TWI508786B - 塗佈裝置 - Google Patents

塗佈裝置 Download PDF

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Publication number
TWI508786B
TWI508786B TW099102820A TW99102820A TWI508786B TW I508786 B TWI508786 B TW I508786B TW 099102820 A TW099102820 A TW 099102820A TW 99102820 A TW99102820 A TW 99102820A TW I508786 B TWI508786 B TW I508786B
Authority
TW
Taiwan
Prior art keywords
coating
collision
foreign matter
unit
substrate
Prior art date
Application number
TW099102820A
Other languages
English (en)
Chinese (zh)
Other versions
TW201036704A (en
Inventor
Genshin Nakazawa
Nobuo Horiuchi
Original Assignee
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW201036704A publication Critical patent/TW201036704A/zh
Application granted granted Critical
Publication of TWI508786B publication Critical patent/TWI508786B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Coating Apparatus (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Liquid Crystal (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW099102820A 2009-03-26 2010-02-01 塗佈裝置 TWI508786B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009076902A JP2010232326A (ja) 2009-03-26 2009-03-26 塗布装置

Publications (2)

Publication Number Publication Date
TW201036704A TW201036704A (en) 2010-10-16
TWI508786B true TWI508786B (zh) 2015-11-21

Family

ID=42771540

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099102820A TWI508786B (zh) 2009-03-26 2010-02-01 塗佈裝置

Country Status (4)

Country Link
JP (1) JP2010232326A (ja)
KR (1) KR101643256B1 (ja)
CN (1) CN101846884B (ja)
TW (1) TWI508786B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI743297B (zh) * 2017-01-27 2021-10-21 日商迪思科股份有限公司 雷射加工裝置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5337547B2 (ja) * 2009-03-26 2013-11-06 東レエンジニアリング株式会社 塗布装置
TWI496621B (zh) * 2010-10-26 2015-08-21 Prologium Technology Co 塗佈頭及其應用之佈漿機
CN103245678B (zh) * 2013-04-26 2015-12-09 深圳市华星光电技术有限公司 一种异物检测装置
JP6404654B2 (ja) * 2014-09-22 2018-10-10 Ntn株式会社 塗布方法および塗布装置
CN106583157B (zh) * 2016-12-23 2019-01-11 武汉华星光电技术有限公司 涂布设备
CN106583165B (zh) * 2017-01-17 2019-05-10 晶澳（邢台）太阳能有限公司 一种边框打胶机胶头自动检测装置
CN107199139B (zh) * 2017-05-25 2019-08-30 昆山国显光电有限公司 涂布装置及检测基板上异物的方法
CN110000046A (zh) * 2019-04-29 2019-07-12 华工制造装备数字化国家工程中心有限公司 一种用于硬质载体的液体涂布设备及方法
JP7344533B2 (ja) * 2019-05-14 2023-09-14 Ａｉメカテック株式会社 塗布装置及び塗布方法
CN114618835A (zh) * 2022-03-23 2022-06-14 鹏硕智能装备(深圳)有限公司 Smt大气式等离子清洗机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1577739A (zh) * 2003-07-23 2005-02-09 东京毅力科创株式会社 涂布方法和涂布装置
JP2006198460A (ja) * 2005-01-18 2006-08-03 Toppan Printing Co Ltd 塗布装置及び塗布方法
TW200726528A (en) * 2005-08-18 2007-07-16 Dainippon Screen Mfg Coating device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3653688B2 (ja) * 1998-07-10 2005-06-02 平田機工株式会社 スリットコート式塗布装置とスリットコート式塗布方法
KR101074952B1 (ko) * 2004-08-31 2011-10-18 엘지디스플레이 주식회사 포토레지스트 코팅장치 및 코팅방법
JP3849984B2 (ja) * 2004-09-09 2006-11-22 日立金属株式会社 磁気ディスク用グライドヘッド
JP4523442B2 (ja) * 2005-02-10 2010-08-11 東京エレクトロン株式会社 塗布膜形成装置および塗布膜形成方法、コンピュータプログラム
JP4657855B2 (ja) * 2005-08-23 2011-03-23 東京応化工業株式会社 塗布装置
JP2008032481A (ja) * 2006-07-27 2008-02-14 Toray Eng Co Ltd 部材間距離計測方法、塗布装置のノズル高さ調節方法及び、塗布装置
JP4331760B2 (ja) * 2007-01-22 2009-09-16 シャープ株式会社 液滴吐出ヘッド検査装置および液滴吐出装置
JP5303129B2 (ja) * 2007-09-06 2013-10-02 東京応化工業株式会社 塗布装置及び塗布方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1577739A (zh) * 2003-07-23 2005-02-09 东京毅力科创株式会社 涂布方法和涂布装置
JP2006198460A (ja) * 2005-01-18 2006-08-03 Toppan Printing Co Ltd 塗布装置及び塗布方法
TW200726528A (en) * 2005-08-18 2007-07-16 Dainippon Screen Mfg Coating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI743297B (zh) * 2017-01-27 2021-10-21 日商迪思科股份有限公司 雷射加工裝置

Also Published As

Publication number Publication date
CN101846884A (zh) 2010-09-29
JP2010232326A (ja) 2010-10-14
KR101643256B1 (ko) 2016-07-27
KR20100108200A (ko) 2010-10-06
TW201036704A (en) 2010-10-16
CN101846884B (zh) 2013-04-03

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