KR20120125612A - 상-분리 중합체 블렌드를 포함하는 폴리싱 패드 및 이의 제조 및 사용 방법 - Google Patents

상-분리 중합체 블렌드를 포함하는 폴리싱 패드 및 이의 제조 및 사용 방법 Download PDF

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Publication number
KR20120125612A
KR20120125612A KR1020127019847A KR20127019847A KR20120125612A KR 20120125612 A KR20120125612 A KR 20120125612A KR 1020127019847 A KR1020127019847 A KR 1020127019847A KR 20127019847 A KR20127019847 A KR 20127019847A KR 20120125612 A KR20120125612 A KR 20120125612A
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South Korea
Prior art keywords
polishing
polishing pad
pad
polymer
elements
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Ceased
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KR1020127019847A
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English (en)
Korean (ko)
Inventor
윌리암 디 조셉
게리 엠 팜그렌
스테펜 씨 로퍼
크리스토퍼 엔 로에쉬
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쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20120125612A publication Critical patent/KR20120125612A/ko
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020127019847A 2009-12-30 2010-12-28 상-분리 중합체 블렌드를 포함하는 폴리싱 패드 및 이의 제조 및 사용 방법 Ceased KR20120125612A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29117609P 2009-12-30 2009-12-30
US61/291,176 2009-12-30
PCT/US2010/062204 WO2011082155A2 (en) 2009-12-30 2010-12-28 Polishing pads including phase-separated polymer blend and method of making and using the same

Publications (1)

Publication Number Publication Date
KR20120125612A true KR20120125612A (ko) 2012-11-16

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KR1020127019847A Ceased KR20120125612A (ko) 2009-12-30 2010-12-28 상-분리 중합체 블렌드를 포함하는 폴리싱 패드 및 이의 제조 및 사용 방법

Country Status (7)

Country Link
US (1) US9162340B2 (enExample)
JP (1) JP6004941B2 (enExample)
KR (1) KR20120125612A (enExample)
CN (1) CN102686362A (enExample)
SG (1) SG181678A1 (enExample)
TW (1) TWI552832B (enExample)
WO (1) WO2011082155A2 (enExample)

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KR20170071559A (ko) * 2014-10-17 2017-06-23 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스에 의해 제조되는 폴리싱 패드들
KR20180066126A (ko) * 2015-10-07 2018-06-18 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법
US11446788B2 (en) 2014-10-17 2022-09-20 Applied Materials, Inc. Precursor formulations for polishing pads produced by an additive manufacturing process
US11724362B2 (en) 2014-10-17 2023-08-15 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US11772229B2 (en) 2016-01-19 2023-10-03 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process

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TWI754275B (zh) * 2015-10-16 2022-02-01 美商應用材料股份有限公司 拋光墊及形成其之方法
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
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WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN109773671B (zh) * 2017-12-05 2020-11-20 长沙理工大学 一种有序微槽结构多层超硬磨料电镀砂轮
CN111684571A (zh) 2018-02-05 2020-09-18 应用材料公司 用于3d打印的cmp垫的压电终点指示
EP3790706A4 (en) 2018-05-07 2022-02-16 Applied Materials, Inc. CHEMICAL MECHANICAL POLISHING PADS WITH ADJUSTABLE HYDROPHIL AND ZETA POTENTIAL
PL3814053T3 (pl) * 2018-06-29 2026-02-23 Saint-Gobain Abrasives, Inc. Artykuły ścierne i sposoby ich tworzenia
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US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
CN110776724B (zh) * 2019-10-23 2022-02-25 青岛科技大学 一种功能性弹性发泡材料及其制备方法和应用
US11813712B2 (en) * 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US20210323114A1 (en) * 2020-04-21 2021-10-21 Smart Pad LLC Chemical-mechanical polishing pad with protruded structures
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
WO2022014978A1 (ko) * 2020-07-16 2022-01-20 한국생산기술연구원 연마 패드, 이를 포함하는 연마 장치, 그리고 연마 패드의 제조 방법
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN118290810B (zh) * 2024-06-05 2024-08-13 浙江新恒泰新材料股份有限公司 一种微孔发泡热塑性聚氨酯基材及其制备方法与应用

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170071559A (ko) * 2014-10-17 2017-06-23 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스에 의해 제조되는 폴리싱 패드들
US11446788B2 (en) 2014-10-17 2022-09-20 Applied Materials, Inc. Precursor formulations for polishing pads produced by an additive manufacturing process
US11724362B2 (en) 2014-10-17 2023-08-15 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US11958162B2 (en) 2014-10-17 2024-04-16 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
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Also Published As

Publication number Publication date
CN102686362A (zh) 2012-09-19
SG181678A1 (en) 2012-07-30
US9162340B2 (en) 2015-10-20
JP2013516768A (ja) 2013-05-13
WO2011082155A3 (en) 2011-11-17
WO2011082155A2 (en) 2011-07-07
TW201136710A (en) 2011-11-01
TWI552832B (zh) 2016-10-11
JP6004941B2 (ja) 2016-10-12
US20120315830A1 (en) 2012-12-13

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