JP5367752B2 - Solder plated wire manufacturing method and manufacturing apparatus - Google Patents

Description

  The present invention relates to a method and apparatus for producing a solder plated wire used in electrical and electronic equipment and communication equipment, and more specifically, a method for producing a solder plated wire having low strength characteristics suitable for use as a lead wire of a solar cell, and It relates to a manufacturing apparatus.

  Some plated wires used for electronic parts are required to have low yield strength characteristics such as a low 0.2% yield strength value. For example, the lead wire for solar cells is one of them.

Solar cells are required to be thin in order to reduce the cost of the silicon material constituting the solar cells and to mitigate the effects of insufficient material supply.
However, when the solar cell is thinned, the strength is weakened, and the connecting portion where the solar cell lead wire in the solar cell is soldered is likely to be warped or damaged due to the difference in expansion coefficient. There was a problem.

  Therefore, the solar cell lead wire needs to follow the deformation of the solar cell at the connection portion with the solar cell, and it is important to reduce the 0.2% proof stress value. For this reason, a solder plated wire having a low yield strength characteristic is used as the lead wire for the solar cell.

  Such a solder-plated wire is formed by forming a plating layer on the wire to be plated through a solder plating process as disclosed in Patent Document 1 regardless of whether or not it has low strength characteristics.

  In the solder plating process disclosed in Patent Document 1, a metal wire as a wire to be plated is introduced into a plating solution containing molten solder plating solution through a metal wire introduction port, and is led out from a solder plating wire outlet. This is a step of plating the metal wires by cooling to the atmosphere.

  Furthermore, in the solder plating wire manufacturing process, in addition to the solder plating process described above, the surface of the metal element wire is subjected to a solder plating pretreatment process such as cleaning and annealing, A winding process for winding the plated wire is performed.

  And when it is going to perform such a process continuously with respect to the to-be-plated wire which carried out low yield strength, since it becomes easy to apply a load to a to-be-plated wire, it becomes difficult to carry out a continuous process and it carries out a continuous process. Even if it was possible, it was difficult to stably obtain a plated wire having a desired quality.

  For example, too much emphasis is placed on suppressing the load applied to the plated wire whose strength has been lowered, and the surface of the plated wire cannot be sufficiently cleaned, and impurities and oxide layers may remain on the surface. .

  Then, when forming a plating layer on the surface of the wire to be plated in the subsequent solder plating process, it is difficult to stably obtain a plating wire of a desired quality such that the plating layer is easily peeled off.

  In addition, during the production of the plated wire, because the proof strength of the plated wire (wire to be plated) is low, it is not possible to increase the traveling speed of the plated wire, it takes a lot of production time, and if you try to do it continuously On the contrary, there is a problem that the production efficiency may be lowered.

As a method for producing a solder-plated wire having low yield strength characteristics, for example, Patent Document 2 proposes a method for producing a flat conductor for solar cells.
In the method of manufacturing a rectangular conductor for solar cell in Patent Document 2, the conductor is formed into a rectangular shape by a process such as rolling, and then 0.2% proof stress is reduced by a heat treatment process, or a solder plating film is formed on the surface of the conductor. It is a manufacturing method to be applied.

  However, the cited document 2 includes specific descriptions such as temperature setting for performing heat treatment, components of atmospheric gas inside the softening annealing furnace, and specific processes other than the heat treatment process such as a cleaning process. There is no mention.

  For this reason, even if the cleaning process is performed, these processes such as the heat treatment process, the cleaning process, or the plating process are performed on an independent production line. Even if it is performed, it is not certain in what process order.

  That is, as described above, Cited Document 2 has a 0.2% proof stress while it becomes difficult to ensure the quality of the lead wire of the solar cell as the 0.2% proof stress of the flat conductor is reduced. No attention is paid to two conflicting manufacturing problems that the manufacturing efficiency is lowered in order to ensure the quality of the plated wire with a reduced value.

JP 2000-80460 A JP 2006-54355 A

  Therefore, the present invention can obtain a plated wire of a desired quality with a sufficiently reduced 0.2% proof stress value, and by stably obtaining such a plated wire, the product yield can be improved. It is another object of the present invention to provide a method and apparatus for manufacturing a solder plated wire that can improve manufacturing efficiency.

The present invention relates to a plating pretreatment means for performing a plating pretreatment on a copper wire formed of a pure copper-based material, a plating means for performing solder plating on the surface of the copper wire, and winding the copper wire having the surface plated. An apparatus for producing a solder plated wire comprising a winding means, wherein the plating pretreatment means includes a softening annealing means for softening and annealing the copper wire to reduce the strength, The winding means is wound by the winding means with a winding force lower than the proof stress of the copper wire, and the softening annealing means, the plating means, and the winding means are arranged from the upstream side in the running direction of the copper wire. The plating pretreatment means includes a heat treatment means for performing a heat treatment on the copper wire, and a cleaning means. The heat treatment means and the cleaning means are more copper than the softening annealing means. Arranged in this order on the upstream side of the line travel direction, Processing means, as well as capable of setting the heat treatment temperature of 100 to 300 degrees, the anneal unit, characterized by being capable of setting the anneal temperature of 800 to 900 degrees.

  Here, the configuration in which the winding means winds with the winding force lower than the proof strength of the copper wire described above is not limited to the configuration in which the copper wire is wound only with the winding means, for example, the winding means. A feed capstan for assisting winding by the above-described arrangement is disposed upstream of the winding means, and a configuration in which a copper wire is wound by the winding means and the feed capstan is also included.

  The copper wire is not limited in shape and size, but is preferably a rectangular wire. By forming the copper wire as a rectangular wire with the above-described pure copper-based conductor material, by plating the surface, the lead wire for connection connected to a predetermined region of the silicon crystal wafer (Si cell), that is, It is because it can be used as a solder plating wire for solar cells.

  The term “arranged in series” means that they are arranged in a so-called tandem, continuously or intermittently from the upstream side to the downstream side in the traveling direction.

The pure copper-based material refers to a material having a purity of 99.9% or more that does not include impurities such as oxides such as oxygen-free copper (OFC), tough pitch copper, and phosphorus deoxidized copper .

Or octopus invention, a pre-plating treatment step of performing plating pretreatment to copper wire formed of pure copper material, a plating step of applying solder plating on the surface of the copper wire, a copper wire plated on the surface A method of manufacturing a solder plated wire manufactured through a winding process, wherein in the pre-plating process, a softening annealing process is performed to soften and anneal the copper wire to reduce the yield strength, and the winding process is performed. In the pre-plating process, the softening annealing process and the plating process are continuously performed during the winding process, with the winding process being lower than the yield strength of the copper wire having a reduced yield strength. In addition, the heat treatment step and the cleaning step are performed in this order on the copper wire before the softening annealing step, and in the heat treatment step, the heat treatment temperature is set to 100 to 300 degrees , and in the softening annealing step, , 800 to 900 And setting the softening annealing temperature.

