TWI550006B - 光模組用密封劑、其製造方法及含有其的光模組 - Google Patents
光模組用密封劑、其製造方法及含有其的光模組 Download PDFInfo
- Publication number
- TWI550006B TWI550006B TW104106312A TW104106312A TWI550006B TW I550006 B TWI550006 B TW I550006B TW 104106312 A TW104106312 A TW 104106312A TW 104106312 A TW104106312 A TW 104106312A TW I550006 B TWI550006 B TW I550006B
- Authority
- TW
- Taiwan
- Prior art keywords
- sealant
- group
- optical module
- ethylene
- decane
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title description 8
- 239000008393 encapsulating agent Substances 0.000 title description 6
- 239000000565 sealant Substances 0.000 claims description 140
- 239000004711 α-olefin Substances 0.000 claims description 97
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 89
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 76
- 230000003287 optical effect Effects 0.000 claims description 67
- 239000005977 Ethylene Substances 0.000 claims description 64
- -1 polypropylene Polymers 0.000 claims description 55
- 239000002952 polymeric resin Substances 0.000 claims description 44
- 229920003002 synthetic resin Polymers 0.000 claims description 44
- 239000011521 glass Substances 0.000 claims description 43
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 37
- 238000002844 melting Methods 0.000 claims description 32
- 230000008018 melting Effects 0.000 claims description 32
- 125000000217 alkyl group Chemical group 0.000 claims description 29
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 27
- 229910052739 hydrogen Inorganic materials 0.000 claims description 24
- 239000001257 hydrogen Substances 0.000 claims description 24
- 125000003118 aryl group Chemical group 0.000 claims description 23
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 20
- 229920001684 low density polyethylene Polymers 0.000 claims description 20
- 239000004702 low-density polyethylene Substances 0.000 claims description 20
- 229910052760 oxygen Inorganic materials 0.000 claims description 20
- 239000001301 oxygen Substances 0.000 claims description 20
- 239000000155 melt Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 19
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 18
- 125000004432 carbon atom Chemical group C* 0.000 claims description 18
- 229910052717 sulfur Inorganic materials 0.000 claims description 18
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 17
- 239000011593 sulfur Substances 0.000 claims description 17
- 125000004429 atom Chemical group 0.000 claims description 16
- 229920001577 copolymer Polymers 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 15
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 150000001412 amines Chemical class 0.000 claims description 12
- 229910052736 halogen Inorganic materials 0.000 claims description 12
- 150000002367 halogens Chemical class 0.000 claims description 12
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 12
- 125000005843 halogen group Chemical group 0.000 claims description 11
- 125000003277 amino group Chemical group 0.000 claims description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 9
- 239000000178 monomer Substances 0.000 claims description 9
- 150000001336 alkenes Chemical class 0.000 claims description 7
- 125000003545 alkoxy group Chemical group 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 7
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 7
- 238000006116 polymerization reaction Methods 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 125000003342 alkenyl group Chemical group 0.000 claims description 6
- 125000004414 alkyl thio group Chemical group 0.000 claims description 6
- 125000006612 decyloxy group Chemical group 0.000 claims description 6
- 239000011342 resin composition Substances 0.000 claims description 6
- 125000002947 alkylene group Chemical group 0.000 claims description 5
- 125000004104 aryloxy group Chemical group 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 229920013716 polyethylene resin Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 125000002178 anthracenyl group Chemical group C1(=CC=CC2=CC3=CC=CC=C3C=C12)* 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 238000007334 copolymerization reaction Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 37
- 239000002344 surface layer Substances 0.000 description 13
- 230000000704 physical effect Effects 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 239000006096 absorbing agent Substances 0.000 description 8
- 150000002431 hydrogen Chemical class 0.000 description 8
- 239000003999 initiator Substances 0.000 description 8
- 150000003254 radicals Chemical class 0.000 description 8
- 239000003963 antioxidant agent Substances 0.000 description 7
- 230000003078 antioxidant effect Effects 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000000654 additive Substances 0.000 description 6
- 230000007774 longterm Effects 0.000 description 6
- 239000004594 Masterbatch (MB) Substances 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 5
- 239000005038 ethylene vinyl acetate Substances 0.000 description 5
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- 239000005341 toughened glass Substances 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 230000032798 delamination Effects 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 230000000379 polymerizing effect Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000009823 thermal lamination Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical group [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000004611 light stabiliser Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000002978 peroxides Chemical class 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229910052707 ruthenium Inorganic materials 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 2
