JP5255668B2 - Solder plated wire manufacturing method and manufacturing apparatus - Google Patents

Description

  The present invention relates to a method and apparatus for producing a solder plated wire used in electrical and electronic equipment and communication equipment, and more specifically, a method for producing a solder plated wire having low strength characteristics suitable for use as a lead wire of a solar cell, and It relates to a manufacturing apparatus.

  Some plated wires used for electronic parts are required to have low yield strength characteristics such as a low 0.2% yield strength value. For example, the lead wire for solar cells is one of them.

Solar cells are required to be thin in order to reduce the cost of the silicon material constituting the solar cells and to mitigate the effects of insufficient material supply.
However, when the solar cell is thinned, the strength is weakened, and the connecting portion where the solar cell lead wire in the solar cell is soldered is likely to be warped or damaged due to the difference in expansion coefficient. There was a problem.

  Therefore, the solar cell lead wire needs to follow the deformation of the solar cell at the connection portion with the solar cell, and it is important to reduce the 0.2% proof stress value. For this reason, a solder plated wire having a low yield strength characteristic is used as the lead wire for the solar cell.

  Such a solder-plated wire is formed by forming a plating layer on the wire to be plated through a solder plating process as disclosed in Patent Document 1 regardless of whether or not it has low strength characteristics.

  In the solder plating process disclosed in Patent Document 1, a metal wire as a wire to be plated is introduced into a plating solution containing molten solder plating solution through a metal wire introduction port, and is led out from a solder plating wire outlet. This is a step of plating the metal wires by cooling to the atmosphere.

  Furthermore, in the solder plating wire manufacturing process, in addition to the solder plating process described above, the surface of the metal element wire is subjected to a solder plating pretreatment process such as cleaning and annealing, A winding process for winding the plated wire is performed.

  And when it is going to perform such a process continuously with respect to the to-be-plated wire which carried out low yield strength, since it becomes easy to apply a load to a to-be-plated wire, it becomes difficult to carry out a continuous process and it carries out a continuous process. Even if it was possible, it was difficult to stably obtain a plated wire having a desired quality.

  For example, too much emphasis is placed on suppressing the load applied to the plated wire whose strength has been lowered, and the surface of the plated wire cannot be sufficiently cleaned, and impurities and oxide layers may remain on the surface. .

  Then, when forming a plating layer on the surface of the wire to be plated in the subsequent solder plating process, it is difficult to stably obtain a plating wire of a desired quality such that the plating layer is easily peeled off.

  In addition, during the production of the plated wire, because the proof strength of the plated wire (wire to be plated) is low, it is not possible to increase the traveling speed of the plated wire, it takes a lot of production time, and if you try to do it continuously On the contrary, there is a problem that the production efficiency may be lowered.

As a method for producing a solder-plated wire having low yield strength characteristics, for example, Patent Document 2 proposes a method for producing a flat conductor for solar cells.
In the method of manufacturing a rectangular conductor for solar cell in Patent Document 2, the conductor is formed into a rectangular shape by a process such as rolling, and then 0.2% proof stress is reduced by a heat treatment process, or a solder plating film is formed on the surface of the conductor. It is a manufacturing method to be applied.

  However, the cited document 2 includes specific descriptions such as temperature setting for performing heat treatment, components of atmospheric gas inside the softening annealing furnace, and specific processes other than the heat treatment process such as a cleaning process. There is no mention. For this reason, even if the cleaning process is performed, these processes such as the heat treatment process, the cleaning process, or the plating process are performed on an independent production line. Even if it is performed, it is not certain in what process order.

  That is, as described above, Cited Document 2 has a 0.2% proof stress while it becomes difficult to ensure the quality of the lead wire of the solar cell as the 0.2% proof stress of the flat conductor is reduced. It must be said that no attention has been paid to two conflicting manufacturing problems that the manufacturing efficiency is lowered in order to ensure the quality of the plated wire with a reduced value.

JP 2000-80460 A JP 2006-54355 A

  Therefore, the present invention can obtain a plated wire of a desired quality with a sufficiently reduced 0.2% proof stress value, and by stably obtaining such a plated wire, the product yield can be improved. It is another object of the present invention to provide a method and apparatus for manufacturing a solder plated wire that can improve manufacturing efficiency.

The present invention comprises a plating pretreatment means for pre-plating a copper wire, a plating means for performing solder plating on the surface of the copper wire, and a winding means for winding up the copper wire plated on the surface. A solder plated wire manufacturing apparatus, wherein the copper wire is formed of a pure copper-based material, and the pre-plating processing means includes a soft annealing means for softening and annealing the copper wire to reduce the yield strength. The formed copper wire is wound by the winding means with a winding force lower than the proof strength of the copper wire, and the softening annealing means, the plating means, and the winding means are used for running the copper wire. A feed capstan that is arranged in this order from the upstream side of the direction and assists the winding of the copper wire by the winding means is provided on the upstream side in the copper wire traveling direction from the softening annealing means , and the plating means, Molten solder plating containing molten solder plating solution Comprising, inside the molten solder plating tank, a tank middle direction changing roller that changes the traveling direction of the copper wire before and after passing through the molten solder plating tank, the feed capstan, and The tank direction changing roller is composed of an active rotating roller that is actively rotated by a driving means, and the feed capstan is fed faster than the winding speed of the copper wire by the winding means within a range in which no blurring of the copper wire occurs. The tank direction changing roller is configured to be capable of active rotation at a speed, and is configured to be capable of active rotation at a feed speed equivalent to the winding speed of the copper wire by the winding means .

