JP2017504200A - 光モジュール用封止材、その製造方法及び光モジュール - Google Patents
光モジュール用封止材、その製造方法及び光モジュール Download PDFInfo
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- JP2017504200A JP2017504200A JP2016542729A JP2016542729A JP2017504200A JP 2017504200 A JP2017504200 A JP 2017504200A JP 2016542729 A JP2016542729 A JP 2016542729A JP 2016542729 A JP2016542729 A JP 2016542729A JP 2017504200 A JP2017504200 A JP 2017504200A
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- sealing material
- ethylene
- olefin copolymer
- optical module
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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Abstract
Description
前記エチレン/α−オレフィン共重合体の溶融指数(MI)を前述した範囲で調節し、封止材として製造時優れた成形性などを示すことができる。
[化学式1]
DSiR1 pR2 (3−p)
[化学式2]
SiR5 qR6 (4−q)
[化学式3]
−SiR12R13R14
[化学式4]
−SiR25 rR26 (3−r)
[一般式1]
△X≦3mm
1)ガラス板及び封止材シート:厚さが3.2mmであり、大きさが20cm×30cm(横×縦)である2個の低鉄粉強化ガラス板(重量475g)を準備した。また、前記各実施例及び比較例による封止材シート(厚さ:約500um)を20cm×25cm(横×縦)の大きさに切断した。
2)熱ラミネーション:前記2個のガラス板の間に封止材シート2枚を第1ガラス板(下板)、封止材(2枚)及び第2ガラス板(上板)の順に積層した。前記第1ガラス板と第2ガラス板の一方にそれぞれ5cmの余裕を持たせて封止材2枚を配置して積層した(図2参照)。その後、真空ラミネータで150℃の温度で17分間熱ラミネーション(真空6分→圧着1分→維持10分)して20cm×35cm(横×縦)の大きさの試料を製造した。
3)ずれた距離測定:前記試料をチャンバ(chamber)内に垂直(90゜)に設置するが、第1ガラス板は、クランプ(clamp)で吊るして固定して、100℃温度と60%の湿度で維持されているチャンバ(chamber)内で10時間垂直据置(図2参照)した後、基準線から第2ガラス板のずれた距離(ずり下がった距離)を左側、中央、右側でそれぞれ測定し、これに対する平均値(△X)を計算して下記基準により評価して表1に表した。
<評価基準>
○:ずれた距離を左側、中央及び右側でそれぞれ測定して平均した値(△X)が3mm以下の場合
×:ずれた距離を左側、中央及び右側でそれぞれ測定して平均した値(△X)が3mm以上の場合
<シラン変性エチレン/α−オレフィン共重合体の製造>
ビニルトリメトキシシラン(vinyltrimethoxysilane、VTMS)及びLuperox(登録商標)101(2、5−ビス(t−ブチルパーオキシ)−2、5−ジメチルヘキサン(2、5−Bis(tert−butylperoxy)−2、5−dimethylhexane)を50:1の重量比に混合した後、これを密度が0.870g/cm2であり、溶融指数(MI)が190℃、2.16kgの荷重下で5g/10分のエチレン/1−オクテン共重合体(LC670、(株)LG化学(製))100重量部に対して5重量部で二軸押出機(Twin screw extruder)に共に投入し、220℃の温度でグラフティング反応押出(加熱溶融撹拌)し、シラン変性エチレン/α−オレフィン共重合体のマスターバッチ(以下、“Si M/B”という)を製造した。
<封止材シートの製造>
密度が0.870g/cm2であり、融点(Tm)が58℃であり、溶融指数(MI)が190℃、2.16kgの荷重下で5g/10分のエチレン/1−オクテン共重合体(LC670、(株)LG化学(製)、以下、“ベース樹脂”という)に、UV吸収剤、UV安定剤及び酸化防止剤を一定量混合及び押出してUVマスターバッチ(以下、“UV M/B”という)を製造した。
