JP2973350B2 - Manufacturing method of hot-dip wire - Google Patents
Manufacturing method of hot-dip wireInfo
- Publication number
- JP2973350B2 JP2973350B2 JP15536594A JP15536594A JP2973350B2 JP 2973350 B2 JP2973350 B2 JP 2973350B2 JP 15536594 A JP15536594 A JP 15536594A JP 15536594 A JP15536594 A JP 15536594A JP 2973350 B2 JP2973350 B2 JP 2973350B2
- Authority
- JP
- Japan
- Prior art keywords
- hot
- dip
- wire
- plating
- soft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/745—Apparatus for manufacturing wire connectors
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- H01L2224/43825—Plating, e.g. electroplating, electroless plating
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/45147—Copper (Cu) as principal constituent
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating With Molten Metal (AREA)
- Heat Treatment Of Strip Materials And Filament Materials (AREA)
- Wire Bonding (AREA)
- Metal Extraction Processes (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は溶融めっき線の製造方法
に関する。更に詳しくは電子部品のリード線材、或は電
子機器の配線材用導体として用いられる軟質錫或ははん
だめっき銅線の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a hot-dip wire. More particularly, the present invention relates to a method for producing a soft tin or solder plated copper wire used as a lead wire of an electronic component or a conductor for a wiring material of an electronic device.
【０００２】[0002]
【従来の技術】近時，部品技術の進歩に従って各種電子
部品が小型化してきている。そのため，従来より電子部
品のリード線材として用いられているめっき線，例えば
軟質錫めっき銅線や軟質はんだめっき銅線も細線化の傾
向にあり、一般に線径が０．３〜０．６ｍｍのものが主
として用いられている。これらのめっき線の錫或ははん
だめっき厚さは一般に３〜１２μｍである。また、電子
機器の配線材の導体として，撚線や編組線の状態で用い
られるめっき線は線径が０．１〜０．３ｍｍのものが殆
どで、その錫或ははんだめっき厚さは０．５〜２μｍで
ある。これらリード線材或は配線材用導体として用いら
れるめっき線は、めっき厚さに偏りがなく，均一なめっ
き厚さを有するものが求められていた。2. Description of the Related Art In recent years, various electronic components have been miniaturized with the progress of component technology. Therefore, plated wires conventionally used as lead wires for electronic components, such as soft tin-plated copper wires and soft solder-plated copper wires, also tend to be thinner, and generally have a wire diameter of 0.3 to 0.6 mm. Is mainly used. The tin or solder plating thickness of these plated wires is generally 3 to 12 μm. Also, most of the plated wires used as conductors of wiring materials of electronic devices in the form of stranded or braided wires have a wire diameter of 0.1 to 0.3 mm and a tin or solder plating thickness of 0 to 0.3 mm. 0.5 to 2 μm. There has been a demand for a plated wire used as a lead wire material or a conductor for a wiring material having a uniform plating thickness without unevenness in plating thickness.
【０００３】上記の用途に使用される，めっき厚さに偏
りがなく，均一なめっき厚さを得る方法としては，当社
の特許である特公昭６３−６０８２５号の溶融めっき方
法を採用している。この溶融めっき方法を用いて，例え
ば錫めっき銅線を製造する方法としては、銅母線を伸線
機によって最終線径まで伸線して硬質被めっき銅線とし
た後、還元性ガス雰囲気の加熱炉で焼鈍して軟質被めっ
き銅線とし、続いてこの被めっき銅線を溶融錫めっき浴
の中に浸漬した後、非酸化性ガス雰囲気中にあるめっき
浴表面から垂直上方向に走行させて溶融錫めっきを施し
た後、溶融めっき層を冷却固着させて軟質錫めっき銅線
とし、続いて巻枠に巻き取るという製造方法であった。As a method for obtaining a uniform plating thickness without unevenness in the plating thickness used in the above-mentioned applications, the hot-dip plating method of Japanese Patent Publication No. 63-60825, which is a patent of the Company, is adopted. . As a method of manufacturing a tin-plated copper wire using this hot-dip plating method, for example, a copper bus is drawn to a final wire diameter by a wire drawing machine to form a hard-plated copper wire, and then heated in a reducing gas atmosphere. After annealing in a furnace to form a soft-plated copper wire, and subsequently immersing this copper-plated wire in a hot-dip tin plating bath, the copper wire is moved vertically upward from the plating bath surface in a non-oxidizing gas atmosphere. After the hot-dip tin plating was applied, the hot-dip layer was cooled and fixed to form a soft tin-plated copper wire, and then wound around a bobbin.
【０００４】図４によって従来の製造方法を更に詳しく
説明する。まず母線貯留巻枠２から母線１ｆを引き出
し、伸線機８に導き、複数の中間ダイス９及び仕上げダ
イス９ａを通過させて最終線径の硬質被めっき線１ｇと
する。続いて該被めっき線１ｇを還元性ガス雰囲気から
なるトンネル式加熱炉３中を連続走行させ、該線１ｇの
焼鈍，軟質化及び表面清浄化を行い，軟質被めっき線１
ｈとする。続いて該被めっき線１ｈを間断なく溶融金属
めっき浴４中に導き、浸漬，走行させ、非酸化性ガス雰
囲気５中の溶融めっき浴表面６から垂直上方向に走行さ
せて溶融めっきを施し、連続して冷却域７を通過させて
溶融めっき層を固着させ軟質溶融めっき線１ｉとする。
続いてこのめっき線１ｉを巻枠１１に巻き取る。という
製造方法であった。A conventional manufacturing method will be described in more detail with reference to FIG. First, a bus 1f is drawn out from the bus storage reel 2, guided to a wire drawing machine 8, and passed through a plurality of intermediate dies 9 and finishing dies 9a to form a hard plated wire 1g having a final wire diameter. Subsequently, 1 g of the wire to be plated is continuously run in a tunnel type heating furnace 3 composed of a reducing gas atmosphere to anneal, soften, and clean the surface of the wire 1 g.
h. Subsequently, the wire to be plated 1h is guided into the molten metal plating bath 4 without interruption, immersed and run, and run vertically upward from the hot-dip bath surface 6 in the non-oxidizing gas atmosphere 5 to perform hot-dip plating. The hot-dip layer is fixed by passing through the cooling zone 7 continuously to form a soft hot-dip wire 1i.