  Here, the configuration in which the winding means winds with the winding force lower than the proof strength of the copper wire described above is not limited to the configuration in which the copper wire is wound only with the winding means, for example, the winding means. A feed capstan for assisting winding by the above-described arrangement is disposed upstream of the winding means, and a configuration in which a copper wire is wound by the winding means and the feed capstan is also included.

  The series of arrangements means that they are arranged in a so-called tandem, regardless of whether they are continuous or intermittent from the upstream side to the downstream side in the traveling direction.

The pre-Symbol pure copper material, if example embodiment, oxygen-free copper (OFC), tough pitch copper, the purity containing no impurities such as oxides such as phosphorus deoxidized copper exhibits what is 99.9%.

  The copper wire is not limited in shape and size, but is preferably a rectangular wire. By forming the copper wire as a rectangular wire with the above-described pure copper-based conductor material, by plating the surface, the lead wire for connection connected to a predetermined region of the silicon crystal wafer (Si cell), that is, It is because it can be used as a solder plating wire for solar cells.

  The copper wire feed auxiliary means transmits, for example, a driving force by a drive means such as a motor such as a feed capstan to the copper wire by a transmission means constituted by a roller, a belt, or a combination of these members. That is, it is a means that can feed and assist the plated wire and the plated wire.

As an aspect of the present invention, the feed capstan can be configured to be rotatable at a feed speed that is 1 m / min faster than the winding speed of the copper wire by the winding means .

Further, as an aspect of the present invention, the plating pretreatment means includes a cleaning means for cleaning the copper wire upstream of the softening annealing means in the copper wire traveling direction, and the feed capstan is arranged in the copper wire traveling direction. It can arrange | position in the downstream of a copper wire traveling direction rather than the washing | cleaning means .

The present invention includes a plating pretreatment process for performing plating pretreatment on a copper wire, a plating process for solder plating on the surface of the copper wire, and a winding process for winding the copper wire plated on the surface. A method of manufacturing a solder plated wire to be manufactured, wherein the copper wire is made of a pure copper-based material, and in the pre-plating process, the copper wire is softened and annealed to reduce the strength. The winding step is a step of winding with a lower winding strength than the proof strength of the copper wire, and the softening annealing step and the plating step are continuously performed during the winding step. Before the softening annealing step, the winding capstan assists the winding of the copper wire in the winding step, and in the plating step, the copper wire is placed inside the molten solder plating tank in which the molten solder plating solution is stored. And the molten half By the direction change roller in the tank provided inside the plating tank, the traveling direction of the copper wire is changed before and after passing through the molten solder plating tank, and before the softening annealing step, the feed capstan is causes actively rotated by the driving means at a faster feed rate than the take-up speed of the copper wire in the winding process to the extent that the shake of the copper wire does not occur, in the plating process, the bath deflecting rollers, the winding It is characterized in that it is actively rotated by the driving means at a feed rate equivalent to the winding speed of the copper wire by the means .

As an aspect of the present invention, the feed capstan can be actively rotated at a feed speed that is 1 m / min faster than the copper wire winding speed in the winding step.

  According to this invention, it is possible to obtain a plated wire of a desired quality with a sufficiently reduced 0.2% proof stress value, and to improve the product yield by stably obtaining such a plated wire. In addition, it is possible to provide a method and an apparatus for manufacturing a solder plated wire that can improve manufacturing efficiency.

Schematic of the manufacturing apparatus of the solder plating wire of this embodiment. Explanatory drawing of the softening annealing furnace of this embodiment. Explanatory drawing of the bobbin traverse type winder of this embodiment. The graph which shows the relationship with the 0.2% yield strength value of the plating wire according to the installation aspect of a feed capstan and a tank direction change roller. Schematic which shows a part of manufacturing apparatus of the solder plating wire of other embodiment.

An embodiment of the present invention will be described below with reference to the drawings.
As shown in FIG. 1, a solder plated wire manufacturing apparatus 10 according to the present embodiment performs a plating pretreatment means 2 for performing a pretreatment for plating on a wire to be plated 1a, and performs solder plating on the surface of the wire to be plated 1a. It comprises a plating means 61 and a winding means 71 for winding the plated wire 1b plated on the surface.

  The to-be-plated wire 1a is preferably made of oxygen-free copper (OFC) with a thickness of 0.05 to 0.5 mm and a width of 0.8 to 10 mm by a separately provided flat wire manufacturing machine (not shown). A rectangular copper wire rolled with a thickness of 0.08 to 0.24 mm and a width of 1 to 2 mm is used.

  The plating pretreatment means 2 mainly comprises a supplier 11, a heat treatment furnace 22, an acid cleaning tank 31, an ultrasonic water cleaning tank 41, and a softening annealing furnace 51.

