TWI520202B - 在一同步雙面晶圓研磨器中之流體靜力墊壓力調變 - Google Patents
在一同步雙面晶圓研磨器中之流體靜力墊壓力調變 Download PDFInfo
- Publication number
- TWI520202B TWI520202B TW100110457A TW100110457A TWI520202B TW I520202 B TWI520202 B TW I520202B TW 100110457 A TW100110457 A TW 100110457A TW 100110457 A TW100110457 A TW 100110457A TW I520202 B TWI520202 B TW I520202B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- hydrostatic
- grinding
- pad
- pads
- Prior art date
Links
- 230000002706 hydrostatic effect Effects 0.000 title claims description 222
- 238000000227 grinding Methods 0.000 claims description 248
- 238000000034 method Methods 0.000 claims description 56
- 238000005498 polishing Methods 0.000 claims description 32
- 230000008569 process Effects 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 25
- 238000012545 processing Methods 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 235000012431 wafers Nutrition 0.000 description 430
- 238000005259 measurement Methods 0.000 description 35
- 238000004458 analytical method Methods 0.000 description 28
- 230000007547 defect Effects 0.000 description 18
- 238000011156 evaluation Methods 0.000 description 18
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- 238000006073 displacement reaction Methods 0.000 description 12
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- 238000006731 degradation reaction Methods 0.000 description 11
- 230000008859 change Effects 0.000 description 9
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- 230000002093 peripheral effect Effects 0.000 description 9
- 230000000246 remedial effect Effects 0.000 description 8
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- 238000009826 distribution Methods 0.000 description 6
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- 238000007517 polishing process Methods 0.000 description 3
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- 230000003068 static effect Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
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- 230000006870 function Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/14—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of optical work, e.g. lenses, prisms
- B24B9/148—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of optical work, e.g. lenses, prisms electrically, e.g. numerically, controlled
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07, with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US31791910P | 2010-03-26 | 2010-03-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201201264A TW201201264A (en) | 2012-01-01 |
| TWI520202B true TWI520202B (zh) | 2016-02-01 |
Family
ID=44657008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100110457A TWI520202B (zh) | 2010-03-26 | 2011-03-25 | 在一同步雙面晶圓研磨器中之流體靜力墊壓力調變 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8712575B2 (enExample) |
| EP (1) | EP2552644A4 (enExample) |
| JP (1) | JP6013317B2 (enExample) |
| KR (1) | KR101694574B1 (enExample) |
| CN (1) | CN102844151A (enExample) |
| SG (1) | SG184014A1 (enExample) |
| TW (1) | TWI520202B (enExample) |
| WO (1) | WO2011117792A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9960088B2 (en) * | 2011-11-07 | 2018-05-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | End point detection in grinding |