  According to this invention, it is possible to obtain a plated wire of a desired quality with a sufficiently reduced 0.2% proof stress value, and to improve the product yield by stably obtaining such a plated wire. In addition, it is possible to provide a method and an apparatus for manufacturing a solder plated wire that can improve manufacturing efficiency.

Schematic of the manufacturing apparatus of the solder plating wire of this embodiment. Explanatory drawing of the softening annealing furnace of this embodiment. Explanatory drawing of the bobbin traverse type winder of this embodiment. The graph which shows the relationship between the softening annealing temperature which made heat processing temperature 100 degreeC, and 0.2% yield strength value. The graph which shows the relationship between heat processing temperature and a 0.2% yield strength value. The graph which shows the 0.2% yield strength value of the to-be-plated wire at the time of each using the reducing gas according to the presence or absence of hydrogen containing in a softening annealing process. The graph which shows the relationship between the hydrogen mixing ratio of reducing gas, and 0.2% yield strength value. Schematic which shows a part of manufacturing apparatus of the solder plating wire of other embodiment. Schematic which shows a part of manufacturing apparatus of the solder plating wire of other embodiment.

An embodiment of the present invention will be described below with reference to the drawings.
As shown in FIG. 1, a solder plated wire manufacturing apparatus 10 according to the present embodiment performs a plating pretreatment means 2 for performing a pretreatment for plating on a wire to be plated 1a, and performs solder plating on the surface of the wire to be plated 1a. It comprises a plating means 61 and a winding means 71 for winding the plated wire 1b plated on the surface.

  The to-be-plated wire 1a is preferably made of oxygen-free copper (OFC) with a thickness of 0.05 to 0.5 mm and a width of 0.8 to 10 mm by a separately provided flat wire manufacturing machine (not shown). A rectangular copper wire rolled with a thickness of 0.08 to 0.24 mm and a width of 1 to 2 mm is used.

  The plating pretreatment means 2 mainly comprises a supplier 11, a heat treatment furnace 22, an acid cleaning tank 31, an ultrasonic water cleaning tank 41, and a softening annealing furnace 51.

  The supplier 11 supplies the wire to be plated 1a that is wound around the drum to the production line while the drum rotates in order to be solved. The supplier 11 may be configured with a dancer function as necessary, or may be configured to be fed out in a normal lateral feed.

  The heat treatment furnace 22 has substantially the same configuration as a soft annealing furnace 51 described later, and has an outer shape that is a rectangular parallelepiped shape that is long in the traveling direction with respect to the thickness direction. The heat treatment furnace 22 is inclined and arranged along the traveling direction so that the downstream end in the traveling direction is lower than the upstream end. The inside of the heat treatment furnace 22 is a steam atmosphere having a set temperature of 200 ° C.

  A cooling water tank 23 for cooling the wire to be plated 1 a that has passed through the inside of the heat treatment furnace 22 is installed on the downstream side of the heat treatment furnace 22 in the traveling direction. The downstream end of the heat treatment furnace 22 and the cooling water tank 23 are connected to each other by a connecting pipe 24 that guides the plated wire 1a led out from the heat treatment furnace 22 to the cooling water tank 23 so as not to touch the air.

  The acid cleaning tank 31 stores a phosphoric acid cleaning liquid 32 for acid cleaning the surface of the wire 1a to be plated.

  The ultrasonic water cleaning tank 41 stores water 43 for cleaning the water-soluble lubricant and other impurities attached to the surface of the wire to be plated 1a using an ultrasonic water cleaning machine provided separately. On the bottom surface of the ultrasonic water cleaning tank 41, an ultrasonic vibration plate 42a constituting a part of the ultrasonic water cleaning machine 42 is disposed along the traveling direction of the wire to be plated 1a. Note that an air wiper 45 is provided above the ultrasonic water cleaning tank 41 to blow air from the side on the track on which the wire to be plated 1a travels toward the wire to be plated 1a.

  As shown in FIG. 2, the softening annealing furnace 51 is inclined so that the downstream end is gradually lower than the upstream end in the traveling direction. The softening annealing furnace 51 is arranged so as to penetrate the softening annealing furnace main body 52 configured in a rectangular parallelepiped shape like the heat treatment furnace 22 and the softening annealing furnace main body 52, and allows the insertion of the wire to be plated 1a. And a heater 54 that heats the inside of the softening annealing furnace main body 52.

  The sheath tube 53 is disposed along the traveling direction in the internal space of the soft annealing furnace main body 52, and protrudes from the upper end portion and the lower end portion of the soft annealing furnace main body 52 with respect to the soft annealing furnace main body 52. An upper end opening 55u is formed at the upper end of the sheath tube upper projecting portion 55 projecting from the upper end of the softening annealing furnace main body 52 in the sheath tube 53.

  The upper end opening 55u allows the introduction of the wire to be plated 1a into the sheath tube 53 and discharges the reducing gas G filled in the sheath tube 53 as will be described later. A lower end opening 55 d is formed at the lower end of the sheath pipe lower projecting portion 56 that projects from the lower end of the soft annealing furnace body 52 in the sheath pipe 53.

  The lower end opening 55d allows the wire to be plated to be led out from the sheath tube. The casing tube lower protruding portion 56 is connected to the connecting tube 58 in series. Further, a branch portion is formed in the middle portion of the sheath tube lower projecting portion 56, and the branch portion is configured as a reducing gas supply portion 57 that supplies the reducing gas G to the inside of the sheath tube 53.

  Although not shown, the reducing gas supply unit 57 includes a pressure control valve, a pressure gauge, and the like, and the reducing gas supply unit 57 reduces the reducing gas according to the concentration of the reducing gas G inside the softening annealing furnace 51. The inflow amount of G can be adjusted.

  The inside of the sheath tube 53 is made into a reducing gas atmosphere by flowing the reducing gas G from the reducing gas supply unit 57.

  The heater 54 includes a plurality of heaters configured in a straight bar shape, and is arranged in an upper space and a lower space with respect to the sheath tube 53 in the internal space of the soft annealing furnace main body 52. The heater 54 is installed in a direction orthogonal to the traveling direction of the wire to be plated 1a, specifically, in a direction corresponding to a direction perpendicular to the paper surface of FIG. 2 when the paper surface of FIG. The heaters 54 are arranged in parallel at predetermined intervals along the traveling direction in each of the upper space and the lower space.

  The temperature inside the softening annealing furnace 51 is set to 800 ° C. or higher by a heater.

  By connecting the lower protruding portion of the sheath pipe in series to the connecting pipe 58, the wire 1a to be plated that has passed through the softening annealing furnace 51 is caused to travel so as not to come into contact with air until it enters the molten solder plating solution 63. be able to.

  The plating means 61 is composed of a molten solder plating tank 62 in which a molten solder plating solution 63 is stored. The molten solder plating solution 63 is set to a set temperature of 260 ° C. and molten tin (Sn-3.0Ag-0.5Cu). Is used.

  Inside the molten solder plating tank 62, a tank middle direction changing roller 64 is disposed that changes the traveling direction of the plated wire 1b having the molten solder plating solution 63 attached to the surface thereof vertically upward.

