TWI553658B - Conductive particles, conductive materials and connecting structures - Google Patents

Conductive particles, conductive materials and connecting structures Download PDF

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Publication number
TWI553658B
TWI553658B TW101149095A TW101149095A TWI553658B TW I553658 B TWI553658 B TW I553658B TW 101149095 A TW101149095 A TW 101149095A TW 101149095 A TW101149095 A TW 101149095A TW I553658 B TWI553658 B TW I553658B
Authority
TW
Taiwan
Prior art keywords
conductive layer
weight
conductive
particles
nickel
Prior art date
Application number
TW101149095A
Other languages
English (en)
Chinese (zh)
Other versions
TW201337951A (zh
Inventor
Keizo Nishioka
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW201337951A publication Critical patent/TW201337951A/zh
Application granted granted Critical
Publication of TWI553658B publication Critical patent/TWI553658B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18—Non-metallic particles coated with metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
TW101149095A 2011-12-21 2012-12-21 Conductive particles, conductive materials and connecting structures TWI553658B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011280085 2011-12-21

Publications (2)

Publication Number Publication Date
TW201337951A TW201337951A (zh) 2013-09-16
TWI553658B true TWI553658B (zh) 2016-10-11

Family

ID=48668521

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101149095A TWI553658B (zh) 2011-12-21 2012-12-21 Conductive particles, conductive materials and connecting structures

Country Status (5)

Country Link
JP (3) JP5297569B1 (ko)
KR (1) KR101941721B1 (ko)
CN (1) CN103748635B (ko)
TW (1) TWI553658B (ko)
WO (1) WO2013094637A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015109267A (ja) * 2013-10-21 2015-06-11 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6397736B2 (ja) * 2013-11-18 2018-09-26 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
CN112863732B (zh) * 2014-10-29 2023-01-17 迪睿合株式会社 连接结构体的制造方法、连接结构体以及导电材料
CN107851482B (zh) * 2016-02-08 2020-03-20 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
KR102222105B1 (ko) * 2019-07-31 2021-03-03 덕산하이메탈(주) 도전입자, 도전재료 및 접속 구조체

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080078977A1 (en) * 2006-09-29 2008-04-03 Nisshinbo Industries, Inc. Conductive particles and method of preparing the same
TW201100593A (en) * 2009-06-17 2011-01-01 Enthone Electrolytic deposition of metal-based composite coatings comprising nano-particles
TW201125661A (en) * 2009-08-06 2011-08-01 Hitachi Chemical Co Ltd Conductive fine particles and anisotropic conductive material
TW201139124A (en) * 2010-03-01 2011-11-16 Nippon Steel Chemical Co Metal microparticle composite and method for manufacturing the same

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JPH07207185A (ja) * 1994-01-21 1995-08-08 Kawazumi Gijutsu Kenkyusho:Kk 被覆パラジウム微粉末および導電性ペースト
JP3696429B2 (ja) 1999-02-22 2005-09-21 日本化学工業株式会社 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料
JP4864195B2 (ja) * 2000-08-30 2012-02-01 三井金属鉱業株式会社 被覆銅粉
JP2002275511A (ja) * 2001-03-15 2002-09-25 Murata Mfg Co Ltd 金属粉末の製造方法、金属粉末、導電性ペーストならびに積層セラミック電子部品
JP4017903B2 (ja) * 2002-04-01 2007-12-05 宇部日東化成株式会社 導電性粒子およびその製造方法
JP4737177B2 (ja) * 2006-10-31 2011-07-27 日立化成工業株式会社 回路接続構造体
CN101210305B (zh) * 2006-12-31 2011-09-28 成都深嘉机械制造有限公司 钨合金复合镀层材料及制造方法
JP5139002B2 (ja) * 2007-08-10 2013-02-06 株式会社東芝 微粒子担持方法および微粒子担持装置
JP4714719B2 (ja) * 2007-09-07 2011-06-29 積水化学工業株式会社 導電性微粒子の製造方法
JP2009224059A (ja) * 2008-03-13 2009-10-01 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
JP5430093B2 (ja) * 2008-07-24 2014-02-26 デクセリアルズ株式会社 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
JP4752986B1 (ja) * 2010-01-08 2011-08-17 日立化成工業株式会社 回路接続用接着フィルム及び回路接続構造体
JP5534891B2 (ja) * 2010-03-26 2014-07-02 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、異方性導電材料及び接続構造体
JP2012164454A (ja) * 2011-02-04 2012-08-30 Sony Chemical & Information Device Corp 導電性粒子及びこれを用いた異方性導電材料
KR101626266B1 (ko) * 2011-07-28 2016-05-31 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
JP5952553B2 (ja) * 2011-12-14 2016-07-13 株式会社日本触媒 導電性微粒子及びこれを含む異方性導電材料

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080078977A1 (en) * 2006-09-29 2008-04-03 Nisshinbo Industries, Inc. Conductive particles and method of preparing the same
TW201100593A (en) * 2009-06-17 2011-01-01 Enthone Electrolytic deposition of metal-based composite coatings comprising nano-particles
TW201125661A (en) * 2009-08-06 2011-08-01 Hitachi Chemical Co Ltd Conductive fine particles and anisotropic conductive material
TW201139124A (en) * 2010-03-01 2011-11-16 Nippon Steel Chemical Co Metal microparticle composite and method for manufacturing the same

Also Published As

Publication number Publication date
CN103748635B (zh) 2016-08-31
WO2013094637A1 (ja) 2013-06-27
TW201337951A (zh) 2013-09-16
JP5297569B1 (ja) 2013-09-25
JP2016219438A (ja) 2016-12-22
JPWO2013094637A1 (ja) 2015-04-27
CN103748635A (zh) 2014-04-23
KR101941721B1 (ko) 2019-01-23
JP6004983B2 (ja) 2016-10-12
JP2013232408A (ja) 2013-11-14
JP6276351B2 (ja) 2018-02-07
KR20140106385A (ko) 2014-09-03

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