TWI504468B - Glass welding method and glass layer fixation method - Google Patents
Glass welding method and glass layer fixation method Download PDFInfo
- Publication number
- TWI504468B TWI504468B TW099131761A TW99131761A TWI504468B TW I504468 B TWI504468 B TW I504468B TW 099131761 A TW099131761 A TW 099131761A TW 99131761 A TW99131761 A TW 99131761A TW I504468 B TWI504468 B TW I504468B
- Authority
- TW
- Taiwan
- Prior art keywords
- glass
- glass layer
- laser light
- layer
- irradiation
- Prior art date
Links
- 239000011521 glass Substances 0.000 title claims description 376
- 238000000034 method Methods 0.000 title claims description 39
- 238000003466 welding Methods 0.000 title claims description 31
- 238000007499 fusion processing Methods 0.000 claims description 47
- 238000009826 distribution Methods 0.000 claims description 15
- 230000031700 light absorption Effects 0.000 claims description 12
- 230000002902 bimodal effect Effects 0.000 claims description 11
- 239000011358 absorbing material Substances 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 200
- 238000002844 melting Methods 0.000 description 14
- 230000008018 melting Effects 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000001354 calcination Methods 0.000 description 10
- 238000002425 crystallisation Methods 0.000 description 9
- 230000008025 crystallization Effects 0.000 description 9
- 239000000049 pigment Substances 0.000 description 9
- 239000011230 binding agent Substances 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 7
- 239000003960 organic solvent Substances 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000000356 contaminant Substances 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- GLMOMDXKLRBTDY-UHFFFAOYSA-A [V+5].[V+5].[V+5].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O Chemical compound [V+5].[V+5].[V+5].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GLMOMDXKLRBTDY-UHFFFAOYSA-A 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000012002 vanadium phosphate Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229940072049 amyl acetate Drugs 0.000 description 1
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000005391 art glass Substances 0.000 description 1
- 239000005385 borate glass Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- ZPPSOOVFTBGHBI-UHFFFAOYSA-N lead(2+);oxido(oxo)borane Chemical compound [Pb+2].[O-]B=O.[O-]B=O ZPPSOOVFTBGHBI-UHFFFAOYSA-N 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/26—Sealing together parts of vessels
- H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
- B23K26/324—Bonding taking account of the properties of the material involved involving non-metallic parts
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/20—Uniting glass pieces by fusing without substantial reshaping
- C03B23/24—Making hollow glass sheets or bricks
- C03B23/245—Hollow glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Joining Of Glass To Other Materials (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009267475A JP5567319B2 (ja) | 2009-11-25 | 2009-11-25 | ガラス溶着方法及びガラス層定着方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201119778A TW201119778A (en) | 2011-06-16 |
| TWI504468B true TWI504468B (zh) | 2015-10-21 |
Family
ID=44066214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099131761A TWI504468B (zh) | 2009-11-25 | 2010-09-17 | Glass welding method and glass layer fixation method |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9922790B2 (enExample) |