  Furthermore, a tank upper direction changing roller 65 for changing the plating wire 1b from a traveling direction vertically upward to a direction toward the winding means 71 is provided vertically above the tank direction changing roller 64.

  The tank middle direction changing roller 64 and the tank upper direction changing roller 65 are constituted by, for example, a roller having a diameter of about 100 mm, which is larger than a normal roller having a diameter of about 20 mm. Further, the tank middle direction changing roller 64 and the tank upper direction changing roller 65 are substantially the same as the rotational speeds of dancer rollers 74 and bobbins 76, which will be described later, provided in the winding means 71 by drive motors not shown. The direction of the plated wire 1b is changed so as to actively rotate by itself at the rotational speed and to synchronize with the winding speed by the winding means 71.

Next, the winding means 71 will be described.
The winding means 71 includes a winding tension adjusting machine 72 and a bobbin traverse type winding machine 75.

  The winding tension adjuster 72 includes a dancer roller 74 that is movable in the vertical direction in accordance with the tension applied to the plated wire 1b that spans the fixed roller 73 and adjusts the tension. Although not shown, based on a tension detection sensor that detects the tension of the plated wire 1b that has been passed, a control unit that controls the tension to be stabilized according to the tension detected by the tension detection sensor, and a command from the control unit It is comprised with the roller moving machine which moves the dancer roller 74. FIG.

  As shown in FIG. 3A, the bobbin traverse type winder 75 swings the bobbin 76 along the axial direction of the bobbin 76 and the bobbin 76 configured to be wider than the width of the plating wire 1b. Motor 77 to be transmitted, and a transmission means 78 such as a ball screw for transmitting the drive of the motor 77. Further, the bobbin traverse type winding machine 75 has a winding force detection sensor 79 for detecting the winding force by the bobbin 76, and the tension is stabilized according to the winding force detected by the winding tension detection sensor 79. A control unit 81 to be controlled and a motor 82 for rotating the bobbin 76 based on a command from the control unit 81 are configured.

  The solder plating wire manufacturing apparatus 10 configured in this manner includes a supplier 11 as a plating pretreatment means 2, a heat treatment furnace 22, an acid cleaning tank 31, an ultrasonic water cleaning tank 41, a softening annealing furnace 51, and a plating. Each of the molten solder plating tank 62 as the means 61 and the winding means 71 are arranged in tandem in this order from the upstream side in the traveling direction of the plated wire 1a and the plated wire 1b.

  Further, the solder plated wire manufacturing apparatus 10 lowers the 0.2% proof stress value of the wire 1a to be plated before plating, and thereafter performs plating on the wire 1a having the reduced proof stress. While performing, it is set as the structure wound up by the said winding means 71 with the winding force lower than the yield strength of this plated wire 1b.

  Specifically, the above-described winding tension adjusting machine 72 and the bobbin traverse type winding machine 75 are adopted as the winding means 71, and the first feed capstan 91 assisting the winding of the winding means 71; A second feed capstan 92 is installed. Both the first feed capstan 91 and the second feed capstan 92 are installed on the upstream side of the soft annealing furnace 51 so as to feed and assist the traveling of the wire to be plated 1a before the reduction in yield strength.

  Specifically, the first feed capstan 91 is provided between the heat treatment furnace 22 and the acid cleaning tank 31, and the second feed capstan 92 is provided between the acid cleaning tank 31 and the softening annealing furnace 51. Yes.

  If the winding speed of the plated wire 1b is too slow or too fast, the load applied to the plated wire 1b increases. In particular, if the winding speed is too high, a problem of line blurring also occurs. Therefore, the first feed capstan 91 and the second feed capstan 92 are slightly lower than the winding speed of the winding means 71. The to-be-plated wire 1a and the plated wire 1b are sent to the downstream side at a very high speed, for example, at a feed speed that is about +1 m / min faster than the winding speed.

  In addition, the winding means 71 is appropriately provided with a plurality of fixed rollers 73 that bridge the plated wire 1b in the vicinity of the winding tension adjuster 72 and the bobbin traverse type winding machine 75 described above.

Of the plurality of fixed rollers 73 arranged in the winding means 71, the fixed roller 73 installed on the most upstream side in the running direction is set as the winding means upstream arrangement roller 73A. The winding means upstream arrangement roller 73 </ b> A is a roller that first bridges the plated wire 1 b that has traveled to the winding means 71 side after the direction is changed by the tank upward direction changing roller 65 on the winding means 71 side.
The tank upper direction changing roller 65 is arranged at a position higher than the winding means upstream arrangement roller 73A.

Then, the manufacturing method of a solder plating wire is demonstrated.
The solder plating wire manufacturing method includes a pre-plating process for performing plating pre-treatment on the plated wire 1a, a plating process for performing solder plating on the surface of the plated wire 1a, and a plated wire 1b having a plated surface. It is manufactured through a winding process.

  The plating pretreatment process is a process in which a heat treatment process, an acid washing process, a water washing process, and a softening annealing process are performed in this order.

  In the heat treatment step, the surface of the wire to be plated 1a is steam cleaned by running the wire to be plated 1a inside the heat treatment furnace 22 in a steam atmosphere. By this steam cleaning, the water-soluble lubricant and other impurities adhering to the surface of the wire to be plated 1a can be separated from the surface so that it can be easily removed.

  In the heat treatment step, the annealing temperature in the heat treatment furnace 22 is set to 200 ° C., which is lower than the general annealing temperature of about 650 ° C., the inside of the heat treatment furnace 22 set at this low temperature is made a steam atmosphere, The plating wire 1a is made to travel, and water vapor cleaning is performed on the wire to be plated 1a.

  Thus, in this step, in addition to performing steam cleaning on the wire to be plated 1a, the yield strength is also reduced by annealing the wire to be plated 1a. However, in this process, the annealing temperature is set to 200 ° C., thereby suppressing the degree of lowering the yield strength of the wire to be plated 1a. Further, the wire 1a to be plated after passing through the heat treatment furnace 22 is cooled to a predetermined temperature by the cooling water tank 23.

  In the acid cleaning step, the surface of the to-be-plated wire 1a that has traveled through the phosphoric acid-based cleaning liquid 32 stored in the acid cleaning tank 31 is cleaned.

In the water washing step, the surface of the wire to be plated 1a is ultrasonically washed in the ultrasonic water washing tank 41 to remove the water-soluble lubricant and other impurities attached to the surface of the wire to be plated 1a.
In the softening annealing step, the wire to be plated 1a is run inside the softening annealing furnace 51 in which the inside is a reducing gas atmosphere, thereby softening and annealing the wire 1a to be plated and reducing the strength, and the surface of the wire 1a to be plated. This is a step of reducing the oxide layer.

