CN104249420A - 模具 - Google Patents

模具 Download PDF

Info

Publication number
CN104249420A
CN104249420A CN201410282999.3A CN201410282999A CN104249420A CN 104249420 A CN104249420 A CN 104249420A CN 201410282999 A CN201410282999 A CN 201410282999A CN 104249420 A CN104249420 A CN 104249420A
Authority
CN
China
Prior art keywords
mould
pattern
substrate
concave portions
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410282999.3A
Other languages
English (en)
Chinese (zh)
Inventor
宮岛义一
铃木章义
岩永武彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN104249420A publication Critical patent/CN104249420A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2012—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201410282999.3A 2013-06-26 2014-06-23 模具 Pending CN104249420A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-134209 2013-06-26
JP2013134209A JP6368075B2 (ja) 2013-06-26 2013-06-26 モールド

Publications (1)

Publication Number Publication Date
CN104249420A true CN104249420A (zh) 2014-12-31

Family

ID=52115827

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410282999.3A Pending CN104249420A (zh) 2013-06-26 2014-06-23 模具

Country Status (5)

Country Link
US (1) US20150004275A1 (enExample)
JP (1) JP6368075B2 (enExample)
KR (1) KR101717328B1 (enExample)
CN (1) CN104249420A (enExample)
TW (1) TWI534858B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108068254A (zh) * 2016-11-14 2018-05-25 昇印光电（昆山）股份有限公司 微纳结构压印模具
CN109397677A (zh) * 2017-08-18 2019-03-01 昇印光电（昆山）股份有限公司 微纳压印模具

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160023404A1 (en) * 2014-07-25 2016-01-28 Stephen Raymond Anderson Three-dimensional manufacturing, fabricating, forming, and/or repairing apparatus and method
US10409156B2 (en) 2015-02-13 2019-09-10 Canon Kabushiki Kaisha Mold, imprint apparatus, and method of manufacturing article
JP6583747B2 (ja) 2015-09-29 2019-10-02 大日本印刷株式会社 インプリント用のモールドおよびその製造方法
US20170210036A1 (en) * 2016-01-22 2017-07-27 Canon Kabushiki Kaisha Mold replicating method, imprint apparatus, and article manufacturing method
TWI565577B (zh) * 2016-01-29 2017-01-11 森田印刷廠股份有限公司 模內轉印模具及模內轉印方法
JP6748496B2 (ja) * 2016-06-30 2020-09-02 キヤノン株式会社 モールド、インプリント方法、インプリント装置および物品製造方法
JP6821408B2 (ja) * 2016-11-28 2021-01-27 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
US10712660B2 (en) * 2016-12-21 2020-07-14 Canon Kabushiki Kaisha Template for imprint lithography including a recession and an apparatus and method of using the template
JP7384153B2 (ja) * 2018-04-09 2023-11-21 大日本印刷株式会社 ナノインプリント用テンプレート及びその製造方法、並びに、２段メサブランクス及びその製造方法
US11281095B2 (en) 2018-12-05 2022-03-22 Canon Kabushiki Kaisha Frame curing template and system and method of using the frame curing template
JP7278135B2 (ja) 2019-04-02 2023-05-19 キヤノン株式会社 インプリント装置および物品製造方法
JP7414508B2 (ja) * 2019-12-16 2024-01-16 キヤノン株式会社 インプリント装置、および物品製造方法
US11747731B2 (en) 2020-11-20 2023-09-05 Canon Kabishiki Kaisha Curing a shaped film using multiple images of a spatial light modulator
JP2023091495A (ja) * 2021-12-20 2023-06-30 キヤノン株式会社 インプリント方法、インプリント装置および物品製造方法。

