TWI539564B - Semiconductor package - Google Patents

Semiconductor package Download PDF

Info

Publication number
TWI539564B
TWI539564B TW101125091A TW101125091A TWI539564B TW I539564 B TWI539564 B TW I539564B TW 101125091 A TW101125091 A TW 101125091A TW 101125091 A TW101125091 A TW 101125091A TW I539564 B TWI539564 B TW I539564B
Authority
TW
Taiwan
Prior art keywords
layer
resin
film
semiconductor package
sheet
Prior art date
Application number
TW101125091A
Other languages
English (en)
Chinese (zh)
Other versions
TW201318121A (zh
Inventor
Eiichi Hayashi
Hideki Ooyama
Original Assignee
Ajinomoto Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Kk filed Critical Ajinomoto Kk
Publication of TW201318121A publication Critical patent/TW201318121A/zh
Application granted granted Critical
Publication of TWI539564B publication Critical patent/TWI539564B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW101125091A 2011-07-13 2012-07-12 Semiconductor package TWI539564B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011155149 2011-07-13

Publications (2)

Publication Number Publication Date
TW201318121A TW201318121A (zh) 2013-05-01
TWI539564B true TWI539564B (zh) 2016-06-21

Family

ID=47839351

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101125091A TWI539564B (zh) 2011-07-13 2012-07-12 Semiconductor package

Country Status (3)

Country Link
JP (1) JP6051630B2 (ko)
KR (1) KR101939839B1 (ko)
TW (1) TWI539564B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201507775XA (en) * 2013-03-22 2015-10-29 Lintec Corp Protective film-forming film and protective film-forming composite sheet
JP6185342B2 (ja) * 2013-09-05 2017-08-23 信越化学工業株式会社 封止材積層複合体、封止後半導体素子搭載基板又は封止後半導体素子形成ウエハ、及び半導体装置の製造方法
KR102116987B1 (ko) * 2013-10-15 2020-05-29 삼성전자 주식회사 반도체 패키지
JP6314416B2 (ja) * 2013-10-17 2018-04-25 富士電機株式会社 半導体装置
JP2015103572A (ja) 2013-11-21 2015-06-04 日東電工株式会社 両面セパレータ付き封止用シート、及び、半導体装置の製造方法
JP6272690B2 (ja) * 2013-12-26 2018-01-31 日東電工株式会社 両面セパレータ付き封止用シート、及び、半導体装置の製造方法
JP5976073B2 (ja) * 2014-11-07 2016-08-23 日東電工株式会社 半導体装置の製造方法
JP7166090B2 (ja) * 2018-07-03 2022-11-07 日東電工株式会社 封止用シートおよび電子素子装置の製造方法
JP7562989B2 (ja) 2020-03-12 2024-10-08 住友ベークライト株式会社 電子装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258162A (ja) * 2002-02-27 2003-09-12 Toshiba Corp １次，２次実装体
JP3818183B2 (ja) 2002-03-15 2006-09-06 日立化成工業株式会社 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置
JP4383768B2 (ja) * 2003-04-23 2009-12-16 スリーエム イノベイティブ プロパティズ カンパニー 封止用フィルム接着剤、封止用フィルム積層体及び封止方法
KR101152040B1 (ko) * 2004-11-30 2012-07-23 스미토모 베이클라이트 가부시키가이샤 에폭시 수지 조성물 및 반도체장치
JP2006286829A (ja) * 2005-03-31 2006-10-19 Renesas Technology Corp 半導体装置およびその製造方法
JP4682796B2 (ja) * 2005-04-19 2011-05-11 日立化成工業株式会社 封止用シート
JP5083070B2 (ja) * 2007-11-19 2012-11-28 日立化成工業株式会社 封止用フィルム
JP5324114B2 (ja) * 2008-03-27 2013-10-23 リンテック株式会社 発光モジュール用シートの製造方法、発光モジュール用シート
CN101983419B (zh) 2008-04-04 2012-08-08 索尼化学&信息部件株式会社 半导体装置及其制造方法
JP5190993B2 (ja) * 2008-11-20 2013-04-24 日東電工株式会社 光半導体封止用シート
JP2011077108A (ja) * 2009-09-29 2011-04-14 Elpida Memory Inc 半導体装置
JP5877291B2 (ja) * 2010-05-14 2016-03-08 パナソニックＩｐマネジメント株式会社 半導体装置およびその製造方法
JP5623970B2 (ja) * 2011-04-22 2014-11-12 信越化学工業株式会社 樹脂積層体、及び半導体装置とその製造方法

Also Published As

Publication number Publication date
TW201318121A (zh) 2013-05-01
JP6051630B2 (ja) 2016-12-27
KR101939839B1 (ko) 2019-01-17
KR20130009653A (ko) 2013-01-23
JP2013038410A (ja) 2013-02-21

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