  The supplier 11 supplies the wire to be plated 1a that is wound around the drum to the production line while the drum rotates in order to be solved. The supplier 11 may be configured with a dancer function as necessary, or may be configured to be fed out in a normal lateral feed.

  The heat treatment furnace 22 has substantially the same configuration as a soft annealing furnace 51 described later, and has an outer shape that is a rectangular parallelepiped shape that is long in the traveling direction with respect to the thickness direction. The heat treatment furnace 22 is inclined and arranged along the traveling direction so that the downstream end in the traveling direction is lower than the upstream end. The inside of the heat treatment furnace 22 is a steam atmosphere having a set temperature of 200 ° C.

  A cooling water tank 23 for cooling the wire to be plated 1 a that has passed through the inside of the heat treatment furnace 22 is installed on the downstream side of the heat treatment furnace 22 in the traveling direction. The downstream end of the heat treatment furnace 22 and the cooling water tank 23 are connected to each other by a connecting pipe 24 that guides the plated wire 1a led out from the heat treatment furnace 22 to the cooling water tank 23 so as not to touch the air.

  The acid cleaning tank 31 stores a phosphoric acid cleaning liquid 32 for acid cleaning the surface of the wire 1a to be plated.

  The ultrasonic water cleaning tank 41 stores water 43 for cleaning the water-soluble lubricant and other impurities attached to the surface of the wire to be plated 1a using an ultrasonic water cleaning machine provided separately. On the bottom surface of the ultrasonic water cleaning tank 41, an ultrasonic vibration plate 42a constituting a part of the ultrasonic water cleaning machine 42 is disposed along the traveling direction of the wire to be plated 1a. Note that an air wiper 45 is provided above the ultrasonic water cleaning tank 41 to blow air from the side on the track on which the wire to be plated 1a travels toward the wire to be plated 1a.

  As shown in FIG. 2, the softening annealing furnace 51 is inclined so that the downstream end is gradually lower than the upstream end in the traveling direction. The softening annealing furnace 51 is arranged so as to penetrate the softening annealing furnace main body 52 configured in a rectangular parallelepiped shape like the heat treatment furnace 22 and the softening annealing furnace main body 52, and allows the insertion of the wire to be plated 1a. And a heater 54 that heats the inside of the softening annealing furnace main body 52.

  The sheath tube 53 is disposed along the traveling direction in the internal space of the soft annealing furnace main body 52, and protrudes from the upper end portion and the lower end portion of the soft annealing furnace main body 52 with respect to the soft annealing furnace main body 52. An upper end opening 55u is formed at the upper end of the sheath tube upper projecting portion 55 projecting from the upper end of the softening annealing furnace main body 52 in the sheath tube 53.

  The upper end opening 55u allows the introduction of the wire to be plated 1a into the sheath tube 53 and discharges the reducing gas G filled in the sheath tube 53 as will be described later. A lower end opening 55 d is formed at the lower end of the sheath pipe lower projecting portion 56 that projects from the lower end of the soft annealing furnace body 52 in the sheath pipe 53.

The lower end opening 55d allows the wire to be plated to be led out from the sheath tube. The casing tube lower protruding portion 56 is connected to the connecting tube 58 in series. Further, a branch portion is formed in the middle portion of the sheath tube lower projecting portion 56, and the branch portion is configured as a reducing gas supply portion 57 that supplies the reducing gas G to the inside of the sheath tube 53.

  Although not shown, the reducing gas supply unit 57 includes a pressure control valve, a pressure gauge, and the like, and the reducing gas supply unit 57 reduces the reducing gas according to the concentration of the reducing gas G inside the softening annealing furnace 51. The inflow amount of G can be adjusted.

  The inside of the sheath tube 53 is made into a reducing gas atmosphere by flowing the reducing gas G from the reducing gas supply unit 57.

  The heater 54 includes a plurality of heaters configured in a straight bar shape, and is arranged in an upper space and a lower space with respect to the sheath tube 53 in the internal space of the soft annealing furnace main body 52. The heater 54 is installed in a direction orthogonal to the traveling direction of the wire to be plated 1a, specifically, in a direction corresponding to a direction perpendicular to the paper surface of FIG. 2 when the paper surface of FIG. The heaters 54 are arranged in parallel at predetermined intervals along the traveling direction in each of the upper space and the lower space.

  The temperature inside the softening annealing furnace 51 is set to 800 ° C. or higher by a heater.

By connecting the lower protruding portion of the sheath pipe in series to the connecting pipe 58 , the wire 1a to be plated that has passed through the softening annealing furnace 51 is caused to travel so as not to come into contact with air until it enters the molten solder plating solution 63. be able to.

  The plating means 61 is composed of a molten solder plating tank 62 in which a molten solder plating solution 63 is stored. The molten solder plating solution 63 is set to a set temperature of 260 ° C. and molten tin (Sn-3.0Ag-0.5Cu). Is used.

  Inside the molten solder plating tank 62, a tank middle direction changing roller 64 is disposed that changes the traveling direction of the plated wire 1b having the molten solder plating solution 63 attached to the surface thereof vertically upward.

  Furthermore, a tank upper direction changing roller 65 for changing the plating wire 1b from a traveling direction vertically upward to a direction toward the winding means 71 is provided vertically above the tank direction changing roller 64.