  Specifically, as shown in FIG. 2, in the softening annealing step, the sheath tube lower protruding portion is disposed inside the sheath tube 53 of the softening annealing furnace 51 that is inclined so that the downstream side is lower than the upstream side in the traveling direction. As a reducing gas G, for example, a mixed gas obtained by mixing hydrogen gas with nitrogen gas is supplied from a reducing gas supply unit 57 provided in 56, and the inside of the sheath tube 53 is set as a reducing gas atmosphere (see arrow d in FIG. 2). ). Further, the internal space of the soft annealing furnace main body 52 is heated to about 800 ° C. by the heater 54.

  In the inside of the sheath tube 53 having such a reducing gas atmosphere, the wire to be plated 1a introduced from the upper end opening 55u travels in a downward direction D that is opposite to the direction d in which the reducing gas G rises. I am letting.

  In the subsequent plating step, the wire to be plated 1a travels in the molten solder plating solution 63 stored in the molten solder plating tank 62, thereby attaching molten tin to the surface of the wire to be plated 1a.

  The to-be-plated wire 1a led out from the lower end opening 55d of the softening annealing furnace 51 is guided until it penetrates into the molten solder plating solution 63 without contacting the air by running inside the connecting pipe 58.

  The to-be-plated wire 1a that has entered the molten solder plating solution 63 becomes a plated wire 1b in which the molten solder plating solution 63 adheres to the surface and the entire surface is coated with the molten solder plating solution 63. The plating wire 1b is redirected vertically upward in the process of running through the molten solder plating tank 62 by the tank direction changing roller 64 provided in the molten solder plating tank 62 in the process of running inside the molten solder plating tank 62. Then, it is led out vertically from the molten solder plating tank 62.

  After the plating wire 1b is led out from the molten solder plating tank 62, the direction of the plating wire 1b is changed by the tank upper direction changing roller 65 and travels to the winding means 71 side.

  In the winding process, while the pre-plating process and the plating process described above are performed on the wire to be plated 1 a, the plated wire 1 b that has undergone these processes is plated by controlling the dancer roller 74 of the winding tension adjuster 72. While adjusting the tension of 1b, the bobbin traverse type winder 75 is aligned and wound around the bobbin 76.

  Specifically, as shown in FIGS. 3A and 3B, the bobbin 76 of the bobbin traverse type winding machine 75 is rotated in the axial direction of the bobbin 76 by rotating the bobbin 76, thereby causing the bobbin 76 to move the plating wire 1 b. Can be wound in parallel along the axial direction, and can be wound so as to overlap a plurality of layers.

  As shown in a partially enlarged cross-sectional view in FIG. 3B, this parallel winding is a winding for winding the plated wire 1b so that the parallel pitch of the plated wire 1b is shifted by, for example, a half pitch between the overlapping layers. It is a method.

The solder plated wire manufacturing apparatus 10 and the manufacturing method described above can obtain various actions and effects as follows.
The solder plating wire manufacturing apparatus 10 includes a supplier 11 as a plating pretreatment means 2, a heat treatment furnace 22, an acid cleaning tank 31, an ultrasonic water cleaning tank 41, a softening annealing furnace 51, and a melting as a plating means 61. The solder plating tank 62 and the winding means 71 are sequentially arranged in this order from the upstream side to the downstream side in the traveling direction of the plated wire 1b.

  By arranging each means in this way, it is possible to prevent the plated wire 1b, which has been reduced in strength during manufacturing, from traveling a useless distance, and to reduce the load applied to the plated wire 1b during traveling. it can.

  Therefore, it is possible to obtain a desired quality plated wire 1b with a sufficiently reduced 0.2% proof stress value, and by stably obtaining such a plated wire 1b, the product yield can be improved, Moreover, manufacturing efficiency can be improved.

  Furthermore, in the method for producing a solder plated wire, the heat treatment process, the acid washing process, the water washing process, the softening annealing process, the plating process, and the winding process as the plating pretreatment process are continuously performed. And do it.

  Thus, by continuously performing each process, for example, the traveling of the plated wire 1b (the plated wire 1a) is interrupted every time a predetermined process is performed, and the plated wire is placed on another traveling line to perform the next process. Since there is no need to move 1b (wire to be plated 1a), the load applied to the plated wire 1b can be greatly reduced, and a plated wire 1b having a desired quality can be stably obtained.

  Therefore, it is possible to obtain a desired quality plated wire 1b with a sufficiently reduced 0.2% proof stress value, and by stably obtaining such a plated wire 1b, the product yield can be improved, Moreover, manufacturing efficiency can be improved.

  Furthermore, since the plated wire 1b having a desired quality with a sufficiently reduced 0.2% proof stress can be efficiently produced, mass-produced low-proof plated wire 1b suitable as a lead wire for a solar cell is produced. Can also be realized.

  In addition, the solder plating wire manufacturing apparatus 10 has the soft annealing furnace 51 inclined so that the downstream side is lower than the upstream side in the running direction, and the soft annealing furnace 51 is placed on the downstream side in the running direction in the soft annealing furnace 51. In this configuration, a reducing gas supply unit 57 that allows the supply of the reducing gas G to the sheath tube 53 that allows the traveling with the plated wire 1a inserted therein is provided.

  In the softening annealing step, the solder plating wire manufacturing method is provided in the softening annealing furnace 51 at the lower end side portion (downstream side portion) of the sheath tube 53, so that the reducing gas G is supplied to the sheath tube 53 through the reducing gas supply unit 57. This is a manufacturing method in which the wire to be plated 1a travels from the upstream side to the downstream side in the traveling direction inside the sheath tube 53 that is supplied to the inside and has a reducing gas atmosphere.

  As shown in FIG. 2, by the solder plating wire manufacturing apparatus 10 and manufacturing method described above, the downward direction D, which is opposite to the direction d in which the reducing gas G rises inside the sheath tube 53 in the reducing gas atmosphere. The to-be-plated wire 1a can be made to travel toward.

  Thereby, since the to-be-plated wire 1a running inside the sheath tube 53 can be positively exposed to the atmosphere of the reducing gas G to be raised, the reduction of the oxide layer on the surface of the to-be-plated wire 1a and the to-be-plated The low proof stress of the wire 1a can be promoted efficiently.

  Moreover, immediately after the lower end side portion (downstream side portion) in the length direction of the wire to be plated 1 a traveling inside the sheath tube 53 is newly supplied to the inside of the sheath tube 53 through the reducing gas supply unit 57. It can be exposed to the atmosphere of the reducing gas G (see FIG. 2).

  That is, in the sheath tube 53, the lower the proof stress of the wire 1a to be plated and the reduction of the oxide layer on the surface can be actively promoted as the traveling wire 1a nears the reducing gas supply unit 57. Before the plated wire 1a is led out from the softening annealing furnace 51 through the reducing gas supply unit 57, it is possible to reliably reduce the yield strength of the plated wire 1a and reduce the oxide layer on the surface under heating by the heater 54. it can.

  Further, since the low yield strength of the wire to be plated 1a and the reduction of the oxide layer on the surface can be reliably and efficiently performed, the travel distance of the wire to be plated 1a that travels inside the softening annealing furnace 51. Can be shortened, and the traveling speed of the plated wire 1a can be improved.

