TWI545154B - 液體壓縮成形封裝劑 - Google Patents

液體壓縮成形封裝劑 Download PDF

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Publication number
TWI545154B
TWI545154B TW102122264A TW102122264A TWI545154B TW I545154 B TWI545154 B TW I545154B TW 102122264 A TW102122264 A TW 102122264A TW 102122264 A TW102122264 A TW 102122264A TW I545154 B TWI545154 B TW I545154B
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TW
Taiwan
Prior art keywords
group
composition
wafer
weight
block
Prior art date
Application number
TW102122264A
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English (en)
Chinese (zh)
Other versions
TW201410778A (zh
Inventor
白潔
Original Assignee
漢高智慧財產控股公司
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Publication date
Application filed by 漢高智慧財產控股公司 filed Critical 漢高智慧財產控股公司
Publication of TW201410778A publication Critical patent/TW201410778A/zh
Application granted granted Critical
Publication of TWI545154B publication Critical patent/TWI545154B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
TW102122264A 2012-07-06 2013-06-21 液體壓縮成形封裝劑 TWI545154B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201261668643P 2012-07-06 2012-07-06

Publications (2)

Publication Number Publication Date
TW201410778A TW201410778A (zh) 2014-03-16
TWI545154B true TWI545154B (zh) 2016-08-11

Family

ID=49877917

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102122264A TWI545154B (zh) 2012-07-06 2013-06-21 液體壓縮成形封裝劑

Country Status (5)

Country Link
US (1) US9263360B2 (https=)
JP (1) JP6195921B2 (https=)
KR (1) KR101979482B1 (https=)
TW (1) TWI545154B (https=)
WO (1) WO2014007950A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014091744A (ja) * 2012-10-31 2014-05-19 3M Innovative Properties Co アンダーフィル組成物、半導体装置およびその製造方法
US9245815B2 (en) * 2014-04-29 2016-01-26 Intel Corporation Underfill material including block copolymer to tune coefficient of thermal expansion and tensile modulus
JP6274092B2 (ja) * 2014-12-03 2018-02-07 信越化学工業株式会社 光半導体素子封止用熱硬化性エポキシ樹脂組成物及びそれを用いた光半導体装置
JP7454906B2 (ja) * 2016-10-14 2024-03-25 株式会社レゾナック アンダーフィル材、電子部品装置及び電子部品装置の製造方法
JP7031206B2 (ja) * 2017-10-02 2022-03-08 味の素株式会社 樹脂組成物
JP7239579B2 (ja) * 2018-06-15 2023-03-14 リンテック株式会社 デバイス封止用接着シート、及びデバイス封止体を製造する方法
TWI847997B (zh) * 2018-08-17 2024-07-11 德商漢高股份有限及兩合公司 液體壓縮成型或封裝組合物
TWI700330B (zh) * 2018-11-09 2020-08-01 台光電子材料股份有限公司 樹脂組合物及由其製成之物品
CA3183897C (en) 2020-06-24 2023-09-05 Arxada Ag Compositions comprising cyanate ester resins and substituted bisimides
IL312591B2 (en) 2021-12-14 2025-10-01 Arxada Ag Preparations with improved properties
JP7606797B1 (ja) * 2024-03-26 2024-12-26 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
WO2025203722A1 (ja) * 2024-03-26 2025-10-02 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
CN118213328A (zh) * 2024-05-15 2024-06-18 荣耀终端有限公司 晶圆级封装结构、封装方法、芯片制品及电子设备

