CN102686362A - 包括分相共混聚合物的抛光垫及其制备和使用方法 - Google Patents

包括分相共混聚合物的抛光垫及其制备和使用方法 Download PDF

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Publication number
CN102686362A
CN102686362A CN2010800603140A CN201080060314A CN102686362A CN 102686362 A CN102686362 A CN 102686362A CN 2010800603140 A CN2010800603140 A CN 2010800603140A CN 201080060314 A CN201080060314 A CN 201080060314A CN 102686362 A CN102686362 A CN 102686362A
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CN
China
Prior art keywords
polishing
polishing pad
elements
major side
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800603140A
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English (en)
Chinese (zh)
Inventor
威廉·D·约瑟夫
加里·M·帕尔姆格伦
斯蒂芬·C·洛珀
克里斯托佛·N·勒施
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN102686362A publication Critical patent/CN102686362A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN2010800603140A 2009-12-30 2010-12-28 包括分相共混聚合物的抛光垫及其制备和使用方法 Pending CN102686362A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29117609P 2009-12-30 2009-12-30
US61/291,176 2009-12-30
PCT/US2010/062204 WO2011082155A2 (en) 2009-12-30 2010-12-28 Polishing pads including phase-separated polymer blend and method of making and using the same

Publications (1)

Publication Number Publication Date
CN102686362A true CN102686362A (zh) 2012-09-19

Family

ID=44227135

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800603140A Pending CN102686362A (zh) 2009-12-30 2010-12-28 包括分相共混聚合物的抛光垫及其制备和使用方法

Country Status (7)

Country Link
US (1) US9162340B2 (enExample)
JP (1) JP6004941B2 (enExample)
KR (1) KR20120125612A (enExample)
CN (1) CN102686362A (enExample)
SG (1) SG181678A1 (enExample)
TW (1) TWI552832B (enExample)
WO (1) WO2011082155A2 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107614200A (zh) * 2015-05-13 2018-01-19 3M创新有限公司 抛光垫和使用抛光垫的系统和方法
CN110776724A (zh) * 2019-10-23 2020-02-11 青岛科技大学 一种功能性弹性发泡材料及其制备方法和应用
CN111032284A (zh) * 2017-08-04 2020-04-17 3M创新有限公司 具有增强的共平面性的微复制型抛光表面
CN112423935A (zh) * 2018-06-29 2021-02-26 圣戈班磨料磨具有限公司 磨料制品及其形成方法
TWI754275B (zh) * 2015-10-16 2022-02-01 美商應用材料股份有限公司 拋光墊及形成其之方法
US11772229B2 (en) 2016-01-19 2023-10-03 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN118290810A (zh) * 2024-06-05 2024-07-05 浙江新恒泰新材料股份有限公司 一种微孔发泡热塑性聚氨酯基材及其制备方法与应用

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US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
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US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
CN113146464A (zh) 2016-01-19 2021-07-23 应用材料公司 多孔化学机械抛光垫
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US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
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CN109773671B (zh) * 2017-12-05 2020-11-20 长沙理工大学 一种有序微槽结构多层超硬磨料电镀砂轮
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JP7373503B2 (ja) 2018-05-07 2023-11-02 アプライド マテリアルズ インコーポレイテッド 親水性及びゼータ電位の調節可能な化学機械研磨パッド
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
US11813712B2 (en) * 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US20230226660A1 (en) * 2020-07-16 2023-07-20 Korea Institute Of Industrial Technology Polishing pad, polishing device including same, and manufacturing method thereof
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

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WO2009140622A2 (en) * 2008-05-15 2009-11-19 3M Innovative Properties Company Polishing pad with endpoint window and systems and method using the same

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Cited By (9)

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Publication number Priority date Publication date Assignee Title
CN107614200A (zh) * 2015-05-13 2018-01-19 3M创新有限公司 抛光垫和使用抛光垫的系统和方法
TWI754275B (zh) * 2015-10-16 2022-02-01 美商應用材料股份有限公司 拋光墊及形成其之方法
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Publication number Publication date
US20120315830A1 (en) 2012-12-13
TW201136710A (en) 2011-11-01
JP2013516768A (ja) 2013-05-13
JP6004941B2 (ja) 2016-10-12
WO2011082155A3 (en) 2011-11-17
US9162340B2 (en) 2015-10-20
KR20120125612A (ko) 2012-11-16
SG181678A1 (en) 2012-07-30
TWI552832B (zh) 2016-10-11
WO2011082155A2 (en) 2011-07-07

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Application publication date: 20120919