その後、ベース樹脂、前記製造されたSi M/B及びUV M/Bと耐熱高分子樹脂として、融点(Tm)が約105℃であり、溶融指数(MI)が190℃、2.16kgの荷重下で3g/10分の低密度ポリエチレン(BC500、(株)LG化学(製)、以下、“LDPE”という)をそれぞれ65:35:3:2の重量比率で混合して混合物を製造した。
前記混合物を二軸押出機(φ19mm)及びTダイス(幅:200mm)を有する押出成形機のホッパーに投入し、押出温度180℃、取出速度3m/分で押出成形した後、厚さが約500umである封止材シートを製造した。
ベース樹脂及びSi M/Bを混合した混合物100重量部に対してLDPEが1重量部含まれることを除いて、前記実施例1と同一の方式で封止材シートを製造した。
ベース樹脂及びSi M/Bを混合した混合物100重量部に対してLDPEが3重量部含まれることを除いて、前記実施例1と同一の方式で封止材シートを製造した。
ベース樹脂及びSi M/Bを混合した混合物100重量部に対してLDPEが5重量部含まれることを除いて、前記実施例1と同一の方式で封止材シートを製造した。
耐熱高分子樹脂として融点(Tm)が約105℃であり、溶融指数(MI)が190℃、2.16kgの荷重下で0.3g/10分のLDPE(BF0300、(株)LG化学(製))を含んだことを除いて、前記実施例1と同一の方式で封止材シートを製造した。
耐熱高分子樹脂として融点(Tm)が約105℃であり、溶融指数(MI)が190℃、2.16kgの荷重下で8.5g/10分のLDPE(LB8500、(株)LG化学(製))を含んだことを除いて、前記実施例1と同一の方式で封止材シートを製造した。
耐熱高分子樹脂として融点(Tm)が約105℃であり、溶融指数(MI)が190℃、2.16kgの荷重下で24g/10分のLDPE(MB9205、(株)LG化学(製))を含んだことを除いて、前記実施例1と同一の方式で封止材シートを製造した。
押出成形機のホッパーにLDPEを添加せず、ベース樹脂、Si M/B及びUV M/Bを63.1:34:2.9の重量比率で混合した混合物を使用したことを除いて、前記実施例1と同一の方式で封止材シートを製造した。
耐熱高分子樹脂として融点(Tm)が約105℃であり、溶融指数(MI)が190℃、2.16kgの荷重下で50g/10分のLDPE(MB9500、(株)LG化学(製))を含んだことを除いて、前記実施例1と同一の方式で封止材シートを製造した。
前記各実施例1〜4及び比較例1による封止材シートに対する耐クリープ特性(Anti−Creep property)を下記表1に示した。
2a、221:前面封止材層
2b、222:裏面封止材層
3:強化ガラス
10:基材
20、30:表面層
210:前面基板
220:封止材層
C:太陽電池セル
Claims (19)
- エチレン/α−オレフィン系共重合体と、
シラン変性エチレン/α−オレフィン系共重合体と、
前記エチレン/α−オレフィン系重合体より融点(Tm)が高い耐熱高分子樹脂とを含む光モジュール用封止材。 - 耐熱高分子樹脂は、融点(Tm)が100℃以上であることを特徴とする、請求項1に記載の光モジュール用封止材。
- 耐熱高分子樹脂は、融点(Tm)が100℃〜150℃の範囲内であることを特徴とする、請求項1に記載の光モジュール用封止材。
- 耐熱高分子樹脂は、エチレン/α−オレフィン共重合体より低い溶融指数(MI)を有することを特徴とする、請求項1に記載の光モジュール用封止材。
- 耐熱高分子樹脂は、190℃の温度及び2.16kg荷重での溶融指数(MI)が0.1g/10分〜40g/10分以下の範囲内であることを特徴とする、請求項1に記載の光モジュール用封止材。
- 耐熱高分子樹脂は、エチレン/α−オレフィン系共重合体とシラン変性エチレン/α−オレフィン系共重合体の混合100重量部に対して0.1重量部〜10重量部の範囲内で含まれることを特徴とする、請求項1に記載の光モジュール用封止材。
- 耐熱高分子樹脂は、エチレン/α−オレフィン系共重合体とシラン変性エチレン/α−オレフィン系共重合体の混合100重量部に対して1重量部〜5重量部の範囲内で含まれることを特徴とする、請求項1に記載の光モジュール用封止材。
- 耐熱高分子樹脂は、ポリエチレン系樹脂及び/またはポリプロピレン系樹脂であることを特徴とする、請求項1に記載の光モジュール用封止材。
- 耐熱高分子樹脂は、低密度ポリエチレンを含むことを特徴とする、請求項1に記載の光モジュール用封止材。
- 下記一般式1を満足することを特徴とする、請求項1に記載の光モジュール用封止材:
[一般式1]
△X≦3mm
