KR101495964B1 - 탄성막 - Google Patents

탄성막 Download PDF

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Publication number
KR101495964B1
KR101495964B1 KR20120137040A KR20120137040A KR101495964B1 KR 101495964 B1 KR101495964 B1 KR 101495964B1 KR 20120137040 A KR20120137040 A KR 20120137040A KR 20120137040 A KR20120137040 A KR 20120137040A KR 101495964 B1 KR101495964 B1 KR 101495964B1
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KR
South Korea
Prior art keywords
elastic
peripheral wall
contact portion
wall portion
substrate
Prior art date
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Active
Application number
KR20120137040A
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English (en)
Korean (ko)
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KR20130061097A (ko
Inventor
호즈미 야스다
가츠히데 와타나베
게이스케 나미키
오사무 나베야
마코토 후쿠시마
사토루 야마키
신고 도가시
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20130061097A publication Critical patent/KR20130061097A/ko
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Publication of KR101495964B1 publication Critical patent/KR101495964B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/21—Circular sheet or circular blank
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR20120137040A 2011-11-30 2012-11-29 탄성막 Active KR101495964B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-261327 2011-11-30
JP2011261327A JP5635482B2 (ja) 2011-11-30 2011-11-30 弾性膜

Publications (2)

Publication Number Publication Date
KR20130061097A KR20130061097A (ko) 2013-06-10
KR101495964B1 true KR101495964B1 (ko) 2015-02-25

Family

ID=48467125

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20120137040A Active KR101495964B1 (ko) 2011-11-30 2012-11-29 탄성막

Country Status (4)

Country Link
US (1) US8859070B2 (https=)
JP (1) JP5635482B2 (https=)
KR (1) KR101495964B1 (https=)
TW (1) TWI527700B (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD711330S1 (en) * 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
JP5875950B2 (ja) 2012-06-29 2016-03-02 株式会社荏原製作所 基板保持装置および研磨装置
JP6158637B2 (ja) * 2012-08-28 2017-07-05 株式会社荏原製作所 弾性膜及び基板保持装置
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US20140357161A1 (en) * 2013-05-31 2014-12-04 Sunedison Semiconductor Limited Center flex single side polishing head
EP2910189B1 (en) * 2014-02-21 2016-09-14 Samsung Electronics Co., Ltd X-ray grid structure and x-ray apparatus including the same
KR102110489B1 (ko) * 2014-03-04 2020-05-13 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드의 멤브레인
KR20160013461A (ko) * 2014-07-25 2016-02-04 삼성전자주식회사 캐리어 헤드 및 화학적 기계식 연마 장치
US10029346B2 (en) * 2015-10-16 2018-07-24 Applied Materials, Inc. External clamp ring for a chemical mechanical polishing carrier head
JP6380333B2 (ja) * 2015-10-30 2018-08-29 株式会社Sumco ウェーハ研磨装置およびこれに用いる研磨ヘッド
CN107813220A (zh) * 2016-09-13 2018-03-20 清华大学 压力加载膜
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD918161S1 (en) * 2017-12-19 2021-05-04 Ebara Corporation Elastic membrane
JP7003838B2 (ja) * 2018-05-17 2022-01-21 株式会社Sumco 研磨ヘッド及びこれを用いたウェーハ研磨装置及び研磨方法
US12217979B2 (en) * 2019-07-01 2025-02-04 Axus Technology, Llc Temperature controlled substrate carrier and polishing components
SG10202008012WA (en) * 2019-08-29 2021-03-30 Ebara Corp Elastic membrane and substrate holding apparatus
JP7061144B2 (ja) * 2020-02-05 2022-04-27 三菱電線工業株式会社 弾性膜
JP7762522B2 (ja) 2021-09-01 2025-10-30 株式会社荏原製作所 弾性膜および弾性膜の製造方法
JP7623990B2 (ja) * 2022-11-07 2025-01-29 三菱電線工業株式会社 弾性膜及びその取付構造

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5759918A (en) 1995-05-18 1998-06-02 Obsidian, Inc. Method for chemical mechanical polishing
US6406361B1 (en) 1998-12-09 2002-06-18 Applied Materials, Inc. Carrier head for chemical mechanical polishing
JP2003158105A (ja) 2001-11-20 2003-05-30 Ebara Corp 基板保持装置及びポリッシング装置
JP2006159392A (ja) 2004-12-10 2006-06-22 Ebara Corp 基板保持装置および研磨装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6855043B1 (en) 1999-07-09 2005-02-15 Applied Materials, Inc. Carrier head with a modified flexible membrane
US6508696B1 (en) * 2000-08-25 2003-01-21 Mitsubishi Materials Corporation Wafer-polishing head and polishing apparatus having the same
JP4515047B2 (ja) 2003-06-06 2010-07-28 株式会社荏原製作所 弾性膜、基板保持装置、研磨装置、及び研磨方法
TWI393209B (zh) * 2003-02-10 2013-04-11 荏原製作所股份有限公司 研磨基板之方法
JP2009131920A (ja) 2007-11-29 2009-06-18 Ebara Corp 研磨装置及び方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5759918A (en) 1995-05-18 1998-06-02 Obsidian, Inc. Method for chemical mechanical polishing
US6406361B1 (en) 1998-12-09 2002-06-18 Applied Materials, Inc. Carrier head for chemical mechanical polishing
JP2003158105A (ja) 2001-11-20 2003-05-30 Ebara Corp 基板保持装置及びポリッシング装置
JP2006159392A (ja) 2004-12-10 2006-06-22 Ebara Corp 基板保持装置および研磨装置

Also Published As

Publication number Publication date
US8859070B2 (en) 2014-10-14
KR20130061097A (ko) 2013-06-10
TWI527700B (zh) 2016-04-01
TW201341187A (zh) 2013-10-16
US20130136884A1 (en) 2013-05-30
JP5635482B2 (ja) 2014-12-03
JP2013111717A (ja) 2013-06-10

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