  Further, in the pre-plating process, the surface of the wire to be plated 1a is reduced by simultaneously reducing the yield strength of the wire to be plated 1a and removing the oxide layer on the surface by using the softening annealing furnace 51 in the softening annealing step. Reducing the travel distance of the wire to be plated 1a compared with the case where the reduction step of reducing the oxide film included in the wire and the softening annealing step of softening and annealing the wire to be plated 1a are performed in series in separate steps. Can do.

  Therefore, it is possible to reduce the load applied to the plated wire 1a having reduced strength, and to manufacture a high quality solder plated wire 1b.

  Further, in the heat treatment step performed before the softening annealing step, the heat treatment furnace 22 can remove the deposits attached to the surface of the wire to be plated 1a by heating. For example, when the deposit is a liquid deposit such as oil, it can be vaporized. Thus, regardless of the nature of the deposit such as solid or liquid, the deposit can be removed from the surface of the wire 1a to be plated.

  In particular, by performing the heat treatment step immediately before the acid cleaning step, the wire to be plated 1a is heated in the heat treatment step, and the acid cleaning is performed on the wire to be plated 1a heated in the acid cleaning step. Therefore, the acid cleaning effect can be further enhanced.

Furthermore, in the heat treatment furnace 22, an annealing effect on the plated wire 1a can be obtained depending on the heating temperature.
However, according to the solder plating wire manufacturing apparatus 10 and the manufacturing method described above, the 0.2% proof stress value is completely set to a predetermined value in the heat treatment furnace 22 arranged on the upstream side of the softening annealing furnace 51 in the heat treatment process. The wire 1a is kept soft and annealed without being softened until the wire 1a is lowered. Then, in the cleaning process after the heat treatment process, the necessary cleaning for the plated wire 1a is completed, and then the 0.2% proof stress value is set to a predetermined value in the softening annealing process immediately before the plating process. Softening annealing is performed on the to-be-plated wire 1a until it falls.

  Thereby, since it is not necessary to perform a washing | cleaning process with respect to the to-be-plated wire 1a reduced in yield strength, the load concerning the to-be-plated wire 1a can be reduced.

  Specifically, the heat treatment furnace 22 has a steam atmosphere set to a low temperature of about 200 ° C. as described above, for example, while the set temperature when annealing in the normal heat treatment furnace 22 is about 650 ° C. It is said.

  Furthermore, the softening annealing furnace 51 is set to a high temperature of, for example, about 800 ° C. as described above, while the temperature setting in a normal softening annealing furnace is about 530 ° C.

  As a result, in the heat treatment process, the reduction in the yield strength of the wire to be plated 1a is suppressed, and in the softening annealing process performed after the subsequent cleaning process such as acid cleaning and ultrasonic water cleaning, the soft annealing furnace 51 is used for plating. The wire 1a is reduced in proof strength until the 0.2% proof stress value decreases to a predetermined value.

  Therefore, by performing acid cleaning and ultrasonic water cleaning on the to-be-plated wire 1a before lowering the yield strength, for example, these steps are performed on the to-be-plated wire 1a after lowering the yield strength as in the prior art. Compared with the case where it performs, the influence of the load which acts on the to-be-plated wire 1a can be reduced, and the quality improvement of the plated wire 1b can be aimed at by that much.

  In addition, since the inside of the heat treatment furnace 22 has a steam atmosphere, the wire to be plated 1a can be softened and annealed depending on the heating temperature, but a steam cleaning effect can also be expected. Therefore, in the heat treatment furnace 22, the wire to be plated 1 a is steam-washed, and then a water-soluble lubricant and other impurities attached to the surface of the wire to be plated 1 a in the acid cleaning step and the water cleaning step performed thereafter. Can be reliably removed.

  Therefore, a high quality plated wire 1b coated with a uniform plating thickness can be manufactured.

  The effect confirmation experiment will be described below.

(Effect confirmation experiment)
First, two experiments of annealing effect confirmation experiments A and B performed as an effect confirmation experiment regarding the heat treatment process and the softening annealing process will be described.
(Annealing effect confirmation experiment A)
In the annealing effect confirmation experiment A, the heat treatment process is performed under a low temperature setting of 100 ° C., and then the annealing temperature is set in the softening annealing process when softening annealing is performed under various annealing temperatures. And the relationship with the low proof stress value of the copper wire after a winding process was clarified, Based on this relationship, in order to obtain a desired low proof stress value, it confirmed about the annealing temperature which should be set in a softening annealing process.

  The annealing effect confirmation experiment A was performed under the experimental conditions shown in Table 1 using the manufacturing apparatus described above.

また、焼鈍効果確認実験Ａの結果を、表２、及び、図４に示す。

Moreover, the result of the annealing effect confirmation experiment A is shown in Table 2 and FIG.

ここで、表２は、軟化焼鈍炉５１において所定の焼鈍温度ごとの設定の下で被メッキ線に対して焼鈍を行い、巻き取り工程で巻き取り後の半田メッキ線の引張特性の１つである０．２％耐力値を測定した結果を示している。図４は、巻き取り後の半田メッキ線の０．２％耐力値と、軟化焼鈍温度との関係を、表２をもとにグラフ化したものである。

Here, Table 2 shows one of the tensile characteristics of the solder-plated wire after the wire is annealed in the softening annealing furnace 51 under the setting for each predetermined annealing temperature and wound in the winding process. The result of measuring a certain 0.2% proof stress is shown. FIG. 4 is a graph based on Table 2 showing the relationship between the 0.2% proof stress value of the solder plated wire after winding and the softening annealing temperature.

  As shown in Table 2 and FIG. 4, the heat treatment temperature in the heat treatment step is a low heat treatment temperature of 100 degrees, and the annealing temperature in the softening annealing step is, for example, When the temperature was as low as about 550 ° C., annealing to the wire to be plated 1a was insufficient, and the 0.2% proof stress value tended to be a high value.

  However, even if the heat treatment temperature in the heat treatment step is as low as 100 ° C., if the annealing temperature is 800 ° C. to 900 ° C. in the softening annealing step, the 0.2% yield strength of the plated wire 1b after winding is It was confirmed that the value could be reliably converged to a desired low proof stress value of 55 MPa or less.

(Annealing effect confirmation experiment B)
In the annealing effect confirmation experiment B, the heat treatment process is performed under various heat treatment temperatures, and the relationship between the 0.2% proof stress value of the wire to be plated 1a after the heat treatment process and the heat treatment temperature is clarified. A softening annealing process was performed on these wires 1a to be plated under a constant annealing temperature setting of 850 ° C., and the relationship between the 0.2% proof stress value after the softening annealing process and the heat treatment temperature was clarified.

  In addition, this effect confirmation experiment B was performed on the experimental conditions shown in Table 3 using the manufacturing apparatus mentioned above.

焼鈍効果確認実験Ｂの結果を、表４、及び、図５に示す。

The results of the annealing effect confirmation experiment B are shown in Table 4 and FIG.

