TWI552832B - 包含相分離聚合物摻合物之拋光墊及其製造及使用方法 - Google Patents

包含相分離聚合物摻合物之拋光墊及其製造及使用方法 Download PDF

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Publication number
TWI552832B
TWI552832B TW099146701A TW99146701A TWI552832B TW I552832 B TWI552832 B TW I552832B TW 099146701 A TW099146701 A TW 099146701A TW 99146701 A TW99146701 A TW 99146701A TW I552832 B TWI552832 B TW I552832B
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TW
Taiwan
Prior art keywords
polishing
elements
polishing pad
major side
polymer
Prior art date
Application number
TW099146701A
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English (en)
Chinese (zh)
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TW201136710A (en
Inventor
威廉 戴爾 喬瑟夫
史戴芬 克萊格 洛派
蓋瑞 馬爾文 潘格林
克里斯多夫 尼可拉斯 洛奇
Original Assignee
３Ｍ新設資產公司
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Publication date
Application filed by ３Ｍ新設資產公司 filed Critical ３Ｍ新設資產公司
Publication of TW201136710A publication Critical patent/TW201136710A/zh
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Publication of TWI552832B publication Critical patent/TWI552832B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW099146701A 2009-12-30 2010-12-29 包含相分離聚合物摻合物之拋光墊及其製造及使用方法 TWI552832B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29117609P 2009-12-30 2009-12-30

Publications (2)

Publication Number Publication Date
TW201136710A TW201136710A (en) 2011-11-01
TWI552832B true TWI552832B (zh) 2016-10-11

Family

ID=44227135

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099146701A TWI552832B (zh) 2009-12-30 2010-12-29 包含相分離聚合物摻合物之拋光墊及其製造及使用方法

Country Status (7)

Country Link
US (1) US9162340B2 (enExample)
JP (1) JP6004941B2 (enExample)
KR (1) KR20120125612A (enExample)
CN (1) CN102686362A (enExample)
SG (1) SG181678A1 (enExample)
TW (1) TWI552832B (enExample)
WO (1) WO2011082155A2 (enExample)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110033277A (ko) * 2008-07-18 2011-03-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 플로팅 요소를 구비한 연마 패드 및 이 연마 패드의 제작 방법과 이용 방법
US9554888B2 (en) * 2010-04-20 2017-01-31 University Of Utah Research Foundation Phase separation sprayed scaffold
KR102100654B1 (ko) 2012-04-02 2020-04-14 토마스 웨스트 인코포레이티드 폴리머 연마패드의 원심주조를 위한 방법 및 시스템 및 상기 방법으로 만들어진 연마패드
US10722997B2 (en) * 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
WO2015153601A1 (en) 2014-04-03 2015-10-08 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
WO2015171419A1 (en) * 2014-05-07 2015-11-12 Cabot Microelectronics Corporation Multi-layer polishing pad for cmp
US9873180B2 (en) * 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
TWI689406B (zh) 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
KR20240015167A (ko) 2014-10-17 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
CN107614200B (zh) * 2015-05-13 2020-05-08 3M创新有限公司 抛光垫和使用抛光垫的系统和方法
KR101600393B1 (ko) * 2015-05-20 2016-03-07 에프엔에스테크 주식회사 연마 패드 및 이의 제조 방법
TWI769988B (zh) * 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
CN112025544B (zh) * 2015-10-16 2022-11-01 应用材料公司 使用增材制造工艺形成先进抛光垫的方法和设备
CN113103145B (zh) 2015-10-30 2023-04-11 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
KR20240015161A (ko) 2016-01-19 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 다공성 화학적 기계적 연마 패드들
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
WO2017155969A1 (en) 2016-03-09 2017-09-14 Applied Materials, Inc. Pad structure and fabrication methods
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
JP7165719B2 (ja) 2017-08-04 2022-11-04 スリーエム イノベイティブ プロパティズ カンパニー 平坦性が向上された微細複製研磨表面
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN107866756B (zh) * 2017-12-05 2019-03-19 长沙理工大学 一种有序微槽结构多层超硬磨料电镀砂轮的制备方法
WO2019152222A1 (en) 2018-02-05 2019-08-08 Applied Materials, Inc. Piezo-electric end-pointing for 3d printed cmp pads
US11826876B2 (en) 2018-05-07 2023-11-28 Applied Materials, Inc. Hydrophilic and zeta potential tunable chemical mechanical polishing pads
US11999029B2 (en) * 2018-06-29 2024-06-04 Saint-Gobain Abrasives, Inc. Abrasive articles and methods for forming same
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
CN110776724B (zh) * 2019-10-23 2022-02-25 青岛科技大学 一种功能性弹性发泡材料及其制备方法和应用
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
CN115666852A (zh) * 2020-04-21 2023-01-31 美商智能垫有限责任公司 具有凸出结构的化学机械抛光垫
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
WO2022014978A1 (ko) * 2020-07-16 2022-01-20 한국생산기술연구원 연마 패드, 이를 포함하는 연마 장치, 그리고 연마 패드의 제조 방법
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN118290810B (zh) * 2024-06-05 2024-08-13 浙江新恒泰新材料股份有限公司 一种微孔发泡热塑性聚氨酯基材及其制备方法与应用

