JP2006159392A - 基板保持装置および研磨装置 - Google Patents
基板保持装置および研磨装置 Download PDFInfo
- Publication number
- JP2006159392A JP2006159392A JP2004358859A JP2004358859A JP2006159392A JP 2006159392 A JP2006159392 A JP 2006159392A JP 2004358859 A JP2004358859 A JP 2004358859A JP 2004358859 A JP2004358859 A JP 2004358859A JP 2006159392 A JP2006159392 A JP 2006159392A
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- Prior art keywords
- elastic film
- substrate
- film
- outer peripheral
- polishing
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- 238000005498 polishing Methods 0.000 title claims abstract description 88
- 239000000758 substrate Substances 0.000 title claims abstract description 70
- 230000002093 peripheral effect Effects 0.000 claims abstract description 69
- 238000003825 pressing Methods 0.000 claims abstract description 20
- 239000012528 membrane Substances 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 abstract description 52
- 239000010408 film Substances 0.000 description 127
- 239000012530 fluid Substances 0.000 description 16
- 239000006061 abrasive grain Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
【解決手段】 トップリング3は、半導体ウェハの裏面に当接する弾性膜20と、弾性膜20の外周部を固定する取付部材22と、弾性膜20に当接した半導体ウェハの外周縁を保持するリテーナリング部12とを備える。弾性膜20は、弾性膜20の外周縁から径方向内側に突出する突出部42を有する外周膜26を備えている。取付部材22は、弾性膜20の突出部42の周方向側面に係合する係合部44を備えている。また、弾性膜20は、半導体ウェハの押圧方向に伸縮自在のベローズ部46,48を備えている。
【選択図】 図2
Description
1 研磨パッド
2 研磨テーブル
3,103,203,303,403 トップリング
12 リテーナリング部
20 弾性膜
22,422 取付部材
24,224 底面膜
26,28,426,428 外周膜
30,32 延出部
34,36 基部
42,142 突出部
44 係合部
46,48 ベローズ部
Claims (10)
- 基板の裏面に当接する弾性膜と、前記弾性膜の少なくとも一部を固定する取付部材と、前記弾性膜に当接した基板の外周縁を保持するリテーナリング部とを備えた基板保持装置において、
前記弾性膜は突出部を備え、
前記取付部材は、前記弾性膜の突出部に係合する係合部を備えたことを特徴とする基板保持装置。 - 前記突出部は、前記弾性膜の径方向内側に突出していることを特徴とする請求項1に記載の基板保持装置。
- 前記弾性膜の突出部および前記取付部材の係合部をそれぞれ複数設けたことを特徴とする請求項1または2に記載の基板保持装置。
- 前記複数の係合部は前記基板の中心に対して対称に配置されることを特徴とする請求項3に記載の基板保持装置。
- 前記係合部は、前記基板の裏面に当接する前記弾性膜よりも厚いまたはこれと同じ厚さであることを特徴とする請求項1から4のいずれか一項に記載の基板保持装置。
- 基板の裏面に当接する弾性膜と、前記弾性膜の少なくとも一部を固定する取付部材と、前記弾性膜に当接した基板の外周縁を保持するリテーナリング部とを備えた基板保持装置において、
前記弾性膜は、該弾性膜の外周縁から径方向内側に突出する突出部を全周にわたって有する外周膜を備えたことを特徴とする基板保持装置。 - 前記弾性膜は、前記基板の押圧方向に伸縮自在のベローズ部を備えたことを特徴とする請求項1から6のいずれか一項に記載の基板保持装置。
- 前記基板の裏面に当接する前記弾性膜の厚さを前記ベローズ部より厚くしたことを特徴とする請求項7に記載の基板保持装置。
- 基板の裏面に当接する弾性膜と、前記弾性膜の少なくとも一部を固定する取付部材と、前記弾性膜に当接した基板の外周縁を保持するリテーナリング部とを備えた基板保持装置において、
前記弾性膜は、押圧方向に延びる同心円状の複数の円筒面により構成される外周膜と、前記外周膜と略直角をなして前記基板の裏面に当接する底面膜とを備えたことを特徴とする基板保持装置。 - 研磨面を有する研磨テーブルと、
請求項1から9のいずれか一項に記載の基板保持装置とを備え、
前記基板保持装置により保持された基板を前記研磨テーブルに押圧して該基板を研磨することを特徴とする研磨装置。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004358859A JP5112614B2 (ja) | 2004-12-10 | 2004-12-10 | 基板保持装置および研磨装置 |
CNB200580042189XA CN100509287C (zh) | 2004-12-10 | 2005-12-06 | 衬底保持设备以及抛光装置 |
US11/791,218 US7635292B2 (en) | 2004-12-10 | 2005-12-06 | Substrate holding device and polishing apparatus |
KR1020077015642A KR20070091186A (ko) | 2004-12-10 | 2005-12-06 | 기판유지장치 및 폴리싱장치 |
EP05814728A EP1833640B1 (en) | 2004-12-10 | 2005-12-06 | Substrate holding device and polishing apparatus |
DE602005016602T DE602005016602D1 (de) | 2004-12-10 | 2005-12-06 | Substrathalteeinrichtung und poliervorrichtung |
CNA200910006163XA CN101474772A (zh) | 2004-12-10 | 2005-12-06 | 衬底保持设备以及抛光装置 |
PCT/JP2005/022735 WO2006062232A1 (en) | 2004-12-10 | 2005-12-06 | Substrate holding device and polishing apparatus |
TW094143523A TWI430388B (zh) | 2004-12-10 | 2005-12-09 | 基板固持裝置、研磨設備及彈性薄膜 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004358859A JP5112614B2 (ja) | 2004-12-10 | 2004-12-10 | 基板保持装置および研磨装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006159392A true JP2006159392A (ja) | 2006-06-22 |
JP2006159392A5 JP2006159392A5 (ja) | 2009-03-12 |
JP5112614B2 JP5112614B2 (ja) | 2013-01-09 |
Family