ここで、表４（ａ）は、加熱処理工程において被メッキ線１ａに対して加熱処理を行い、軟化焼鈍工程を行う前における被メッキ線１ａの０．２％耐力値を、所定の加熱処理温度の設定ごとに測定した結果を示している。
表４（ｂ）は、上述した所定の加熱処理温度の設定ごとに、加熱処理工程を行った各被メッキ線１ａに対して、軟化焼鈍工程において焼鈍温度を８５０度という共通の設定の下で焼鈍を行い、巻取り後の半田メッキ線１ｂの０．２％耐力値を測定した結果を示している。

Here, Table 4 (a) shows that the 0.2% proof stress value of the wire to be plated 1a before the softening annealing step is performed on the wire to be plated 1a in the heat treatment step. The measurement results are shown for each temperature setting.
Table 4 (b) shows that for each setting of the predetermined heat treatment temperature described above, for each wire 1a subjected to the heat treatment step, the annealing temperature is 850 degrees in the softening annealing step under a common setting. It shows the result of annealing and measuring the 0.2% proof stress value of the solder plated wire 1b after winding.

  FIG. 5 plots the relationship between the 0.2% proof stress value of the wire to be plated 1a after passing through the heat treatment furnace 22 and the heat treatment furnace temperature based on Table 4 (a), and passes through the soft annealing furnace. It is the graph which plotted the relationship between the 0.2% yield strength value of the later to-be-plated wire 1a, and annealing temperature based on Table 4 (b).

As shown in Tables 4 (a) and 4 (b) and FIG. 5, when the heat treatment temperature was low in the heat treatment step, the annealing effect was small and the 0.2% proof stress value did not decrease. However, the annealing effect increased in the softening annealing process, and the 0.2% proof stress value could be reduced.
On the other hand, if the heat treatment temperature is high in the heat treatment step, a sufficient annealing effect can be obtained also in the heat treatment step, and the annealing effect in the softening annealing step is reduced accordingly.

  That is, regardless of the heat treatment temperature in the heat treatment step, it is confirmed that the 0.2% proof stress value can be reliably reduced to a low value of about 55 Mpa or less by setting the annealing temperature in the soft annealing step to a high temperature of 850 ° C. did it.

  Thus, regardless of the heat treatment temperature in the heat treatment step, the to-be-plated wire 1a that performs the soft annealing step in the softening annealing step that is performed after the heat treatment step is sufficiently reduced in yield strength. The result is that you can. On the contrary, from this result, it can be said that it is not always necessary to set the heat treatment temperature high, and it can be arbitrarily set according to the purpose from the heat treatment step side.

  Specifically, in the heat treatment step, by setting the heat treatment temperature to a low temperature of, for example, about 100 to 300 degrees, it is possible to suppress a reduction in the yield strength of the wire to be plated 1a in the heat treatment furnace 22. Thereby, even if a load is applied to the wire to be plated 1a after the heat treatment step and before the softening annealing step, the yield strength is reduced to such an extent that the wire to be plated 1a does not unexpectedly stretch or break. It was confirmed that it was possible in the heat treatment process.

  On the other hand, in the heat treatment step, when the heat treatment temperature is set to a temperature higher than, for example, about 100 degrees to 300 degrees, it is possible to promote a reduction in the yield strength of the plated wire 1a in the heat treatment step. For this reason, finally, the full annealing performed in order to sufficiently reduce the yield strength of the wire 1a to be plated to a level of about 55 MPa or less in the softening annealing process can be performed more quickly.

  That is, in the heat treatment step, by setting the heat treatment temperature to a temperature higher than, for example, about 100 to 300 degrees, the heat treatment step is performed as pre-annealing for reducing the yield strength of the wire to be plated 1a. The function can be fulfilled, and the annealing time of the wire 1a to be plated in the softening annealing process can be shortened. Further, in order to improve the productivity of the solder plated wire for solar cells, it is not necessary to configure the length of the softening annealing furnace 51 to be long even when the wire speed of the wire to be plated 1a is increased in the manufacturing process. It is possible to respond smoothly to the demand for improvement in linear velocity.

  Subsequently, in the softening annealing step, as an experiment for verifying the influence of the 0.2% proof stress due to the difference in the concentration of hydrogen gas contained in the reducing gas G supplied into the softening annealing furnace 51, the annealing furnace hydrogen concentration verification experiment A And an annealing furnace hydrogen concentration verification experiment B were conducted.

(Annealing furnace hydrogen concentration verification experiment A)
In the annealing furnace hydrogen concentration verification experiment A, the plating wire 1b of the example of the present invention and the plating wire of the comparative example were prepared through the above-described manufacturing steps as test specimens.
The plated wire 1b of the present invention example and the plated wire of the comparative example differ only in the softening annealing process, but all other processes are made through the same process.

  In the softening annealing process performed in order to create the plating wire 1b of the present invention example and the plating wire of the comparative example, the inside of the softening annealing furnace 51 is a reducing gas atmosphere, but the components of the reducing gas G are different. .

  That is, the reducing gas G in the case of creating the plated wire of the comparative example consists of only nitrogen gas, whereas the reducing gas G in the case of creating the plated wire 1b of the present invention example contains at least nitrogen gas. It is a mixed gas with hydrogen gas.

  In this experiment, oxygen-free copper (OFC) was used as the plated wire 1a in the production of the plated wire 1b of the present invention and the plated wire of the comparative example, and the size of the plated wire 1a was 0.16 × 2 mm, The temperature setting of the heat treatment furnace 22 was set to 200 ° C., and the respective winding linear speeds in the first feed capstan 91 and the second feed capstan 92 were set to +1 m / min.

  Moreover, when manufacturing these plated wire 1b, the acid washing | cleaning process and the ultrasonic water washing | cleaning process are performed with respect to the to-be-plated wire 1a before the softening annealing process. In the acid cleaning step, the set temperature of the phosphoric acid-based cleaning liquid was set to 50 ° C. In the plating process, the set temperature of the molten solder plating solution 63 is set to 260 ° C., and molten tin (Sn-3.0Ag-0.5Cu) is used as the molten solder plating solution 63. Further, the winding means 71 does not include the winding tension adjuster 72 but is directly wound by the bobbin traverse type winding machine 75.

  The plating wire 1b of the present invention example and the plating wire of the comparative example were prepared with three types of plating thicknesses of 20 μm, 30 μm, and 40 μm under the above-described settings, respectively, and compared for 0.2% proof stress value, respectively. The result shown in the graph of FIG.

  As shown in the graph of FIG. 6, the plated wire 1b of the example of the present invention has a 0.2% proof stress value lower than that of the comparative example regardless of whether the plating thickness is 20 μm, 30 μm, or 40 μm. It was. In particular, when the plating thickness was 40 μm, it was confirmed that the plating wire 1b of the example of the present invention had the highest rate of decrease in the 0.2% proof stress value compared to the plating wire of the comparative example.