Subsequently, the plating wire 1i is wound around a winding frame 11. It was a manufacturing method.
【０００５】[0005]
【発明が解決しようとする課題】従来の溶融めっき線の
製造方法に於いては、めっき厚さが非酸化性ガス雰囲気
５中の溶融めっき浴表面６から軟質被めっき線１ｈが垂
直上方向に走行するときの線速によって決まり、線径が
０．３〜０．６ｍｍのときに０．５〜１５μｍ程度のめ
っき厚さを得るためにはこの線速が数ｍ／ｍｉｎ〜数十
ｍ／ｍｉｎ程度である。従って生産性が低く，コストア
ップの原因となっていた。また従来の方法では溶融めっ
き工程での生産速度が遅いために数百ｍ／ｍｉｎ以上の
伸線加工速度を持つ伸線機の能力や加熱炉の能力を生か
せないという欠点があった。即ち伸線加工工程と溶融め
っき工程の持つ製造能力（線速）を比較すると、伸線機
自体の能力は、溶融めっき厚さに影響される溶融めっき
速度の１０倍前後或はそれ以上であり、上記した従来技
術のように，母線を伸線加工した後に溶融めっき処理す
る場合は、生産速度は溶融めっき処理の線速に支配され
てしまい、それ以上の生産の効率化ができなかった。In the conventional method of manufacturing a hot-dip coated wire, the soft-plated wire 1h extends vertically from the hot-dip bath surface 6 in a non-oxidizing gas atmosphere 5 in a vertically upward direction. It is determined by the linear velocity when traveling, and in order to obtain a plating thickness of about 0.5 to 15 μm when the wire diameter is 0.3 to 0.6 mm, the linear velocity is several m / min to several tens m / m. min. Therefore, the productivity is low and the cost is increased. Further, the conventional method has a drawback that the production speed in the hot-dip plating process is low, so that the capability of a wire drawing machine having a wire drawing speed of several hundred m / min or more and the capability of a heating furnace cannot be utilized. That is, comparing the production capacity (linear speed) of the wire drawing process and the hot-dip plating process, the capacity of the wire drawing machine itself is about 10 times or more than the hot-dip speed which is affected by the hot-dip thickness. However, when the hot-dip treatment is performed after the bus bar is drawn as in the prior art described above, the production speed is governed by the linear speed of the hot-dip treatment, and the production efficiency cannot be further improved.
【０００６】そのため、前記の製造方法の一部を変更し
て生産の効率化を図った方法も用いられている。この方
法について図示はしないが、まず母線を伸線機によって
伸線加工して最終線径の硬質被めっき線としたものを複
数の巻枠に一旦貯留しておく。そしてそれぞれの貯留巻
枠から並行して硬質被めっき線を走行させ、前記したよ
うに加熱炉，溶融めっき浴等を走行させ、溶融めっき線
を製造する方法である。すなわち母線から溶融めっき線
までを２段階で製造する方法で、多数本の同時溶融めっ
き処理により生産性を確保する方法である。しかしなが
らこの方法は２段階で製造しているので、めっき線の品
質にも影響し、長尺の製品が得られにくく、また歩留り
もあまり良くなかった。For this reason, a method has been used in which a part of the above-mentioned manufacturing method is changed to improve the efficiency of production. Although this method is not shown, first, a bus bar is drawn by a wire drawing machine to form a hard plated wire having a final wire diameter and temporarily stored in a plurality of winding frames. Then, a hard-plated wire is run in parallel from each of the storage reels, and a heating furnace, a hot-dip plating bath and the like are run as described above to manufacture a hot-dip wire. In other words, this is a method for manufacturing from the bus bar to the hot-dip wire in two stages, and is a method for securing productivity by simultaneous hot-dip coating of many wires. However, since this method is manufactured in two steps, the quality of the plated wire is affected, and it is difficult to obtain a long product, and the yield is not so good.
【０００７】本発明は上記従来技術が有する各種問題点
を解決するために為されたものであり、従来の伸線加工
工程と溶融めっき工程に於ける工程能力の大きな差に起
因する生産効率の悪さの改善を図り，めっき厚さの偏り
がなく、均一なめっき層を有する溶融めっき線が効率良
く得られる溶融めっき線の製造方法を提供することを目
的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned various problems of the prior art, and has a high production efficiency due to a large difference between the conventional wire drawing process and the hot-dip plating process. It is an object of the present invention to provide a method of manufacturing a hot-dip wire in which a hot-dip wire having a uniform plating layer can be efficiently obtained without any deviation in plating thickness while improving the badness.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に本発明は、硬質被めっき母線を貯留巻枠から繰り出
し、非酸化性或は還元性ガス雰囲気からなる加熱炉中を
走行させ、該母線を焼鈍，軟質化させると共に表面清浄
化を行い軟質被めっき母線とする焼鈍，清浄化工程；
と、引き続いて前記軟質被めっき母線を溶融金属めっき
浴中に導き、非酸化性ガス雰囲気中にある溶融めっき浴
表面から垂直上方向に走行させて溶融めっきを施し、続
いて冷却域を通過させ，溶融めっき層を固着して軟質溶
融めっき母線とする溶融めっき工程；と、引き続いて前
記溶融めっき母線を伸線機を通過させて伸線加工し、伸
線仕上がり径に於けるめっき厚さが偏りのない０．５μ
ｍ以上１５μｍ以下の範囲内の均一溶融めっき層を有す
る硬質溶融めっき線とする伸線加工工程；と、更に引き
続いて前記硬質溶融めっき線を電流焼鈍装置を通過させ
て通電加熱し、軟質溶融めっき線とする通電加熱工程；
とからなる溶融めっき線の製造方法であって、前記溶融
金属めっき浴を走行する軟質被めっき母線の線速度と伸
線機の仕上げダイスの孔径及び最終仕上がり線速によっ
て、仕上がり軟質溶融めっき線の規定めっき厚さを得る
溶融めっき線の製造方法にある。In order to achieve the above-mentioned object, the present invention provides a method in which a hard-plated bus bar is unwound from a storage reel and is run in a heating furnace comprising a non-oxidizing or reducing gas atmosphere. Annealing and softening the bus bar, annealing and softening the surface and cleaning the surface to form a soft plated bus bar;
And, subsequently, the soft plating target bus is guided into the hot-dip metal plating bath, hot-dip from the hot-dip plating bath surface in a non-oxidizing gas atmosphere and vertically hot-dip to apply hot-dip plating, and then pass through the cooling zone. A hot-dip plating step in which the hot-dip coating layer is fixed to form a soft hot-dip plating bus; and subsequently, the hot-dip plating bus is passed through a wire drawing machine to be drawn, and the plating thickness at a finished diameter of the drawn wire is reduced. 0.5μ without bias
a wire drawing process for forming a hard hot-dip wire having a uniform hot-dip coating layer in the range of not less than m and 15 μm or less; Heating process to make wire;
A method for producing a hot-dip wire comprising:
Linear velocity and elongation of soft plating bus bar running in metal plating bath
It depends on the hole diameter of the finishing die of the wire machine and the final finishing line speed.