  The tank middle direction changing roller 64 and the tank upper direction changing roller 65 are constituted by, for example, a roller having a diameter of about 100 mm, which is larger than a normal roller having a diameter of about 20 mm. Further, the tank middle direction changing roller 64 and the tank upper direction changing roller 65 are substantially the same as the rotational speeds of dancer rollers 74 and bobbins 76, which will be described later, provided in the winding means 71 by drive motors not shown. The direction of the plated wire 1b is changed so as to actively rotate by itself at the rotational speed and to synchronize with the winding speed by the winding means 71.

Next, the winding means 71 will be described.
The winding means 71 includes a winding tension adjusting machine 72 and a bobbin traverse type winding machine 75.

  The winding tension adjuster 72 includes a dancer roller 74 that is movable in the vertical direction in accordance with the tension applied to the plated wire 1b that spans the fixed roller 73 and adjusts the tension. Although not shown, based on a tension detection sensor that detects the tension of the plated wire 1b that has been passed, a control unit that controls the tension to be stabilized according to the tension detected by the tension detection sensor, and a command from the control unit It is comprised with the roller moving machine which moves the dancer roller 74. FIG.

  As shown in FIG. 3A, the bobbin traverse type winder 75 swings the bobbin 76 along the axial direction of the bobbin 76 and the bobbin 76 configured to be wider than the width of the plating wire 1b. Motor 77 to be transmitted, and a transmission means 78 such as a ball screw for transmitting the drive of the motor 77. Further, the bobbin traverse type winding machine 75 has a winding force detection sensor 79 for detecting the winding force by the bobbin 76, and the tension is stabilized according to the winding force detected by the winding tension detection sensor 79. A control unit 81 to be controlled and a motor 82 for rotating the bobbin 76 based on a command from the control unit 81 are configured.

  The solder plating wire manufacturing apparatus 10 configured in this manner includes a supplier 11 as a plating pretreatment means 2, a heat treatment furnace 22, an acid cleaning tank 31, an ultrasonic water cleaning tank 41, a softening annealing furnace 51, and a plating. Each of the molten solder plating tank 62 as the means 61 and the winding means 71 are arranged in tandem in this order from the upstream side in the traveling direction of the plated wire 1a and the plated wire 1b.

  Further, the solder plated wire manufacturing apparatus 10 lowers the 0.2% proof stress value of the wire 1a to be plated before plating, and thereafter performs plating on the wire 1a having the reduced proof stress. While performing, it is set as the structure wound up by the said winding means 71 with the winding force lower than the yield strength of this plated wire 1b.

  Specifically, the above-described winding tension adjusting machine 72 and the bobbin traverse type winding machine 75 are adopted as the winding means 71, and the first feed capstan 91 assisting the winding of the winding means 71; A second feed capstan 92 is installed. Both the first feed capstan 91 and the second feed capstan 92 are installed on the upstream side of the soft annealing furnace 51 so as to feed and assist the traveling of the wire to be plated 1a before the reduction in yield strength.

  Specifically, the first feed capstan 91 is provided between the heat treatment furnace 22 and the acid cleaning tank 31, and the second feed capstan 92 is provided between the acid cleaning tank 31 and the softening annealing furnace 51. Yes.

  If the winding speed of the plated wire 1b is too slow or too fast, the load applied to the plated wire 1b increases. In particular, if the winding speed is too high, a problem of line blurring also occurs. Therefore, the first feed capstan 91 and the second feed capstan 92 are slightly lower than the winding speed of the winding means 71. The to-be-plated wire 1a and the plated wire 1b are sent to the downstream side at a very high speed, for example, at a feed speed that is about +1 m / min faster than the winding speed.

  In addition, the winding means 71 is appropriately provided with a plurality of fixed rollers 73 that bridge the plated wire 1b in the vicinity of the winding tension adjuster 72 and the bobbin traverse type winding machine 75 described above.

Of the plurality of fixed rollers 73 arranged in the winding means 71, the fixed roller 73 installed on the most upstream side in the running direction is set as the winding means upstream arrangement roller 73A. The winding means upstream arrangement roller 73 </ b> A is a roller that first bridges the plated wire 1 b that has traveled to the winding means 71 side after the direction is changed by the tank upward direction changing roller 65 on the winding means 71 side.
The tank upper direction changing roller 65 is arranged at a position higher than the winding means upstream arrangement roller 73A.

Then, the manufacturing method of a solder plating wire is demonstrated.
The solder plating wire manufacturing method includes a pre-plating process for performing plating pre-treatment on the plated wire 1a, a plating process for performing solder plating on the surface of the plated wire 1a, and a plated wire 1b having a plated surface. It is manufactured through a winding process.

  The plating pretreatment process is a process in which a heat treatment process, an acid washing process, a water washing process, and a softening annealing process are performed in this order.

  In the heat treatment step, the surface of the wire to be plated 1a is steam cleaned by running the wire to be plated 1a inside the heat treatment furnace 22 in a steam atmosphere. By this steam cleaning, the water-soluble lubricant and other impurities adhering to the surface of the wire to be plated 1a can be separated from the surface so that it can be easily removed.

