JP6004941B2 - 相分離したポリマーブレンドを含む研磨パッド並びにその製造及び使用方法 - Google Patents

相分離したポリマーブレンドを含む研磨パッド並びにその製造及び使用方法 Download PDF

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Publication number
JP6004941B2
JP6004941B2 JP2012547231A JP2012547231A JP6004941B2 JP 6004941 B2 JP6004941 B2 JP 6004941B2 JP 2012547231 A JP2012547231 A JP 2012547231A JP 2012547231 A JP2012547231 A JP 2012547231A JP 6004941 B2 JP6004941 B2 JP 6004941B2
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Prior art keywords
polishing
elements
polishing pad
polymer
main surface
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JP2013516768A (ja
JP2013516768A5 (enExample
Inventor
ウィリアム ディー． ジョセフ，
ウィリアム ディー． ジョセフ，
ゲアリー エム． パームグレン，
ゲアリー エム． パームグレン，
スティーヴン シー． ローパー，
スティーヴン シー． ローパー，
クリストファー， エヌ． ローシュ，
クリストファー， エヌ． ローシュ，
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2013516768A5 publication Critical patent/JP2013516768A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H10P52/00—

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2012547231A 2009-12-30 2010-12-28 相分離したポリマーブレンドを含む研磨パッド並びにその製造及び使用方法 Active JP6004941B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29117609P 2009-12-30 2009-12-30
US61/291,176 2009-12-30
PCT/US2010/062204 WO2011082155A2 (en) 2009-12-30 2010-12-28 Polishing pads including phase-separated polymer blend and method of making and using the same

Publications (3)

Publication Number Publication Date
JP2013516768A JP2013516768A (ja) 2013-05-13
JP2013516768A5 JP2013516768A5 (enExample) 2014-02-06
JP6004941B2 true JP6004941B2 (ja) 2016-10-12

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JP2012547231A Active JP6004941B2 (ja) 2009-12-30 2010-12-28 相分離したポリマーブレンドを含む研磨パッド並びにその製造及び使用方法

Country Status (7)

Country Link
US (1) US9162340B2 (enExample)
JP (1) JP6004941B2 (enExample)
KR (1) KR20120125612A (enExample)
CN (1) CN102686362A (enExample)
SG (1) SG181678A1 (enExample)
TW (1) TWI552832B (enExample)
WO (1) WO2011082155A2 (enExample)

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Also Published As

Publication number Publication date
TWI552832B (zh) 2016-10-11
US20120315830A1 (en) 2012-12-13
CN102686362A (zh) 2012-09-19
SG181678A1 (en) 2012-07-30
TW201136710A (en) 2011-11-01
US9162340B2 (en) 2015-10-20
WO2011082155A2 (en) 2011-07-07
JP2013516768A (ja) 2013-05-13
WO2011082155A3 (en) 2011-11-17
KR20120125612A (ko) 2012-11-16

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