GB2126250A - Production of electrotinned goods free from whiskers - Google Patents

Production of electrotinned goods free from whiskers Download PDF

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Publication number
GB2126250A
GB2126250A GB08323942A GB8323942A GB2126250A GB 2126250 A GB2126250 A GB 2126250A GB 08323942 A GB08323942 A GB 08323942A GB 8323942 A GB8323942 A GB 8323942A GB 2126250 A GB2126250 A GB 2126250A
Authority
GB
United Kingdom
Prior art keywords
tin
goods
electrotinned
whiskers
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB08323942A
Other versions
GB8323942D0 (en
Inventor
Dietrich Ascher
Dr Heinz-Georg Hiesbock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEUMAYER KARL GmbH
Original Assignee
NEUMAYER KARL GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEUMAYER KARL GmbH filed Critical NEUMAYER KARL GmbH
Publication of GB8323942D0 publication Critical patent/GB8323942D0/en
Publication of GB2126250A publication Critical patent/GB2126250A/en
Withdrawn legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48After-treatment of electroplated surfaces
    • C25D5/50After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/244Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coating With Molten Metal (AREA)

Abstract

Process for the production of electrotinned goods, in particular electrotinned wires, substantially free from whiskers, characterised in that the electrotinned goods are subjected to subsequent heat treatment, during which they are heated to a temperature just below the melting point of the tin applied by electroplating or below the eutectic temperature of the tin alloy applied. The tinned goods are preferably heated to a temperature from 5 DEG C to 30 DEG C below the melting point of tin or below the eutectic temperature. Heating preferably carried out in an inert gas.

Description

SPECIFICATION Process for the production of electrotinned goods substantially free from whiskers The invention relates to a process for the production of electrotinned goods, in particular electrotinned wires, substantially free from whiskers.
The problem of the formation of whiskers exists in tinning, especially of wires or conductor tracks. These whiskers, which consist of filamentous monocrystals, grow on tin, for example on tinned wires or conductor tracks, and can lead to various troubles, such as, for example short circuits in conductor tracks, by growing from one conductor track to another and bridging them. This whisker formation is caused by the tension in the layer of tin or tin alloy applied. If this tension decreases in the course of time through ageing, whiskers are formed as a result of the energy released.
Various measures for avoiding such adverse formation of whiskers are already known. For example, if the tin is melted, less whisker formation occurs. Although layers of tin obtained by hot tinning or by melting layers of tin applied by electroplating have the advantage of a lower tendency to form whiskers, they have the disadvantage that, especially in the case of wires, the layer of tin applied is asymmetric to the core to be tinned. This asymmetry or non-uniformity of the layer of tin applied has the disadvantage that they do not have the minimum coating thicknesses specified by the relevant standards over the cross-section mentioned, which means that difficulties may occur during soldering. As a result of diffusion of atoms from the core consisting of, for example, copper into the tin layer applied and vice versa, a copper/tin phase forms.However, if, because of the non-uniformity mentioned, the layer of tin is so thin that it is completely occupied by the copper/tin phase, no further wetting with tin in the context of a subsequent processing operation can be achieved. Such a processing operation can be, for example, soldering of a component into a printed circuit board or soldering of a wire onto a component, such as, for example, in the production of capacitors, contamination of the electrode occurring in the latter case The invention is therefore based on the object of providing a process for the production of electrotinned goods, in particular electrotinned wires, substantially free from whiskers, the invention being characterised in that the electrotinned goods are subjected to subsequent heat treatment, during which they are heated to a temperature just below the melting point of the tin applied by electroplating or just below the eutectic temperature of the tin alloy applied. The advantage of a tin layer of uniform thickness produced by electrotinning and its substantially whisker-free formation can thereby be achieved.
This reliably ensures that the layer of tin is wettable at all points and hence any subsequent processing operations can be carried out without problems.
The abovementioned mechanical tension is released by heating the material to be tinned to a high temperature, and the formation of whiskers is therefore stopped in a relatively simple and reliable manner. It is of no importance here whether the layer of tin applied by electroplating consists of pure tin or of a tin alloy, such as, for example, a tin/lead alloy. It is advantageous, especially in the case of tin/lead alloys with a high lead content, to carry out the heating according to the invention under an inert gas.
According to another advantageous embodiment of the process, the tinned goods can be heated to about 5 to about 300C below the melting point of tin or to just below the eutectic temperature of the alloy.
In the heat treatment, according to the invention, of wires, it has proved particularly advantageous if the wire or wires passes or pass continuously through a heat treatment zone. The best results have been achieved with a heating oven, but heating can also be effected inductively by infrared treatment or the like. The wire heattreated in this manner is then advantageously subjected to enforced cooling, that is to say it passes through a cooling zone, which can be realised in the most diverse manners which are known per se.
Preferably, with tinned piece goods, these can most advantageously be introduced as such into a heating oven for the purpose of the heat treatment according to the invention. When the heat treatment has been carried out, the piece goods are preferably left to cool at room temperature.
Claims
1. Process for the production of electrotinned goods, in particular electrotinned wires, substantially free from whiskers, characterised in that the electrotinned goods are subjected to subsequent heat treatment, during which they are warmed to a temperature must below the melting point of the tin applied by electroplating or below the eutectic temperature of the tin alloy applied.
2. Process according to claim 1, characterised in that the tinned goods are heated to a temperature which is up to 50C to about 300C below the melting point of tin or below the eutectic temperature.
3. Process according to claim 1 or 2, characterised in that the heating is carried out under an inert gas.
4. Process according to claim 1, 2 or 3, characterised in that the electrotinned goods are subjected to the subsequent heat treatment by continuously passing through a heat treatment zone, for example in a heating oven.
5. Process according to claim 4, characterised in that the electrotinned goods are subjected to enforced cooling after the subsequent heat treatment.
**WARNING** end of DESC field may overlap start of CLMS **.

