CN102844151A - 同时双面晶片研磨机中的流体静力垫压力调控 - Google Patents

同时双面晶片研磨机中的流体静力垫压力调控 Download PDF

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Publication number
CN102844151A
CN102844151A CN201180016139XA CN201180016139A CN102844151A CN 102844151 A CN102844151 A CN 102844151A CN 201180016139X A CN201180016139X A CN 201180016139XA CN 201180016139 A CN201180016139 A CN 201180016139A CN 102844151 A CN102844151 A CN 102844151A
Authority
CN
China
Prior art keywords
wafer
abrasive wheel
pad
hydrostatic
grinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201180016139XA
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English (en)
Chinese (zh)
Inventor
S·S·巴加瓦特
R·R·旺达姆
T·科穆拉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SunEdison Inc
Original Assignee
SunEdison Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SunEdison Inc filed Critical SunEdison Inc
Publication of CN102844151A publication Critical patent/CN102844151A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/14—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of optical work, e.g. lenses, prisms
    • B24B9/148—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of optical work, e.g. lenses, prisms electrically, e.g. numerically, controlled
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07, with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
CN201180016139XA 2010-03-26 2011-03-18 同时双面晶片研磨机中的流体静力垫压力调控 Pending CN102844151A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US31791910P 2010-03-26 2010-03-26
US61/317,919 2010-03-26
PCT/IB2011/051152 WO2011117792A1 (en) 2010-03-26 2011-03-18 Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder

Publications (1)

Publication Number Publication Date
CN102844151A true CN102844151A (zh) 2012-12-26

Family

ID=44657008

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180016139XA Pending CN102844151A (zh) 2010-03-26 2011-03-18 同时双面晶片研磨机中的流体静力垫压力调控

Country Status (8)

Country Link
US (1) US8712575B2 (enExample)
EP (1) EP2552644A4 (enExample)
JP (1) JP6013317B2 (enExample)
KR (1) KR101694574B1 (enExample)
CN (1) CN102844151A (enExample)
SG (1) SG184014A1 (enExample)
TW (1) TWI520202B (enExample)
WO (1) WO2011117792A1 (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105881213A (zh) * 2014-09-01 2016-08-24 曾庆明 一种精密双面研磨机的控制器
CN105881195A (zh) * 2015-02-17 2016-08-24 光洋机械工业株式会社 双头平面研磨装置
CN108127560A (zh) * 2017-12-08 2018-06-08 中国兵器科学研究院宁波分院 用于方形光学元件双面快速抛光的控制系统
CN108475627A (zh) * 2015-11-26 2018-08-31 胜高股份有限公司 晶圆抛光方法
CN112930248A (zh) * 2019-04-01 2021-06-08 株式会社村田制作所 研磨剂供给装置、研磨装置以及研磨剂供给方法
CN113396030A (zh) * 2018-12-27 2021-09-14 胜高股份有限公司 两头磨削方法
CN114227524A (zh) * 2021-12-30 2022-03-25 西安奕斯伟材料科技有限公司 双面研磨装置和双面研磨方法
CN115070604A (zh) * 2022-06-09 2022-09-20 西安奕斯伟材料科技有限公司 双面研磨装置和双面研磨方法
CN115723035A (zh) * 2022-09-08 2023-03-03 西安奕斯伟材料科技有限公司 用于监控研磨装置的加工状态的系统、方法及双面研磨装置
CN120038618A (zh) * 2025-04-18 2025-05-27 浙江求是半导体设备有限公司 一种晶圆双面减薄方法和系统

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US9960088B2 (en) * 2011-11-07 2018-05-01 Taiwan Semiconductor Manufacturing Company, Ltd. End point detection in grinding
US9358660B2 (en) 2011-11-07 2016-06-07 Taiwan Semiconductor Manufacturing Company, Ltd. Grinding wheel design with elongated teeth arrangement
JP6197580B2 (ja) * 2013-10-29 2017-09-20 株式会社Sumco キャリアプレート及びワークの両面研磨装置
JP6513174B2 (ja) * 2017-12-25 2019-05-15 信越半導体株式会社 ウェーハ保持用キャリアの設計方法
US11415971B2 (en) 2020-02-10 2022-08-16 Globalwafers Co., Ltd. Systems and methods for enhanced wafer manufacturing
CN116601575A (zh) * 2020-11-10 2023-08-15 环球晶圆股份有限公司 使用阶层式预测及复合阈值增强机器学习的系统及方法
US12386340B2 (en) 2022-02-25 2025-08-12 Globalwafers Co., Ltd. Systems and methods for generating post-polishing topography for enhanced wafer manufacturing
CN115383616B (zh) * 2022-09-22 2024-05-31 西安奕斯伟材料科技股份有限公司 研磨装置、研磨方法及硅片
CN116475934B (zh) * 2023-03-31 2025-03-28 西安奕斯伟材料科技股份有限公司 静压垫、研磨设备及硅片

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CN1933940A (zh) * 2004-03-19 2007-03-21 Memc电子材料有限公司 用于双面研磨机的晶片夹持装置
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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105881213A (zh) * 2014-09-01 2016-08-24 曾庆明 一种精密双面研磨机的控制器
CN105881195A (zh) * 2015-02-17 2016-08-24 光洋机械工业株式会社 双头平面研磨装置
CN108475627B (zh) * 2015-11-26 2022-11-08 胜高股份有限公司 晶圆抛光方法
CN108475627A (zh) * 2015-11-26 2018-08-31 胜高股份有限公司 晶圆抛光方法
CN108127560A (zh) * 2017-12-08 2018-06-08 中国兵器科学研究院宁波分院 用于方形光学元件双面快速抛光的控制系统
CN113396030A (zh) * 2018-12-27 2021-09-14 胜高股份有限公司 两头磨削方法
CN112930248A (zh) * 2019-04-01 2021-06-08 株式会社村田制作所 研磨剂供给装置、研磨装置以及研磨剂供给方法
CN112930248B (zh) * 2019-04-01 2023-05-02 株式会社村田制作所 研磨剂供给装置、研磨装置以及研磨剂供给方法
CN114227524A (zh) * 2021-12-30 2022-03-25 西安奕斯伟材料科技有限公司 双面研磨装置和双面研磨方法
CN115070604A (zh) * 2022-06-09 2022-09-20 西安奕斯伟材料科技有限公司 双面研磨装置和双面研磨方法
CN115070604B (zh) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法
CN115723035A (zh) * 2022-09-08 2023-03-03 西安奕斯伟材料科技有限公司 用于监控研磨装置的加工状态的系统、方法及双面研磨装置
CN115723035B (zh) * 2022-09-08 2024-05-28 西安奕斯伟材料科技股份有限公司 用于监控研磨装置的加工状态的系统、方法及双面研磨装置
CN120038618A (zh) * 2025-04-18 2025-05-27 浙江求是半导体设备有限公司 一种晶圆双面减薄方法和系统
CN120038618B (zh) * 2025-04-18 2025-07-29 浙江求是半导体设备有限公司 一种晶圆双面减薄方法和系统

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Publication number Publication date
EP2552644A4 (en) 2014-05-14
KR101694574B1 (ko) 2017-01-09
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