ID=36578042
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004358859A Active JP5112614B2 (ja) | 2004-12-10 | 2004-12-10 | 基板保持装置および研磨装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7635292B2 (ja) |
EP (1) | EP1833640B1 (ja) |
JP (1) | JP5112614B2 (ja) |
KR (1) | KR20070091186A (ja) |
CN (2) | CN101474772A (ja) |
DE (1) | DE602005016602D1 (ja) |
TW (1) | TWI430388B (ja) |
WO (1) | WO2006062232A1 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008137149A (ja) * | 2006-11-22 | 2008-06-19 | Applied Materials Inc | 保持リング、保持リングに負荷をかけるフレキシブル膜及び保持リングアセンブリ |
JP2008142884A (ja) * | 2006-11-22 | 2008-06-26 | Applied Materials Inc | キャリアヘッド用フレキシブル膜 |
JP2009107094A (ja) * | 2007-10-31 | 2009-05-21 | Shin Etsu Handotai Co Ltd | ワーク研磨用ヘッド及びこの研磨ヘッドを備えた研磨装置 |
WO2009066351A1 (ja) * | 2007-11-20 | 2009-05-28 | Shin-Etsu Handotai Co., Ltd. | 研磨ヘッド及び研磨装置 |
KR101223010B1 (ko) | 2012-06-29 | 2013-01-17 | 주식회사 케이씨텍 | 화학 기계적 연마 장치의 캐리어 헤드용 멤브레인 |
KR101495964B1 (ko) | 2011-11-30 | 2015-02-25 | 가부시키가이샤 에바라 세이사꾸쇼 | 탄성막 |
JP2016092370A (ja) * | 2014-11-11 | 2016-05-23 | 株式会社荏原製作所 | 研磨装置 |
JP2021030410A (ja) * | 2019-08-29 | 2021-03-01 | 株式会社荏原製作所 | 弾性膜、および基板保持装置 |
KR20210027116A (ko) | 2019-08-29 | 2021-03-10 | 가부시키가이샤 에바라 세이사꾸쇼 | 탄성막 및 기판 보유 지지 장치 |
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TWI375294B (en) | 2003-02-10 | 2012-10-21 | Ebara Corp | Elastic membrane |
JP4814677B2 (ja) * | 2006-03-31 | 2011-11-16 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
JP5464820B2 (ja) * | 2007-10-29 | 2014-04-09 | 株式会社荏原製作所 | 研磨装置 |
US20120264359A1 (en) * | 2011-04-13 | 2012-10-18 | Nanya Technology Corporation | Membrane |
KR101239377B1 (ko) * | 2011-07-18 | 2013-03-05 | 주식회사 케이씨텍 | 캐리어 헤드 |
US10532441B2 (en) | 2012-11-30 | 2020-01-14 | Applied Materials, Inc. | Three-zone carrier head and flexible membrane |
KR101410358B1 (ko) * | 2013-02-25 | 2014-06-20 | 삼성전자주식회사 | 화학적 기계적 연마장치용 멤브레인 및 화학적 기계적 연마장치용 연마헤드 |
KR102323430B1 (ko) * | 2014-03-31 | 2021-11-09 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마 장치 및 연마 방법 |
KR102173323B1 (ko) | 2014-06-23 | 2020-11-04 | 삼성전자주식회사 | 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법 |
JP6360586B1 (ja) * | 2017-04-13 | 2018-07-18 | 三菱電線工業株式会社 | Cmp装置のウエハ保持用の弾性膜 |
USD918161S1 (en) | 2017-12-19 | 2021-05-04 | Ebara Corporation | Elastic membrane |
JP7075814B2 (ja) * | 2018-05-21 | 2022-05-26 | 株式会社荏原製作所 | 基板保持装置、基板研磨装置、弾性部材および基板保持装置の製造方法 |
JP2022074321A (ja) * | 2020-11-04 | 2022-05-18 | 株式会社荏原製作所 | 研磨ヘッドおよび研磨装置 |
CN115673910B (zh) * | 2023-01-03 | 2023-03-21 | 北京特思迪半导体设备有限公司 | 一种液涨控制的压盘及其用于基材抛光的面型控制方法 |
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2005
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- 2005-12-06 DE DE602005016602T patent/DE602005016602D1/de active Active
- 2005-12-06 US US11/791,218 patent/US7635292B2/en active Active
- 2005-12-06 WO PCT/JP2005/022735 patent/WO2006062232A1/en active Application Filing
- 2005-12-06 KR KR1020077015642A patent/KR20070091186A/ko active Search and Examination
- 2005-12-06 CN CNA200910006163XA patent/CN101474772A/zh active Pending
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Cited By (14)
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CN101474772A (zh) | 2009-07-08 |
EP1833640A1 (en) | 2007-09-19 |
JP5112614B2 (ja) | 2013-01-09 |
DE602005016602D1 (de) | 2009-10-22 |
EP1833640A4 (en) | 2008-02-06 |
TW200625510A (en) | 2006-07-16 |
TWI430388B (zh) | 2014-03-11 |
CN100509287C (zh) | 2009-07-08 |
WO2006062232A1 (en) | 2006-06-15 |
EP1833640B1 (en) | 2009-09-09 |
US7635292B2 (en) | 2009-12-22 |
KR20070091186A (ko) | 2007-09-07 |
CN101072658A (zh) | 2007-11-14 |
US20070293129A1 (en) | 2007-12-20 |
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