  In the heat treatment step, the annealing temperature in the heat treatment furnace 22 is set to 200 ° C., which is lower than the general annealing temperature of about 650 ° C., the inside of the heat treatment furnace 22 set at this low temperature is made a steam atmosphere, The plating wire 1a is made to travel, and water vapor cleaning is performed on the wire to be plated 1a.

  Thus, in this step, in addition to performing steam cleaning on the wire to be plated 1a, the yield strength is also reduced by annealing the wire to be plated 1a. However, in this process, the annealing temperature is set to 200 ° C., thereby suppressing the degree of lowering the yield strength of the wire to be plated 1a. Further, the wire 1a to be plated after passing through the heat treatment furnace 22 is cooled to a predetermined temperature by the cooling water tank 23.

  In the acid cleaning step, the surface of the to-be-plated wire 1a that has traveled through the phosphoric acid-based cleaning liquid 32 stored in the acid cleaning tank 31 is cleaned.

In the water washing step, the surface of the wire to be plated 1a is ultrasonically washed in the ultrasonic water washing tank 41 to remove the water-soluble lubricant and other impurities attached to the surface of the wire to be plated 1a.
In the softening annealing step, the wire to be plated 1a is run inside the softening annealing furnace 51 in which the inside is a reducing gas atmosphere, thereby softening and annealing the wire 1a to be plated and reducing the strength, and the surface of the wire 1a to be plated. This is a step of reducing the oxide layer.

  Specifically, as shown in FIG. 2, in the softening annealing step, the sheath tube lower protruding portion is disposed inside the sheath tube 53 of the softening annealing furnace 51 that is inclined so that the downstream side is lower than the upstream side in the traveling direction. As a reducing gas G, for example, a mixed gas obtained by mixing hydrogen gas with nitrogen gas is supplied from a reducing gas supply unit 57 provided in 56, and the inside of the sheath tube 53 is set as a reducing gas atmosphere (see arrow d in FIG. 2). ). Further, the internal space of the soft annealing furnace main body 52 is heated to about 800 ° C. by the heater 54.

  In the inside of the sheath tube 53 having such a reducing gas atmosphere, the wire to be plated 1a introduced from the upper end opening 55u travels in a downward direction D that is opposite to the direction d in which the reducing gas G rises. I am letting.

  In the subsequent plating step, the wire to be plated 1a travels in the molten solder plating solution 63 stored in the molten solder plating tank 62, thereby attaching molten tin to the surface of the wire to be plated 1a.

The to-be-plated wire 1a led out from the lower end opening 55d of the softening annealing furnace 51 is guided until it penetrates into the molten solder plating solution 63 without contacting the air by running inside the connecting pipe 58 .

  The to-be-plated wire 1a that has entered the molten solder plating solution 63 becomes a plated wire 1b in which the molten solder plating solution 63 adheres to the surface and the entire surface is coated with the molten solder plating solution 63. The plating wire 1b is redirected vertically upward in the process of running through the molten solder plating tank 62 by the tank direction changing roller 64 provided in the molten solder plating tank 62 in the process of running inside the molten solder plating tank 62. Then, it is led out vertically from the molten solder plating tank 62.

  After the plating wire 1b is led out from the molten solder plating tank 62, the direction of the plating wire 1b is changed by the tank upper direction changing roller 65 and travels to the winding means 71 side.

  In the winding process, while the pre-plating process and the plating process described above are performed on the wire to be plated 1 a, the plated wire 1 b that has undergone these processes is plated by controlling the dancer roller 74 of the winding tension adjuster 72. While adjusting the tension of 1b, the bobbin traverse type winder 75 is aligned and wound around the bobbin 76.

  Specifically, as shown in FIGS. 3A and 3B, the bobbin 76 of the bobbin traverse type winding machine 75 is rotated in the axial direction of the bobbin 76 by rotating the bobbin 76, thereby causing the bobbin 76 to move the plating wire 1 b. Can be wound in parallel along the axial direction, and can be wound so as to overlap a plurality of layers.

  As shown in a partially enlarged cross-sectional view in FIG. 3B, this parallel winding is a winding for winding the plated wire 1b so that the parallel pitch of the plated wire 1b is shifted by, for example, a half pitch between the overlapping layers. It is a method.

The solder plated wire manufacturing apparatus 10 and the manufacturing method described above can obtain various actions and effects as follows.
The solder plating wire manufacturing apparatus 10 includes a supplier 11 as a plating pretreatment means 2, a heat treatment furnace 22, an acid cleaning tank 31, an ultrasonic water cleaning tank 41, a softening annealing furnace 51, and a melting as a plating means 61. The solder plating tank 62 and the winding means 71 are sequentially arranged in this order from the upstream side to the downstream side in the traveling direction of the plated wire 1b.

  By arranging each means in this way, it is possible to prevent the plated wire 1b, which has been reduced in strength during manufacturing, from traveling a useless distance, and to reduce the load applied to the plated wire 1b during traveling. it can.

  Therefore, it is possible to obtain a desired quality plated wire 1b with a sufficiently reduced 0.2% proof stress value, and by stably obtaining such a plated wire 1b, the product yield can be improved, Moreover, manufacturing efficiency can be improved.