| US9358660B2 (en) | 2011-11-07 | 2016-06-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Grinding wheel design with elongated teeth arrangement |
| JP6197580B2 (ja) * | 2013-10-29 | 2017-09-20 | 株式会社Sumco | キャリアプレート及びワークの両面研磨装置 |
| CN105881213A (zh) * | 2014-09-01 | 2016-08-24 | 曾庆明 | 一种精密双面研磨机的控制器 |
| JP6285375B2 (ja) * | 2015-02-17 | 2018-02-28 | 光洋機械工業株式会社 | 両頭平面研削装置 |
| JP6447472B2 (ja) * | 2015-11-26 | 2019-01-09 | 株式会社Sumco | ウェーハ研磨方法 |
| CN108127560A (zh) * | 2017-12-08 | 2018-06-08 | 中国兵器科学研究院宁波分院 | 用于方形光学元件双面快速抛光的控制系统 |
| JP6513174B2 (ja) * | 2017-12-25 | 2019-05-15 | 信越半導体株式会社 | ウェーハ保持用キャリアの設計方法 |
| JP7159861B2 (ja) * | 2018-12-27 | 2022-10-25 | 株式会社Sumco | 両頭研削方法 |
| JP7116371B2 (ja) * | 2019-04-01 | 2022-08-10 | 株式会社村田製作所 | 研磨剤供給装置、研磨装置及び研磨剤供給方法 |
| US11415971B2 (en) | 2020-02-10 | 2022-08-16 | Globalwafers Co., Ltd. | Systems and methods for enhanced wafer manufacturing |
| CN116601575A (zh) * | 2020-11-10 | 2023-08-15 | 环球晶圆股份有限公司 | 使用阶层式预测及复合阈值增强机器学习的系统及方法 |
| CN114227524A (zh) * | 2021-12-30 | 2022-03-25 | 西安奕斯伟材料科技有限公司 | 双面研磨装置和双面研磨方法 |
| US12386340B2 (en) | 2022-02-25 | 2025-08-12 | Globalwafers Co., Ltd. | Systems and methods for generating post-polishing topography for enhanced wafer manufacturing |
| CN115070604B (zh) * | 2022-06-09 | 2023-09-29 | 西安奕斯伟材料科技股份有限公司 | 双面研磨装置和双面研磨方法 |
| CN115723035B (zh) * | 2022-09-08 | 2024-05-28 | 西安奕斯伟材料科技股份有限公司 | 用于监控研磨装置的加工状态的系统、方法及双面研磨装置 |
| CN115383616B (zh) * | 2022-09-22 | 2024-05-31 | 西安奕斯伟材料科技股份有限公司 | 研磨装置、研磨方法及硅片 |
| CN116475934B (zh) * | 2023-03-31 | 2025-03-28 | 西安奕斯伟材料科技股份有限公司 | 静压垫、研磨设备及硅片 |
| CN120715743A (zh) * | 2025-04-18 | 2025-09-30 | 浙江求是半导体设备有限公司 | 一种晶圆双面减薄方法和系统 |
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| JPH1177497A (ja) * | 1997-09-01 | 1999-03-23 | Waida Seisakusho:Kk | 半導体ウエハの両面研削方法及び両面研削装置 |
| JPH11154655A (ja) * | 1997-11-21 | 1999-06-08 | Komatsu Electron Metals Co Ltd | 半導体ウェハの製造方法 |
| JP3328193B2 (ja) * | 1998-07-08 | 2002-09-24 | 信越半導体株式会社 | 半導体ウエーハの製造方法 |
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| JP2002346924A (ja) * | 2001-05-29 | 2002-12-04 | Sumitomo Heavy Ind Ltd | ワークホルダ |
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-
2011
- 2011-03-16 US US13/049,536 patent/US8712575B2/en active Active
- 2011-03-18 SG SG2012067369A patent/SG184014A1/en unknown
- 2011-03-18 WO PCT/IB2011/051152 patent/WO2011117792A1/en not_active Ceased
- 2011-03-18 CN CN201180016139XA patent/CN102844151A/zh active Pending
- 2011-03-18 KR KR1020127025126A patent/KR101694574B1/ko active Active
- 2011-03-18 JP JP2013500633A patent/JP6013317B2/ja active Active
- 2011-03-18 EP EP11758894.7A patent/EP2552644A4/en not_active Withdrawn
- 2011-03-25 TW TW100110457A patent/TWI520202B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2552644A4 (en) | 2014-05-14 |
| KR101694574B1 (ko) | 2017-01-09 |
| US20110237160A1 (en) | 2011-09-29 |
| KR20130008572A (ko) | 2013-01-22 |
| US8712575B2 (en) | 2014-04-29 |
| CN102844151A (zh) | 2012-12-26 |
| JP6013317B2 (ja) | 2016-10-25 |
| SG184014A1 (en) | 2012-10-30 |
| EP2552644A1 (en) | 2013-02-06 |
| JP2013524484A (ja) | 2013-06-17 |
| WO2011117792A1 (en) | 2011-09-29 |
| TW201201264A (en) | 2012-01-01 |
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