- LBIHNTAFJVHBLJ-UHFFFAOYSA-N 3-(triethoxymethyl)undec-1-ene Chemical compound C(=C)C(C(OCC)(OCC)OCC)CCCCCCCC LBIHNTAFJVHBLJ-UHFFFAOYSA-N 0.000 description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical group CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000012963 UV stabilizer Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000002803 fossil fuel Substances 0.000 description 2
- 238000010559 graft polymerization reaction Methods 0.000 description 2
- 239000012760 heat stabilizer Substances 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- WRXCBRHBHGNNQA-UHFFFAOYSA-N (2,4-dichlorobenzoyl) 2,4-dichlorobenzenecarboperoxoate Chemical compound ClC1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1Cl WRXCBRHBHGNNQA-UHFFFAOYSA-N 0.000 description 1
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- MIZLGWKEZAPEFJ-UHFFFAOYSA-N 1,1,2-trifluoroethene Chemical group FC=C(F)F MIZLGWKEZAPEFJ-UHFFFAOYSA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- RGASRBUYZODJTG-UHFFFAOYSA-N 1,1-bis(2,4-ditert-butylphenyl)-2,2-bis(hydroxymethyl)propane-1,3-diol dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1)C(C)(C)C)C(C)(C)C RGASRBUYZODJTG-UHFFFAOYSA-N 0.000 description 1
- VNQNXQYZMPJLQX-UHFFFAOYSA-N 1,3,5-tris[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CN2C(N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C(=O)N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C2=O)=O)=C1 VNQNXQYZMPJLQX-UHFFFAOYSA-N 0.000 description 1
- XYXJKPCGSGVSBO-UHFFFAOYSA-N 1,3,5-tris[(4-tert-butyl-3-hydroxy-2,6-dimethylphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C)=C1CN1C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C1=O XYXJKPCGSGVSBO-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- JGBAASVQPMTVHO-UHFFFAOYSA-N 2,5-dihydroperoxy-2,5-dimethylhexane Chemical compound OOC(C)(C)CCC(C)(C)OO JGBAASVQPMTVHO-UHFFFAOYSA-N 0.000 description 1
- YAGPRJYCDKGWJR-UHFFFAOYSA-N 2-(2,4,8,10-tetratert-butylbenzo[d][1,3,2]benzodioxaphosphepin-6-yl)oxy-n,n-bis[2-(2,4,8,10-tetratert-butylbenzo[d][1,3,2]benzodioxaphosphepin-6-yl)oxyethyl]ethanamine Chemical compound O1C2=C(C(C)(C)C)C=C(C(C)(C)C)C=C2C2=CC(C(C)(C)C)=CC(C(C)(C)C)=C2OP1OCCN(CCOP1OC2=C(C=C(C=C2C=2C=C(C=C(C=2O1)C(C)(C)C)C(C)(C)C)C(C)(C)C)C(C)(C)C)CCOP(OC1=C(C=C(C=C11)C(C)(C)C)C(C)(C)C)OC2=C1C=C(C(C)(C)C)C=C2C(C)(C)C YAGPRJYCDKGWJR-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- MHNNAWXXUZQSNM-UHFFFAOYSA-N 2-methylbut-1-ene Chemical compound CCC(C)=C MHNNAWXXUZQSNM-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- TXBZITDWMURSEF-UHFFFAOYSA-N 3,3-dimethylpent-1-ene Chemical compound CCC(C)(C)C=C TXBZITDWMURSEF-UHFFFAOYSA-N 0.000 description 1
- XVEASTGLHPVZNA-UHFFFAOYSA-N 3,4-dichlorobut-1-ene Chemical compound ClCC(Cl)C=C XVEASTGLHPVZNA-UHFFFAOYSA-N 0.000 description 1
- WFHXQNMTMDKVJG-UHFFFAOYSA-N 3,4-dimethylpent-1-ene Chemical compound CC(C)C(C)C=C WFHXQNMTMDKVJG-UHFFFAOYSA-N 0.000 description 1
- AIBRSVLEQRWAEG-UHFFFAOYSA-N 3,9-bis(2,4-ditert-butylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP1OCC2(COP(OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)OC2)CO1 AIBRSVLEQRWAEG-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- DUBQWBHZRJHLNB-UHFFFAOYSA-N 3-(difluoromethyl)-1,3,4,4,7,8,8,8-octafluoro-7-(trifluoromethyl)oct-1-ene Chemical compound FC(C(C(F)(F)F)(CCC(C(C(F)F)(F)C=CF)(F)F)F)(F)F DUBQWBHZRJHLNB-UHFFFAOYSA-N 0.000 description 1
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- QCMKXHXKNIOBBC-UHFFFAOYSA-N 3-fluoroprop-1-ene Chemical compound FCC=C QCMKXHXKNIOBBC-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- KLCNJIQZXOQYTE-UHFFFAOYSA-N 4,4-dimethylpent-1-ene Chemical compound CC(C)(C)CC=C KLCNJIQZXOQYTE-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- SUWJESCICIOQHO-UHFFFAOYSA-N 4-methylhex-1-ene Chemical compound CCC(C)CC=C SUWJESCICIOQHO-UHFFFAOYSA-N 0.000 description 1
- UWSMKYBKUPAEJQ-UHFFFAOYSA-N 5-Chloro-2-(3,5-di-tert-butyl-2-hydroxyphenyl)-2H-benzotriazole Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O UWSMKYBKUPAEJQ-UHFFFAOYSA-N 0.000 description 1
- JIUFYGIESXPUPL-UHFFFAOYSA-N 5-methylhex-1-ene Chemical compound CC(C)CCC=C JIUFYGIESXPUPL-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229940122361 Bisphosphonate Drugs 0.000 description 1
- CZOWRDVMIOAGPN-UHFFFAOYSA-N C(=C)C(C(CCCCC)(CCCCC)CCCCC)CCCCCCCC Chemical compound C(=C)C(C(CCCCC)(CCCCC)CCCCC)CCCCCCCC CZOWRDVMIOAGPN-UHFFFAOYSA-N 0.000 description 1
- YXFRBUCPZXPBFQ-UHFFFAOYSA-N C(=C)C(C(OC(C)C)(OC(C)C)OC(C)C)CCCCCCCC Chemical compound C(=C)C(C(OC(C)C)(OC(C)C)OC(C)C)CCCCCCCC YXFRBUCPZXPBFQ-UHFFFAOYSA-N 0.000 description 1
- JZHKIUBMQMDQRG-UHFFFAOYSA-N C(=C)C(C(OC)(OC)OC)CCCCCCCC Chemical compound C(=C)C(C(OC)(OC)OC)CCCCCCCC JZHKIUBMQMDQRG-UHFFFAOYSA-N 0.000 description 1
- VGOSEIMZGBMYQK-UHFFFAOYSA-N C(=C)C(C(OCCC)(OCCC)OCCC)CCCCCCCC Chemical compound C(=C)C(C(OCCC)(OCCC)OCCC)CCCCCCCC VGOSEIMZGBMYQK-UHFFFAOYSA-N 0.000 description 1
- GPLCCGHTAZKRTO-UHFFFAOYSA-N C(=C)C(C(OCCCC)(OCCCC)OCCCC)CCCCCCCC Chemical compound C(=C)C(C(OCCCC)(OCCCC)OCCCC)CCCCCCCC GPLCCGHTAZKRTO-UHFFFAOYSA-N 0.000 description 1
- YMACNDOEBDMEBU-UHFFFAOYSA-N C(C)(C)(C)C(C(=O)OO)(C)C.C(CCC)(=O)OOCC(C)C Chemical compound C(C)(C)(C)C(C(=O)OO)(C)C.C(CCC)(=O)OOCC(C)C YMACNDOEBDMEBU-UHFFFAOYSA-N 0.000 description 1
- NGLCNAVWWQWSPV-UHFFFAOYSA-N C(CCC)NCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C(CCC)NCCCC(C(OC)(OC)OC)CCCCCCCC NGLCNAVWWQWSPV-UHFFFAOYSA-N 0.000 description 1
- DEAPRPKIKRDHBD-UHFFFAOYSA-N CC(C)(C#CC(C)(OOC(C)(C)C)C)OOC(C)(C)C.CC(C)(C#CC(C)(OOC(C)(C)C)C)OOC(C)(C)C Chemical compound CC(C)(C#CC(C)(OOC(C)(C)C)C)OOC(C)(C)C.CC(C)(C#CC(C)(OOC(C)(C)C)C)OOC(C)(C)C DEAPRPKIKRDHBD-UHFFFAOYSA-N 0.000 description 1