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4528366A (en) 1982-09-28 1985-07-09 The Dow Chemical Company Production of polytriazines from aromatic polycyanates with cobalt salt of a carboxylic acid as catalyst
US4477629A (en) 1983-07-27 1984-10-16 The Dow Chemical Company Cyanate-containing polymers
US4902732A (en) * 1985-09-30 1990-02-20 Shin-Etsu Chemical Co., Ltd. Epoxy resin-based curable compositions
US5041254A (en) 1988-10-17 1991-08-20 Dexter Corporation Method of encapsulating a semiconductor device with a flame retardant epoxy molding compound
US5037898A (en) 1990-02-27 1991-08-06 Shell Oil Company Polysiloxane-polylactone block copolymer modified thermostat compositions
KR950011902B1 (ko) * 1990-04-04 1995-10-12 도오레 가부시끼가이샤 반도체 장치 캡슐 봉입 에폭시 수지 조성물
JPH10176036A (ja) 1996-12-19 1998-06-30 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
WO2000045430A1 (en) * 1999-01-29 2000-08-03 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting method and device therefor
JP2000273289A (ja) * 1999-03-23 2000-10-03 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、タブレット及び半導体装置
JP4438973B2 (ja) 2000-05-23 2010-03-24 アムコア テクノロジー，インコーポレイテッド シート状樹脂組成物及びそれを用いた半導体装置の製造方法
FR2809741B1 (fr) 2000-05-31 2002-08-16 Atofina Materiaux thermodurs a tenue au choc amelioree
JP2002194062A (ja) * 2000-12-26 2002-07-10 Toshiba Chem Corp エポキシ樹脂組成物および半導体装置
JP4633249B2 (ja) * 2000-12-26 2011-02-16 京セラケミカル株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
US6887574B2 (en) 2003-06-06 2005-05-03 Dow Global Technologies Inc. Curable flame retardant epoxy compositions
RU2006138618A (ru) 2004-04-02 2008-05-10 Дау Глобал Текнолоджиз Инк. (Us) Модифицированные амфифильным блок-сополимером термоотверждающиеся смолы с повышенной ударной вязкостью
KR101226379B1 (ko) * 2004-11-10 2013-01-24 다우 글로벌 테크놀로지스 엘엘씨 양친매성 블록 공중합체-개질된 에폭시 수지 및 그로부터제조된 접착제
CN102936445A (zh) * 2004-11-10 2013-02-20 陶氏环球技术有限责任公司 两性嵌段共聚物增韧的环氧树脂以及由此制造的环境固化的高固含量的涂料
JP4379387B2 (ja) * 2005-06-27 2009-12-09 パナソニック電工株式会社 エポキシ樹脂無機複合シート及び成形品
KR20080078848A (ko) * 2005-12-22 2008-08-28 다우 글로벌 테크놀로지스 인크. 혼합 촉매 시스템을 함유하는 경화성 에폭시 수지 조성물및 이로부터 제조된 적층물
US7745535B2 (en) * 2006-07-21 2010-06-29 Arkema Inc. Amphiphilic block copolymers
KR20150063590A (ko) 2007-08-02 2015-06-09 다우 글로벌 테크놀로지스 엘엘씨 열경화성 중합체의 성능을 개선시키기 위한 양친매성 블록 공중합체 및 무기 나노충진제
TWI339865B (en) * 2007-08-17 2011-04-01 Chipmos Technologies Inc A dice rearrangement package method
JP4989402B2 (ja) * 2007-10-04 2012-08-01 日東電工株式会社 中空型デバイス封止用樹脂組成物シートおよびそれを用いて封止した中空型デバイス
JP5083070B2 (ja) * 2007-11-19 2012-11-28 日立化成工業株式会社 封止用フィルム
JP5421786B2 (ja) * 2008-01-31 2014-02-19 積水化学工業株式会社 樹脂組成物、及びそれを用いた積層樹脂フィルム
KR101538193B1 (ko) * 2008-02-15 2015-07-20 가부시키가이샤 구라레 경화성 수지 조성물 및 수지 경화물
EP2303953A1 (en) 2008-07-17 2011-04-06 Dow Global Technologies Inc. Structural composites with improved toughness
ATE468344T1 (de) * 2008-08-27 2010-06-15 Sika Technology Ag Silan-/harnstoff-verbindung als hitzeaktivierbarer härter für epoxidharzzusammensetzungen
US8647963B2 (en) * 2009-07-08 2014-02-11 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method of wafer level chip molded packaging
EP2552991A1 (en) * 2010-03-31 2013-02-06 Dow Global Technologies LLC Curable compositions
JP2012017422A (ja) * 2010-07-08 2012-01-26 Nitto Denko Corp 熱硬化性樹脂組成物硬化体の製法およびそれにより得られた硬化物
JP2013256547A (ja) * 2010-10-05 2013-12-26 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物および半導体パッケージ
JP6026095B2 (ja) * 2011-10-31 2016-11-16 太陽インキ製造株式会社 熱硬化性樹脂組成物及びその硬化物、並びにそれを用いたプリント配線板
JP5930704B2 (ja) * 2011-12-22 2016-06-08 太陽インキ製造株式会社 プリント配線板の製造方法、プリント配線板およびフリップチップ実装基板

Also Published As

Publication number Publication date
KR101979482B1 (ko) 2019-05-16
JP6195921B2 (ja) 2017-09-13
US9263360B2 (en) 2016-02-16
JP2015522686A (ja) 2015-08-06
US20140008822A1 (en) 2014-01-09
KR20150035981A (ko) 2015-04-07
WO2014007950A1 (en) 2014-01-09
TW201410778A (zh) 2014-03-16

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