  Therefore, in the annealing process, the lowering of the yield strength of the wire to be plated 1a can be promoted more efficiently by running the wire to be plated 1a inside the softening annealing furnace 51 having a reducing gas atmosphere containing hydrogen gas. I was able to confirm that I could do it.

(Annealing furnace hydrogen concentration verification experiment B)
In the annealing furnace hydrogen concentration verification experiment B, the reducing gas G supplied from the reducing gas supply unit 57 to the inside of the softening annealing furnace 51 is a mixed gas with hydrogen containing at least nitrogen, and hydrogen gas is supplied to the mixed gas. An experiment for verifying the influence of the 0.2% proof stress value of the plated wire 1b (wire to be plated 1a) due to the difference in the mixing ratio represented by the volume ratio occupied by the sample is performed under the experimental conditions shown in Table 5 using the manufacturing apparatus described above. I went there.

焼鈍炉水素濃度検証実験Ｂの結果を、表６、及び、図７に示す。

The results of the annealing furnace hydrogen concentration verification experiment B are shown in Table 6 and FIG.

ここで、表６は、少なくとも窒素ガスからなる還元ガスに対する水素ガスの占める混合比率が０、１０、２０、３０、４０、５０％のそれぞれの設定の場合において、還元ガスを４．０ｌ／ｍｉｎの流量で軟化焼鈍炉５１の内部に供給しながら焼鈍工程を行った場合における巻取り工程後のメッキ線１ｂの０．２％耐力値を測定した結果を示している。

Here, Table 6 shows that when the mixing ratio of the hydrogen gas to the reducing gas composed of at least nitrogen gas is set to 0, 10, 20, 30, 40, and 50%, the reducing gas is 4.0 l / min. The result of having measured the 0.2% yield strength value of the plating wire 1b after the winding process in the case where the annealing process is performed while supplying the inside of the softening annealing furnace 51 at a flow rate of 3 mm is shown.

  FIG. 7 is a graph in which the relationship between the mixing ratio of hydrogen gas in the mixed gas as the reducing gas and the 0.2% proof stress value of the solder plating wire 1b after the winding process is plotted based on Table 6.

  As shown in FIG. 7 and Table 6, as the hydrogen gas mixing ratio was increased, the 0.2% proof stress value was equal or decreased. From this, it was confirmed that the higher the hydrogen gas mixing ratio, the lower the 0.2% proof stress value tends to be low.

  Therefore, the hydrogen gas is not limited to the effect of reducing the oxide film on the surface of the wire 1a to be plated, but can increase the degree to which the 0.2% proof stress value is lowered according to the concentration of the hydrogen gas in the reducing gas. It was confirmed that it has the effect of being able to.

  Then, based on the relationship as shown in FIG. 7 between the concentration of hydrogen gas in the reducing gas and the 0.2% proof stress value of the solder plating wire 1b, the concentration of the hydrogen gas with respect to the reducing gas is controlled. It was possible to find a possibility that the degree of lowering the yield strength of the plated wire 1a can be controlled.

The solder plating wire manufacturing apparatus and the solder plating wire manufacturing method of the present invention are not limited to the configurations of the solder plating wire manufacturing apparatus 10 and the solder plating wire manufacturing method described above, and may be configured in various configurations. Can do.
For example, in the manufacturing apparatus 10A according to another embodiment, as shown in FIGS. 8A and 8B, a preheating furnace 51P may be provided between the ultrasonic water cleaning tank 41 and the softening annealing furnace 51. it can.
As shown in FIG. 8 (b), the preheating furnace 51P is specially configured to rapidly increase the temperature of the wire to be plated 1a even when the travel time and travel distance of the wire to be plated 1a are short. doing.

  Specifically, the preheating furnace 51P includes a sheath tube 53L in the preheating furnace body 52P. The sheath tube 53L is a hollow tube configured linearly along the traveling direction of the wire to be plated 1a, and when the wire to be plated 1a passes through the preheating furnace 51P and the softening annealing furnace 51, It is set as the arrangement | positioning form connected to each inside of the preheating furnace main body 52P and the soft annealing furnace main body 52 so that the plating wire 1a may not be oxidized by touching air.

  Like the soft annealing furnace 51, the pre heating furnace 51P includes a plurality of heaters 54P along the longitudinal direction of the sheath tube 53L in the pre heating furnace main body 52P. Are arranged at a narrower pitch than the arrangement interval of the heaters 54 arranged in FIG.

  As a result, even if the wire to be plated 1a is run at an increased wire speed, the wire to be plated 1a can be heated in the preheating furnace 51P as a preheating step immediately before the softening annealing step, The plated wire 1a can be supplied to the softening annealing furnace 51.

  Therefore, in response to the increase in the wire speed of the wire to be plated 1a, the wire to be plated 1a can be surely and sufficiently reduced in proof stress in the softening annealing step.

  Further, a pre-reducing gas supply portion 57P that supplies a reducing gas to a portion corresponding to the pre-heating furnace 51P in the length direction of the sheath tube 53L is provided in a portion between the softening annealing furnace 51 and the pre-heating furnace 51P in the sheath tube 53L. Is configured.

  In the reducing gas supply unit 57 described above, a mixed gas of hydrogen and nitrogen is supplied as the reducing gas G to the sheath tube 53L, and the internal space corresponding to the softening annealing furnace 51 of the sheath tube 53L is used as a mixed gas atmosphere. In the reducing gas supply unit 57P, nitrogen gas or steam gas (steam gas) is supplied as the reducing gas G to the internal space corresponding to the preheating furnace 51P of the sheath tube 53L, and the internal space is filled with a nitrogen gas atmosphere or A steam gas atmosphere is used.

  As a result, the surface of the wire to be plated 1a can be prevented from oxidizing when passing through the preheating furnace 51P, and in the preheating furnace 51P, nitrogen gas or By using water vapor gas, it is safe and easy to handle the gas.

  More specifically, when the line speed during traveling of the wire 1a to be plated is the normal setting of 4 m / min, as shown in Table 7 (a), the plating process is performed at any rectangular size and temperature setting. After passing, it can be confirmed that the 0.2% proof stress value of the plated wire 1b can be reduced to 45 Mpa or less.

なお、表７（ａ）は、サイズが０．２ｍｍ×１．０ｍｍ、０．１６ｍｍ×２．０ｍｍ、０．２ｍｍ×２．０ｍｍの３種類の平角線を被メッキ線１ａとして用い、これら被メッキ線１ａのそれぞれに対して、線速が４ｍ／ｍｉｎであり、半田温度が２４０℃、２６０℃、２８０℃の３種類のそれぞれに設定の下で、メッキ線１ｂを作成したときの０．２％耐力値とメッキ厚との値を示す表である。

In Table 7 (a), three types of rectangular wires having a size of 0.2 mm × 1.0 mm, 0.16 mm × 2.0 mm, and 0.2 mm × 2.0 mm are used as the plated wire 1a. For each of the plated wires 1a, the wire speed is 4 m / min, and the soldering temperatures are set to three types of 240 ° C., 260 ° C., and 280 ° C., respectively. It is a table | surface which shows the value of 2% yield strength value and plating thickness.