- OJHAEILISKFFHV-UHFFFAOYSA-N CC(C)(C#CC(C)(OOC(C1=CC=CC=C1)=O)C)OOC(C1=CC=CC=C1)=O.CC(C)(C#CC(C)(OOC(C1=CC=CC=C1)C1=CC=CC=C1)C)OOC(C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound CC(C)(C#CC(C)(OOC(C1=CC=CC=C1)=O)C)OOC(C1=CC=CC=C1)=O.CC(C)(C#CC(C)(OOC(C1=CC=CC=C1)C1=CC=CC=C1)C)OOC(C1=CC=CC=C1)C1=CC=CC=C1 OJHAEILISKFFHV-UHFFFAOYSA-N 0.000 description 1
- HJLNXGBORSTSHS-UHFFFAOYSA-N CC(C)C1=C(C(C)C)C=CC=C1.OO.OO.C1=CC=CC=C1 Chemical compound CC(C)C1=C(C(C)C)C=CC=C1.OO.OO.C1=CC=CC=C1 HJLNXGBORSTSHS-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- OKOBUGCCXMIKDM-UHFFFAOYSA-N Irganox 1098 Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NCCCCCCNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 OKOBUGCCXMIKDM-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 150000004663 bisphosphonates Chemical class 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 1
- PBGVMIDTGGTBFS-UHFFFAOYSA-N but-3-enylbenzene Chemical compound C=CCCC1=CC=CC=C1 PBGVMIDTGGTBFS-UHFFFAOYSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- LDLDYFCCDKENPD-UHFFFAOYSA-N ethenylcyclohexane Chemical compound C=CC1CCCCC1 LDLDYFCCDKENPD-UHFFFAOYSA-N 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- UWAVXORKDISRCD-UHFFFAOYSA-N hex-5-enylbenzene Chemical compound C=CCCCCC1=CC=CC=C1 UWAVXORKDISRCD-UHFFFAOYSA-N 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- CIAYYZGZMJDALI-UHFFFAOYSA-N n'-(triethoxysilylmethyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CNCCN CIAYYZGZMJDALI-UHFFFAOYSA-N 0.000 description 1
- NHBRUUFBSBSTHM-UHFFFAOYSA-N n'-[2-(3-trimethoxysilylpropylamino)ethyl]ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCNCCN NHBRUUFBSBSTHM-UHFFFAOYSA-N 0.000 description 1
- YLBPOJLDZXHVRR-UHFFFAOYSA-N n'-[3-[diethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CCO[Si](C)(OCC)CCCNCCN YLBPOJLDZXHVRR-UHFFFAOYSA-N 0.000 description 1
- PJIIFHZKHAFVIF-UHFFFAOYSA-N n'-[[diethoxy(methyl)silyl]methyl]ethane-1,2-diamine Chemical compound CCO[Si](C)(OCC)CNCCN PJIIFHZKHAFVIF-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- XCOASYLMDUQBHW-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)butan-1-amine Chemical compound CCCCNCCC[Si](OC)(OC)OC XCOASYLMDUQBHW-UHFFFAOYSA-N 0.000 description 1
- KOVKEDGZABFDPF-UHFFFAOYSA-N n-(triethoxysilylmethyl)aniline Chemical compound CCO[Si](OCC)(OCC)CNC1=CC=CC=C1 KOVKEDGZABFDPF-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- YZPARGTXKUIJLJ-UHFFFAOYSA-N n-[3-[dimethoxy(methyl)silyl]propyl]aniline Chemical compound CO[Si](C)(OC)CCCNC1=CC=CC=C1 YZPARGTXKUIJLJ-UHFFFAOYSA-N 0.000 description 1
- 229940078552 o-xylene Drugs 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000007539 photo-oxidation reaction Methods 0.000 description 1
- IUGYQRQAERSCNH-UHFFFAOYSA-N pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000006058 strengthened glass Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- LYDRKKWPKKEMNZ-UHFFFAOYSA-N tert-butyl benzoate Chemical compound CC(C)(C)OC(=O)C1=CC=CC=C1 LYDRKKWPKKEMNZ-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- NQRYJNQNLNOLGT-UHFFFAOYSA-N tetrahydropyridine hydrochloride Natural products C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C08L23/0815—Copolymers of ethene with aliphatic 1-olefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
- C08F255/02—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having two or three carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
- C08F255/08—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having four or more carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
- C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D123/04—Homopolymers or copolymers of ethene
- C09D123/08—Copolymers of ethene
- C09D123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C09D123/0815—Copolymers of ethene with aliphatic 1-olefins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
- C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D123/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2500/00—Characteristics or properties of obtained polyolefins; Use thereof
- C08F2500/11—Melt tension or melt strength
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2500/00—Characteristics or properties of obtained polyolefins; Use thereof
- C08F2500/12—Melt flow index or melt flow ratio
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2500/00—Characteristics or properties of obtained polyolefins; Use thereof
- C08F2500/26—Use as polymer for film forming
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2810/00—Chemical modification of a polymer
- C08F2810/30—Chemical modification of a polymer leading to the formation or introduction of aliphatic or alicyclic unsaturated groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2810/00—Chemical modification of a polymer
- C08F2810/40—Chemical modification of a polymer taking place solely at one end or both ends of the polymer backbone, i.e. not in the side or lateral chains
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/04—Homopolymers or copolymers of ethene
- C08J2323/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08J2323/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2423/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2423/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2423/04—Homopolymers or copolymers of ethene
- C08J2423/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2423/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2423/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2423/04—Homopolymers or copolymers of ethene
- C08J2423/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2451/00—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
- C08J2451/06—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
- C08L2203/162—Applications used for films sealable films
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/06—Properties of polyethylene
