KR20120125612A - 상-분리 중합체 블렌드를 포함하는 폴리싱 패드 및 이의 제조 및 사용 방법 - Google Patents

상-분리 중합체 블렌드를 포함하는 폴리싱 패드 및 이의 제조 및 사용 방법 Download PDF

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Publication number
KR20120125612A
KR20120125612A KR1020127019847A KR20127019847A KR20120125612A KR 20120125612 A KR20120125612 A KR 20120125612A KR 1020127019847 A KR1020127019847 A KR 1020127019847A KR 20127019847 A KR20127019847 A KR 20127019847A KR 20120125612 A KR20120125612 A KR 20120125612A
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KR
South Korea
Prior art keywords
polishing
polishing pad
pad
polymer
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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KR1020127019847A
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English (en)
Korean (ko)
Inventor
윌리암 디 조셉
게리 엠 팜그렌
스테펜 씨 로퍼
크리스토퍼 엔 로에쉬
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20120125612A publication Critical patent/KR20120125612A/ko
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020127019847A 2009-12-30 2010-12-28 상-분리 중합체 블렌드를 포함하는 폴리싱 패드 및 이의 제조 및 사용 방법 Ceased KR20120125612A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29117609P 2009-12-30 2009-12-30
US61/291,176 2009-12-30
PCT/US2010/062204 WO2011082155A2 (en) 2009-12-30 2010-12-28 Polishing pads including phase-separated polymer blend and method of making and using the same

Publications (1)

Publication Number Publication Date
KR20120125612A true KR20120125612A (ko) 2012-11-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127019847A Ceased KR20120125612A (ko) 2009-12-30 2010-12-28 상-분리 중합체 블렌드를 포함하는 폴리싱 패드 및 이의 제조 및 사용 방법

Country Status (7)

Country Link
US (1) US9162340B2 (enExample)
JP (1) JP6004941B2 (enExample)
KR (1) KR20120125612A (enExample)
CN (1) CN102686362A (enExample)
SG (1) SG181678A1 (enExample)
TW (1) TWI552832B (enExample)
WO (1) WO2011082155A2 (enExample)

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KR20170071559A (ko) * 2014-10-17 2017-06-23 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스에 의해 제조되는 폴리싱 패드들
KR20180066126A (ko) * 2015-10-07 2018-06-18 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법
US11446788B2 (en) 2014-10-17 2022-09-20 Applied Materials, Inc. Precursor formulations for polishing pads produced by an additive manufacturing process
US11724362B2 (en) 2014-10-17 2023-08-15 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US11772229B2 (en) 2016-01-19 2023-10-03 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process

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TWI689406B (zh) 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
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KR102608124B1 (ko) * 2017-08-04 2023-11-29 쓰리엠 이노베이티브 프로퍼티즈 컴파니 향상된 동일 평면성을 갖는 미세복제된 폴리싱 표면
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CN109773671B (zh) * 2017-12-05 2020-11-20 长沙理工大学 一种有序微槽结构多层超硬磨料电镀砂轮
WO2019152222A1 (en) 2018-02-05 2019-08-08 Applied Materials, Inc. Piezo-electric end-pointing for 3d printed cmp pads
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KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
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US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
CN110776724B (zh) * 2019-10-23 2022-02-25 青岛科技大学 一种功能性弹性发泡材料及其制备方法和应用
US11813712B2 (en) * 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US20230226660A1 (en) * 2020-07-16 2023-07-20 Korea Institute Of Industrial Technology Polishing pad, polishing device including same, and manufacturing method thereof
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN118290810B (zh) * 2024-06-05 2024-08-13 浙江新恒泰新材料股份有限公司 一种微孔发泡热塑性聚氨酯基材及其制备方法与应用

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170071559A (ko) * 2014-10-17 2017-06-23 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스에 의해 제조되는 폴리싱 패드들
US11446788B2 (en) 2014-10-17 2022-09-20 Applied Materials, Inc. Precursor formulations for polishing pads produced by an additive manufacturing process
US11724362B2 (en) 2014-10-17 2023-08-15 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
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Also Published As

Publication number Publication date
US20120315830A1 (en) 2012-12-13
TW201136710A (en) 2011-11-01
JP6004941B2 (ja) 2016-10-12
TWI552832B (zh) 2016-10-11
SG181678A1 (en) 2012-07-30
WO2011082155A3 (en) 2011-11-17
CN102686362A (zh) 2012-09-19
US9162340B2 (en) 2015-10-20
WO2011082155A2 (en) 2011-07-07
JP2013516768A (ja) 2013-05-13

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