To obtain the specified plating thickness of the finished soft hot-dip wire
The method is for producing a hot-dip wire .
【０００９】また本発明は、前記硬質被めっき母線が、
溶融めっき金属の溶融点温度よりも高い溶融点を有し、
かつ溶融めっき金属の溶融点温度よりも低温で焼鈍され
軟質化する溶融めっき線の製造方法にある。また前記硬
質被めっき母線が、１８０〜２００℃の加熱温度で焼鈍
され軟質化する，含有不純物としての砒素及びアンチモ
ンを極力取り去った純度が99.996％以上の銅線である溶
融めっき線の製造方法にある。また前記溶融めっき金属
が溶融錫或ははんだである溶融めっき線の製造方法にあ
る。また前記通電加熱工程に於いて、硬質溶融めっき線
のめっき層が再溶融しない範囲の条件で硬質溶融めっき
線に通電する溶融めっき線の製造方法にある。 Further, the present invention provides the above-mentioned hard-plated bus bar,
Having a melting point higher than the melting point temperature of the hot-dip plated metal,
The present invention also provides a method for producing a hot-dip wire which is annealed and softened at a temperature lower than the melting point of the hot-dip metal. Further, the present invention relates to a method for producing a hot-dip coated wire, which is a copper wire having a purity of 99.996% or more, in which the hard-plated bus bar is annealed at a heating temperature of 180 to 200 ° C. and softened, and arsenic and antimony as impurities are removed as much as possible. is there. The present invention also provides a method for producing a hot-dip wire in which the hot-dip metal is hot-dip tin or solder. Also, the present invention is a method for producing a hot-dip wire in which the hot-dip wire is energized under the condition that the plating layer of the hot-dip wire is not re-melted in the heating step .
【００１０】本発明の溶融めっき線の製造方法について
図１，２を用いて更に詳しく説明する。図１は溶融めっ
き線の製造方法を示す略図，また図２は溶融めっき線の
製造方法を示す工程図である。この図１に於いて、１は
軟質溶融めっき線，１ａは硬質被めっき母線，１ｂは軟
質被めっき母線，１ｃは軟質溶融めっき母線，１ｄは硬
質溶融めっき線，２は貯留巻枠，３は非酸化性或は還元
性ガス雰囲気トンネル式加熱炉，４は溶融めっき浴，５
は非酸化性ガス雰囲気，６は溶融めっき浴表面，７は冷
却域，８は伸線機，９は中間ダイス，９ａは仕上げダイ
ス，１０は電流焼鈍装置、また１１は巻枠である。The method for manufacturing a hot-dip wire according to the present invention will be described in more detail with reference to FIGS. FIG. 1 is a schematic view showing a method for manufacturing a hot-dip wire, and FIG. 2 is a process diagram showing a method for manufacturing a hot-dip wire. In FIG. 1, 1 is a soft hot-dip wire, 1a is a hard-plated bus, 1b is a soft-plated bus, 1c is a soft hot-dip bus, 1d is a hard hot-dip wire, 2 is a storage reel, and 3 is a storage reel. Non-oxidizing or reducing gas atmosphere tunnel heating furnace, 4 is hot-dip bath, 5
Is a non-oxidizing gas atmosphere, 6 is a hot-dip bath surface, 7 is a cooling zone, 8 is a wire drawing machine, 9 is an intermediate die, 9a is a finishing die, 10 is a current annealing device, and 11 is a bobbin.
【００１１】まず、焼鈍，清浄化工程として、硬質被め
っき母線１ａを貯留巻枠２から引き出し、非酸化性或は
還元性ガス雰囲気からなるトンネル式加熱炉３に導き，
被めっき母線１ａを焼鈍し軟化すると共に表面清浄化処
理を行い軟質被めっき母線１ｂとする。次いで溶融めっ
き工程として、前記焼鈍，清浄化工程に引き続き，間断
なく直ちに前記軟質被めっき母線１ｂを溶融めっき浴４
中に浸漬し走行させ、引き続き，非酸化性ガス雰囲気５
中の溶融めっき浴表面６から垂直上方向に引き出し，溶
融めっきを施した後、冷却域７を通過させて溶融めっき
層を固着せしめ軟質溶融めっき母線１ｃとする。次いで
めっき線伸線加工工程として、前記軟質溶融めっき母線
１ｃを伸線機８に導き、中間ダイス９及び仕上げダイス
９ａによって所定の仕上げ線径とめっき厚さの硬質溶融
めっき線１ｄとする。引き続いて焼鈍工程として、電流
焼鈍装置１０を通過させて通電加熱し軟質溶融めっき線
１とし、続いて該溶融めっき線１を巻枠１１に巻き取る
方法である。First, as an annealing and cleaning step, a hard-plated busbar 1a is pulled out of the storage reel 2 and led to a tunnel heating furnace 3 made of a non-oxidizing or reducing gas atmosphere.