- C08L2207/066—LDPE (radical process)
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2310/00—Masterbatches
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Photovoltaic Devices (AREA)
- Sealing Material Composition (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Graft Or Block Polymers (AREA)
Description
本申請案是關於一種光模組用密封劑、其製造方法以及光模組。
最近,由於環境污染及化石燃料枯竭之問題,已大量關注新能源及可再生能源或清潔能源。其中,使用光之能源作為能夠解決環境污染及化石燃料枯竭之問題的一種代表性清潔能源而成為關注點。作為使用光之代表性能源,(例如)存在光電池,諸如太陽能電池等。
光電池為將日光轉化成電能之裝置,一般需要其長期暴露於外部環境以便易於吸收日光,且因此使用各種類型之封裝來保護內部裝置且光電池以典型地被稱作「光模組」之單元形式製造。
通常,光模組包含背板以保護內部裝置(例如太陽能電
池)。圖1為說明作為習知光模組之太陽能電池模組之橫截面的視圖。
參考圖1,太陽能電池模組通常具有如下結構,其中光入射之透明強化玻璃3、正面密封劑層2a、多個太陽能電池C、背面密封劑層2b以及背板1按順序堆疊。另外,所述多個太陽能電池C彼此電連接,且藉由正面密封劑層2a及背面密封劑層2b封裝及固定。
通常使用乙烯乙酸乙烯酯(ethylene vinyl acetate;EVA)共聚物作為形成正面密封劑層2a及背面密封劑層2b之密封劑。由於乙烯乙酸乙烯酯共聚物在可成形性、製造成本以及物理特性(諸如透明性等)方面為有利的,所以其在過去已被廣泛使用。
然而,乙烯乙酸乙烯酯共聚物具有低的防潮特性,且因此導致太陽能電池C或透明強化玻璃3在高溫且高濕度條件下之低黏合強度,且導致在長期使用之後在層之間產生分層。另外,乙烯乙酸乙烯酯共聚物藉由產生因濕氣滲入所致的水解反應而造成電極腐蝕,且亦引起氣泡問題等。這些問題在密封劑應用於太陽能電池模組時最終降低效率。
為了解決這些問題,正嘗試使用乙烯/α(alpha)-烯烴類共聚物用於密封劑之技術。與其相關的技術揭露於專利文件1及2中。乙烯/α-烯烴類共聚物具有低於乙烯乙酸乙烯酯共聚物之透濕性,不產生諸如乙酸等之水解反應產物,且因此可提高太陽能電池模組之可靠性。
然而,由乙烯/α(alpha)-烯烴類共聚物之材料形成的
密封劑具有低黏合力等特性,在長期使用之後仍然存在可歸因於因太陽能電池模組中低熔點(Tm)所致的低耐熱性之分層問題,因此,在應用於光模組之後來自太陽能電池模組的功率輸出降低,且因此需要一種解決方案。
(專利文件1)韓國專利特許公開案第10-2012-0078026號
(專利文件2)日本專利特許公開案第2009-302220號
本申請案提供一種光模組用密封劑、其製造方法以及一種光模組。
更具體言之,本申請案是關於提供一種光模組用密封劑、其製造方法以及一種光模組,所述光模組用密封劑展現改善的黏合力,且特定言之,其可防止在長期使用之後可歸因於因太陽能電池模組中低熔點(Tm)所致的低耐熱性之分層。
根據本發明一實施例,提供一種光模組用的密封劑,包括:乙烯/α-烯烴類共聚物、經矽烷改質之乙烯/α-烯烴類共聚物、以及耐熱聚合物樹脂,所述耐熱聚合物樹脂之熔點(Tm)高於所述乙烯/α-烯烴類共聚物之熔點(Tm)。
根據本發明一實施例之光模組用的密封劑,其中所
述耐熱聚合物樹脂之熔點(Tm)為100℃或大於100℃。
根據本發明一實施例之光模組用的密封劑,其中所述耐熱聚合物樹脂之熔點(Tm)在100℃至150℃範圍內。
根據本發明一實施例之光模組用的密封劑,其中所述耐熱聚合物樹脂之熔融指數(MI)小於所述乙烯/α-烯烴類共聚物之熔融指數(MI)。
根據本發明一實施例之光模組用的密封劑,其中所述耐熱聚合物樹脂在190℃的溫度及2.16公斤的負荷下之熔融指數(MI)是在0.1公克/10分鐘至40公克/10分鐘範圍內。
根據本發明一實施例之光模組用的密封劑,其中相對於所述乙烯/α-烯烴類共聚物與所述經矽烷改質之乙烯/α-烯烴類共聚物之100重量份的混合物,以0.1重量份至10重量份之範圍來包含所述耐熱聚合物樹脂。
根據本發明一實施例之光模組用的密封劑,其中相對於所述乙烯/α-烯烴類共聚物與所述經矽烷改質之乙烯/α-烯烴類共聚物之100重量份的混合物,以1重量份至5重量份之範圍來包含所述耐熱聚合物樹脂。
根據本發明一實施例之光模組用的密封劑,其中所述耐熱聚合物樹脂為聚乙烯類樹脂及/或聚丙烯類樹脂。
根據本發明一實施例之光模組用的密封劑,其中所述耐熱聚合物樹脂包括低密度聚乙烯。
根據本發明一實施例之光模組用的密封劑,滿足以下表達式1:
在所述表達式1中,在將兩層所述密封劑重疊且插入於第一玻璃板與第二玻璃板之間,且進行層壓以製備尺寸為20公分×35公分(寬度×長度)之樣品之後,將所述樣品垂直(90°)豎立,將所述第一玻璃板固定地懸掛,將所述樣品在100℃下維持10小時,其中所述密封劑的尺寸為20公分×25公分(寬度×長度),所述第一玻璃板的厚度為3.2毫米且尺寸為20公分×30公分(寬度×長度),所述第二玻璃板的厚度為3.2毫米且尺寸為20公分×30公分(寬度×長度),且在本文中,所述第二玻璃板之左側、中心以及右側之垂直蠕變距離之平均值由△X表示。
根據本發明一實施例之光模組用的密封劑,其中所述經矽烷改質之乙烯/α-烯烴類共聚物為與矽烷化合物進行接枝聚合之所述乙烯/α-烯烴類共聚物。
根據本發明一實施例之光模組用的密封劑,其中所述矽烷化合物包括不飽和矽烷化合物及/或氨基矽烷化合物。
根據本發明一實施例之光模組用的密封劑,其中所述矽烷化合物包括由下式1表示之化合物:[式1]DSiR1 pR2 (3-p)
在所述式1中,D為烯基,R1為烷氧基、烷硫基、芳氧基、醯氧基、羥基、鹵素基團、胺基或-R3R4,R3為氧(O)或硫(S)原子,R4為烷基、芳基或醯基,R2為氫、烷基、芳基或芳烷基,
且p為1至3的範圍內的整數。
根據本發明一實施例之光模組用的密封劑,其中所述矽烷化合物包括由下式2表示之化合物:[式2]SiR5 qR6 (4-q)
在所述式2中,R5為-(CH2)vNR7R8,R7及R8各自獨立地為結合至氮原子之R9NH2或氫,R9為具有1個至6個碳原子之伸烷基,R6為鹵素、胺基、-R10R11或-R11,R10為氧(O)或硫(S)原子,R11為氫、烷基、芳基、芳烷基或醯基,且q為1至4的範圍內的整數,且v為1或大於1的整數。
根據本發明一實施例之光模組用的密封劑,其中所述經矽烷改質之乙烯/α-烯烴類共聚物包括包含烯烴類單體聚合單元之主鏈及結合至所述主鏈之分支鏈,且所述分支鏈包含由下式3表示之化合物:[式3]-SiR12R13R14
在所述式3中,R12及R13各自獨立地為鹵素、胺基、-R15R16或-R16,R15為氧(O)或硫(S)原子,R16為氫、烷基、芳基、芳烷基或醯基,R14為-OSiR17 mR18 (2-m)R19,R17及R18各自獨立地為鹵素、胺基、-R20R21或-R21,R20為氧(O)或硫(S)原子,R21為氫、烷基、芳基、芳烷基或醯基,R19為-(CH2)nNR22R23,R22及R23各自獨立地為結合至氮原子之氫或R24NH2,R24為伸烷基,m為1或2的整數,且n為1或大於1的整數。
根據本發明一實施例之光模組用的密封劑,其中所述經矽烷改質之乙烯/α-烯烴類共聚物包括包含烯烴類單體聚合單元之主鏈及結合至所述主鏈之分支鏈,且所述分支鏈包含由下式4表示之化合物:[式4]-SiR25 rR26 (3-r)
在所述式4中,R25及R26各自獨立地為鹵素、胺基、-R27R28或-R28,R27為氧(O)或硫(S)原子,R28為氫、烷基、芳基、芳烷基或醯基,且r為1至3範圍內的整數。
根據本發明一實施例之製造光模組用的密封劑之方法,包括製造片狀樹脂組成物,其包含乙烯/α-烯烴類共聚物、經矽烷改質之乙烯/α-烯烴類共聚物以及耐熱聚合物樹脂,所述耐熱聚合物樹脂的熔點高於所述乙烯/α-烯烴類聚合物的熔點。
根據本發明一實施例之光模組,包括如申請專利範圍第1項至第16項中任一項所述之光模組用的密封劑。
根據本發明一實施例之光模組,包括:正面基板;密封劑層,形成於所述正面基板上;太陽能電池,由所述密封劑層密封;以及背板,形成於所述密封劑層上。
根據本申請案之實施例的密封劑具有優良的耐熱性等及改善的蠕變特性,且因此即使在高溫及/或高濕度之條件下長期
使用所述密封劑時,變形亦很小且所述密封劑可展現優良的黏合強度。因此,當所述密封劑應用於光模組時,耐久性等可得到改善。
1、100‧‧‧背板
2a、221‧‧‧正面密封劑層
2b、222‧‧‧背面密封劑層
3‧‧‧強化玻璃
10‧‧‧基底
20、30‧‧‧表面層
210‧‧‧正面基板
220‧‧‧密封劑層
C‧‧‧太陽能電池
G1、G2‧‧‧玻璃板
S‧‧‧密封劑
圖1為作為習知光模組之太陽能電池模組之橫截面視圖。
圖2為描述一種量測根據本申請案之一實施例的密封劑之蠕變物理特性的方法作為一實例之視圖。
圖3為例示性說明根據本申請案之一實施例的光模組之結構之視圖。
圖4展示說明根據本申請案之實例1及比較實例1的密封劑樣品之評估結果之圖像。
根據本申請案之一實施例的例示性密封劑是關於一種光模組用密封劑(在下文中可被稱作「密封劑」)。
在一實施例中,密封劑可包含1)乙烯/α(alpha)-烯烴類共聚物、2)經矽烷改質之乙烯/α-烯烴類共聚物以及3)耐熱聚合物樹脂。
在下文中,將詳細地描述組分。
作為根據本申請案之實施例的乙烯/α-烯烴類共聚物,可
使用藉由乙烯與α-烯烴聚合所製備之任何共聚物,無特別限制。
在本說明書中,「乙烯/α-烯烴類共聚物」可指示涵蓋如下所有共聚物之概念:除乙烯均聚物之外,包含50莫耳%或大於50莫耳%之乙烯作為聚合單元,且更包含具有三個或大於三個碳原子之烯烴單體或其他共聚單體作為聚合單元。
舉例而言,形成乙烯/α-烯烴共聚物之α-烯烴可包含由下列各者所構成的族群中選出之一或多種類型:α(alpha)-烯烴類以及經鹵素取代之α-烯烴類,其中所述α(alpha)-烯烴類諸如乙烯、丙烯、異丁烯、1-丁烯、1-戊烯、1-己烯、1-庚烯、1-辛烯、1-壬烯、1-癸烯、4-苯基-1-丁烯、6-苯基-1-己烯、2-甲基-1-丁烯、3-甲基-1-丁烯、4-甲基-1-丁烯、3-甲基-1-戊烯、4-甲基-1-己烯、5-甲基-1-己烯、3,3-二甲基-1-戊烯、3,4-二甲基-1-戊烯、4,4-二甲基-1-戊烯、乙烯基環己烷等,所述經鹵素取代之α-烯烴類諸如六氟丙烯、四氟乙烯、2-氟丙烯、氟乙烯、1,1-二氟乙烯、3-氟丙烯、三氟乙烯、3,4-二氯-1-丁烯等。
乙烯/α-烯烴類共聚物可為呈各種形狀之聚合物,即使在共聚物是由相同類型之單體製備時。乙烯/α-烯烴類共聚物可包含(例如)藉由調整不同片段而聚合之無規共聚物、嵌段共聚物或接枝共聚物。
在實施例中,乙烯/α-烯烴類共聚物可為由下列各者所構成的族群中選出之一或多種類型:低密度乙烯/α-烯烴類共聚物、中密度乙烯/α-烯烴類共聚物、高密度乙烯/α-烯烴類共聚物、超低密度乙烯/α-烯烴類共聚物、超級超低密度乙烯/α-烯烴類共聚物、
線性低密度乙烯/α-烯烴類共聚物等。
乙烯/α-烯烴類共聚物之密度可在約0.82公克/立方公分至0.96公克/立方公分或約0.85公克/立方公分至0.92公克/立方公分之範圍內,但不限於此。
另外,乙烯/α-烯烴共聚物在約190℃溫度及2.16公斤負荷下之熔融指數(melt index;MI)可在約1.0公克/10分鐘至50.0公克/10分鐘、約1.0公克/10分鐘至30.0公克/10分鐘、約1.0公克/10分鐘至10.0公克/10分鐘、約1.0公克/10分鐘至8.0公克/10分鐘或約3.0公克/10分鐘至7.0公克/10分鐘之範圍內。當在上述範圍內調整乙烯/α-烯烴共聚物之熔融指數(MI)時,自其製備之密封劑可展現優良的可成形性等。
根據本申請案之實施例的經矽烷改質之乙烯/α-烯烴類共聚物可為乙烯/α-烯烴類共聚物之經矽烷改質之共聚物。
在本說明書中,「經矽烷改質之乙烯/α-烯烴類共聚物」可指示藉由將乙烯/α-烯烴類共聚物與矽烷化合物進行聚合所製備之共聚物。另外,所述聚合可為(但不特別限於)例如接枝聚合。
根據本申請案之實施例的密封劑可藉由在其中包含經矽烷改質之乙烯/α-烯烴類共聚物來確保物理特性,諸如黏合強度、密封特性等。
相對於100重量份的乙烯/α-烯烴類共聚物,經矽烷改質之乙烯/α-烯烴類共聚物可包含約0.001重量份至20重量份、約0.01重量份至15重量份或約0.1重量份至10重量份之矽烷化合
物。當矽烷化合物之含量小於0.001重量份時,由其實現的黏合強度、密封特性等之改善效果可能是小的。當矽烷化合物之含量大於20重量份時,歸因於過度使用之協同效應不很大,但是黏度可能增加且因此可成形性可能降低。
作為矽烷化合物,可使用在分子中具有矽烷基團之任何化合物(不特別限制)。舉例而言,矽烷化合物可包含不飽和矽烷化合物及/或氨基矽烷化合物(amino silane compound)。
在實施例中,矽烷化合物可由用下式1表示之化合物中選出。
[式1]DSiR1 pR2 (3-p)
