JPS6164862A - Continuous wire drawing, annealing and plating method and device therefor - Google Patents

Abstract

PURPOSE:To make it unnecessary to use uselessly heat energy by reheating a metallic wire rod at the time of plating of a molten metal, by stopping the cooling of the metallic wire rod after annealing at about a temperature of a plating molten metal, when wire-drawing a metal to the wire rod and annealing it, and thereafter, executing the plating of the molten metal. CONSTITUTION:A metallic wire rod 1 of copper, iron, etc. is subjected wire drawing in an object diameter by a wire drawing machine 2, and subsequently, led into an annealing device 5, and heated and annealed by electric conduction by a feed sheave 6. Next, it is led into a cooling chamber 7 and cooled, it is cooled to about a temperature of a molten plating metal of Sn, Zn, solder, etc. to be melted and plated in the next time, and led into a melting and plating device 13 through an oxidation preventing box 10 of an inert gas atmosphere. The wire rod plated with a molten metal is cooled to room temperature by a cooling device 14. A temperature of the wire rod going into the melting and plating device 13 is as high as the molten plating metal, therefore, reheating is not required, and a molten plating metallic wire rod can be manufactured by use of a small quantity of heat energy.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a continuous processing method for wire drawing, annealing, and hot-dip plating of metal wires such as copper, iron, alloys or composites thereof, and a method for carrying out the method. It relates to a device for.

[Conventional technology]

In the conventional continuous wire drawing, annealing and hot-dip plating process, the metal wire is drawn through a wire drawing material.

Thereafter, it is introduced into an annealing device to be heated and softened, and then sufficiently cooled by a cooling device to prevent oxidation on the surface of the sintered material, and then supplied to a plating device. In this method, the temperature of the binding material that enters the molten metal such as tin, solder, zinc, etc. in the plating equipment is sufficiently low to about room temperature, so the temperature of the molten metal itself decreases and the desired plating is performed. It is relatively difficult to do so. A large capacity heating device is required to maintain a constant temperature of the molten metal.

A common method used in conventional methods to solve this problem is to reheat the wire after it has been cooled.

The method is to introduce it into the hot-dip plating equipment in that state.

However, this method also requires a large amount of electric power for reheating, and there remains a problem in terms of energy cost from an industrial perspective.

[Problem that the invention seeks to solve]

As described above, in the conventional method, the wire rod is heated and annealed after drawing, and then the wire rod is once cooled to about room temperature. Therefore, it is difficult to control the temperature of the molten metal in the next step of hot-dip plating, and energy has to be used again to solve the problem, which is uneconomical. The present invention maintains the molten metal temperature constant without the use of energy, which is essential in conventional methods.

[Means for solving problems]

In the present invention, the influence of the molten metal temperature on the wire temperature is eliminated by cooling the wire after annealing to a temperature that is approximately equal to the temperature of the molten metal. On the other hand, oxidation of the surface of the wire that occurs before the wire in such a high temperature state enters the molten metal can be prevented by creating an oxidation-preventing atmosphere between the cooling section and the hot-dip plating section.

[Effect]

By adopting the above measures! The wire rod, which has been heated and annealed in the mirror device and cooled to a certain extent, passes through an oxidation-preventing atmosphere to prevent surface oxidation due to insufficient cooling.
Enables entry into molten metal while maintaining sufficient temperature.

〔Example〕

FIG. 1 is a schematic diagram of an apparatus for carrying out the method of the invention.

In FIG. 1, the binding material 1 is guided to the capster/3 of the wire drawing machine 2, passes through the die 4, is buried, and then enters the annealing device 5. Inside the annealing device 5, a picture center sheave 6 is arranged, and by passing through contact with them, the wire rod 1
A stream flows through the area and the area becomes heated and softens.

A cooling chamber 7 is provided downstream of the annealing device 5, and the heated and softened wire 1 is cooled in this cooling chamber Z.

As described above, in the conventional method, the wire rod 1 is cooled to about room temperature in the cooling chamber 7.

This is done by making the passage length of these wire rods 1 in the cooling chamber 7 sufficiently long, for example, as shown by the chain line 8. In the present invention, the passage length is made sufficiently short compared to the conventional one. That is, as shown in the figure, for example, a driven or non-driven guide pulley 9 is provided at a position where the wire passing distance is sufficiently reduced compared to the conventional one. By doing this, the wire rod, which has conventionally been cooled to around room temperature, can exit the annealing device 5 at a sufficiently high temperature.

- One end of an oxidation prevention box 10 is fixed to the outlet of the cooling chamber 7 of the annealing device 5. The other end of the oxidation prevention box is fixed to the base of the hot-dip plating device 16.

The inside of this oxidation prevention box 10 is filled with water vapor or an inert gas such as N2 gas, so that the wire 1 leaving the cooling chamber 7 is not oxidized despite its high temperature and is transferred to the M-dip plating device 16. The molten metal passes through the sealing die 11, is introduced into the internal molten metal and is plated, and then passes through the drawing die 12 to remove the excess molten metal. Thereafter, it is cooled in a cooling device 14, passed through a take-up hook 15 and a dancer 16, and wound onto a grain bin 17.

〔Effect of the invention〕

As described above, according to the present invention, the annealed wire rod, which was conventionally cooled to about room temperature, is kept cooled to a temperature relatively close to the molten metal temperature in the next-stage hot-dip plating equipment, thereby preventing oxidation. Measures are in place to prevent shipments. Therefore, the problem of increased energy costs due to control of molten metal temperature or reheating of the wire after cooling due to low wire temperature is completely solved.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing an example of an apparatus for carrying out the continuous wire drawing and annealing plating method according to the present invention. 1; wire rod, 2; wire drawing machine, 3; capstan, 4; die, 5; annealing device, 6; power supply/bu, 7; cooling chamber, 9; guide pulley, 10; oxidation prevention box, 11; sole Dice, 12; Drawing die, 13; Hot-dip plating device, 14; Cooling device, 15; Take-up pot, 16; G/S, 17; Bobbin. 1st item

Claims (2)

[Claims] (1) In a continuous wire drawing annealing plating method in which hot-dip plating is performed after continuously annealing a continuously drawn wire, the wire is passed through an oxidation-preventing atmosphere before the wire temperature drops sufficiently after annealing. , followed by hot-dip plating. (2) A continuous annealing device comprising a wire drawing device and a cooling chamber in the latter stage for annealing the drawn wire from the wire drawing device, and a continuous annealing device including molten metal for plating the wire after annealing. and a plating device, and includes an oxidation prevention device provided between the cooling chamber of the continuous annealing device and the continuous plating device, and the wire rod after being cooled to the degree of cooling in the cooling chamber is approximately equal to that of the continuous plating device. A continuous wire drawing annealing and plating device for wire rods, characterized in that the temperature is approximately the same as that of the molten metal in the wire rod.