TWI534858B - 模具 - Google Patents

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Publication number
TWI534858B
TWI534858B TW103120021A TW103120021A TWI534858B TW I534858 B TWI534858 B TW I534858B TW 103120021 A TW103120021 A TW 103120021A TW 103120021 A TW103120021 A TW 103120021A TW I534858 B TWI534858 B TW I534858B
Authority
TW
Taiwan
Prior art keywords
mold
pattern
light shielding
light
substrate
Prior art date
Application number
TW103120021A
Other languages
English (en)
Chinese (zh)
Other versions
TW201503232A (zh
Inventor
宮島義一
鈴木章義
岩永武彦
Original Assignee
佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 佳能股份有限公司 filed Critical 佳能股份有限公司
Publication of TW201503232A publication Critical patent/TW201503232A/zh
Application granted granted Critical
Publication of TWI534858B publication Critical patent/TWI534858B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2012—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H10P76/00—
    • H10P95/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW103120021A 2013-06-26 2014-06-10 模具 TWI534858B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013134209A JP6368075B2 (ja) 2013-06-26 2013-06-26 モールド

Publications (2)

Publication Number Publication Date
TW201503232A TW201503232A (zh) 2015-01-16
TWI534858B true TWI534858B (zh) 2016-05-21

Family

ID=52115827

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103120021A TWI534858B (zh) 2013-06-26 2014-06-10 模具

Country Status (5)

Country Link
US (1) US20150004275A1 (enExample)
JP (1) JP6368075B2 (enExample)
KR (1) KR101717328B1 (enExample)
CN (1) CN104249420A (enExample)
TW (1) TWI534858B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160023404A1 (en) * 2014-07-25 2016-01-28 Stephen Raymond Anderson Three-dimensional manufacturing, fabricating, forming, and/or repairing apparatus and method
US10409156B2 (en) 2015-02-13 2019-09-10 Canon Kabushiki Kaisha Mold, imprint apparatus, and method of manufacturing article
WO2017057263A1 (ja) * 2015-09-29 2017-04-06 大日本印刷株式会社 配線構造体およびその製造方法、半導体装置、多層配線構造体およびその製造方法、半導体素子搭載用基板、パターン構造体の形成方法、インプリント用のモールドおよびその製造方法、インプリントモールドセット、ならびに多層配線基板の製造方法
US20170210036A1 (en) * 2016-01-22 2017-07-27 Canon Kabushiki Kaisha Mold replicating method, imprint apparatus, and article manufacturing method
TWI565577B (zh) * 2016-01-29 2017-01-11 森田印刷廠股份有限公司 模內轉印模具及模內轉印方法
JP6748496B2 (ja) * 2016-06-30 2020-09-02 キヤノン株式会社 モールド、インプリント方法、インプリント装置および物品製造方法
CN108068254A (zh) * 2016-11-14 2018-05-25 昇印光电（昆山）股份有限公司 微纳结构压印模具
JP6821408B2 (ja) * 2016-11-28 2021-01-27 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
US10712660B2 (en) * 2016-12-21 2020-07-14 Canon Kabushiki Kaisha Template for imprint lithography including a recession and an apparatus and method of using the template
CN109397677A (zh) * 2017-08-18 2019-03-01 昇印光电（昆山）股份有限公司 微纳压印模具
WO2019198668A1 (ja) * 2018-04-09 2019-10-17 大日本印刷株式会社 ナノインプリント用テンプレート及びその製造方法、並びに、２段メサブランクス及びその製造方法
US11281095B2 (en) 2018-12-05 2022-03-22 Canon Kabushiki Kaisha Frame curing template and system and method of using the frame curing template
JP7278135B2 (ja) 2019-04-02 2023-05-19 キヤノン株式会社 インプリント装置および物品製造方法
JP7414508B2 (ja) * 2019-12-16 2024-01-16 キヤノン株式会社 インプリント装置、および物品製造方法
US11747731B2 (en) 2020-11-20 2023-09-05 Canon Kabishiki Kaisha Curing a shaped film using multiple images of a spatial light modulator
US12153343B2 (en) * 2021-12-20 2024-11-26 Canon Kabushiki Kaisha Imprint method, imprint apparatus, and article manufacturing method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4727806A (en) * 1985-08-26 1988-03-01 Wilson Engraving Company, Inc. Pin register system for flexographic printing plates
US8011916B2 (en) * 2005-09-06 2011-09-06 Canon Kabushiki Kaisha Mold, imprint apparatus, and process for producing structure
JP5182470B2 (ja) * 2007-07-17 2013-04-17 大日本印刷株式会社 インプリントモールド
JP4799575B2 (ja) * 2008-03-06 2011-10-26 株式会社東芝 インプリント方法
JP5534311B2 (ja) * 2010-01-22 2014-06-25 Ｈｏｙａ株式会社 マスクブランク用基板とその製造方法、インプリントモールド用マスクブランクとその製造方法、及びインプリントモールドとその製造方法
JP5744590B2 (ja) * 2011-03-28 2015-07-08 キヤノン株式会社 インプリント方法、型、それらを用いた物品の製造方法
JP5831012B2 (ja) * 2011-07-27 2015-12-09 大日本印刷株式会社 インプリント用位置合わせマーク、該マークを備えたテンプレートおよびその製造方法
JP6061524B2 (ja) * 2011-08-11 2017-01-18 キヤノン株式会社 インプリント装置および物品の製造方法
JP2013051360A (ja) * 2011-08-31 2013-03-14 Fujikura Ltd 絶縁性基板の製造方法及び多層積層板の製造方法

Also Published As

Publication number Publication date
KR20150001630A (ko) 2015-01-06
JP2015012034A (ja) 2015-01-19
CN104249420A (zh) 2014-12-31
KR101717328B1 (ko) 2017-03-16
JP6368075B2 (ja) 2018-08-01
US20150004275A1 (en) 2015-01-01
TW201503232A (zh) 2015-01-16

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