through the pre-heating means and the softening annealing means. A plating pretreatment step of performing plating pretreatment on copper wire,
A plating process of performing solder plating on the surface of the copper wire,
As a manufacturing method of a solder plating wire manufactured by the winding process of winding the copper wire which plated on the surface,
In the plating pretreatment step, a softening annealing step of softening and annealing the copper wire is performed.
The winding process,
It is set as the process of winding up with the winding force lower than the strength of the said copper wire which became low-bearing strength,
The manufacturing method of the solder plating wire which performs the said softening annealing process and the said plating process continuously during the said winding process. 20. The method of claim 19, wherein the copper wire is formed of a pure copper material.
In the softening annealing step, a reducing gas for reducing an oxide layer on the surface of the copper wire is supplied to a softening annealing furnace inclined so that the downstream side is lower than the upstream side of the traveling direction from a reducing gas supply unit provided downstream of the traveling direction. and,
A method for producing a solder plated wire in which the inside of the softening annealing furnace is made into a reducing gas atmosphere so that the copper wire is driven through the softening annealing furnace. 21. The method of manufacturing a solder plating wire according to claim 20, wherein the reducing gas comprises a mixed gas of nitrogen gas and hydrogen gas. The manufacturing method of the solder plating wire of Claim 21 which set the volume ratio of the said nitrogen gas and the said hydrogen gas to 4: 1. The method according to any one of claims 19 to 22,
In the plating pretreatment step,
The manufacturing method of the solder plating wire which performs a heat processing process with respect to copper wire before the said softening annealing process. 20. The method of claim 19, wherein the copper wire is formed of a pure copper material.
The said plating pretreatment process WHEREIN: The manufacturing method of the solder plating wire which performs the washing | cleaning process which wash | cleans a copper wire before the said softening annealing process. The said plating pretreatment process is a heat treatment process of Claim 24 which heat-processes a copper wire before the said softening annealing process,
A method for producing a solder plated wire, wherein the heat treatment step is performed before the cleaning step. The method of claim 25, wherein the washing step comprises an acid washing step and a water washing step,
The said plating pretreatment process WHEREIN: The manufacturing method of the solder plating wire which performs the said heat processing process, the said acid washing process, the said water washing process, and the said softening annealing process in this order. 27. The copper wire according to claim 25 or 26, wherein the copper wire is a flat copper wire having a width in the orthogonal cross section orthogonal to the longitudinal direction in the range of 0.8 to 10 mm and having a thickness in the range of 0.05 to 0.5 mm. , Set the traveling speed of the copper wire to about 4.0m / min,
A method of manufacturing a solder plating wire in which an acid washing time in the acid washing step is set to about 12.8 seconds and a water washing time in a water washing step is set to about 13.5 seconds. 20. The method of claim 19, wherein the copper wire is formed of a pure copper material.
A method for producing a solder plated wire, which performs a copper wire transfer assistance step of assisting winding of a copper wire performed in the winding step while the winding step is performed. 20. The method of claim 19,
As said copper wire, using what was formed from the pure copper system material,
After the plating step, the upstream side of the molten solder plating bath is disposed on an upstream side of the winding means, and the winding means upstream side arrangement roller is configured to guide the copper wire after passing through the bath upstream direction change roller to the downstream side from the winding means. The manufacturing method of the solder plating wire which changes the running direction of the copper wire after passing through the said molten solder plating bath to the said winding means upstream arrangement roller side by the tank upper side direction turning roller arrange | positioned at the position higher than an arrangement height. 20. The method of claim 19, wherein the copper wire is formed of a pure copper material.
In the plating step, any one of a thin plating setting for plating copper wire with a thin plating and a post plating setting that becomes a plating thickness thicker than the plating thickness in the case of thin plating setting, is performed.
The thin plated setting is set to set the speed at which the copper wire travels to be plated on the copper wire under a low traveling speed,
The post-plating setting is a setting in which the speed at which the copper wire travels is set to perform plating at a high traveling speed which is faster than the low traveling speed,
A method for manufacturing a solder plated wire, characterized in that the plating is performed on copper wire at the plating thickness according to the solder temperature based on a predetermined relationship between the solder temperature and the plating thickness at the high speed travel speed. The method of claim 30, wherein the low speed traveling speed is set to about 4 m / min,
A method for producing a solder plated wire having a high traveling speed of about 13 m / min. The manufacturing method of the solder plating wire of Claim 30 or 31 which set the said solder temperature to about 240 degreeC at the said high speed traveling speed. 33. The method according to any one of claims 30 to 32, wherein when the plating step is performed at the post-plating setting,
A pre-heating step of heating the copper wire immediately before the soft-annealing step is performed between the washing step and the soft-annealing step,
The manufacturing method of the solder plating wire which performs the said plating process with respect to the copper wire which performed the said softening annealing process after the said pre-heating process.

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