| JP (1) | JP5567319B2 (enExample) |
| KR (1) | KR101844078B1 (enExample) |
| CN (1) | CN102666414B (enExample) |
| TW (1) | TWI504468B (enExample) |
| WO (1) | WO2011065111A1 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5308718B2 (ja) | 2008-05-26 | 2013-10-09 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
| US10322469B2 (en) * | 2008-06-11 | 2019-06-18 | Hamamatsu Photonics K.K. | Fusion bonding process for glass |
| CN102066279B (zh) * | 2008-06-23 | 2013-09-11 | 浜松光子学株式会社 | 玻璃熔接方法 |
| JP5481167B2 (ja) * | 2009-11-12 | 2014-04-23 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
| JP5535590B2 (ja) | 2009-11-25 | 2014-07-02 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
| JP5535589B2 (ja) * | 2009-11-25 | 2014-07-02 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
| JP5466929B2 (ja) * | 2009-11-25 | 2014-04-09 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
| JP5567319B2 (ja) | 2009-11-25 | 2014-08-06 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
| JP5481173B2 (ja) * | 2009-11-25 | 2014-04-23 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
| JP5481172B2 (ja) | 2009-11-25 | 2014-04-23 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
| JP5525246B2 (ja) * | 2009-11-25 | 2014-06-18 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
| JP5535588B2 (ja) | 2009-11-25 | 2014-07-02 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
| US20140127857A1 (en) * | 2012-11-07 | 2014-05-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Carrier Wafers, Methods of Manufacture Thereof, and Packaging Methods |
| US9666763B2 (en) | 2012-11-30 | 2017-05-30 | Corning Incorporated | Glass sealing with transparent materials having transient absorption properties |
| WO2014182776A1 (en) | 2013-05-10 | 2014-11-13 | Corning Incorporated | Laser welding transparent glass sheets using low melting glass or thin absorbing films |
| CN109071325B (zh) * | 2013-05-10 | 2022-04-29 | 康宁股份有限公司 | 包含透明激光焊接区域的密封装置 |
| WO2017156048A1 (en) * | 2016-03-10 | 2017-09-14 | Corning Incorporated | Sealed devices comprising transparent laser weld regions |
| JP2018501175A (ja) | 2014-10-31 | 2018-01-18 | コーニング インコーポレイテッド | レーザ溶接ガラスパッケージ及びその作製方法 |
| CN108687442B (zh) * | 2017-03-30 | 2021-10-01 | 法拉第未来公司 | 用于焊接的系统和方法 |
| CN109093251B (zh) * | 2017-06-20 | 2020-08-04 | 上海微电子装备（集团）股份有限公司 | 一种激光封装装置及封装方法 |
| JP6674422B2 (ja) * | 2017-09-14 | 2020-04-01 | フタバ産業株式会社 | レーザ溶接装置、及び、部材の製造方法 |
| CN110627380A (zh) * | 2019-09-16 | 2019-12-31 | 深圳市裕展精密科技有限公司 | 玻璃复合件、玻璃复合件的制备方法以及激光焊接设备 |
| KR102809214B1 (ko) * | 2020-05-08 | 2025-05-19 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200737370A (en) * | 2005-12-06 | 2007-10-01 | Corning Inc | System and method for frit sealing glass packages |
| CN101095247A (zh) * | 2004-10-20 | 2007-12-26 | 康宁股份有限公司 | 用于封装有机发光二极管(oled)显示器的参数的优化 |
| CN101312234A (zh) * | 2003-04-16 | 2008-11-26 | 康宁股份有限公司 | 用玻璃料密封的玻璃外壳及其制造方法 |
| US20090086325A1 (en) * | 2007-09-28 | 2009-04-02 | Anping Liu | Method and apparatus for frit sealing with a variable laser beam |
| CN101434453A (zh) * | 2007-11-13 | 2009-05-20 | 佳能株式会社 | 气密容器的制造方法 |
Family Cites Families (100)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1244346B (de) | 1964-10-19 | 1967-07-13 | Menzel Gerhard Glasbearbeitung | Verfahren zum Schneiden von Glas |
| US3663793A (en) | 1971-03-30 | 1972-05-16 | Westinghouse Electric Corp | Method of decorating a glazed article utilizing a beam of corpuscular energy |