在式1中,D為烯基,R1為烷氧基、烷硫基、芳氧基、醯氧基、羥基、鹵素基團、胺基或-R3R4,R3為氧(O)或硫(S)原子,R4為烷基、芳基或醯基,R2為氫、烷基、芳基或芳烷基,且p為1至3範圍內的整數。
在本說明書中,術語「烯基」可指示結合於矽原子且在分子中具有至少一個不飽和基團(例如具有雙鍵之官能基)的烴化合物。另外,烯基之碳原子數目可(例如)在2至20、2至12或2至6之範圍內。舉例而言,烯基可包含乙烯基、烯丙基、丙烯基、異丙烯基、丁烯基、己烯基、環己烯基、γ-甲基丙烯醯氧基丙基等,且較佳可為乙烯基,但不限於此。
在式1中,R1結合至矽原子,且由下列各者中選出:烷氧基、烷硫基、芳氧基、醯氧基、羥基、鹵素基團、胺基或-R3R4。
這裡,R3為氧(O)或硫(S)原子,且R4是由烷基、芳基或醯基中選出。
在式1中,R2結合至矽原子,且由氫、烷基、芳基或芳烷基中選出。另外,在式1中,p為1至3範圍內的整數,且較佳可為3,但不限於此。
在本說明書中,術語「烷氧基」可指示(例如)具有1個至20個碳原子、1個至12個碳原子、1個至8個碳原子或1個至4個碳原子之烷氧基。烷氧基可(例如)由甲氧基、乙氧基、丙氧基、異丙氧基、丁氧基等中選出,且較佳可為甲氧基或乙氧基,但不限於此。
另外,醯氧基可為具有1個至12個碳原子之醯氧基,烷硫基可為1個至12個碳原子之烷硫基。
在本說明書中,術語「烷基」可具有(例如)1個至12個碳原子、1個至8個碳原子或1個至4個碳原子,且(例如)可由甲基、乙基、丙基等中選出。芳基可具有(例如)6個至18個碳原子或6個至12個碳原子,且(例如)可為苯基。另外,芳烷基可為(例如)具有7個至19個碳原子或7個至13個碳原子之芳烷基,且(例如)可為苄基,但不限於此。
在實施例中,矽烷化合物可由在分子中具有一或多個乙烯基之乙烯基烷氧基矽烷類中選出。乙烯基烷氧基矽烷可為例如由下列各者所構成的族群中選出之一或多種類型:乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、乙烯基三丙氧基矽烷、乙烯基三異丙氧基矽烷、乙烯基三丁氧基矽烷、乙烯基三戊氧基矽烷、乙
烯基三苯氧基矽烷以及乙烯基三乙醯氧基矽烷。
在實施例中,矽烷化合物可包含由下式2表示之化合物。
[式2]SiR5 qR6 (4-q)
在式2中,R5為-(CH2)vNR7R8,R7及R8各自獨立地為結合至氮原子之R9NH2或氫,R9為具有1個至6個碳原子之伸烷基,R6為鹵素、胺基、-R10R11或-R11,R10為氧(O)或硫(S)原子,R11為氫、烷基、芳基、芳烷基或醯基,且q為1至4範圍內的整數,且v為1或大於1的整數。
胺基可為一級胺及/或二級胺。
在式2中,烷基、芳基、芳烷基以及醯基與式1中所述相同。
在實施例中,矽烷化合物可為氨基烷氧基矽烷。
舉例而言,氨基矽烷化合物可為由下列各者所構成的族群中選出之一或多種類型:氨丙基三甲氧基矽烷(aminopropyltrimethoxy silane)、氨丙基三乙氧基矽烷(aminopropyltriethoxy silane)、雙[(3-三乙氧基矽烷基)丙基]胺(bis[(3-triethoxysilyl)propyl]amine)、雙[(3-三甲氧基矽烷基)丙基]胺(bis[(3-trimethoxysilyl)propyl]amine)、氨丙基甲基二乙氧基矽烷(aminopropylmethyldiethoxy silane)、氨丙基甲基二甲氧基矽烷(aminopropylmethyldimethoxy silane)、N-[3-(三甲氧基矽烷基)丙基]乙二胺(N-[3-(trimethoxysilyl)propyl]ethylenediamine)、氨乙基氨丙基三乙氧基矽烷(aminoethylaminopropyltriethoxy silane)、氨
乙基氨丙基甲基二甲氧基矽烷(aminoethylaminopropylmethyldimethoxy silane)、氨乙基氨丙基甲基二乙氧基矽烷(aminoethylaminopropylmethyldiethoxy silane)、氨乙基氨甲基三乙氧基矽烷(aminoethylaminomethyltriethoxy silane)、氨乙基氨甲基甲基二乙氧基矽烷(aminoethylaminomethylmethyldiethoxy silane)、二伸乙基三氨丙基三甲氧基矽烷(diethylenetriaminopropyltrimethoxy silane)、二伸乙基三氨丙基三乙氧基矽烷(diethylenetriaminopropyltriethoxy silane)、二伸乙基三氨丙基甲基二甲氧基矽烷(diethylenetriaminopropylmethyldimethoxy silane)、二伸乙基氨甲基甲基二乙氧基矽烷(diethyleneaminomethylmethyldiethoxy silane)、(N-苯氨基)甲基三甲氧基矽烷((N-phenylamino)methyltrimethoxy silane)、(N-苯氨基)甲基三乙氧基矽烷((N-phenylamino)methyltriethoxy silane)、(N-苯氨基)甲基甲基二甲氧基矽烷((N-phenylamino)methylmethyldimethoxy silane)、(N-苯氨基)甲基甲基二乙氧基矽烷((N-phenylamino)methylmethyldiethoxy silane)、3-(N-苯氨基)丙基三甲氧基矽烷(3-(N-phenylamino)propyltrimethoxy silane)、3-(N-苯氨基)丙基三乙氧基矽烷(3-(N-phenylamino)propyltriethoxy silane)、3-(N-苯氨基)丙基甲基二甲氧基矽烷(3-(N-phenylamino)propylmethyldimethoxy silane)、3-(N-苯氨基)丙基甲基二乙氧基矽烷(3-(N-phenylamino)propylmethyldiethoxy silane)、N-(正丁基)-3-氨丙基三甲氧基矽烷
(N-(N-butyl)-3-aminopropyltrimethoxy silane)、縮水甘油氧基丙基三甲氧基矽烷(glycidoxypropyl trimethoxy silane)以及縮水甘油氧基丙基三乙氧基矽烷(glycidoxypropyl triethoxy silane)。
在實施例中,經矽烷改質之乙烯/α-烯烴類共聚物可包含上述不飽和矽烷化合物以及氨基矽烷化合物兩者作為矽烷化合物。在本文中,不飽和矽烷化合物及氨基矽烷化合物(例如)可以100:0.5至100:30之重量比進行混合且被包含。當經矽烷改質之乙烯/α-烯烴類共聚物包含不飽和矽烷化合物與氨基矽烷化合物兩者時,自其製備之密封劑與其中僅包含兩種材料中之一者的情況相比可確保更優良的黏合物理特性。
經矽烷改質之乙烯/α-烯烴類共聚物可藉由將包含自由基起始劑之樹脂組成物進行聚合而非將上述乙烯/α-烯烴類共聚物與矽烷化合物進行聚合來製備。
作為自由基起始劑,可使用使矽烷化合物及乙烯/α-烯烴類共聚物之接枝聚合起始之任何自由基起始劑,不特別限制。自由基起始劑(例如)可由可起始乙烯基之自由基聚合之化合物中選出,且作為具體實例,自由基起始劑可為由有機過氧化物、氫過氧化物(hydro peroxide)、偶氮化合物等所構成的族群中選出之一或多種類型。更具體言之,自由基起始劑之實例可包含由下列各者所構成的族群中選出之一或多種類型:二烷基過氧化物,諸如第三丁基異丙苯基過氧化物(t-butylcumyl peroxide)、二第三丁基過氧化物、二異丙苯基過氧化物、2,5-二甲基-2,5-二(第三丁基過氧基)己烷、2,5-二甲基-2,5-二(第三丁基過氧基)-3-己炔
(2,5-dimethyl-2,5-di(t-butylperoxy)-3-hexyne)等;氫過氧化物,諸如氫過氧化異丙苯(cumene hydroperoxide)、氫過氧化二異丙苯(diisopropyl benzene hydroperoxide)、2,5-二甲基-2,5-二(氫過氧基)己烷、氫過氧化第三丁基(t-butyl hydroperoxide)等;二醯基過氧化物(diacyl peroxide),諸如過氧化雙-3,5,5-三甲基己醯基(bis-3,5,5-trimethylhexanoyl peroxide)、過氧化辛醯基(octanoyl peroxide)、過氧化苯甲醯基、過氧化鄰甲基苯甲醯基(o-methylbenzoyl peroxide)、過氧化2,4-二氯苯甲醯基(2,4-dichlorobenzoyl peroxide)等;過氧酯,諸如異丁酸第三丁基過氧酯(t-butylperoxy isobutyrate)、乙酸第三丁基過氧酯(t-butylperoxy acetate)、第三丁基過氧-2-乙基己酸酯(t-butylperoxy-2-ethylhexanoate)、特戊酸第三丁基過氧酯(t-butylperoxy pivalate)、辛酸第三丁基過氧酯(t-butylperoxy octoate)、碳酸第三丁基過氧異丙酯(t-butylperoxyisopropyl carbonate)、苯甲酸第三丁基過氧酯(t-butylperoxy benzoate)、鄰苯二甲酸二第三丁基過氧酯(di-t-butylperoxy phthalate)、2,5-二甲基-2,5-二(苯甲醯基過氧基)己烷(2,5-dimethyl-2,5-di(benzoylperoxy)hexane)、2,5-二甲基-2,5-二(苯甲醯基過氧基)-3-己炔(2,5-dimethyl-2,5-di(benzoylperoxy)-3-hexyne)等;酮過氧化物,諸如甲基乙基酮過氧化物、過氧化環己酮(cyclohexanone peroxide)等;過氧化月桂醯基(lauroyl peroxide);以及偶氮化合物,諸如偶氮雙異丁腈(azobisisobutyronitrile)、偶氮雙(2,4-二甲
基戊腈)(azobis(2,4-dimethylvaleronitrile))等,但不限於此。
相對於100重量份的乙烯/α-烯烴類共聚物,可包含0.001重量份至5重量份、0.005重量份至3重量份或0.01重量份至1重量份的自由基起始劑。
製備經矽烷改質之乙烯/α-烯烴類共聚物之方法不受特別限制。舉例而言,將包含乙烯/α-烯烴類共聚物之樹脂組成物及矽烷化合物添加至反應器中,且藉由在自由基起始劑存在下熱熔融進行接枝反應以製備經矽烷改質之乙烯/α-烯烴類共聚物。
作為反應器,可使用其中藉由使液相反應物熱熔融或反應來製備所需共聚物之任何反應器,不特別限制。反應器(例如)可由雙螺桿擠壓機中選出,且經矽烷改質之乙烯/α-烯烴類共聚物可經由上述擠壓機製備為呈球粒形式之母料。
在實施例中,經矽烷改質之乙烯/α-烯烴類共聚物可包含含有烯烴類單體單元之主鏈及結合至主鏈之分支鏈。
當上述乙烯/α-烯烴類共聚物具有許多側鏈時,密度為低的。具有較少側鏈之乙烯/α-烯烴類共聚物具有高密度,且因此考慮到接枝效率,較佳使用具有許多側鏈之乙烯/α-烯烴類共聚物。當乙烯/α-烯烴類共聚物之接枝效率提高時,密封劑之黏合強度可得到進一步改善。
在所述實施例中,分支鏈可包含由下式3表示之化合物。
[式3]-SiR12R13R14
在式3中,R12及R13各自獨立地為鹵素、胺基、-R15R16
或-R16,R15為氧(O)或硫(S)原子,R16為氫、烷基、芳基、芳烷基或醯基,R14為-OSiR17 mR18 (2-m)R19,R17及R18各自獨立地為鹵素、胺基、-R20R21或-R21,R20為氧(O)或硫(S)原子,R21為氫、烷基、芳基、芳烷基或醯基,R19為-(CH2)nNR22R23,R22及R23各自獨立地為結合至氮原子之氫或R24NH2,R24為伸烷基,m為1或2的整數,且n為1或大於1的整數。
在式3中,較佳地,R12及R13獨立地表示結合至矽原子之羥基或-R15R16,R15為氧,R16表示烷基。另外,R14較佳結合至矽原子且表示-OSiR17 mR18 (2-m)R19。這裡,R17及R18可獨立地表示結合至矽原子之羥基或-R20R21,R20可為氧,且R21可為烷基。
另外,R19較佳結合至矽原子且表示-(CH2)nNR22R23,R22及R23可獨立地表示結合至氮原子之氫或R24NH2,R24可為伸烷基,但本申請案不限於此。
另外,更佳地,在式3中,R12及R13可為羥基,R14可為結合至矽原子之-OSiR17 mR18 (2-m)R19,R17及R18可為羥基,R19可為結合至矽原子之-(CH2)nNR22R23。另外,更佳地,R22可為氫,R23可為R24NH2,且R24可為伸烷基,但本申請案不限於此。
在實施例中,經矽烷改質之乙烯/α-烯烴類共聚物可包含含有烯烴類單體聚合單元之主鏈及結合至所述主鏈之分支鏈,且所述分支鏈可包含由下式4表示之化合物。
[式4]-SiR25 rR26 (3-r)
在式4中,R25及R26各自獨立地為鹵素、胺基、-R27R28
或-R28,R27為氧(O)或硫(S)原子,R28為氫、烷基、芳基、芳烷基或醯基,且r為1至3範圍內的整數。
在式4中,較佳地,R25及R26可獨立地為結合至矽原子之羥基或-R27R28,R27可為氧,且R28可為烷基,但本申請案不限於此。
當經矽烷改質之乙烯/α-烯烴類共聚物包含主鏈及分支鏈,且所述分支鏈包含含有上述式3及/或式4之化合物時,可極好地確保更優良的物理特性,諸如黏合強度、密封特性、絕緣特性、長期耐久性、可成形性等。
形成經矽烷改質之乙烯/α-烯烴類共聚物之主鏈為乙烯/α-烯烴類共聚物,且與上述相同。