  Furthermore, in the method for producing a solder plated wire, the heat treatment process, the acid washing process, the water washing process, the softening annealing process, the plating process, and the winding process as the plating pretreatment process are continuously performed. And do it.

  Thus, by continuously performing each process, for example, the traveling of the plated wire 1b (the plated wire 1a) is interrupted every time a predetermined process is performed, and the plated wire is placed on another traveling line to perform the next process. Since there is no need to move 1b (wire to be plated 1a), the load applied to the plated wire 1b can be greatly reduced, and a plated wire 1b having a desired quality can be stably obtained.

  Furthermore, according to the solder plated wire manufacturing apparatus 10, the first feed capstan 91 and the second feed capstan 92 (hereinafter referred to as “feed capstan 91”) assisting the winding of the wire 1 a to be plated by the winding means 71. , 92 ")) is provided upstream of the winding means 71 in the traveling direction of the wire to be plated 1a.

  In addition, according to the method of manufacturing a solder plated wire, a wire-feeding auxiliary process for assisting winding of the wire to be plated 1a (plated wire 1b) performed in the winding process is performed during the winding process. Features.

  According to the solder plating wire manufacturing apparatus 10 and the solder plating wire manufacturing method described above, it is possible to obtain a plated wire 1b having a desired quality with a sufficiently reduced 0.2% proof stress value. By stably obtaining the plated wire 1b, the product yield can be improved and the manufacturing efficiency can be improved.

  Furthermore, since the plated wire 1b having a desired quality with a sufficiently reduced 0.2% proof stress can be efficiently produced, mass-produced low-proof plated wire 1b suitable as a lead wire for a solar cell is produced. Can also be realized.

  More specifically, the feeding capstans 91 and 92 assist the winding by the winding means 71 on the upstream side in the traveling direction, so that the winding force applied to the wire 1a to be plated by the winding means 71 can be increased. The stuns 91 and 92 can be dispersed on the upstream side and the downstream side in the traveling direction, and the load applied to the plated wire 1a by the winding by the winding means 71 can be reduced.

  As a result, the 0.2% proof stress value of the plated wire 1b can be sufficiently reduced, the elongation rate can be suppressed, and a plated wire of a desired quality can be obtained.

In addition, according to the solder plated wire manufacturing apparatus 10 described above, the feed capstans 91 and 92 are disposed upstream of the softening annealing furnace 51 in the traveling direction.
The to-be-plated wire 1a before reducing the yield strength in the softening annealing furnace 51 can be fed and assisted.

  For this reason, for example, when assisting the feeding of the wire to be plated 1a by a feed captan that is actively rotated, a load such as a tensile tension is not applied to the wire to be plated 1a having a reduced strength, so that the strength is reduced. A load is not applied to the plated wire 1a, and the feeding can be surely supported while ensuring the quality of the plated wire 1b.

  In particular, as in the second feed capstan 92, a low yield strength is provided on the downstream side of the cleaning unit 30 in the traveling direction and on the upstream side of the softening annealing furnace 51. The wire to be plated 1a (plated wire 1b) which has passed through the soft annealing furnace 51 and reduced the yield strength without applying a burden to the wire to be plated 1a by assisting the feeding of the wire to be plated 1a immediately before the conversion. It is possible to efficiently feed and assist the traveling.

  Also, among the direction changing rollers for changing the traveling direction of the plated wire 1b, the middle direction changing roller 64 provided inside the molten solder plating vessel 62 is driven by a motor as in the case of the feed capstans 91 and 92. You may comprise as a feed capstan which rotates actively and assists the feeding of the plating wire 1b.

  By configuring the tank direction changing roller 64 as a feed capstan, when changing the traveling direction of the plating wire 1b before and after passing through the molten solder plating tank 62, the tank direction changing roller 64 is plated. Since it actively rotates at a rotational speed that approximately matches the traveling speed of the wire 1b, in addition to changing the traveling direction of the plated wire 1b, the traveling of the plated wire 1b can be assisted.

  Therefore, when the plated wire 1b comes into contact with the in-tank direction changing roller 64, the load due to the frictional resistance in the rotation direction is not applied to the plated wire 1b, and the plated wire 1b can be smoothly sent out.

  Specifically, since the load is applied particularly to the plated wire 1b when changing its running direction, the change of the running direction of the plated wire 1b causes the 0.2% proof stress value of the plated wire 1b to increase. It becomes. And when taking out the plated wire 1b from the state immersed in the molten solder plating solution 63, it is necessary to carry out such a change in the traveling direction in the molten solder plating tank 62.

  For this reason, the plated wire 1b travels in a state immersed in the molten solder plating solution 63. When the direction is changed, the plated wire 1b receives a viscous resistance from the molten solder plating solution 63. The load further increases, and the amount of increase in the 0.2% proof stress value becomes significant.

  For this reason, as described above, by configuring the tank direction changing roller 64 as a feed capstan, even if the direction of the plated wire 1b is changed in the state of being immersed in the molten solder plating solution 63, the plating wire 1b The applied load can be suppressed as much as possible, and the plated wire 1b having a low 0.2% proof stress value can be manufactured.