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090224436A1 (en) * 2008-03-06 2009-09-10 Shinji Mikami Imprint method and template for imprinting
CN101666974A (zh) * 2005-09-06 2010-03-10 佳能株式会社 用于生产结构的模具、印痕设备以及工艺
CN102929099A (zh) * 2011-08-11 2013-02-13 佳能株式会社 压印装置和物品制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4727806A (en) * 1985-08-26 1988-03-01 Wilson Engraving Company, Inc. Pin register system for flexographic printing plates
JP5182470B2 (ja) * 2007-07-17 2013-04-17 大日本印刷株式会社 インプリントモールド
JP5534311B2 (ja) * 2010-01-22 2014-06-25 Ｈｏｙａ株式会社 マスクブランク用基板とその製造方法、インプリントモールド用マスクブランクとその製造方法、及びインプリントモールドとその製造方法
JP5744590B2 (ja) * 2011-03-28 2015-07-08 キヤノン株式会社 インプリント方法、型、それらを用いた物品の製造方法
JP5831012B2 (ja) * 2011-07-27 2015-12-09 大日本印刷株式会社 インプリント用位置合わせマーク、該マークを備えたテンプレートおよびその製造方法
JP2013051360A (ja) * 2011-08-31 2013-03-14 Fujikura Ltd 絶縁性基板の製造方法及び多層積層板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101666974A (zh) * 2005-09-06 2010-03-10 佳能株式会社 用于生产结构的模具、印痕设备以及工艺
US20090224436A1 (en) * 2008-03-06 2009-09-10 Shinji Mikami Imprint method and template for imprinting
CN102929099A (zh) * 2011-08-11 2013-02-13 佳能株式会社 压印装置和物品制造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108068254A (zh) * 2016-11-14 2018-05-25 昇印光电（昆山）股份有限公司 微纳结构压印模具
CN109397677A (zh) * 2017-08-18 2019-03-01 昇印光电（昆山）股份有限公司 微纳压印模具

Also Published As

Publication number Publication date
KR20150001630A (ko) 2015-01-06
JP2015012034A (ja) 2015-01-19
US20150004275A1 (en) 2015-01-01
JP6368075B2 (ja) 2018-08-01
KR101717328B1 (ko) 2017-03-16
TW201503232A (zh) 2015-01-16
TWI534858B (zh) 2016-05-21

Similar Documents

Publication Publication Date Title
CN104249420A (zh) 模具
JP5744590B2 (ja) インプリント方法、型、それらを用いた物品の製造方法
JP5759303B2 (ja) インプリント装置、それを用いた物品の製造方法
JP6273548B2 (ja) 微細構造の製造装置
JP6333031B2 (ja) インプリント装置および物品の製造方法
US20100072665A1 (en) Thermal imprinting device and thermal imprinting method
KR102103288B1 (ko) 임프린트 장치 및 물품 제조 방법
JP6029268B2 (ja) インプリント装置、それを用いた物品の製造方法
CN102929099A (zh) 压印装置和物品制造方法
JP5637785B2 (ja) 原版、及びそれを用いた物品の製造方法
JP2012134214A (ja) インプリント装置、および、物品の製造方法
JP2016225433A (ja) モールド、インプリント方法、インプリント装置および物品の製造方法
JP2016096327A (ja) インプリント方法、インプリント装置、型、および物品の製造方法
JP2016004794A (ja) インプリント方法、インプリント装置、および物品の製造方法
US8772179B2 (en) Pattern forming method, pattern forming apparatus, and method for manufacturing semiconductor device
CN105301893B (zh) 压印装置、压印方法及物品的制造方法
TWI495559B (zh) 用以製作一透鏡晶圓之方法及裝置
TWI654060B (zh) Imprinting device, imprinting method and article manufacturing method
JP5492369B2 (ja) 転写用の型および転写方法
JP5693090B2 (ja) 基板のエンボス加工用装置
JP6391709B2 (ja) ナノ構造を型押しする方法及び装置
TWI411522B (zh) 基材對準技術
WO2009069866A1 (en) Apparatus for fixing plastic sheet and method of fabricating nano pattern on plastic sheet using the same
US20150328827A1 (en) Imprint apparatus and article manufacturing method
KR100934239B1 (ko) 임프린트용 대면적 스탬프 제작방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20141231

WD01 Invention patent application deemed withdrawn after publication