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050221741A1 (en) * 1992-08-19 2005-10-06 Reinhardt Heinz F Polymeric polishing pad having continuously regenerated work surface
TWI268831B (en) * 2002-09-17 2006-12-21 Korea Polyol Co Ltd Integral polishing pad and manufacturing method thereof
TWI279289B (en) * 2004-09-01 2007-04-21 Cabot Microelectronics Corp Polishing pad with microporous regions
US20070128991A1 (en) * 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
TWI293911B (en) * 2004-05-11 2008-03-01 Innopad Inc Polishing pad
US20090270019A1 (en) * 2008-04-29 2009-10-29 Rajeev Bajaj Polishing pad composition and method of manufacture and use

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5257478A (en) 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US5578098A (en) * 1990-10-09 1996-11-26 Minnesota Mining And Manufacturing Company Coated abrasive containing erodible agglomerates
US5489233A (en) 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5609517A (en) * 1995-11-20 1997-03-11 International Business Machines Corporation Composite polishing pad
JPH10156705A (ja) 1996-11-29 1998-06-16 Sumitomo Metal Ind Ltd 研磨装置および研磨方法
US6126532A (en) 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
JP4293480B2 (ja) * 1999-01-12 2009-07-08 東洋ゴム工業株式会社 研磨パッドの製造方法
US6641463B1 (en) 1999-02-06 2003-11-04 Beaver Creek Concepts Inc Finishing components and elements
US6238592B1 (en) 1999-03-10 2001-05-29 3M Innovative Properties Company Working liquids and methods for modifying structured wafers suited for semiconductor fabrication
JP2000263423A (ja) * 1999-03-16 2000-09-26 Toray Ind Inc 研磨パッドおよび研磨装置
US6491843B1 (en) 1999-12-08 2002-12-10 Eastman Kodak Company Slurry for chemical mechanical polishing silicon dioxide
US20020068516A1 (en) 1999-12-13 2002-06-06 Applied Materials, Inc Apparatus and method for controlled delivery of slurry to a region of a polishing device
US6702954B1 (en) 2000-10-19 2004-03-09 Ferro Corporation Chemical-mechanical polishing slurry and method
US20020072296A1 (en) 2000-11-29 2002-06-13 Muilenburg Michael J. Abrasive article having a window system for polishing wafers, and methods
JP3804064B2 (ja) 2001-12-04 2006-08-02 株式会社東京精密 ウェーハ研磨装置の研磨終点検出方法及び装置
JP2003136397A (ja) * 2001-11-01 2003-05-14 Roki Techno Co Ltd 研磨パッド
US6722946B2 (en) 2002-01-17 2004-04-20 Nutool, Inc. Advanced chemical mechanical polishing system with smart endpoint detection
JP2003318140A (ja) * 2002-04-26 2003-11-07 Applied Materials Inc 研磨方法及び装置
US20050194681A1 (en) * 2002-05-07 2005-09-08 Yongqi Hu Conductive pad with high abrasion
US20040171339A1 (en) 2002-10-28 2004-09-02 Cabot Microelectronics Corporation Microporous polishing pads
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
JP2004160573A (ja) 2002-11-11 2004-06-10 Ebara Corp 研磨装置