The bus bar 1a to be plated is annealed and softened, and the surface is cleaned to obtain a soft bus bar 1b. Then, as a hot-dip plating step, immediately after the annealing and the cleaning steps, the soft-plated busbar 1b is immediately put into the hot-dip bath 4 without interruption.
Immersed in the air and allowed to run.
After being drawn vertically upward from the hot-dip bath surface 6 and subjected to hot-dip plating, the hot-dip layer is fixed by passing through the cooling zone 7 to form a soft hot-dip plating bus 1c. Next, as a plating wire drawing process, the soft hot-dip plating bus 1c is guided to a wire drawing machine 8 and is turned into a hard hot-dip wire 1d having a predetermined finished wire diameter and plating thickness by an intermediate die 9 and a finished die 9a. Subsequently, as an annealing step, a method of passing through a current annealing apparatus 10 and heating it to form a soft hot-dip wire 1, and then winding the hot-dip wire 1 around a bobbin 11.
【００１２】なお所定の線径におけるめっき厚さを、偏
りのない０．５μｍ以上から１５μｍ以下に限定した理
由は、電子部品のリード線材，或は電子機器の配線用導
体として使用される溶融めっき線は線径に係わらず，実
用上このめっき厚の範囲内にあるからである。なお、リ
ード線材として使用する場合は、耐熱，耐湿性，はんだ
付け性の要求から３〜１５μｍが必要とされており、一
方電子配線材の導体としては０．５〜２μｍが要求され
ている。The reason why the plating thickness at a predetermined wire diameter is limited to 0.5 μm or more and 15 μm or less without deviation is that a hot-dip plating used as a lead wire material of an electronic component or a wiring conductor of an electronic device is used. This is because the wire is practically within the range of the plating thickness regardless of the wire diameter. When used as a lead wire, heat resistance, moisture resistance and solderability require a thickness of 3 to 15 μm, while a conductor of an electronic wiring material requires a thickness of 0.5 to 2 μm.
【００１３】[0013]
【作用】本発明の溶融めっき線の製造方法によれば、ま
ず軟質被めっき母線１ｂへのめっき厚さは該母線１ｂが
非酸化性ガス雰囲気５の溶融めっき浴表面６から垂直上
方向に走行する速度によって決定する。また所定の仕上
がり線径でのめっき厚さは伸線機８の仕上げダイス９ａ
の孔径によって決まる。従って所定の仕上がり線径で所
定のめっき厚さを得るためには、仕上がりめっき線１の
巻取り速度を調節することにより軟質被めっき母線１ｂ
へのめっき速度を変え、該母線１ｂに対するめっき厚さ
を調節するものである。According to the method of manufacturing a hot-dip wire of the present invention, first, the plating thickness of the soft-plated bus bar 1b is such that the bus bar 1b runs vertically upward from the hot-dip bath surface 6 in the non-oxidizing gas atmosphere 5. Determined by speed. The plating thickness at a predetermined finished wire diameter is determined by the finishing dies 9a of the wire drawing machine 8.
Is determined by the hole diameter of Therefore, in order to obtain a predetermined plating thickness with a predetermined finished wire diameter, the winding speed of the finished plated wire 1 is adjusted to adjust the soft plated busbar 1b.
The plating speed on the bus bar 1b is adjusted by changing the plating speed.
【００１４】本発明の製造方法によれば、溶融めっき金
属の溶融点温度よりも高い溶融点を有し、かつ溶融めっ
き金属の溶融点温度より低温で焼鈍し軟質化する母線材
を用いているので、該母線材を非酸化性ガス雰囲気中の
溶融金属めっき浴表面から垂直上方向に引き上げ、めっ
きされた溶融金属を固着した後、軟質溶融めっき母線を
伸線加工し、更にめっき層が再溶融しない温度範囲の通
電加熱によって軟質溶融めっき線が得られる。従って、
従来仕上がり線径の軟質被めっき線に溶融めっきを施し
て軟質溶融めっき線を得ていた方法と比較して、はるか
に速い，伸線機の伸線速度能力で生産することができる
ようになった。なお本発明に於いても従来と同じ溶融金
属めっき浴と伸線機を用いているが、工程の順序を逆に
することにより、それぞれの能力の高い方でバランスが
とれるようにし生産性をアップさせているものである。According to the production method of the present invention, a base wire having a melting point higher than the melting point temperature of the hot-dip metal and being annealed and softened at a lower temperature than the melting point temperature of the hot-dip metal is used. Therefore, the bus bar is lifted vertically upward from the surface of the molten metal plating bath in a non-oxidizing gas atmosphere, and the plated molten metal is fixed. A soft hot-dip wire can be obtained by applying current in a temperature range that does not melt. Therefore,
Compared to the conventional method of hot-dip coating by applying hot-dip to soft-coated wire with finished wire diameter, it is now possible to produce with much faster wire drawing speed capability of wire drawing machine. Was. In the present invention, the same hot-dip metal plating bath and wire drawing machine as in the past are used, but by reversing the order of the steps, the higher capacity of each can be balanced to increase the productivity. It is what is being done.