  On the other hand, when the line speed of the to-be-plated wire 1a is 13 m / min, which is a high speed setting, as shown in Table 7 (b), plating is performed at any rectangular size and temperature setting. The 0.2% proof stress value of the wire 1b was 50 Mpa or more in most settings, and was higher than that in the normal setting where the linear velocity was 4 m / min.

  This is because the wire speed of the wire to be plated 1a is set to a high speed so that the wire to be plated 1a passes through the softening annealing furnace 51 before the softening annealing furnace 51 has a sufficiently low yield strength. This is because a situation occurs in which a plated wire 1b that is not proof-proof is created.

  Table 7 (b) shows 0.2% when the wire speed is set to 13 m / min and the flat wire size and the solder temperature are set under the same settings as in Table 7 (a). It is a table | surface which shows the value of a proof stress value and plating thickness.

  That is, when the line speed of the to-be-plated wire 1a is simply set at a high speed, there is a problem in that it is not possible to sufficiently reduce the yield strength and to cope with the increase in the line speed.

  On the other hand, the manufacturing apparatus 10 </ b> A described above has a configuration in which a preheating furnace 51 </ b> P is provided between the softening annealing furnace 51 and the ultrasonic water cleaning tank 41.

  Immediately before the wire to be plated 1a is supplied to the softening annealing furnace 51 by the preheating furnace 51P, the wire to be plated 1a can be heated to a high temperature in a short time, and the softening annealing is performed in the state of the high temperature. It can be supplied to the furnace 51.

  Therefore, even when the wire speed is set to the high speed and the wire to be plated 1a is passed through the soft annealing furnace 51 at a high speed, the wire to be plated is surely reduced in yield strength in the soft annealing step. be able to.

  Specifically, as described above, by setting the preheating furnace 51P and performing the preheating process, even if the linear speed is set to a high speed of 13 m / min, the normal setting of the linear speed of 4 m / min is set. Since the 0.2% proof stress value of the to-be-plated wire 1a can be reduced to the same extent as the case, a high quality plated wire 1b having a low 0.2% proof stress value can be obtained with excellent production efficiency.

  Furthermore, even if the wire 1a to be plated is run at a high speed of 13 m / min, the oxide layer on the surface of the wire 1a can be reliably reduced in the softening annealing furnace 51.

  As described above, the preheating furnace 51P installed in the vicinity of the upstream side of the softening annealing furnace 51 has a configuration specialized for the heating performance of the wire to be plated 1a, and is supplied with nitrogen gas or water vapor gas. As a means for ensuring the softening annealing time in the softening annealing furnace 51, for example, the installation space and cost are increased as compared with a configuration in which the softening annealing furnace 51 is simply lengthened. It is possible to respond to higher line speeds by adding a simple design change level that utilizes existing equipment.

  Further, as another embodiment, the heat treatment furnace 22 is not an essential configuration, and as a manufacturing apparatus according to another embodiment, as shown in FIG. It is good also as a structure which does not install the heat processing furnace 22 in between. Furthermore, the heat treatment furnace 22 is not limited to being installed between the supplier 11 and the acid cleaning tank 31 in the traveling direction, and may be installed in other parts as long as it is upstream of the softening annealing furnace 51. .

  For example, without installing the heat treatment furnace 22 on the upstream side of the acid cleaning tank 31, only the above-described preheating furnace 51P is installed, and steam gas is used as the reducing gas supplied to the inside of the preheating furnace 51P. Also good.

  With this configuration, in the preheating furnace 51P, as described above, in addition to the function of performing preheating immediately before the softening annealing furnace 51, it is possible to have both of the functions performed by the heat treatment furnace 22 described above.

  Therefore, not only can the equipment cost be reduced, but also the travel distance of the plated wire 1a can be further shortened, and a high quality plated wire 1b having a low 0.2% proof stress value is produced. be able to.

  As described above, the inside of the softening annealing furnace 51 is a reducing gas atmosphere. However, the reducing gas G is not limited to nitrogen gas or a mixed gas of nitrogen gas and hydrogen gas as described above. Further, it may be composed of only nitrogen gas or may contain other components. Moreover, you may comprise by reducing gas other than nitrogen gas and hydrogen gas.

In the correspondence between the configuration of the present invention and the above-described embodiment, the copper wire corresponds to the to-be-plated wire 1a and the plated wire 1b of the present invention.
The heat treatment furnace 22 corresponds to the heat treatment means of the present invention.
The present invention is not limited only to the configuration of the above-described embodiment, and many embodiments can be obtained.

DESCRIPTION OF SYMBOLS 1a ... Wire to be plated 1b ... Plating wire 2 ... Pre-plating means 10 ... Plating wire manufacturing device 12 ... Supplier 22 ... Heat treatment furnace 31 ... Acid cleaning tank 41 ... Ultrasonic water cleaning tank 51 ... Soft annealing furnace 57 ... Reduction Gas supply part 61 ... Plating means 63 ... Molten solder plating solution 71 ... Winding means 72 ... Winding tension adjuster 75 ... Bobbin traverse type winding machine 83 ... Take-up capstan part G ... Reducing gas

Claims (2)

Pre-plating treatment means for performing pre-plating treatment on a copper wire formed of a pure copper-based material;
Plating means for performing solder plating on the surface of the copper wire;
A solder plated wire manufacturing apparatus comprising winding means for winding a copper wire plated on the surface,
The plating pretreatment means includes a softening annealing means for softening and annealing the copper wire to reduce the strength.
The copper wire having a reduced yield strength is configured to be wound by the winding means with a winding force lower than the yield strength of the copper wire,
The softening annealing means, the plating means, and the winding means are arranged in this order from the upstream side in the traveling direction of the copper wire,
The plating pretreatment means includes a heat treatment means for performing a heat treatment on the copper wire, and a cleaning means,
The heat treatment means and the cleaning means are arranged in this order on the upstream side in the copper wire traveling direction from the softening annealing means,
The heat treatment means,
While being configured to be set at a heat treatment temperature of 100 to 300 degrees ,
The softening annealing means,
A solder plated wire manufacturing apparatus configured to be set at a softening annealing temperature of 800 to 900 degrees . A pre-plating treatment step of performing plating pretreatment to copper wire formed of pure copper material,
A plating process for solder plating on the surface of the copper wire;
A method of manufacturing a solder plated wire manufactured through a winding step of winding a copper wire plated on the surface,
In the plating pretreatment process, a softening annealing process is performed in which the copper wire is softened and annealed to reduce strength.
The winding step,
As a process of winding with a lower winding strength than the strength of the copper wire having reduced strength,
During the winding process, the softening annealing process and the plating process are continuously performed,
In the plating pretreatment step,
Before the softening annealing step, the copper wire is subjected to a heat treatment step and a cleaning step in this order,
In the heat treatment step, the heat treatment temperature is set to 100 to 300 degrees ,
In the softening annealing step, a method for producing a solder plated wire, which is set to a softening annealing temperature of 800 to 900 degrees .

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