US6908366B2 (en) 2003-01-10 2005-06-21 3M Innovative Properties Company Method of using a soft subpad for chemical mechanical polishing
KR20060035653A (ko) 2003-07-01 2006-04-26 어플라이드 머티어리얼스, 인코포레이티드 Ｅｃｍｐ용 셀, 시스템 및 물품
JP2007081322A (ja) 2005-09-16 2007-03-29 Jsr Corp 化学機械研磨パッドの製造方法
JP4697399B2 (ja) * 2004-06-11 2011-06-08 Ｊｓｒ株式会社 化学機械研磨パッド及び化学機械研磨方法
US20060258276A1 (en) 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
US7523440B2 (en) 2004-11-16 2009-04-21 The Mathworks, Inc. Dynamic generation of formatted user interfaces in software environments
JP2006142439A (ja) 2004-11-22 2006-06-08 Sumitomo Bakelite Co Ltd 研磨パッドおよびこれを用いた研磨方法
US7846008B2 (en) * 2004-11-29 2010-12-07 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization and CMP pad
WO2006057714A2 (en) 2004-11-29 2006-06-01 Rajeev Bajaj Method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
US20080318505A1 (en) * 2004-11-29 2008-12-25 Rajeev Bajaj Chemical mechanical planarization pad and method of use thereof
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
US7267610B1 (en) * 2006-08-30 2007-09-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having unevenly spaced grooves
US20090062414A1 (en) * 2007-08-28 2009-03-05 David Picheng Huang System and method for producing damping polyurethane CMP pads
US8066555B2 (en) * 2007-09-03 2011-11-29 Semiquest Inc. Polishing pad
CN102089122A (zh) * 2008-05-15 2011-06-08 3M创新有限公司 具有终点窗口的抛光垫以及使用其的系统和方法
WO2009158665A1 (en) 2008-06-26 2009-12-30 3M Innovative Properties Company Polishing pad with porous elements and method of making and using the same
KR20110033277A (ko) 2008-07-18 2011-03-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 플로팅 요소를 구비한 연마 패드 및 이 연마 패드의 제작 방법과 이용 방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050221741A1 (en) * 1992-08-19 2005-10-06 Reinhardt Heinz F Polymeric polishing pad having continuously regenerated work surface
TWI268831B (en) * 2002-09-17 2006-12-21 Korea Polyol Co Ltd Integral polishing pad and manufacturing method thereof
TWI293911B (en) * 2004-05-11 2008-03-01 Innopad Inc Polishing pad
TWI279289B (en) * 2004-09-01 2007-04-21 Cabot Microelectronics Corp Polishing pad with microporous regions
US20070128991A1 (en) * 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
US20090270019A1 (en) * 2008-04-29 2009-10-29 Rajeev Bajaj Polishing pad composition and method of manufacture and use

Also Published As

Publication number Publication date
SG181678A1 (en) 2012-07-30
KR20120125612A (ko) 2012-11-16
WO2011082155A2 (en) 2011-07-07
JP2013516768A (ja) 2013-05-13
US9162340B2 (en) 2015-10-20
WO2011082155A3 (en) 2011-11-17
JP6004941B2 (ja) 2016-10-12
TW201136710A (en) 2011-11-01
CN102686362A (zh) 2012-09-19
US20120315830A1 (en) 2012-12-13

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