【００１５】[0015]
【実施例】本発明の溶融めっき線の製造方法について実
施例を挙げて詳細に説明する。なお本発明は本実施例に
限定されるものではない。 実施例１ 実施例１について図１〜３を用いて説明する。図３は本
発明に用いる特定の特性と組成を有する硬質被めっき銅
母線１．２ｍｍφの加熱温度と伸びの関係を示すグラフ
図である。まず焼鈍，清浄化工程として、第３図に示し
た１８０〜２００℃の加熱温度で完全焼鈍した場合に軟
質化し、伸び特性値が４０％を示す，純度99.996％の銅
からなる１．２ｍｍφの硬質被めっき銅母線１ａを貯留
巻枠２から繰り出し、炉内温度が４５０℃の（３％Ｈ2-
９７％Ｎ2)ガス雰囲気からなるトンネル式加熱炉３中を
２４．５ｍ／ｍｉｎの速度で通過させ硬質銅母線１ａを
焼鈍すると同時に該線１ａの表面の清浄化を行い軟質被
めっき銅母線１ｂとする。EXAMPLES The method for manufacturing a hot-dip wire according to the present invention will be described in detail with reference to examples. Note that the present invention is not limited to the present embodiment. Embodiment 1 Embodiment 1 will be described with reference to FIGS. FIG. 3 is a graph showing the relationship between the heating temperature and the elongation of the hard-plated copper bus bar 1.2 mmφ having the specific characteristics and composition used in the present invention. First, as an annealing and cleaning step, when the sample is completely annealed at a heating temperature of 180 to 200 ° C. shown in FIG. 3, it becomes soft and has an elongation characteristic value of 40%. The hard-plated copper bus 1a is unwound from the storage reel 2 and the furnace temperature is 450 ° C. (3% H 2 −
The hard copper bus 1a is passed through a tunnel type heating furnace 3 consisting of a 97% N 2 ) gas atmosphere at a speed of 24.5 m / min to anneal the hard copper bus 1a, and at the same time, clean the surface of the wire 1a to perform soft plating copper bus 1b. And
【００１６】続いて溶融めっき工程として、前記軟質銅
母線１ｂを間断なく２６０℃の溶融錫めっき浴４中に導
き、該めっき浴４中を走行させてから３％Ｈ2-９７％Ｎ
2 ガス雰囲気５中にある溶融錫めっき浴表面６から垂直
上方向に引き出し，３ｍ長の空中冷却域７で溶融めっき
層を凝固させ軟質溶融錫めっき銅母線１ｃとする。この
時の錫めっき層は偏りがなく、均一な１０μｍのめっき
厚さであり、錫めっき銅母線１ｃの外径は１．２２ｍｍ
であった。Subsequently, as a hot-dip plating step, the soft copper bus 1b is led into the hot-dip tin plating bath 4 at 260 ° C. without interruption, and after running in the bath 4, 3% H 2 -97% N
(2 ) The molten hot-dip plating layer is drawn vertically upward from the hot-dip-tin bath surface 6 in the gas atmosphere 5, and the hot-dip coating layer is solidified in an air cooling zone 7 having a length of 3 m to form a soft hot-dip tinned copper bus 1c. At this time, the tin plating layer has no unevenness, has a uniform plating thickness of 10 μm, and the outer diameter of the tin-plated copper bus 1c is 1.22 mm.
Met.
【００１７】続いて伸線加工工程として、前記工程と連
続して前記錫めっき銅母線１ｃを伸線機８に導き，１ダ
イスの断面縮小率が１８％で中間ダイス９及び仕上げダ
イス９ａの計２０枚のダイスにより1800ｍ／ｍｉｎの速
度で伸線加工し、線径が０．１４ｍｍで錫めっき層が偏
りのない１μｍ厚さの硬質溶融錫めっき銅線１ｄとす
る。Subsequently, as a wire drawing process, the tin-plated copper bus 1c is guided to a wire drawing machine 8 continuously with the above-mentioned process, and the cross-sectional reduction rate of one die is 18%, and the intermediate die 9 and the finish die 9a are counted. Wire drawing is performed at a speed of 1800 m / min by using 20 dies to obtain a hard-dipped tin-plated copper wire 1d having a wire diameter of 0.14 mm and a thickness of 1 μm with a uniform tin plating layer.
【００１８】続いて通電加熱工程として、前記の工程に
引き続いて電流焼鈍装置１０に導き，前記伸線速度と同
じ線速で電圧２８Ｖ，電流１５Ａの条件で通電加熱を施
し、線径が０．１４ｍｍの軟質溶融錫めっき銅線１を製
造し、巻枠１１に巻き取った。Subsequently, as an electric heating step, following the above-mentioned step, the electric heating apparatus is led to a current annealing apparatus 10 and subjected to electric heating at the same drawing speed as the drawing speed at a voltage of 28 V and a current of 15 A. A 14 mm soft molten tin-plated copper wire 1 was manufactured and wound on a bobbin 11.
【００１９】上記実施例１により得られた０．１４ｍｍ
φ軟質錫めっき銅線の特性として、伸び特性値は，通常
電子機器の配線材として用いられている軟質錫めっき銅
線と同じ程度の２０％を示し、錫めっき層は偏りのない
１μｍ厚さで、また線の表面は平滑で光沢性に優れてい
た。従って，電子機器配線材用導体として、従来方法に
劣らない高品質の軟質錫めっき銅線を高い生産性のもと
に得ることが出来た。0.14 mm obtained in Example 1 above
As a characteristic of φ soft tin-plated copper wire, the elongation characteristic value shows 20% which is about the same as that of soft tin-plated copper wire which is usually used as a wiring material of electronic equipment, and the tin-plated layer has a uniform thickness of 1 μm. The surface of the line was smooth and excellent in gloss. Therefore, a high-quality soft tin-plated copper wire of the same quality as that of the conventional method can be obtained as a conductor for wiring members of electronic equipment with high productivity.
【００２０】実施例２ まず焼鈍，清浄化工程として、実施例１と同じ伸び特性
及び純度を示す２．６ｍｍφの硬質被めっき銅母線１ａ
を貯留巻枠２から繰り出し、実施例１と同じ条件のトン
ネル式加熱炉３中を３０ｍ／ｍｉｎの速度で通過させ、
線の焼鈍，清浄化を行い軟質被めっき銅母線１ｂとす
る。続いて溶融めっき工程として、前記実施例１と同じ
装置を用い，同条件で溶融錫めっきを施し軟質溶融錫め
っき銅母線１ｃとする。この時の錫めっき層は偏りがな
く、均一な２６μｍのめっき厚さであり、錫めっき銅母
線１ｃの外径は 2.652ｍｍであった。Example 2 First, as an annealing and cleaning step, a hard-plated copper bus bar 1a of 2.6 mmφ having the same elongation characteristics and purity as in Example 1 was used.
Is fed from the storage reel 2 and passed through the tunnel heating furnace 3 under the same conditions as in Example 1 at a speed of 30 m / min.
The wire is annealed and cleaned to obtain a soft plated copper bus 1b. Subsequently, in the hot-dip plating step, using the same apparatus as in the first embodiment, hot-dip tin plating is performed under the same conditions to obtain a soft hot-dip tinned copper bus 1c. The tin-plated layer at this time was not uneven, had a uniform plating thickness of 26 μm, and the outer diameter of the tin-plated copper bus 1c was 2.652 mm.