前記一般式1において、△Xは、厚さ3.2mmの第1ガラス板(横20cm×縦30cm)及び厚さ3.2mmの第2ガラス板(横20cm×縦30cm)の間に封止材(横20cm×縦25cm)を2枚重ねて入れて、ラミネーションして20cm×35cm(横×縦)の大きさの試料を製造した後、前記試料を垂直(90゜)に立てて第1ガラス板を吊るして固定し、100℃で10時間維持した後、第2ガラス板の左側、中央及び右側が垂直方向にずれた距離の平均値である。 - シラン変性エチレン/α−オレフィン系共重合体は、エチレン/α−オレフィン系共重合体にシラン化合物がグラフト重合されたものであることを特徴とする、請求項1に記載の光モジュール用封止材。
- シラン化合物は、不飽和シラン化合物及び/またはアミノシラン化合物を含むことを特徴とする、請求項11に記載の光モジュール用封止材。
- シラン化合物は、下記化学式1で表示される化合物を含むことを特徴とする、請求項11に記載の光モジュール用封止材:
[化学式1]
DSiR1 pR2 (3−p)
前記化学式1において、Dは、アルケニルであり、R1は、アルコキシ基、アルキルチオ基、アリールオキシ基、アシルオキシ基、ヒドロキシ基、ハロゲン基、アミン基または−R3R4であり、前記R3は、酸素(O)または硫黄(S)原子であり、R4は、アルキル基、アリール基またはアシル基であり、R2は、水素、アルキル基、アリール基またはアラルキル基であり、pは1〜3の整数である。 - 前記シラン化合物は、下記化学式2で表示される化合物を含むことを特徴とする、請求項11に記載の光モジュール用封止材:
[化学式2]
SiR5 qR6 (4−q)
前記化学式2において、R5は、−CH2)vNR7R8であり、R7及びR8は、それぞれ独立的に窒素原子に結合された水素またはR9NH2であり、前記R9は、炭素数1〜6のアルキレンであり、R6はハロゲン、アミン基、−R10R11または−R11であり、前記R10は、酸素(O)または硫黄(S)原子であり、R11は、水素、アルキル基、アリール基、アラルキル基またはアシル基であり、qは1〜4の整数である。 - 前記シラン変性エチレン/α−オレフィン系共重合体は、オレフィン系単量体の重合単位を含む主鎖及び前記主鎖に結合された分枝鎖を含み、前記分枝鎖は、下記化学式3で表示される化合物を含むことを特徴とする、請求項11に記載の光モジュール用封止材:
[化学式3]
−SiR12R13R14
前記化学式3において、R12及びR13は、それぞれ独立的にハロゲン、アミン基、−R15R16または−R16であり、前記R15は、酸素(O)または硫黄(S)原子であり、前記R16は、水素、アルキル基、アリール基、アラルキル基またはアシル基であり、R14は−OSiR17 mR18 (2−m)R19であり、前記R17及びR18は、それぞれ独立的にハロゲン、アミン基、−R20R21または−R21であり、前記R20は、酸素(O)または硫黄(S)原子であり、前記R21は、水素、アルキル基、アリール基、アラルキル基またはアシル基であり、前記R19は、−(CH2)nNR22R23であり、前記R22及びR23は、それぞれ独立的に窒素原子に結合された水素またはR24NH2であり、前記R24は、アルキレンであり、前記mは1または2の整数であり、前記nは1以上の整数である。 - 前記シラン変性エチレン/α−オレフィン系共重合体は、オレフィン系単量体の重合単位を含む主鎖及び前記主鎖に結合された分枝鎖を含み、前記分枝鎖は下記化学式4で表示される化合物を含むことを特徴とする、請求項11に記載の光モジュール用封止材:
[化学式4]
−SiR25 rR26 (3−r)
前記化学式4において、R25及びR26は、それぞれ独立的にハロゲン、アミン基、−R27R28または−R28であり、前記R27は、酸素(O)または硫黄(S)原子であり、前記R28は、水素、アルキル基、アリール基、アラルキル基またはアシル基であり、rは1〜3の整数である。 - エチレン/α−オレフィン系共重合体、シラン変性エチレン/α−オレフィン系共重合体及び前記エチレン/α−オレフィン系重合体より融点が高い耐熱高分子樹脂を含む樹脂組成物をシート形状に製造する段階を含む光モジュール用封止材の製造方法。
- 請求項1〜請求項16のいずれか1項による封止材を含むことを特徴とする、光モジュール。
- 前記光モジュールは、前面基板と、
前記前面基板上に形成された封止材層と、
前記封止材層に封止された太陽電池セルと、及び
前記封止材層上に形成されたバックシートとを含むことを特徴とする、請求項18に記載の光モジュール。
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