  Hereinafter, a tension verification experiment for verifying the tension applied immediately before winding the plated wire 1b will be described as an effect confirmation experiment.

(Tension verification experiment)
In the tension verification experiment, the influence of the 0.2% proof stress value depends on the tension applied to the plated wire 1b until the plated wire 1b reaches the winding tension adjuster 72, that is, the loose state of the plated wire 1b. Verification was performed.

  Since it is difficult to quantify the tension applied to the plated wire 1b before reaching the winding tension adjusting machine 72, the tension applied is determined by the feed capstan 91 that affects the tension applied. The parameters are whether the number of 92 and the shaft inside the molten solder plating tank 62 (in-tank direction changing roller 64) are active rotation or passive rotation, and 0.2% proof stress characteristic according to the setting of these parameters. Verified.

  Specifically, as shown in Table 1, the degree of tension applied to the plated wire 1b until reaching the winding tension adjuster 72 was set in four stages from the first tension setting to the fourth tension setting.

第１張力設定では、送りキャプスタンの設置数が第１送りキャプスタン９１のみの１つであり、槽中方向転換ローラ６４を、従動回転ローラで構成した場合の設定である。なお、従動回転ローラとは、ローラを駆動するモータなどを備えず、能動的に回転しないフリー回転自在なローラである。第１張力設定は、張力が４段階のうち最も強く、メッキ線１ｂがぴんと張った状態となる。

In the first tension setting, the number of installed feed capstans is only one of the first feed capstans 91, and the tank direction changing roller 64 is configured by a driven rotation roller. The driven rotating roller is a free-rotating roller that does not include a motor that drives the roller and does not actively rotate. In the first tension setting, the tension is the strongest among the four stages, and the plated wire 1b is tightly tensioned.

In the second tension setting, the number of feed capstans installed is only one of the first feed capstans 91, and the tank direction changing roller 64 is a drive rotation roller.
The drive rotation roller is a roller that actively rotates by driving a motor or the like. In the second tension setting, the tension is slightly weaker than the first tension setting.

  In the third tension setting, the number of feed capstans installed is two, that is, the first feed capstan 91 and the second feed capstan 92, and the tank direction changing roller 64 is configured by a driven rotary roller. Yes, the tension is slightly weaker than the second tension setting.

  In the fourth tension setting, the number of feed capstans installed is two, that is, the first feed capstan 91 and the second feed capstan 92, and the tank direction changing roller 64 is configured by a drive rotating roller. Yes, the tension is slightly weaker than the third tension setting, the weakest of the four stages, and the plated wire 1b is in the most loose state.

  The load characteristics of the plated wire 1b including the 0.2% proof stress characteristic of the plated wire 1b are the results shown in Table 2 and FIG. 4 in each case of the first tension setting to the fourth tension setting described above. It became.

なお、被メッキ線１ａは、いずれもＯＦＣであり、０．１６ｍｍ×２．０ｍｍ、０．２ｍｍ×１．０ｍｍのサイズの２種類の平角線のそれぞれについて行った。

In addition, all the to-be-plated wires 1a are OFC, and it performed about each of two types of rectangular wires of a size of 0.16 mm x 2.0 mm and 0.2 mm x 1.0 mm.

  From the results shown in Table 2 and FIG. 4, 0.2% proof stress is obtained when the number of feed capstans is two rather than one in either case of the two types of wire to be plated 1a. The value could be set lower. Thereby, the effectiveness in the case where the number of installed feed capstans is two than the case of one was confirmed.

  Further, when the wire 1a to be plated is a rectangular wire having a size of 0.2 mm × 1.0 mm and the number of feed capstans is two, the tank direction changing roller 64 is a driving rotating roller. The 0.2% proof stress value was the same regardless of whether it was a driven rotating roller. On the other hand, in all other settings, the 0.2% proof stress value is lower when the in-tank direction changing roller 64 is configured by a driving rotating roller than when it is configured by a driven rotating roller. became.

  From this, it is clear that the case where the tank direction changing roller 64 is constituted by a driving rotary roller shows a tendency that the 0.2% proof stress tends to be lower than the case where it is constituted by a driven rotary roller, It was confirmed that the tank direction changing roller 64 is composed of a driving rotary roller.

  In particular, from the results shown in Table 2 and FIG. 4, the plating wire 1 b is the most wire line in the case of the fourth tension setting among the first tension setting to the fourth tension setting, that is, until reaching the winding tension adjuster 72. It was confirmed that when the wire was wound in a loosened state, the load on the plated wire 1b could be reduced and the 0.2% proof stress value was particularly lowered.

  Further, at least one of a configuration in which two feed capstans are installed and a configuration in which the tank direction changing roller 64 is configured by a driving rotary roller is used to wind the wire to be plated 1a (plating wire 1b). , The plated wire 1b can be loosened before reaching the winding tension adjusting machine 72, and the 0.2% proof stress is reduced to a predetermined value. It was confirmed to be effective in obtaining 1b.