【００２１】続いて伸線加工工程として、前記実施例１
と同様に, 伸線機８に導き，１ダイスの断面縮小率が１
８％で中間ダイス９及び仕上げダイス９ａの計１８枚の
ダイスにより800 ｍ／ｍｉｎの速度で伸線加工し、線径
が0.50ｍｍで錫めっき層が偏りのない５μｍ厚さの硬質
溶融錫めっき銅線１ｄとする。続いて通電加熱工程とし
て、前記の工程に引き続いて実施例１と同じ電流焼鈍装
置１０に導き，前記伸線速度と同じ線速で電圧３８Ｖ，
電流２５Ａの条件で通電加熱を施し、線径が0.50ｍｍの
軟質溶融錫めっき銅線１を製造し、巻枠１１に巻き取っ
た。Subsequently, in the wire drawing process, the first embodiment was used.
In the same manner as described above, the wire is guided to the wire drawing machine 8 and the cross-sectional reduction rate of one die is 1
8% of the intermediate die 9 and the finishing die 9a are drawn at a speed of 800 m / min with a total of 18 dies. The wire diameter is 0.50 mm and the tin plating layer is not uneven. The copper wire is 1d. Subsequently, as an energization heating step, following the above-described step, the same current annealing apparatus 10 as in Example 1 was introduced, and a voltage of 38 V was applied at the same linear speed as the drawing speed.
Electric current heating was performed under the condition of a current of 25 A to produce a soft molten tin-plated copper wire 1 having a wire diameter of 0.50 mm, which was wound around a reel 11.
【００２２】上記実施例２により得られた0.50ｍｍφ軟
質錫めっき銅線の特性として、伸び特性値は通常電子部
品のリード線材として用いられている軟質錫めっき銅線
と同じ程度の２５％を示し、錫めっき層は偏りがなく、
均一な５μｍのめっき厚さであり、また線の表面は平滑
で光沢性に優れていた。従って，電子部品用リード線材
として、従来方法に劣らない高品質の軟質錫めっき銅線
を高い生産性のもとに得ることが出来た。As a characteristic of the 0.50 mmφ soft tin-plated copper wire obtained in Example 2, the elongation characteristic value is 25%, which is about the same as that of a soft tin-plated copper wire usually used as a lead material of electronic parts. , The tin plating layer is not biased,
The plating thickness was uniform 5 μm, and the surface of the wire was smooth and excellent in gloss. Therefore, as a lead wire material for electronic parts, a high-quality soft tin-plated copper wire comparable to the conventional method could be obtained with high productivity.
【００２３】比較例 比較例について図４を用いて説明する。まず実施例１と
同じ伸び特性及び純度を示す２．６ｍｍφの硬質銅母線
１ｆを貯留巻枠２から繰り出し、実施例１と同じ伸線機
８に導き，１ダイスの断面縮小率が１８％で中間ダイス
９及び仕上げダイス９ａの計１８枚のダイスにより２０
ｍ／ｍｉｎの伸線速度で伸線加工し、線径が0.49ｍｍの
硬質被めっき銅線１g とする。続いて前記実施例１と同
じ，炉内温度が４００℃の（３％Ｈ2-９７％Ｎ2)ガス雰
囲気からなるトンネル式加熱炉３中を通過させ、線の焼
鈍，清浄化を行い軟質被めっき銅線１ｈとする。続いて
前記実施例１と同じ２６０℃の溶融錫めっき浴４中に浸
漬した後、実施例１と同様に非酸化性ガス雰囲気５中に
ある溶融めっき浴表面６から垂直上方向に走行させて溶
融錫めっきを施した後、溶融めっき層を冷却固着させ線
径が0.50ｍｍの軟質溶融錫めっき銅線１ｉを製造し、２
０ｍ／ｍｉｎの速度で巻枠１１に巻き取った。Comparative Example A comparative example will be described with reference to FIG. First, a 2.6 mmφ hard copper busbar 1f exhibiting the same elongation characteristics and purity as in Example 1 is drawn out from the storage reel 2 and guided to the same wire drawing machine 8 as in Example 1, and the cross-sectional reduction rate of one die is 18%. A total of 18 dies including the intermediate die 9 and the finishing die 9a are used to make 20
The wire is drawn at a drawing speed of m / min to obtain 1 g of a hard-plated copper wire having a wire diameter of 0.49 mm. Subsequently, the wire is passed through a tunnel type heating furnace 3 consisting of a (3% H 2 -97% N 2 ) gas atmosphere having a furnace temperature of 400 ° C., and annealing and cleaning of the wire are performed. The plated copper wire is 1 h. Subsequently, after being immersed in the hot-dip tin plating bath 4 at 260 ° C., which is the same as in the first embodiment, it is run vertically upward from the hot-dip bath surface 6 in the non-oxidizing gas atmosphere 5 as in the first embodiment. After the hot-dip tin plating, the hot-dip layer is cooled and fixed to produce a soft hot-dip tinned copper wire 1i having a wire diameter of 0.50 mm.
It was wound around the winding frame 11 at a speed of 0 m / min.
【００２４】上記比較例により得られた0.50ｍｍφ軟質
錫めっき銅線の特性として、伸び特性値は２５％を示
し、錫めっき層は偏りがなく、均一な５μｍのめっき厚
さであり、また線の表面は平滑で光沢性に優れていた。As a characteristic of the 0.50 mmφ soft tin-plated copper wire obtained in the above comparative example, the elongation characteristic value is 25%, the tin plating layer is not biased and has a uniform plating thickness of 5 μm. Was smooth and excellent in gloss.
【００２５】実施例２と比較例を比べてみた場合、実施
例２の0.50ｍｍφ軟質錫めっき銅線の特性は比較例の軟
質錫めっき銅線の特性と何等変わりなく良好である。ま
た生産性を比較した場合、実施例２の巻取り速度は800
ｍ／ｍｉｎ，比較例の巻取り速度は２０ｍ／ｍｉｎであ
るので実施例２は比較例の４０倍の生産性がある事が分
かる。When comparing Example 2 with the comparative example, the characteristics of the 0.50 mmφ soft tin-plated copper wire of Example 2 are as good as those of the comparative example. When the productivity was compared, the winding speed of Example 2 was 800
m / min, and the winding speed of the comparative example is 20 m / min. Therefore, it can be seen that the productivity of the example 2 is 40 times that of the comparative example.