Claims (7)

**WARNING** start of CLMS field may overlap end of DESC **. SPECIFICATION Process for the production of electrotinned goods substantially free from whiskers The invention relates to a process for the production of electrotinned goods, in particular electrotinned wires, substantially free from whiskers. The problem of the formation of whiskers exists in tinning, especially of wires or conductor tracks. These whiskers, which consist of filamentous monocrystals, grow on tin, for example on tinned wires or conductor tracks, and can lead to various troubles, such as, for example short circuits in conductor tracks, by growing from one conductor track to another and bridging them. This whisker formation is caused by the tension in the layer of tin or tin alloy applied. If this tension decreases in the course of time through ageing, whiskers are formed as a result of the energy released. Various measures for avoiding such adverse formation of whiskers are already known. For example, if the tin is melted, less whisker formation occurs. Although layers of tin obtained by hot tinning or by melting layers of tin applied by electroplating have the advantage of a lower tendency to form whiskers, they have the disadvantage that, especially in the case of wires, the layer of tin applied is asymmetric to the core to be tinned. This asymmetry or non-uniformity of the layer of tin applied has the disadvantage that they do not have the minimum coating thicknesses specified by the relevant standards over the cross-section mentioned, which means that difficulties may occur during soldering. As a result of diffusion of atoms from the core consisting of, for example, copper into the tin layer applied and vice versa, a copper/tin phase forms.However, if, because of the non-uniformity mentioned, the layer of tin is so thin that it is completely occupied by the copper/tin phase, no further wetting with tin in the context of a subsequent processing operation can be achieved. Such a processing operation can be, for example, soldering of a component into a printed circuit board or soldering of a wire onto a component, such as, for example, in the production of capacitors, contamination of the electrode occurring in the latter case The invention is therefore based on the object of providing a process for the production of electrotinned goods, in particular electrotinned wires, substantially free from whiskers, the invention being characterised in that the electrotinned goods are subjected to subsequent heat treatment, during which they are heated to a temperature just below the melting point of the tin applied by electroplating or just below the eutectic temperature of the tin alloy applied. The advantage of a tin layer of uniform thickness produced by electrotinning and its substantially whisker-free formation can thereby be achieved. This reliably ensures that the layer of tin is wettable at all points and hence any subsequent processing operations can be carried out without problems. The abovementioned mechanical tension is released by heating the material to be tinned to a high temperature, and the formation of whiskers is therefore stopped in a relatively simple and reliable manner. It is of no importance here whether the layer of tin applied by electroplating consists of pure tin or of a tin alloy, such as, for example, a tin/lead alloy. It is advantageous, especially in the case of tin/lead alloys with a high lead content, to carry out the heating according to the invention under an inert gas. According to another advantageous embodiment of the process, the tinned goods can be heated to about 5 to about 300C below the melting point of tin or to just below the eutectic temperature of the alloy. In the heat treatment, according to the invention, of wires, it has proved particularly advantageous if the wire or wires passes or pass continuously through a heat treatment zone. The best results have been achieved with a heating oven, but heating can also be effected inductively by infrared treatment or the like. The wire heattreated in this manner is then advantageously subjected to enforced cooling, that is to say it passes through a cooling zone, which can be realised in the most diverse manners which are known per se. Preferably, with tinned piece goods, these can most advantageously be introduced as such into a heating oven for the purpose of the heat treatment according to the invention. When the heat treatment has been carried out, the piece goods are preferably left to cool at room temperature. Claims
1. Process for the production of electrotinned goods, in particular electrotinned wires, substantially free from whiskers, characterised in that the electrotinned goods are subjected to subsequent heat treatment, during which they are warmed to a temperature must below the melting point of the tin applied by electroplating or below the eutectic temperature of the tin alloy applied.
2. Process according to claim 1, characterised in that the tinned goods are heated to a temperature which is up to 50C to about 300C below the melting point of tin or below the eutectic temperature.
3. Process according to claim 1 or 2, characterised in that the heating is carried out under an inert gas.
4. Process according to claim 1, 2 or 3, characterised in that the electrotinned goods are subjected to the subsequent heat treatment by continuously passing through a heat treatment zone, for example in a heating oven.
5. Process according to claim 4, characterised in that the electrotinned goods are subjected to enforced cooling after the subsequent heat treatment.
6. Process according to claim 1, 2 or 3, characterised in that the electrotinned goods are subjected to the subsequent heat treatment by introduction as piece goods into a heating oven.
7. Process according to claim 6, characterised in that the tinned goods are brought out of the oven when the heat treatment has ended and are exposed to room temperature.
GB08323942A 1982-09-07 1983-09-07 Production of electrotinned goods free from whiskers Withdrawn GB2126250A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT334882A AT378008B (en) 1982-09-07 1982-09-07 METHOD FOR PRODUCING WIRE COATED WITH A TIN ALLOY

