TWI550821B - 使用可壓縮結構維持在多晶片模組中之對準的方法及該多晶片模組與包含多晶片模組的系統 - Google Patents

使用可壓縮結構維持在多晶片模組中之對準的方法及該多晶片模組與包含多晶片模組的系統 Download PDF

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TWI550821B
TWI550821B TW102105343A TW102105343A TWI550821B TW I550821 B TWI550821 B TW I550821B TW 102105343 A TW102105343 A TW 102105343A TW 102105343 A TW102105343 A TW 102105343A TW I550821 B TWI550821 B TW I550821B
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wafer
bridge
compressible structure
island
module
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TW102105343A
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Chinese (zh)
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TW201401480A (zh
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席倫 沙克
楊恆石
艾文 旭賓
約翰 康寧罕
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奧瑞可國際公司
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    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0652—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00 the devices being arranged next and on each other, i.e. mixed assemblies
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
TW102105343A 2012-02-15 2013-02-08 使用可壓縮結構維持在多晶片模組中之對準的方法及該多晶片模組與包含多晶片模組的系統 TWI550821B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/397,593 US8742576B2 (en) 2012-02-15 2012-02-15 Maintaining alignment in a multi-chip module using a compressible structure

Publications (2)

Publication Number Publication Date
TW201401480A TW201401480A (zh) 2014-01-01
TWI550821B true TWI550821B (zh) 2016-09-21

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US (1) US8742576B2 (enExample)
EP (1) EP2815429B1 (enExample)
JP (1) JP6182548B2 (enExample)
CN (1) CN104471709B (enExample)
TW (1) TWI550821B (enExample)
WO (1) WO2013123259A2 (enExample)

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