除了上述乙烯/α-烯烴類共聚物及經矽烷改質之乙烯/α-烯烴類共聚物之外,根據本申請案之實施例的密封劑亦可包含耐熱聚合物樹脂。
在實施例中,耐熱聚合物樹脂為具有高於乙烯/α-烯烴類共聚物的熔點(Tm)之聚合物樹脂。
作為耐熱聚合物樹脂,可使用各種具有高於乙烯/α-烯烴類共聚物的熔點(Tm)之任何耐熱聚合物樹脂,不特別限制。考慮到與乙烯/α-烯烴類共聚物、經矽烷改質之乙烯/α-烯烴類共聚物等之相容性,可適當地選擇耐熱聚合物樹脂,且(例如)可為聚烯烴類樹脂,諸如聚乙烯類樹脂及/或聚丙烯類樹脂等。
在實施例中,耐熱聚合物樹脂可包含低密度聚乙烯(low
density polyethylene;LDPE)。在本說明書中,術語「低密度聚乙烯」可指示衍生自乙烯單體且具有低結晶度之熱塑性乙烯聚合物,其在基於約2%碳原子計算之後包含比高密度聚乙烯(high density polyethylene;HDPE)更多的長鏈分支。
低密度聚乙烯可為密度為0.960公克/立方公分或小於0.960公克/立方公分之聚乙烯,且更具體言之,可為密度在約0.820公克/立方公分至0.960公克/立方公分範圍內之低密度聚乙烯。
舉例而言,耐熱聚合物樹脂之熔點可為60℃或大於60℃。在本說明書中,術語「熔點」可指示與一般含義的「熔點」相同的概念,且更具體言之,可指示樹脂之主鏈可流動之最低溫度。
在另一實施例中,耐熱聚合物樹脂之熔點可為70℃或大於70℃、80℃或大於80℃、90℃或大於90℃、或100℃或大於100℃,但不限於此。
另外,耐熱聚合物樹脂之熔點愈高,其可成形性及與上述乙烯/α-烯烴類共聚物及/或經矽烷改質之乙烯/α-烯烴類共聚物之相容性愈優良,且因此熔點之上限不受特別限制,但(例如)可為約250℃、200℃或150℃。
在實施例中,考慮到可成形性及與其他共聚物之相容性,耐熱聚合物樹脂之熔點可在100℃至150℃範圍內。
耐熱聚合物樹脂在190℃的溫度及2.16公斤的負荷下之熔融指數(MI)可(例如)在0.1公克/10分鐘至40公克/10分鐘、0.1公克/10分鐘至35公克/10分鐘、0.1公克/10分鐘至30公克/10分鐘或0.1公克/10分鐘至25公克/10分鐘之範圍內,但不特別限
於此。
當在上述範圍內調整耐熱聚合物樹脂之熔融指數時,由耐熱聚合物樹脂製成之密封劑可防止可歸因於太陽能電池模組中蠕變特性(creep property)之低改善作用之分層,可提高與上述乙烯/α-烯烴共聚物等之相容性,且當形成片型密封劑時,可成形性可為優良的。
相對於100重量份之乙烯/α-烯烴類共聚物與經矽烷改質之乙烯/α-烯烴類共聚物的混合物,可包含(例如)0.01重量份或大於0.01重量份但小於3重量份、且更具體言之0.1重量份至2.5重量份或1重量份至2重量份之範圍的耐熱聚合物樹脂。
當在上述範圍內調整耐熱聚合物樹脂之含量時,由耐熱聚合物樹脂製成之密封劑片可改善蠕變特性且確保優良的透明性。
根據本申請案之實施例的密封劑包含上述三種組分,且可選擇性地更包含其他樹脂組分或添加劑。
作為樹脂組分,可鑒於上述熔點、熔融指數等來適當地選擇及包含典型使用的樹脂。
舉例而言,添加劑可包含熱穩定劑、光穩定劑(UV穩定劑)、UV吸收劑、抗氧化劑等。
舉例而言,熱穩定劑可為由下列各者中選出之一或多種類型:磷類穩定劑,諸如亞磷酸三(2,4-二第三丁基苯基)酯、亞磷酸雙[2,4-雙(1,1-二甲基乙基)-6-甲基苯基]乙酯、雙膦酸四(2,4-二
第三丁基苯基)-[1,1-聯苯]-4,4’-二基酯(tetrakis(2,4-di-tert-butylphenyl)-[1,1-biphenyl]-4,4’-diylbisphosph onate)、雙(2,4-二第三丁基苯基)季戊四醇二亞磷酸酯等;及內酯類穩定劑,諸如8-羥基-5,7-二第三丁基-呋喃-2-酮與鄰二甲苯之反應產物等。
光穩定劑可防止光氧化,且胺類化合物或哌啶類化合物可為其示例,但光穩定劑不限於此。
舉例而言,UV吸收劑可包含二苯甲酮類UV吸收劑、苯并三唑類UV吸收劑、丙烯腈類UV吸收劑、金屬錯合物鹽類UV吸收劑、胺類UV吸收劑、氧化鈦、氧化鋅等。
另外,可使用相關領域中已知的任何抗氧化劑作為抗氧化劑(而沒有限制),例如酚、胺、醌、硫或磷抗氧化劑可為示例,且可使用市售產品。舉例而言,市售產品可包含例如適當地由下列各者中選出之一種類型或兩種或大於兩種類型之混合物:Irganox 1076(巴斯夫股份公司(BASF SE))、Irgafos 168(巴斯夫股份公司)、Irganox 1010(汽巴精化(Ciba Specialty Chemicals))、Irganox 1098(汽巴精化)、Irganox 1330(汽巴精化)、Irganox 3114(汽巴精化)、Irganox 3125(汽巴精化)、Cyanox 1790(氰特工業公司(Cytec Industries Inc.))、Tinuvin 120(巴斯夫股份公司)、Tinuvin 326(巴斯夫股份公司)、Tinuvin 327(巴斯夫股份公司)、Tinuvin 328(巴斯夫股份公司)、Irgafos 12(汽巴精化)、Irgafos 38(汽巴精化)、Weston 618(通用電氣(GENERAL ELECTRICS))、Weston 619G(通用電氣)或Ultranox 626(通用
電氣)。抗氧化劑之含量可根據用途及類型進行適當調整,且相對於上述乙烯/α-烯烴類共聚物與經矽烷改質之乙烯/α-烯烴類共聚物之100重量份的混合物,(例如)可以0.1重量份至10重量份之範圍來包含抗氧化劑。
除了上述添加劑之外,可進一步適當地使用相關領域中已知的各種添加劑。添加劑之含量可根據用途及類型進行適當調整。相對於乙烯/α-烯烴類共聚物與經矽烷改質之乙烯/α-烯烴類共聚物之100重量份的混合物,可(例如)以約0.001重量份至10重量份之適合範圍呈混合物形式來包含添加劑,但不限於此。
當根據本申請案之實施例的密封劑包含上述組分時,密封劑可展現優良的蠕變特性。
在實施例中,根據本申請案之實施例的密封劑可滿足以下表達式1。
在表達式1中,在將兩層密封劑在第一玻璃板與第二玻璃板之間重疊且層壓以製備尺寸為20公分×35公分(寬度×長度)之樣品之後,將樣品垂直(90°)豎立,將第一玻璃板懸掛,將樣品在100℃下維持10小時,其中所述密封劑尺寸為20公分×25公分(寬度×長度),所述第一玻璃板厚度為3.2毫米且尺寸為20公分×30公分(寬度×長度),所述第二玻璃板厚度為3.2毫米且尺寸為20公分×30公分(寬度×長度),且在本文中,第二玻璃板之左側、中心以及右側之垂直蠕變距離之平均值由△X表示。
將參考圖2詳細地描述表達式1。
參考圖2,製備厚度為3.2毫米、寬度為20公分以及長度為30公分之第一玻璃板G1;及厚度為3.2毫米、寬度為20公分以及長度為30公分之第二玻璃板G2。在本文中,低鐵強化玻璃板較佳用作玻璃板G1及玻璃板G2,且第一玻璃板G1及第二玻璃板G2各自可具有約465公克至480公克範圍內之重量。
隨後,在第一玻璃板G1與第二玻璃板G2之間重疊及插入兩層密封劑S,且在約150℃溫度下在真空層壓機中層壓以製備尺寸為20公分×35公分(寬度×長度)之樣品。在本文中,將密封劑S切成20公分×25公分(寬度×長度)尺寸以供使用,但密封劑S之厚度不受限制。另外,當將玻璃板G1及玻璃板G2安置於密封劑S兩側上時,如圖2中所說明,第一玻璃板G1及第二玻璃板G2較佳安置成分別在密封劑S上方及下方延伸,且以約5公分間隙交替。
隨後,將樣品豎立成垂直(90°)於地面,且經由夾具等將第一玻璃板G1固定地懸掛。接著,在將樣品在100℃下在室中垂直固持約10小時之後,在第二玻璃板G2之左側、中心以及右側中的每一者處量測圖2中所示的第二玻璃板G2自基線向下滑動之距離,亦即,第二玻璃板G2在垂直方向上蠕變之距離,且因此可計算其平均值(△X)。
當使用一種根據例示性實施例之方法量測的平均值(△X)為3毫米或小於3毫米時,可確保優良的蠕變物理特性。在另一實施例中,根據本申請案之實施例的蠕變距離(△X)可為2.75
毫米或小於2.75毫米、或2.5毫米或小於2.5毫米。
當調整根據本申請案之實施例的密封劑以滿足表達式1時,可確保優良的蠕變物理特性,且因此即使是在高溫及/或高濕度之條件下長期使用密封劑時,不會產生分層且改變減少。因此,當密封劑應用於光模組時,光模組可展現優良的耐久性等。
另外,本申請案是關於一種製造密封劑之方法。
作為一種製造密封劑之例示性方法,可使用包含製備片型密封劑之操作的任何方法(而沒有限制),其中所述片型密封劑使用包含上述組分之樹脂組成物。
更具體言之,製造密封劑之方法包含使用包含乙烯/α-烯烴共聚物、經矽烷改質之乙烯/α-烯烴共聚物以及耐熱聚合物樹脂之樹脂組成物製備片型密封劑之操作。
可使用擠壓機、例如T模擠壓機使密封劑成形為片形。
另外,可添加各組份至擠壓機中,或可以母料形式放入,且較佳以母料形式添加所述組分。
經由擠壓製程製備的密封劑之厚度可(例如)在10微米至5000微米、50微米至2000微米或100微米至1500微米之範圍內,但不限於此。
本申請案亦關於一種光模組。
作為例示性光模組,可使用包含上述密封劑之任何光模組,不特別限制。
根據本申請案之實施例的光模組包含密封劑及由所述密封劑密封之光學裝置。所述光學裝置(例如)可適當地由下列
各者中選出:光電池裝置,諸如太陽能電池等;發光裝置,諸如發光二極體、有機發光二極體等;以及感測光之光感測器等。根據本申請案之實施例的光模組可為(例如)太陽能電池模組。
圖3為例示性說明根據本申請案之實施例的光模組之視圖。
如圖3中所示,根據本申請案之實施例的例示性光模組包含正面基板210、密封劑層220、太陽能電池C以及背板100。
正面基板較佳為保護太陽能電池之正面(對應於圖中之上側)且提供光接收表面之基板。較佳地,正面基板具有優良的透光率。作為正面基板,(例如)較佳使用硬基板(諸如強化玻璃)、透明塑膠板等作為有利於入射光之透明基板。
密封劑層為密封(封裝及/或固定)太陽能電池之層,其可包含正面密封劑層221及背面密封劑層222。在本文中,如圖3中所示,太陽能電池可封裝及/或固定在正面密封劑層與背面密封劑層之間。正面密封劑層221及背面密封劑層222中之至少一者可設置為根據本申請案之實施例的密封劑。
如圖3中所示,可將多個太陽能電池配置於密封劑層中。亦即,可在正面密封劑層221與背面密封劑層222之間配置多個太陽能電池的同時進行封裝及/或固定。另外,太陽能電池彼此電連接。
太陽能電池可為(例如)結晶太陽能電池、薄膜型太陽能電池等,但不特別限於此。另外,太陽能電池可包含正面電極太陽能電池、背面電極太陽能電池以及其組合。
將背板附接在背面密封劑層之下。可藉由熱層壓(熱焊接)、黏合劑等將背板附接在背面密封劑層之下。黏合劑可為(例如)由下列各者中選出之一或多種類型:丙烯酸系黏合劑、氨基甲酸乙酯黏合劑、環氧黏合劑以及聚烯烴黏合劑等,但不特別限於此。
用來進行背板及背面密封劑層之熱層壓的條件不受特別限制,且(例如)熱層壓可在90℃至230℃或110℃至200℃之範圍內的溫度下進行1分鐘至30分鐘或1分鐘至10分鐘。
根據本申請案之實施例的光模組可藉由按順序堆疊正面基板、正面密封劑層、多個彼此電連接的太陽能電池、背面密封劑層以及背板,且使用一種在上面進行熱層壓同時整體真空吸收其之方法使其黏附來製備。
背板可包含基底10及形成於基底10之至少一側上之表面層20及表面層30。背板可具有各種顏色,諸如透明色、白色、黑色等。顏色(例如)可根據包含於表面層20及表面層30中的顏色染料之類型及含量來適當地實現。
表面層20及表面層30之數目可為一或多個。圖3展示本申請案之一例示性實施例,例示在基底10之兩側上形成的表面層20及表面層30。
背板除了基底及表面層之外可更包含一或多個功能層,且相關領域中已知的各種材料可用作基底及表面層。
在下文中,將結合根據本申請案之實例及並非根據本申請案之比較實例詳細地描述本申請案,但本申請案之範疇不限於
以下實例。
實例及比較實例中之物理特性根據以下方法評估如下。
1)玻璃板及密封劑片:製備兩個厚度為3.2毫米及尺寸為20公分×30公分(寬度×長度)之低鐵強化玻璃板(重量:475公克)。另外,將根據實例及比較實例的每一者的密封劑片(厚度:約500微米)切成20公分×25公分(寬度×長度)的尺寸。
2)熱層壓:以第一玻璃板(下板)、(兩個)密封劑以及第二玻璃板(上板)之順序將兩個密封劑片堆疊在兩個玻璃板之間。將第一玻璃板及第二玻璃板堆疊成分別在兩個密封劑上方及下方延伸,其中間隙為約5公分(參考圖2)。
接著,在150℃溫度下在真空層壓機中進行熱層壓17分鐘(真空處理6分鐘→壓縮1分鐘→維持10分鐘),且因此製備尺寸為20公分×35公分(寬度×長度)之樣品。
3)蠕變距離之量測:將樣品垂直豎立於室中,經由夾具懸掛第一玻璃板,將樣品在維持100℃溫度及60%濕度之室中以垂直固持方式儲存10小時(參考圖2),量測第二玻璃板之左側、中心以及右側各自距基線之各蠕變距離(滑動距離),計算其平均值(△X)且根據以下標準進行評估,且接著展示於表1中。
○:當在左側、中心以及右側中的每一者處量測的蠕變距離之平均值(△X)為3毫米或小於3毫米時。
×:當在左側、中心以及右側中之每一者處量測的蠕變
距離之平均值(△X)大於3毫米時。
