TWI518829B - Conveying device and substrate processing system - Google Patents

Conveying device and substrate processing system Download PDF

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Publication number
TWI518829B
TWI518829B TW101144902A TW101144902A TWI518829B TW I518829 B TWI518829 B TW I518829B TW 101144902 A TW101144902 A TW 101144902A TW 101144902 A TW101144902 A TW 101144902A TW I518829 B TWI518829 B TW I518829B
Authority
TW
Taiwan
Prior art keywords
air blowing
casing
gas
disposed
conveying device
Prior art date
Application number
TW101144902A
Other languages
English (en)
Chinese (zh)
Other versions
TW201339073A (zh
Inventor
廣木勤
澤田郁夫
松崎和愛
福原芳樹
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201339073A publication Critical patent/TW201339073A/zh
Application granted granted Critical
Publication of TWI518829B publication Critical patent/TWI518829B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
TW101144902A 2011-12-01 2012-11-30 Conveying device and substrate processing system TWI518829B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011264099A JP5603314B2 (ja) 2011-12-01 2011-12-01 搬送装置及び基板処理システム

Publications (2)

Publication Number Publication Date
TW201339073A TW201339073A (zh) 2013-10-01
TWI518829B true TWI518829B (zh) 2016-01-21

Family

ID=48535464

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101144902A TWI518829B (zh) 2011-12-01 2012-11-30 Conveying device and substrate processing system

Country Status (5)

Country Link
US (1) US9165810B2 (https=)
JP (1) JP5603314B2 (https=)
KR (1) KR101552805B1 (https=)
TW (1) TWI518829B (https=)
WO (1) WO2013081013A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6468848B2 (ja) * 2015-01-13 2019-02-13 株式会社ディスコ 搬送装置
JP6430870B2 (ja) * 2015-03-20 2018-11-28 東京エレクトロン株式会社 クランプ装置及びこれを用いた基板搬入出装置、並びに基板処理装置
JP6553388B2 (ja) 2015-03-31 2019-07-31 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、基板処理装置および基板搬送方法
JP6564642B2 (ja) * 2015-07-23 2019-08-21 東京エレクトロン株式会社 基板搬送室、基板処理システム、及び基板搬送室内のガス置換方法
CN105292980B (zh) * 2015-10-30 2018-01-02 中汽昌兴（洛阳）机电设备工程有限公司 一种输送系统及其吊具、输送装置
US11373891B2 (en) * 2018-10-26 2022-06-28 Applied Materials, Inc. Front-ducted equipment front end modules, side storage pods, and methods of operating the same
JP7316104B2 (ja) * 2019-06-14 2023-07-27 株式会社日立ハイテク ウエハ搬送装置
JP7401219B2 (ja) 2019-07-31 2023-12-19 ニデックインスツルメンツ株式会社 産業用ロボット
KR20230017185A (ko) * 2020-05-29 2023-02-03 엘피이 에스피에이 오버헤드 스크린을 구비한 기판 핸들링을 위한 도구 및 관련 핸들링 방법 및 에피택셜 반응기
US11666951B2 (en) * 2020-07-10 2023-06-06 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer handler cleaning tool
JP7555210B2 (ja) * 2020-07-29 2024-09-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
WO2025205177A1 (ja) * 2024-03-29 2025-10-02 東京エレクトロン株式会社 搬送装置及び排気方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2503732Y2 (ja) * 1994-04-22 1996-07-03 大日本スクリーン製造株式会社 半導体製造装置
JPH1131730A (ja) * 1997-07-14 1999-02-02 Dainippon Screen Mfg Co Ltd 基板処理装置
US6983195B2 (en) * 2000-12-08 2006-01-03 Tokyo Electron Limited Semiconductor processing system and method of transferring workpiece
JP2003007799A (ja) * 2001-06-21 2003-01-10 Tokyo Electron Ltd 処理システム
KR100483428B1 (ko) * 2003-01-24 2005-04-14 삼성전자주식회사 기판 가공 장치
KR100583730B1 (ko) * 2004-06-29 2006-05-26 삼성전자주식회사 기판 이송 시스템 및 상기 시스템의 프레임 내 압력을조절하는 방법
US20070233313A1 (en) * 2006-03-28 2007-10-04 Tokyo Electron Limited Transfer pick, transfer device, substrate processing apparatus and transfer pick cleaning method
JP4896899B2 (ja) * 2007-01-31 2012-03-14 東京エレクトロン株式会社 基板処理装置およびパーティクル付着防止方法
JP4959457B2 (ja) * 2007-07-26 2012-06-20 東京エレクトロン株式会社 基板搬送モジュール及び基板処理システム
JP4359640B2 (ja) * 2007-09-25 2009-11-04 東京エレクトロン株式会社 基板搬送装置及びダウンフロー制御方法
US8757026B2 (en) * 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
JP5131094B2 (ja) * 2008-08-29 2013-01-30 東京エレクトロン株式会社 熱処理装置及び熱処理方法並びに記憶媒体

Also Published As

Publication number Publication date
US20150125238A1 (en) 2015-05-07
JP5603314B2 (ja) 2014-10-08
JP2013118229A (ja) 2013-06-13
KR20140100484A (ko) 2014-08-14
TW201339073A (zh) 2013-10-01
KR101552805B1 (ko) 2015-09-11
WO2013081013A1 (ja) 2013-06-06
US9165810B2 (en) 2015-10-20

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