KR101552805B1 - 반송 장치 및 기판 처리 시스템 - Google Patents

반송 장치 및 기판 처리 시스템 Download PDF

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Publication number
KR101552805B1
KR101552805B1 KR1020147014689A KR20147014689A KR101552805B1 KR 101552805 B1 KR101552805 B1 KR 101552805B1 KR 1020147014689 A KR1020147014689 A KR 1020147014689A KR 20147014689 A KR20147014689 A KR 20147014689A KR 101552805 B1 KR101552805 B1 KR 101552805B1
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South Korea
Prior art keywords
housing
blowing
end effector
moving
driving mechanism
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Expired - Fee Related
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KR1020147014689A
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English (en)
Korean (ko)
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KR20140100484A (ko
Inventor
츠토무 히로키
이쿠오 사와다
가즈요시 마츠자키
요시키 후쿠하라
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도쿄엘렉트론가부시키가이샤
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Publication of KR20140100484A publication Critical patent/KR20140100484A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
KR1020147014689A 2011-12-01 2012-11-28 반송 장치 및 기판 처리 시스템 Expired - Fee Related KR101552805B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011264099A JP5603314B2 (ja) 2011-12-01 2011-12-01 搬送装置及び基板処理システム
JPJP-P-2011-264099 2011-12-01
PCT/JP2012/080766 WO2013081013A1 (ja) 2011-12-01 2012-11-28 搬送装置及び基板処理システム

Publications (2)

Publication Number Publication Date
KR20140100484A KR20140100484A (ko) 2014-08-14
KR101552805B1 true KR101552805B1 (ko) 2015-09-11

Family

ID=48535464

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147014689A Expired - Fee Related KR101552805B1 (ko) 2011-12-01 2012-11-28 반송 장치 및 기판 처리 시스템

Country Status (5)

Country Link
US (1) US9165810B2 (https=)
JP (1) JP5603314B2 (https=)
KR (1) KR101552805B1 (https=)
TW (1) TWI518829B (https=)
WO (1) WO2013081013A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6468848B2 (ja) * 2015-01-13 2019-02-13 株式会社ディスコ 搬送装置
JP6430870B2 (ja) * 2015-03-20 2018-11-28 東京エレクトロン株式会社 クランプ装置及びこれを用いた基板搬入出装置、並びに基板処理装置
JP6553388B2 (ja) 2015-03-31 2019-07-31 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、基板処理装置および基板搬送方法
JP6564642B2 (ja) * 2015-07-23 2019-08-21 東京エレクトロン株式会社 基板搬送室、基板処理システム、及び基板搬送室内のガス置換方法
CN105292980B (zh) * 2015-10-30 2018-01-02 中汽昌兴（洛阳）机电设备工程有限公司 一种输送系统及其吊具、输送装置
US11373891B2 (en) * 2018-10-26 2022-06-28 Applied Materials, Inc. Front-ducted equipment front end modules, side storage pods, and methods of operating the same
JP7316104B2 (ja) * 2019-06-14 2023-07-27 株式会社日立ハイテク ウエハ搬送装置
JP7401219B2 (ja) 2019-07-31 2023-12-19 ニデックインスツルメンツ株式会社 産業用ロボット
KR20230017185A (ko) * 2020-05-29 2023-02-03 엘피이 에스피에이 오버헤드 스크린을 구비한 기판 핸들링을 위한 도구 및 관련 핸들링 방법 및 에피택셜 반응기
US11666951B2 (en) * 2020-07-10 2023-06-06 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer handler cleaning tool
JP7555210B2 (ja) * 2020-07-29 2024-09-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
WO2025205177A1 (ja) * 2024-03-29 2025-10-02 東京エレクトロン株式会社 搬送装置及び排気方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2503732Y2 (ja) * 1994-04-22 1996-07-03 大日本スクリーン製造株式会社 半導体製造装置
JPH1131730A (ja) * 1997-07-14 1999-02-02 Dainippon Screen Mfg Co Ltd 基板処理装置
US6983195B2 (en) * 2000-12-08 2006-01-03 Tokyo Electron Limited Semiconductor processing system and method of transferring workpiece
JP2003007799A (ja) * 2001-06-21 2003-01-10 Tokyo Electron Ltd 処理システム
KR100483428B1 (ko) * 2003-01-24 2005-04-14 삼성전자주식회사 기판 가공 장치
KR100583730B1 (ko) * 2004-06-29 2006-05-26 삼성전자주식회사 기판 이송 시스템 및 상기 시스템의 프레임 내 압력을조절하는 방법
US20070233313A1 (en) * 2006-03-28 2007-10-04 Tokyo Electron Limited Transfer pick, transfer device, substrate processing apparatus and transfer pick cleaning method
JP4896899B2 (ja) * 2007-01-31 2012-03-14 東京エレクトロン株式会社 基板処理装置およびパーティクル付着防止方法
JP4959457B2 (ja) * 2007-07-26 2012-06-20 東京エレクトロン株式会社 基板搬送モジュール及び基板処理システム
JP4359640B2 (ja) * 2007-09-25 2009-11-04 東京エレクトロン株式会社 基板搬送装置及びダウンフロー制御方法
US8757026B2 (en) * 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
JP5131094B2 (ja) * 2008-08-29 2013-01-30 東京エレクトロン株式会社 熱処理装置及び熱処理方法並びに記憶媒体

Also Published As

Publication number Publication date
US20150125238A1 (en) 2015-05-07
JP5603314B2 (ja) 2014-10-08
JP2013118229A (ja) 2013-06-13
KR20140100484A (ko) 2014-08-14
TW201339073A (zh) 2013-10-01
WO2013081013A1 (ja) 2013-06-06
US9165810B2 (en) 2015-10-20
TWI518829B (zh) 2016-01-21

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