在將乙烯基三甲氧基矽烷(vinyltrimethoxy silane;VTMS)及Luperox® 101(2,5-雙(第三丁基過氧基)-2,5-二甲基己烷)以50:1重量比混合之後,相對於100重量份的乙烯/1-辛烯共聚物,混合物以5重量份包含於密度為0.870公克/立方公分及在190℃溫度及2.16公斤負荷下熔融指數(MI)為5公克/10分鐘之乙烯/1-辛烯共聚物(LC670;LG化學(LG Chem.))中,將其與乙烯/1-辛烯共聚物一起放入雙螺桿擠壓機中,在220℃溫度下擠壓(加熱、熔融以及攪拌)以進行接枝反應,且因此製備經矽烷改質之乙烯/α-烯烴共聚物之母料(在下文中被稱作「Si M/B」)。
將一定量的UV吸收劑、UV穩定劑以及抗氧化劑與密度為0.870公克/立方公分、熔點為58℃以及在190℃溫度及2.16公斤負荷下熔融指數為5公克/10分鐘之乙烯/1-辛烯共聚物(LC670;LG化學,在下文中被稱作「基礎樹脂」)混合,且接著擠壓以製備UV母料(在下文中被稱作「UV M/B」)。
此後,將如上製備的基礎樹脂、Si M/B以及UV M/B與作為耐熱聚合物樹脂的低密度聚乙烯(BC500;LG化學,在下文中被稱作「LDPE」)以65:35:3:2重量比混合,且因此製備混合物,其中所述低密度聚乙烯的熔點(Tm)約為105℃及在190℃溫度及2.16公斤負荷下熔融指數(MI)為3公克/10分鐘。
將混合物引入具有雙螺桿擠壓機(φ 19毫米)及T模(寬度:200毫米)之擠壓機之料斗中,在180℃溫度及3公尺/分鐘提取速度下擠壓,且因此製備厚度為約500微米之密封劑片。
除了相對於基礎樹脂與Si M/B之100重量份混合物,以1重量份來包含LDPE外,以與實例1中相同之方式製備密封劑片。
除了相對於基礎樹脂與Si M/B之100重量份混合物,以3重量份來包含LDPE外,以與實例1中相同之方式製備密封劑片。
除了相對於基礎樹脂與Si M/B之100重量份混合物,以5重量份來包含LDPE外,以與實例1中相同之方式製備密封劑片。
除了包含熔點(Tm)約為105℃、在190℃及2.16公斤負荷下熔融指數(MI)為0.3公克/10分鐘之LDPE(BF0300;LG化學)作為耐熱聚合物樹脂外,以與實例1中相同之方式製備密封劑片。
除了包含熔點(Tm)約為105℃、在190℃及2.16公斤負荷下熔融指數(MI)為8.5公克/10分鐘之LDPE(LB8500;LG
化學)作為耐熱聚合物樹脂外,以與實例1中相同之方式製備密封劑片。
除了包含熔點(Tm)約為105℃、在190℃及2.16公斤負荷下熔融指數(MI)為24公克/10分鐘之LDPE(MB9205;LG化學)作為耐熱聚合物樹脂外,以與實例1中相同之方式製備密封劑片。
除了未將LDPE引入擠壓機之料斗中,且使用其中基礎樹脂、Si M/B以及UV M/B以63.1:34:2.9重量比混合之混合物外,以與實例1中相同之方式製備密封劑片。
除了包含熔點(Tm)約為105℃、在190℃及2.16公斤負荷下熔融指數(MI)為50公克/10分鐘之LDPE(MB9500;LG化學)作為耐熱聚合物樹脂外,以與實例1中相同之方式製備密封劑片。
根據實例1至實例4及比較實例1之密封劑片中每一者之抗蠕變特性展示於下表1中。
另外,圖4展示根據實例1及比較實例1之密封劑片在剛剛測試抗蠕變特性之後的圖像。
如表1及圖4中所示,當包含耐熱聚合物樹脂(LDPE)時,蠕變特性得到改善,蠕變距離最小或不存在蠕變,且因此可確定密封劑片適用於密封劑。
另外,根據實例5至實例7及比較實例2之密封劑片之蠕變特性展示於下表2中。
如表2中所示,確定蠕變物理特性可隨LDPE之熔融指數(MI)而不同,且當熔融指數(MI)為約40公克/10分鐘或小於40公克/10分鐘時,蠕變物理特性對欲應用於密封劑之密封劑片而言為足夠優良的。
10‧‧‧基底
20‧‧‧表面層
30‧‧‧表面層
100‧‧‧背板
210‧‧‧正面基板
220‧‧‧密封劑層
221‧‧‧正面密封劑層
222‧‧‧背面密封劑層
C‧‧‧太陽能電池
Claims (18)
- 一種光模組用的密封劑,包括:乙烯/α-烯烴類共聚物;經矽烷改質之乙烯/α-烯烴類共聚物;以及耐熱聚合物樹脂,具有高於所述乙烯/α-烯烴類共聚物之熔點(Tm),其中所述光模組用的密封劑滿足以下表達式1:[表達式1]△X3毫米在所述表達式1中,在將兩層所述密封劑重疊且插入於第一玻璃板與第二玻璃板之間,且進行層壓以製備尺寸為20公分×35公分(寬度×長度)之樣品之後,將所述樣品垂直(90°)豎立,將所述第一玻璃板固定地懸掛,將所述樣品在100℃下維持10小時,其中所述密封劑的尺寸為20公分×25公分(寬度×長度),所述第一玻璃板的厚度為3.2毫米且尺寸為20公分×30公分(寬度×長度),所述第二玻璃板的厚度為3.2毫米且尺寸為20公分×30公分(寬度×長度),且所述第二玻璃板之左側、中心以及右側之垂直蠕變距離之平均值由△X表示。
- 如申請專利範圍第1項所述之光模組用的密封劑,其中所述耐熱聚合物樹脂之熔點(Tm)為100℃或大於100℃。
- 如申請專利範圍第1項所述之光模組用的密封劑,其中所述耐熱聚合物樹脂之熔點(Tm)在100℃至150℃範圍內。
- 如申請專利範圍第1項所述之光模組用的密封劑,其中所述耐熱聚合物樹脂之熔融指數(MI)小於所述乙烯/α-烯烴類共聚 物之熔融指數(MI)。
- 如申請專利範圍第1項所述之光模組用的密封劑,其中所述耐熱聚合物樹脂在190℃的溫度及2.16公斤的負荷下之熔融指數(MI)是在0.1公克/10分鐘至40公克/10分鐘範圍內。
- 如申請專利範圍第1項所述之光模組用的密封劑,其中相對於所述乙烯/α-烯烴類共聚物與所述經矽烷改質之乙烯/α-烯烴類共聚物之100重量份的混合物,以0.1重量份至10重量份之範圍來包含所述耐熱聚合物樹脂。
- 如申請專利範圍第1項所述之光模組用的密封劑,其中相對於所述乙烯/α-烯烴類共聚物與所述經矽烷改質之乙烯/α-烯烴類共聚物之100重量份的混合物,以1重量份至5重量份之範圍來包含所述耐熱聚合物樹脂。
- 如申請專利範圍第1項所述之光模組用的密封劑,其中所述耐熱聚合物樹脂為聚乙烯類樹脂及/或聚丙烯類樹脂。
- 如申請專利範圍第1項所述之光模組用的密封劑,其中所述耐熱聚合物樹脂包括低密度聚乙烯。
- 如申請專利範圍第1項所述之光模組用的密封劑,其中所述經矽烷改質之乙烯/α-烯烴類共聚物為與矽烷化合物進行接枝聚合之所述乙烯/α-烯烴類共聚物。
- 如申請專利範圍第10項所述之光模組用的密封劑,其中所述矽烷化合物包括不飽和矽烷化合物及/或氨基矽烷化合物。
- 如申請專利範圍第10項所述之光模組用的密封劑,其中所述矽烷化合物包括由下式1表示之化合物: [式1]DSiR1 pR2 (3-p)在所述式1中,D為烯基,R1為烷氧基、烷硫基、芳氧基、醯氧基、羥基、鹵素基團、胺基或-R3R4,R3為氧(O)或硫(S)原子,R4為烷基、芳基或醯基,R2為氫、烷基、芳基或芳烷基,且p為1至3的範圍內的整數。
- 如申請專利範圍第10項所述之光模組用的密封劑,其中所述矽烷化合物包括由下式2表示之化合物:[式2]SiR5 qR6 (4-q)在所述式2中,R5為-(CH2)vNR7R8,R7及R8各自獨立地為結合至氮原子之R9NH2或氫,R9為具有1個至6個碳原子之伸烷基,R6為鹵素、胺基、-R10R11或-R11,R10為氧(O)或硫(S)原子,R11為氫、烷基、芳基、芳烷基或醯基,且q為1至4的範圍內的整數,且v為1或大於1的整數。
- 如申請專利範圍第10項所述之光模組用的密封劑,其中所述經矽烷改質之乙烯/α-烯烴類共聚物包括包含烯烴類單體聚合單元之主鏈及結合至所述主鏈之分支鏈,且所述分支鏈包含由下式3表示之化合物:[式3]-SiR12R13R14在所述式3中,R12及R13各自獨立地為鹵素、胺基、-R15R16或-R16,R15為氧(O)或硫(S)原子,R16為氫、烷基、芳基、 芳烷基或醯基,R14為-OSiR17 mR18 (2-m)R19,R17及R18各自獨立地為鹵素、胺基、-R20R21或-R21,R20為氧(O)或硫(S)原子,R21為氫、烷基、芳基、芳烷基或醯基,R19為-(CH2)nNR22R23,R22及R23各自獨立地為結合至氮原子之氫或R24NH2,R24為伸烷基,m為1或2的整數,且n為1或大於1的整數。
- 如申請專利範圍第10項所述之光模組用的密封劑,其中所述經矽烷改質之乙烯/α-烯烴類共聚物包括包含烯烴類單體聚合單元之主鏈及結合至所述主鏈之分支鏈,且所述分支鏈包含由下式4表示之化合物:[式4]-SiR25 rR26 (3-r)在所述式4中,R25及R26各自獨立地為鹵素、胺基、-R27R28或-R28,R27為氧(O)或硫(S)原子,R28為氫、烷基、芳基、芳烷基或醯基,且r為1至3範圍內的整數。
- 一種製造如申請專利範圍第1項所述之光模組用的密封劑之方法,包括製造片狀樹脂組成物,其包含乙烯/α-烯烴類共聚物、經矽烷改質之乙烯/α-烯烴類共聚物以及耐熱聚合物樹脂,所述耐熱聚合物樹脂的熔點高於所述乙烯/α-烯烴類聚合物的熔點。
- 一種光模組,包括如申請專利範圍第1項至第15項中任一項所述之光模組用的密封劑。
- 如申請專利範圍第17項所述之光模組,包括:正面基板;密封劑層,形成於所述正面基板上; 太陽能電池,由所述密封劑層密封;以及背板,形成於所述密封劑層上。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20140022842 | 2014-02-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201542655A TW201542655A (zh) | 2015-11-16 |
TWI550006B true TWI550006B (zh) | 2016-09-21 |
Family
ID=54009354
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104106312A TWI550006B (zh) | 2014-02-26 | 2015-02-26 | 光模組用密封劑、其製造方法及含有其的光模組 |
TW104106305A TWI563072B (en) | 2014-02-26 | 2015-02-26 | Encapsulant for light module, method for manufacturing the same and light module comprising the same |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104106305A TWI563072B (en) | 2014-02-26 | 2015-02-26 | Encapsulant for light module, method for manufacturing the same and light module comprising the same |
Country Status (7)
Country | Link |
---|---|
US (2) | US10854766B2 (zh) |
EP (2) | EP3112415B1 (zh) |
JP (2) | JP6296314B2 (zh) |
KR (2) | KR101692610B1 (zh) |
CN (2) | CN106062067B (zh) |
TW (2) | TWI550006B (zh) |
WO (2) | WO2015130101A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2811973T3 (es) * | 2016-03-24 | 2021-03-15 | Borealis Ag | Película laminada que comprende copolímero de etileno |
KR102553655B1 (ko) * | 2018-04-16 | 2023-07-07 | 보레알리스 아게 | 다층 요소 |
JP2021526728A (ja) * | 2018-04-16 | 2021-10-07 | セ エス エ エム サントル スイス デレクトロニク エ ド ミクロテクニク ソシエテ アノニム ルシェルシェ エ ディベロップメント | 光電池モジュールの製造方法 |
KR101955911B1 (ko) * | 2018-08-23 | 2019-03-12 | 더블유스코프코리아 주식회사 | 분리막 및 그 제조방법 |
CN111261537A (zh) * | 2020-02-19 | 2020-06-09 | 浙江祥邦科技股份有限公司 | 垂直蠕变测试方法 |
WO2023229581A1 (en) * | 2022-05-24 | 2023-11-30 | Amcor Flexibles North America, Inc. | Encapsulant film and photovoltaic module comprising the same |
KR20240075475A (ko) * | 2022-11-22 | 2024-05-29 | 롯데케미칼 주식회사 | 에틸렌-알파-올레핀 공중합체 조성물, 이를 포함하는 태양전지 봉지재용 수지 조성물 및 태앙전지용 봉지재 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101248099A (zh) * | 2005-07-11 | 2008-08-20 | 陶氏环球技术公司 | 硅烷接枝的烯烃聚合物、组合物和由其制备的制品,及其制备方法 |
