TWI526376B - 基板收納容器、遮罩基底收納體、轉印遮罩收納體及覆膜玻璃基板收納體 - Google Patents

基板收納容器、遮罩基底收納體、轉印遮罩收納體及覆膜玻璃基板收納體 Download PDF

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Publication number
TWI526376B
TWI526376B TW101105610A TW101105610A TWI526376B TW I526376 B TWI526376 B TW I526376B TW 101105610 A TW101105610 A TW 101105610A TW 101105610 A TW101105610 A TW 101105610A TW I526376 B TWI526376 B TW I526376B
Authority
TW
Taiwan
Prior art keywords
substrate
groove
glass substrate
coated glass
storage container
Prior art date
Application number
TW101105610A
Other languages
English (en)
Chinese (zh)
Other versions
TW201233605A (en
Inventor
荒井英人
Original Assignee
Ｈｏｙａ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｈｏｙａ股份有限公司 filed Critical Ｈｏｙａ股份有限公司
Publication of TW201233605A publication Critical patent/TW201233605A/zh
Application granted granted Critical
Publication of TWI526376B publication Critical patent/TWI526376B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/22—Details
    • B65D77/24—Inserts or accessories added or incorporated during filling of containers
    • B65D77/26—Elements or devices for locating or protecting articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
TW101105610A 2005-11-30 2006-11-28 基板收納容器、遮罩基底收納體、轉印遮罩收納體及覆膜玻璃基板收納體 TWI526376B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005345272A JP4801981B2 (ja) 2005-11-30 2005-11-30 基板収納容器、膜付きガラス基板収納体、マスクブランク収納体、および転写マスク収納体

Publications (2)

Publication Number Publication Date
TW201233605A TW201233605A (en) 2012-08-16
TWI526376B true TWI526376B (zh) 2016-03-21

Family

ID=38207282

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101105610A TWI526376B (zh) 2005-11-30 2006-11-28 基板收納容器、遮罩基底收納體、轉印遮罩收納體及覆膜玻璃基板收納體
TW095143912A TWI367850B (en) 2005-11-30 2006-11-28 Substrate container, mask blank package, and transfer mask package and film-coated glass substrate container

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW095143912A TWI367850B (en) 2005-11-30 2006-11-28 Substrate container, mask blank package, and transfer mask package and film-coated glass substrate container

Country Status (3)

Country Link
JP (1) JP4801981B2 (enExample)
KR (3) KR100955983B1 (enExample)
TW (2) TWI526376B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5153399B2 (ja) * 2008-03-19 2013-02-27 三洋電機株式会社 基板ケース及び処理方法
WO2014136247A1 (ja) * 2013-03-07 2014-09-12 ミライアル株式会社 基板収納容器

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59113442A (ja) * 1982-12-18 1984-06-30 Konishiroku Photo Ind Co Ltd フオトマスク素材の保存方法
JPH0135474Y2 (enExample) * 1986-05-30 1989-10-30
JPH04116193A (ja) * 1990-09-05 1992-04-16 Nkk Corp 耐食性および溶接性に優れた複層電解クロメート処理鋼板
JPH04116193U (ja) * 1991-03-28 1992-10-16 ホーヤ株式会社 基板収納ケース用載置台
JPH06204328A (ja) * 1992-12-25 1994-07-22 Mitsubishi Materials Corp ウェーハケース
JP2552625B2 (ja) * 1993-11-09 1996-11-13 淀川化成株式会社 ガラス基板搬送用ボックス
KR20000014678U (ko) * 1998-12-30 2000-07-25 김영환 반도체장치의 마스크캐리어 박스
JP2001240179A (ja) * 2000-02-29 2001-09-04 Shin Etsu Polymer Co Ltd 精密基板収納容器
JP2003300583A (ja) * 2002-04-09 2003-10-21 Sekisui Plastics Co Ltd 板状体の搬送用箱
JP2004059075A (ja) * 2002-07-29 2004-02-26 Nissho Iwai Plastic Corp ガラス基板搬送用ボックス
JP4363114B2 (ja) * 2003-07-25 2009-11-11 凸版印刷株式会社 板状基板処理用ラック
JP3995049B2 (ja) * 2003-08-20 2007-10-24 旭平硝子加工株式会社 ガラス基板搬送用ボックス
JP4675601B2 (ja) * 2003-11-18 2011-04-27 株式会社 ネットプラスチック 大型精密シート状製品および半製品用密封容器
KR20050057889A (ko) * 2003-12-11 2005-06-16 김성모 평판표시장치용 기판 저장을 위한 수납박스

Also Published As

Publication number Publication date
KR20110026450A (ko) 2011-03-15
TW200728168A (en) 2007-08-01
TW201233605A (en) 2012-08-16
KR20100004906A (ko) 2010-01-13
KR20070057028A (ko) 2007-06-04
KR100955983B1 (ko) 2010-05-04
KR101067200B1 (ko) 2011-09-22
KR101141484B1 (ko) 2012-05-04
JP2007145397A (ja) 2007-06-14
JP4801981B2 (ja) 2011-10-26
TWI367850B (en) 2012-07-11

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