The solder-plated wire manufacturing apparatus 10 and the solder-plated wire manufacturing method described above are not limited to the above-described configuration and manufacturing method, and can be configured in various configurations and manufacturing methods.
For example, the first feed capstan 91 and the second feed capstan 92 are not limited to being arranged at the above-described arrangement positions, and may be arranged at any position in the traveling direction. Further, the feed capstan may be configured to include only one of the first feed capstan 91 and the second feed capstan 92.
Specifically, for example, as shown in FIG. 5, the second feed capstan 92 may not be installed.

  Further, a plurality of feed capstans may be provided in addition to the first feed capstan 91 and the second feed capstan 92, and may be installed at appropriate locations.

  Furthermore, as described above, the tank direction changing roller 64 is configured as a driving rotation roller, and is not limited to the active rotation, but the tank upper direction changing roller 65 is configured as a driving rotation roller and is actively rotated. You may comprise.

In the correspondence between the configuration of the present invention and the above-described embodiment, the copper wire corresponds to the to-be-plated wire 1a and the plated wire 1b.
The copper wire feed auxiliary process corresponds to the plated wire feed auxiliary process,
The copper wire feed assisting means corresponds to the first feed capstan 91, the second feed capstan 92, and the in-tank direction changing roller 64, and the present invention is not limited to the above-described embodiment. It can be configured in various embodiments.

DESCRIPTION OF SYMBOLS 1a ... Wire to be plated 1b ... Plating wire 2 ... Pre-plating means 10 ... Plating wire manufacturing device 12 ... Supplier 22 ... Heat treatment furnace 31 ... Acid cleaning tank 41 ... Ultrasonic water cleaning tank 51 ... Soft annealing furnace 57 ... Reduction Gas supply unit 61 ... plating means 62 ... molten solder plating tank 63 ... molten solder plating solution 71 ... winding means 72 ... winding tension adjusting machine 75 ... bobbin traverse type winding machine 91 ... first feed capstan 92 ... second Feed capstan G ... Reducing gas

Claims (5)

Plating pretreatment means for performing plating pretreatment on copper wire;
Plating means for performing solder plating on the surface of the copper wire;
A solder plated wire manufacturing apparatus comprising winding means for winding a copper wire plated on the surface,
Forming the copper wire with a pure copper-based material;
The plating pretreatment means includes a softening annealing means for softening and annealing the copper wire to reduce the strength.
The copper wire having a reduced yield strength is configured to be wound by the winding means with a winding force lower than the yield strength of the copper wire,
The softening annealing means, the plating means, and the winding means are arranged in this order from the upstream side in the traveling direction of the copper wire,
A feed capstan for assisting the winding of the copper wire by the winding means;
Provided on the upstream side of the copper wire running direction than the softening annealing means ,
The plating means comprises a molten solder plating tank in which a molten solder plating solution is stored,
Inside the molten solder plating tank, a tank middle direction changing roller that changes the traveling direction of the copper wire before and after passing through the molten solder plating tank,
The feed capstan and the tank direction changing roller are constituted by an active rotating roller that actively rotates by a driving means,
The feed capstan is configured to be capable of active rotation at a feed speed faster than the winding speed of the copper wire by the winding means within a range in which the copper wire does not shake.
The solder plated wire manufacturing apparatus, wherein the tank direction changing roller is configured to be capable of active rotation at a feeding speed equivalent to a copper wire winding speed by the winding means . The apparatus for manufacturing a solder plated wire according to claim 1, wherein the feed capstan is configured to be rotatable at a feed speed that is 1 m / min faster than a winding speed of the copper wire by the winding means . In the plating pretreatment means, the cleaning means for cleaning the copper wire is provided upstream of the softening annealing means in the copper wire traveling direction,
The feed capstan,
The apparatus for manufacturing a solder plated wire according to claim 1, wherein the solder plating wire is disposed downstream of the cleaning means in the copper wire traveling direction in the copper wire traveling direction. A pre-plating process for pre-plating copper wires;
A plating process for solder plating on the surface of the copper wire;
A method of manufacturing a solder plated wire manufactured through a winding step of winding a copper wire plated on the surface,
For the copper wire, one made of a pure copper-based material is used,
In the plating pretreatment process, a softening annealing process is performed in which the copper wire is softened and annealed to reduce strength.
The winding step,
As a process of winding with a lower winding strength than the strength of the copper wire having reduced strength,
During the winding process, the softening annealing process and the plating process are continuously performed,
Before the softening annealing step, assist the winding of the copper wire in the winding step by a feed capstan ,
In the plating step, a copper wire is run inside a molten solder plating tank in which a molten solder plating solution is stored, and the molten solder plating tank is formed by a tank middle direction changing roller provided in the molten solder plating tank. Change the traveling direction of the copper wire before and after passing,
Prior to the softening annealing step, the feed capstan is actively rotated by the driving means at a feeding speed higher than the winding speed of the copper wire in the winding process in a range where the blurring of the copper wire does not occur.
The method for producing a solder plated wire, wherein, in the plating step, the tank direction changing roller is actively rotated by a driving unit at a feeding speed equal to a winding speed of the copper wire by the winding unit .   The feed capstan is actively rotated at a feed speed that is 1 m / min faster than the winding speed of the copper wire in the winding process.
The manufacturing method of the solder plating wire of Claim 4.

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