【００２６】[0026]
【発明の効果】本発明の溶融めっき線の製造方法は、硬
質被めっき母線を焼鈍，軟質化及び表面清浄化してから
溶融めっきを施し、次いで伸線加工してから通電加熱し
て軟質溶融めっき線を得る方法であって、溶融金属めっ
き浴を走行する軟質被めっき母線の線速度と伸線機の仕
上げダイスの孔径及び最終仕上がり線速によって、仕上
がり軟質溶融めっき線の規定めっき厚さを得る方法なの
で、得られた溶融めっき線は偏肉のない均一な厚さで均
質なめっき層を備えたものとなるうえに、伸線機のもつ
伸線速度能力で溶融めっき線が生産出来るようになり、
従来の製造方法と比較して生産性が格段に改善出来た。
そのため，めっき厚さが３〜１５μｍで線径が０．３〜
０．６ｍｍの軟質錫めっき銅線は電子部品用リード線材
或はフレキシブルフラット配線材の導体母線として、コ
スト低減と高品質化がなされ好適となった。まためっき
厚さが０．５〜２μｍで線径が０．１〜０．３ｍｍ近辺
のものは電子機器の配線材用の撚り線や編組線としてコ
スト低減や高品質化がなされ好適となった。The method of manufacturing a hot-dip coated wire according to the present invention comprises the steps of annealing, softening, and cleaning the surface of a hard-plated bus bar, applying hot-dip plating, and then drawing and softening by applying current and heating. This is a method of obtaining a wire,
The linear velocity of the soft-plated bus running in the bath and the specifications of the wire drawing machine
Finishing depends on the hole diameter of the lifting die and the final finished line speed.
This is a method to obtain the specified plating thickness of the soft-coated hot-dip wire.The obtained hot-dip wire has a uniform plating layer with a uniform thickness without uneven thickness. Hot-dip wire can be produced with the drawing speed capability of the wire machine,
The productivity was significantly improved as compared with the conventional manufacturing method.
Therefore, the plating thickness is 3 to 15 μm and the wire diameter is 0.3 to
A 0.6 mm soft tin-plated copper wire is suitable as a lead wire for electronic parts or a conductor bus of a flexible flat wiring material because of its cost reduction and high quality. Those having a plating thickness of about 0.5 to 2 μm and a wire diameter of about 0.1 to 0.3 mm have become suitable as stranded or braided wires for wiring materials of electronic devices because of cost reduction and high quality. .
【図１】本発明の溶融めっき線の製造方法を示す略図で
ある。FIG. 1 is a schematic view illustrating a method for producing a hot-dip wire according to the present invention.
【図２】本発明の溶融めっき線の製造方法を示す工程図
である。FIG. 2 is a process chart showing a method of manufacturing a hot-dip wire according to the present invention.
【図３】本発明に用いる特定の特性と組成を有する硬質
被めっき銅母線１．２ｍｍφの加熱温度と伸びの関係を
示すグラフ図である。FIG. 3 is a graph showing the relationship between the heating temperature and the elongation of a hard-plated copper bus bar having a specific property and composition used in the present invention, which is 1.2 mmφ.
【図４】従来の溶融めっき線の製造方法を示す略図であ
る。FIG. 4 is a schematic view showing a conventional method of manufacturing a hot-dip wire.
１ 軟質溶融めっき線 １ａ 硬質被めっき母線 １ｂ 軟質被めっき母線 １ｃ 軟質溶融めっき母線 １ｄ 硬質溶融めっき線 ２ 貯留巻枠 ３ 非酸化性或は還元性ガス雰囲気トンネル式加熱炉 ４ 溶融金属めっき浴 ５ 非酸化性ガス雰囲気 ６ 溶融めっき浴表面 ７ 冷却域 ８ 伸線機 ９ 中間ダイス ９ａ 仕上げダイス １０ 電流焼鈍装置 １１ 巻枠 DESCRIPTION OF SYMBOLS 1 Soft hot-dip wire 1a Hard hot-plated bus 1b Soft hot-plated bus 1c Soft hot-dip bus 1d Hard hot-dip wire 2 Storage reel 3 Non-oxidizing or reducing gas atmosphere tunnel heating furnace 4 Hot-dip metal plating bath 5 Non Oxidizing gas atmosphere 6 Hot-dip plating bath surface 7 Cooling area 8 Wire drawing machine 9 Intermediate die 9a Finishing die 10 Current annealing device 11 Reel
フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｃ２３Ｃ 2/26 Ｃ２３Ｃ 2/26 Ｈ０１Ｂ 13/00 ５０１ Ｈ０１Ｂ 13/00 ５０１Ｅ Ｈ０１Ｌ 21/60 ３０１ Ｈ０１Ｌ 21/60 ３０１Ｆ Continued on the front page (51) Int.Cl. 6 Identification symbol FI C23C 2/26 C23C 2/26 H01B 13/00 501 H01B 13/00 501E H01L 21/60 301 H01L 21/60 301F
Claims (5)
し、非酸化性或は還元性ガス雰囲気からなる加熱炉中を
走行させ、該母線を焼鈍，軟質化させると共に表面清浄
化を行い軟質被めっき母線とする焼鈍，清浄化工程；
と、引き続いて前記軟質被めっき母線を溶融金属めっき
浴中に導き、非酸化性ガス雰囲気中にある溶融めっき浴
表面から垂直上方向に走行させて溶融めっきを施し、続
いて冷却域を通過させ，溶融めっき層を固着して軟質溶
融めっき母線とする溶融めっき工程；と、引き続いて前
記溶融めっき母線を伸線機を通過させて伸線加工し、伸
線仕上がり径に於けるめっき厚さが偏りのない０．５μ
ｍ以上１５μｍ以下の範囲内の均一溶融めっき層を有す
る硬質溶融めっき線とする伸線加工工程；と、更に引き
続いて前記硬質溶融めっき線を電流焼鈍装置を通過させ
て通電加熱し、軟質溶融めっき線とする通電加熱工程；
とからなる溶融めっき線の製造方法であって、前記溶融
金属めっき浴を走行する軟質被めっき母線の線速度と伸
線機の仕上げダイスの孔径及び最終仕上がり線速によっ
て、仕上がり軟質溶融めっき線の規定めっき厚さを得る
ことを特徴とする溶融めっき線の製造方法。1. A bus bar for hard plating is drawn out of a storage reel and is run in a heating furnace containing a non-oxidizing or reducing gas atmosphere to anneal and soften the bus bar and clean the surface by soft cleaning. Annealing and cleaning processes for plating buses;
And, subsequently, the soft plating target bus is guided into the hot-dip metal plating bath, hot-dip from the hot-dip plating bath surface in a non-oxidizing gas atmosphere and vertically hot-dip to apply hot-dip plating, and then pass through the cooling zone. A hot-dip plating step in which the hot-dip coating layer is fixed to form a soft hot-dip plating bus; and subsequently, the hot-dip plating bus is passed through a wire drawing machine to be drawn, and the plating thickness at a finished diameter of the drawn wire is reduced. 0.5μ without bias
a wire drawing process for forming a hard hot-dip wire having a uniform hot-dip coating layer in the range of not less than m and 15 μm or less; Heating process to make wire;
A Do that molten plated wire manufacturing method from the said melting
Linear velocity and elongation of soft plating bus bar running in metal plating bath
It depends on the hole diameter of the finishing die of the wire machine and the final finishing line speed.
