CN104471709B - 使用可压缩结构维持多芯片模块中的对准 - Google Patents

使用可压缩结构维持多芯片模块中的对准 Download PDF

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CN104471709B
CN104471709B CN201380009348.0A CN201380009348A CN104471709B CN 104471709 B CN104471709 B CN 104471709B CN 201380009348 A CN201380009348 A CN 201380009348A CN 104471709 B CN104471709 B CN 104471709B
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chip
mcm
bridge chip
island
compressible structure
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CN104471709A (zh
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H·D·塞科
H·S·杨
I·舒彬
J·E·坎宁安
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Oracle International Corp
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Oracle International Corp
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    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
CN201380009348.0A 2012-02-15 2013-02-14 使用可压缩结构维持多芯片模块中的对准 Active CN104471709B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/397,593 2012-02-15
US13/397,593 US8742576B2 (en) 2012-02-15 2012-02-15 Maintaining alignment in a multi-chip module using a compressible structure
PCT/US2013/026223 WO2013123259A2 (en) 2012-02-15 2013-02-14 Maintaining alignment in a multi-chip module using a compressible structure

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CN104471709A CN104471709A (zh) 2015-03-25
CN104471709B true CN104471709B (zh) 2018-11-16

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US (1) US8742576B2 (enExample)
EP (1) EP2815429B1 (enExample)
JP (1) JP6182548B2 (enExample)
CN (1) CN104471709B (enExample)
TW (1) TWI550821B (enExample)
WO (1) WO2013123259A2 (enExample)

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