TWI527700B - Elastic film - Google Patents

Elastic film Download PDF

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Publication number
TWI527700B
TWI527700B TW101141747A TW101141747A TWI527700B TW I527700 B TWI527700 B TW I527700B TW 101141747 A TW101141747 A TW 101141747A TW 101141747 A TW101141747 A TW 101141747A TW I527700 B TWI527700 B TW I527700B
Authority
TW
Taiwan
Prior art keywords
elastic film
peripheral wall
elastic
wall portion
abutting portion
Prior art date
Application number
TW101141747A
Other languages
English (en)
Chinese (zh)
Other versions
TW201341187A (zh
Inventor
安田穗積
渡辺和英
並木計介
鍋谷治
福島誠
山木曉
富樫真吾
Original Assignee
荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荏原製作所股份有限公司 filed Critical 荏原製作所股份有限公司
Publication of TW201341187A publication Critical patent/TW201341187A/zh
Application granted granted Critical
Publication of TWI527700B publication Critical patent/TWI527700B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/21—Circular sheet or circular blank
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW101141747A 2011-11-30 2012-11-09 Elastic film TWI527700B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011261327A JP5635482B2 (ja) 2011-11-30 2011-11-30 弾性膜

Publications (2)

Publication Number Publication Date
TW201341187A TW201341187A (zh) 2013-10-16
TWI527700B true TWI527700B (zh) 2016-04-01

Family

ID=48467125

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101141747A TWI527700B (zh) 2011-11-30 2012-11-09 Elastic film

Country Status (4)

Country Link
US (1) US8859070B2 (https=)
JP (1) JP5635482B2 (https=)
KR (1) KR101495964B1 (https=)
TW (1) TWI527700B (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD711330S1 (en) * 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
JP5875950B2 (ja) 2012-06-29 2016-03-02 株式会社荏原製作所 基板保持装置および研磨装置
JP6158637B2 (ja) * 2012-08-28 2017-07-05 株式会社荏原製作所 弾性膜及び基板保持装置
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US20140357161A1 (en) * 2013-05-31 2014-12-04 Sunedison Semiconductor Limited Center flex single side polishing head
EP2910189B1 (en) * 2014-02-21 2016-09-14 Samsung Electronics Co., Ltd X-ray grid structure and x-ray apparatus including the same
KR102110489B1 (ko) * 2014-03-04 2020-05-13 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드의 멤브레인
KR20160013461A (ko) * 2014-07-25 2016-02-04 삼성전자주식회사 캐리어 헤드 및 화학적 기계식 연마 장치
US10029346B2 (en) * 2015-10-16 2018-07-24 Applied Materials, Inc. External clamp ring for a chemical mechanical polishing carrier head
JP6380333B2 (ja) * 2015-10-30 2018-08-29 株式会社Sumco ウェーハ研磨装置およびこれに用いる研磨ヘッド
CN107813220A (zh) * 2016-09-13 2018-03-20 清华大学 压力加载膜
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD918161S1 (en) * 2017-12-19 2021-05-04 Ebara Corporation Elastic membrane
JP7003838B2 (ja) * 2018-05-17 2022-01-21 株式会社Sumco 研磨ヘッド及びこれを用いたウェーハ研磨装置及び研磨方法
US12217979B2 (en) * 2019-07-01 2025-02-04 Axus Technology, Llc Temperature controlled substrate carrier and polishing components
SG10202008012WA (en) * 2019-08-29 2021-03-30 Ebara Corp Elastic membrane and substrate holding apparatus
JP7061144B2 (ja) * 2020-02-05 2022-04-27 三菱電線工業株式会社 弾性膜
JP7762522B2 (ja) 2021-09-01 2025-10-30 株式会社荏原製作所 弾性膜および弾性膜の製造方法
JP7623990B2 (ja) * 2022-11-07 2025-01-29 三菱電線工業株式会社 弾性膜及びその取付構造

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5908530A (en) 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US6165058A (en) 1998-12-09 2000-12-26 Applied Materials, Inc. Carrier head for chemical mechanical polishing
US6855043B1 (en) 1999-07-09 2005-02-15 Applied Materials, Inc. Carrier head with a modified flexible membrane
US6508696B1 (en) * 2000-08-25 2003-01-21 Mitsubishi Materials Corporation Wafer-polishing head and polishing apparatus having the same
JP3989234B2 (ja) 2001-11-20 2007-10-10 株式会社荏原製作所 基板保持装置及びポリッシング装置
JP4515047B2 (ja) 2003-06-06 2010-07-28 株式会社荏原製作所 弾性膜、基板保持装置、研磨装置、及び研磨方法
TWI393209B (zh) * 2003-02-10 2013-04-11 荏原製作所股份有限公司 研磨基板之方法
JP5112614B2 (ja) 2004-12-10 2013-01-09 株式会社荏原製作所 基板保持装置および研磨装置
JP2009131920A (ja) 2007-11-29 2009-06-18 Ebara Corp 研磨装置及び方法

Also Published As

Publication number Publication date
US8859070B2 (en) 2014-10-14
KR20130061097A (ko) 2013-06-10
KR101495964B1 (ko) 2015-02-25
TW201341187A (zh) 2013-10-16
US20130136884A1 (en) 2013-05-30
JP5635482B2 (ja) 2014-12-03
JP2013111717A (ja) 2013-06-10

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