To obtain the specified plating thickness of the finished soft hot-dip wire
What is claimed is: 1. A method for manufacturing a hot-dip wire .
属の溶融点温度よりも高い溶融点を有し、かつ溶融めっ
き金属の溶融点温度よりも低温で焼鈍され軟質化するこ
とを特徴とする請求項１記載の溶融めっき線の製造方
法。2. The hard-plated bus bar has a melting point higher than the melting point temperature of the hot-dip metal and is annealed and softened at a temperature lower than the melting point temperature of the hot-dip metal. A method for producing a hot-dip wire according to claim 1.
０℃の加熱温度で焼鈍され軟質化する，含有不純物とし
ての砒素及びアンチモンを極力取り去った純度が99.996
％以上の銅線であることを特徴とする請求項１または２
記載の溶融めっき線の製造方法。3. The method according to claim 1, wherein said hard-plated bus bar has a thickness of 180 to 20.
Purity is 99.996, which is annealed at a heating temperature of 0 ° C and softens.
% Or more of copper wire.
The method for producing a hot-dip wire according to the above.
であることを特徴とする請求項１，２または３記載の溶
融めっき線の製造方法。4. The method according to claim 1, wherein said hot-dip metal is hot-dip tin or solder.
っき線のめっき層が再溶融しない範囲の条件で硬質溶融
めっき線に通電することを特徴とする請求項１，２，３
または４記載の溶融めっき線の製造方法。 5. The method according to claim 1, wherein in the heating step, a current is applied to the hard hot-dip wire under a condition that the plating layer of the hard hot-dip wire is not re-melted.
Or the method for producing a hot-dip wire according to 4 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15536594A JP2973350B2 (en) | 1994-06-14 | 1994-06-14 | Manufacturing method of hot-dip wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15536594A JP2973350B2 (en) | 1994-06-14 | 1994-06-14 | Manufacturing method of hot-dip wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH083713A JPH083713A (en) | 1996-01-09 |
| JP2973350B2 true JP2973350B2 (en) | 1999-11-08 |
Family
ID=15604334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15536594A Expired - Fee Related JP2973350B2 (en) | 1994-06-14 | 1994-06-14 | Manufacturing method of hot-dip wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2973350B2 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100550432C (en) * | 2005-09-28 | 2009-10-14 | 株式会社新王材料 | The manufacture method of electrode wire for solar battery |
| JP4640260B2 (en) * | 2006-05-19 | 2011-03-02 | 住友電気工業株式会社 | Flat cable manufacturing method |
| JP5010300B2 (en) * | 2007-02-02 | 2012-08-29 | 富士電線工業株式会社 | Coaxial cable and method of manufacturing inner conductor for coaxial cable |
| JP5255668B2 (en) * | 2010-06-11 | 2013-08-07 | 古河電気工業株式会社 | Solder plated wire manufacturing method and manufacturing apparatus |
| WO2012063396A1 (en) * | 2010-11-08 | 2012-05-18 | 三菱電線工業株式会社 | Plated wire material, production method for same, and production device |
| WO2012111185A1 (en) * | 2011-02-15 | 2012-08-23 | 三菱電線工業株式会社 | Solder-plated copper wire and method for producing same |
| GB201416963D0 (en) * | 2014-09-25 | 2014-11-12 | Strip Tinning Ltd | Coatings |
| CN104971954B (en) * | 2015-07-17 | 2018-04-27 | 上海鼎凡电工机械股份有限公司 | A kind of big-and-middle drawing wire drawing machine of high speed high stability copper conductor |
| CN105363824B (en) * | 2015-12-04 | 2017-07-07 | 无锡统力电工股份有限公司 | Flute profile wire line continuous producing apparatus |
| CN108914035A (en) * | 2018-09-03 | 2018-11-30 | 德清县欣琪电子有限公司 | A kind of copper covered steel wire tinning stack of double-station |
| CN112226719A (en) * | 2020-10-16 | 2021-01-15 | 鹰潭市众鑫成铜业有限公司 | Hot-dip coating device for copper wire |
| CN112553551B (en) * | 2020-12-08 | 2022-05-06 | 重庆星达铜业有限公司 | Heating pipe for annealing copper wire |
| CN113106369A (en) * | 2021-04-15 | 2021-07-13 | 江西富鸿金属有限公司 | Hot tinning process for superfine copper wire |
-
1994
- 1994-06-14 JP JP15536594A patent/JP2973350B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH083713A (en) | 1996-01-09 |
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