Publications (2)

Publication Number Publication Date
GB8323942D0 GB8323942D0 (en) 1983-10-12
GB2126250A true GB2126250A (en) 1984-03-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
GB08323942A Withdrawn GB2126250A (en) 1982-09-07 1983-09-07 Production of electrotinned goods free from whiskers

Country Status (3)

Country Link
AT (1) AT378008B (en)
DE (2) DE3331212A1 (en)
GB (1) GB2126250A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1614771A1 (en) * 2004-06-25 2006-01-11 Ormecon GmbH Tin-coated printed circuit boards with a low tendency to the whisker formation
US7396596B2 (en) 2004-06-23 2008-07-08 Ormecon Gmbh Article with a coating of electrically conductive polymer
WO2010061259A1 (en) * 2008-11-27 2010-06-03 Toyota Jidosha Kabushiki Kaisha Plating substrate having sn plating layer, and fabrication method therefor
US7947199B2 (en) 2005-03-02 2011-05-24 Ormecon Gmbh Conductive polymers consisting of anisotropic morphology particles
US7989533B2 (en) 2005-08-19 2011-08-02 Ormecon Gmbh Chemical compound comprising an indium-containing intrinsically conductive polymer
US8153271B2 (en) 2006-09-13 2012-04-10 Ormecon Gmbh Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof
US8344062B2 (en) 2004-01-23 2013-01-01 Ormecon Gmbh Dispersions of intrinsically conductive polymers

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3440668A1 (en) * 1984-11-07 1986-05-07 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen METHOD FOR PRESERVING THE SOLUTABILITY OF LEAD TIN
AT386147B (en) * 1986-04-16 1988-07-11 Neumayer Karl METHOD FOR PRODUCING TAPE OR WIRE SHAPED MATERIAL
DE102010054539A1 (en) * 2010-12-15 2012-06-21 OTB Oberflächentechnik in Berlin GmbH & Co. KG Method for producing a workpiece made of copper or a copper alloy with a coating

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB985044A (en) * 1960-09-12 1965-03-03 United States Steel Corp Method and apparatus for reflowing the coating on tin plate
FR2244017B1 (en) * 1973-09-14 1977-09-23 Stephanois Rech
DE2730625C3 (en) * 1977-07-07 1980-01-17 Kabel- Und Metallwerke Gutehoffnungshuette Ag, 3000 Hannover Process for the production of heavily tinned copper wires
DE2931939C2 (en) * 1979-08-07 1982-07-08 Felten & Guilleaume Carlswerk AG, 5000 Köln Method and device for the production of heavily tinned copper wires, in particular jumper wires

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8344062B2 (en) 2004-01-23 2013-01-01 Ormecon Gmbh Dispersions of intrinsically conductive polymers
US7396596B2 (en) 2004-06-23 2008-07-08 Ormecon Gmbh Article with a coating of electrically conductive polymer
EP1614771A1 (en) * 2004-06-25 2006-01-11 Ormecon GmbH Tin-coated printed circuit boards with a low tendency to the whisker formation
US7547479B2 (en) 2004-06-25 2009-06-16 Ormecon Gmbh Tin-coated printed circuit boards with low tendency to whisker formation
US7947199B2 (en) 2005-03-02 2011-05-24 Ormecon Gmbh Conductive polymers consisting of anisotropic morphology particles
US7989533B2 (en) 2005-08-19 2011-08-02 Ormecon Gmbh Chemical compound comprising an indium-containing intrinsically conductive polymer
US8153271B2 (en) 2006-09-13 2012-04-10 Ormecon Gmbh Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof
WO2010061259A1 (en) * 2008-11-27 2010-06-03 Toyota Jidosha Kabushiki Kaisha Plating substrate having sn plating layer, and fabrication method therefor

Also Published As

Publication number Publication date
DE8325961U1 (en) 1984-12-13
DE3331212A1 (en) 1984-03-08
AT378008B (en) 1985-06-10
GB8323942D0 (en) 1983-10-12
ATA334882A (en) 1984-10-15

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WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)