CN103228721A (zh) * | 2010-11-26 | 2013-07-31 | Lg化学株式会社 | 用于光伏电池模块的封装组合物和包括该封装组合物的光伏电池模块 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63171513A (ja) * | 1987-01-07 | 1988-07-15 | 松下電器産業株式会社 | 調理器 |
JP4336442B2 (ja) | 2000-05-23 | 2009-09-30 | キヤノン株式会社 | 太陽電池モジュール |
CN100546052C (zh) | 2003-06-03 | 2009-09-30 | 大日本印刷株式会社 | 太阳能电池模块用填充材料层及使用它的太阳能电池模块 |
JP5072211B2 (ja) * | 2005-10-05 | 2012-11-14 | 三井化学株式会社 | 太陽電池封止材、太陽電池封止用シート、およびそれらを用いた太陽電池モジュール。 |
KR100840114B1 (ko) | 2005-10-20 | 2008-06-19 | 주식회사 엘지화학 | 점착제 조성물 |
US8525017B2 (en) * | 2005-11-25 | 2013-09-03 | Mitsui Chemicals, Inc. | Sealing material for solar battery, sheet for sealing solar battery, and solar battery module using the same |
JP2009302220A (ja) | 2008-06-12 | 2009-12-24 | Techno Polymer Co Ltd | 太陽電池用封止膜および太陽電池モジュール |
KR101448314B1 (ko) * | 2009-05-15 | 2014-10-08 | 주식회사 엘지화학 | 봉지재 시트, 이의 제조방법 및 이를 포함하는 태양전지 모듈 |
US8865835B2 (en) * | 2009-07-17 | 2014-10-21 | Mitsubishi Plastics, Inc. | Solar cell sealing material and solar cell module produced using the same |
KR101191126B1 (ko) * | 2009-09-01 | 2012-10-15 | 주식회사 엘지화학 | 봉지재 시트, 이의 제조방법 및 이를 포함하는 태양전지 모듈 |
EP2585292A1 (en) * | 2010-06-24 | 2013-05-01 | Dow Global Technologies LLC | Electronic device module comprising heterogeneous polyolefin copolymer and optionally silane |
JP5525932B2 (ja) * | 2010-06-28 | 2014-06-18 | 日本ポリエチレン株式会社 | 太陽電池封止材用組成物、それからなる太陽電池封止材およびそれを用いた太陽電池モジュール |
JP2012097198A (ja) | 2010-11-02 | 2012-05-24 | Japan Polyethylene Corp | 機能性フィルムおよびその製造方法 |
KR20130143068A (ko) | 2010-11-30 | 2013-12-30 | 미쓰비시 쥬시 가부시끼가이샤 | 태양 전지용 다층체 및 그것을 이용하여 제작된 태양 전지 모듈 |
KR20120078026A (ko) | 2010-12-31 | 2012-07-10 | 에스케이씨 주식회사 | 태양전지 모듈용 백시트 일체형 봉지재 시트 및 이를 포함하는 태양전지 모듈 |
JP2012216805A (ja) | 2011-03-25 | 2012-11-08 | Sekisui Chem Co Ltd | 太陽電池モジュール用充填材シート |
CN103492480B (zh) | 2011-04-19 | 2015-04-22 | Lg化学株式会社 | 基于烯烃的离聚物树脂组合物 |
JP2014520390A (ja) | 2011-05-16 | 2014-08-21 | エルジー・ケム・リミテッド | 太陽電池用保護フィルム及びこれを含む太陽電池 |
JP5862084B2 (ja) * | 2011-07-08 | 2016-02-16 | 日本ポリエチレン株式会社 | 太陽電池封止材用樹脂組成物、及び太陽電池封止材、並びにそれを用いた太陽電池モジュール |
US9365711B2 (en) * | 2011-09-23 | 2016-06-14 | Dow Global Technologies Llc | Olefin-based polymer compositions and articles prepared therefrom |
JP5900511B2 (ja) | 2011-12-05 | 2016-04-06 | 大日本印刷株式会社 | 太陽電池モジュール用封止材シート |
JP2013165263A (ja) | 2012-01-13 | 2013-08-22 | Mitsubishi Plastics Inc | 外観が良好な太陽電池モジュール及びその製造方法 |
CN104114592A (zh) * | 2012-02-03 | 2014-10-22 | 陶氏环球技术有限责任公司 | 包括含硅烷的乙烯互聚物配方的膜和包括其的电子设备模块 |
US9923110B2 (en) * | 2012-06-07 | 2018-03-20 | Dai Nippon Printing Co., Ltd. | Solar battery module and method of manufacture thereof |
JP6252803B2 (ja) * | 2012-12-24 | 2017-12-27 | エルジー・ケム・リミテッド | オレフィン樹脂組成物 |
-
2015
- 2015-02-26 JP JP2016542729A patent/JP6296314B2/ja active Active
- 2015-02-26 CN CN201580010978.9A patent/CN106062067B/zh active Active
- 2015-02-26 KR KR1020150027109A patent/KR101692610B1/ko active IP Right Grant
- 2015-02-26 US US15/106,645 patent/US10854766B2/en active Active
- 2015-02-26 KR KR1020150027108A patent/KR101692609B1/ko active IP Right Grant
- 2015-02-26 TW TW104106312A patent/TWI550006B/zh active
- 2015-02-26 JP JP2016543005A patent/JP6222507B2/ja active Active
- 2015-02-26 EP EP15755958.4A patent/EP3112415B1/en active Active
- 2015-02-26 WO PCT/KR2015/001873 patent/WO2015130101A1/ko active Application Filing
- 2015-02-26 CN CN201580011010.8A patent/CN106103573B/zh active Active
- 2015-02-26 TW TW104106305A patent/TWI563072B/zh active
- 2015-02-26 EP EP15755590.5A patent/EP3112414B1/en active Active
- 2015-02-26 WO PCT/KR2015/001875 patent/WO2015130103A1/ko active Application Filing
- 2015-02-26 US US15/107,075 patent/US9806213B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101248099A (zh) * | 2005-07-11 | 2008-08-20 | 陶氏环球技术公司 | 硅烷接枝的烯烃聚合物、组合物和由其制备的制品,及其制备方法 |
CN103228721A (zh) * | 2010-11-26 | 2013-07-31 | Lg化学株式会社 | 用于光伏电池模块的封装组合物和包括该封装组合物的光伏电池模块 |
Also Published As
Publication number | Publication date |
---|---|
KR101692609B1 (ko) | 2017-01-03 |
EP3112414A1 (en) | 2017-01-04 |
US20180198012A1 (en) | 2018-07-12 |
EP3112414A4 (en) | 2017-10-04 |
JP6222507B2 (ja) | 2017-11-01 |
JP2017504203A (ja) | 2017-02-02 |
KR20150101428A (ko) | 2015-09-03 |
WO2015130103A1 (ko) | 2015-09-03 |
EP3112415B1 (en) | 2020-09-30 |
JP2017504200A (ja) | 2017-02-02 |
US10854766B2 (en) | 2020-12-01 |
KR101692610B1 (ko) | 2017-01-03 |
EP3112415A4 (en) | 2017-09-27 |
EP3112414B1 (en) | 2021-11-10 |
TW201542655A (zh) | 2015-11-16 |
KR20150101427A (ko) | 2015-09-03 |
US20160336469A1 (en) | 2016-11-17 |
CN106103573B (zh) | 2019-06-11 |
TWI563072B (en) | 2016-12-21 |
US9806213B2 (en) | 2017-10-31 |
CN106062067A (zh) | 2016-10-26 |
WO2015130101A1 (ko) | 2015-09-03 |
CN106103573A (zh) | 2016-11-09 |
CN106062067B (zh) | 2019-06-11 |
TW201610119A (zh) | 2016-03-16 |
JP6296314B2 (ja) | 2018-03-20 |
EP3112415A1 (en) | 2017-01-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI550006B (zh) | 光模組用密封劑、其製造方法及含有其的光模組 | |
US8981011B2 (en) | OLEFIN-based ionomer resin composition | |
KR101707268B1 (ko) | 광전자 장치용 이면시트, 이를 포함하는 광전자 장치 및 그 제조방법 | |
KR101718184B1 (ko) | 수지 조성물 | |
KR101514117B1 (ko) | 올레핀 수지 조성물 및 광전자 장치용 봉지재 | |
CN117157350A (zh) | 光学器件用封装剂组合物及使用其的光学器件用封装剂膜 | |
KR20160068259A (ko) | 올레핀 수지 조성물 | |
CN117120534A (zh) | 封装剂膜用组合物及包含其的封装剂膜 | |
KR20240016592A (ko) | 봉지재 필름용 조성물 및 이를 포함하는 봉지재 필름 | |
KR20240008134A (ko) | 올레핀계 공중합체용 가교제 조성물, 이를 포함하는 광소자용 봉지재 조성물 및 광소자용 봉지재 필름 | |
JP2024518490A (ja) | 封止材フィルム用組成物及びそれを含む封止材フィルム | |
KR20230160049A (ko) | 봉지재 필름용 조성물 및 이를 포함하는 봉지재 필름 | |
CN117413010A (zh) | 烯烃类共聚物用助交联剂组合物和交联组合物及光学器件用封装剂组合物用添加剂 | |
KR20240008268A (ko) | 올레핀계 공중합체용 가교제 조성물, 이를 포함하는광소자용 봉지재 조성물 및 광소자용 봉지재 필름 | |
KR20240008267A (ko) | 올레핀계 공중합체용 가교제 조성물, 이를 포함하는광소자용 봉지재 조성물 및 광소자용 봉지재 필름 | |
KR20150035075A (ko) | 올레핀 수지 조성물 |