| US4343833A (en) | 1979-06-26 | 1982-08-10 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing thermal head |
| JPS5915099B2 (ja) * | 1980-03-17 | 1984-04-07 | セントラル硝子株式会社 | 板ガラスの着色部形成方法 |
| JPH02120259A (ja) | 1988-10-28 | 1990-05-08 | Toshiba Corp | ガラスの封止接合体およびその製造方法 |
| JPH05166462A (ja) | 1991-12-17 | 1993-07-02 | Matsushita Electric Ind Co Ltd | 平板型表示装置用真空容器の製造方法 |
| US5489321A (en) | 1994-07-14 | 1996-02-06 | Midwest Research Institute | Welding/sealing glass-enclosed space in a vacuum |
| JP2000313630A (ja) | 1998-08-07 | 2000-11-14 | Shin Meiwa Ind Co Ltd | ガラス融着方法、ガラス融着装置、融着ガラスおよび融着ガラスの製造方法 |
| JP2000167681A (ja) | 1998-12-04 | 2000-06-20 | Samsung Electronics Co Ltd | レ―ザ切断用基板，液晶表示装置パネルおよび液晶表示装置パネルの製造方法 |
| KR100626983B1 (ko) | 1999-06-18 | 2006-09-22 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 레이저를 이용한 스크라이브 방법 |
| KR100316781B1 (ko) | 2000-02-25 | 2001-12-20 | 김순택 | 레이저를 이용한 유리평판표시패널의 프릿 프레임 밀봉 방법 |
| JP2001326290A (ja) | 2000-03-10 | 2001-11-22 | Seiko Epson Corp | パッケージの封止方法、電子素子モジュールの製造方法、封止装置並びにパッケージ品 |
| JP2002015108A (ja) | 2000-06-30 | 2002-01-18 | Nomura Holding Inc | 企業価値分析装置及び企業価値分析方法 |
| WO2002054436A1 (en) | 2000-12-28 | 2002-07-11 | Jae-Hong Park | A method for sealing a flat panel display in a vacuum |
| JP2002224871A (ja) | 2001-01-31 | 2002-08-13 | Seiko Epson Corp | レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置 |
| JP2002287107A (ja) | 2001-03-28 | 2002-10-03 | Hitachi Ltd | 液晶表示装置およびその製造方法 |
| JP2002367514A (ja) | 2001-06-12 | 2002-12-20 | Matsushita Electric Ind Co Ltd | 表示パネルおよびその製造方法およびその製造装置 |
| JP2002366050A (ja) * | 2001-06-12 | 2002-12-20 | Matsushita Electric Ind Co Ltd | 画像表示装置の製造方法、製造装置およびそれを用いて製造した画像表示装置 |
| US6565400B1 (en) | 2001-06-26 | 2003-05-20 | Candescent Technologies Corporation | Frit protection in sealing process for flat panel displays |
| TW517356B (en) | 2001-10-09 | 2003-01-11 | Delta Optoelectronics Inc | Package structure of display device and its packaging method |
| JP2004182567A (ja) | 2002-12-05 | 2004-07-02 | Nippon Sheet Glass Co Ltd | 真空ガラスパネルの製造方法、及び該製造方法により製造された真空ガラスパネル |
| US20040206953A1 (en) | 2003-04-16 | 2004-10-21 | Robert Morena | Hermetically sealed glass package and method of fabrication |
| US20050116245A1 (en) | 2003-04-16 | 2005-06-02 | Aitken Bruce G. | Hermetically sealed glass package and method of fabrication |
| JP4202836B2 (ja) | 2003-06-17 | 2008-12-24 | 浜松ホトニクス株式会社 | レーザ溶接方法およびレーザ溶接装置 |
| CN100533185C (zh) | 2003-07-16 | 2009-08-26 | 3M创新有限公司 | 层压件及制造层压件的方法 |
| US20050103755A1 (en) | 2003-11-13 | 2005-05-19 | Baker Martin C. | Hand-held laser welding wand reflection shield |
| JP2005213125A (ja) * | 2004-02-02 | 2005-08-11 | Futaba Corp | 電子管と電子管の気密容器の製造方法 |
| US20060021977A1 (en) | 2004-07-30 | 2006-02-02 | Menegus Harry E | Process and apparatus for scoring a brittle material incorporating moving optical assembly |
| US7820941B2 (en) | 2004-07-30 | 2010-10-26 | Corning Incorporated | Process and apparatus for scoring a brittle material |
| JP4692918B2 (ja) | 2004-12-01 | 2011-06-01 | 日本電気硝子株式会社 | 封着材料 |
| EP1883855B1 (en) | 2005-05-16 | 2011-07-20 | Donnelly Corporation | Vehicle mirror assembly with indicia at reflective element |
| US20070001579A1 (en) | 2005-06-30 | 2007-01-04 | Eun-Suk Jeon | Glass-to-glass joining method using laser, vacuum envelope manufactured by the method, electron emission display having the vacuum envelope |
| KR101285442B1 (ko) | 2005-08-09 | 2013-07-12 | 아사히 가라스 가부시키가이샤 | 박판 유리 적층체 및 박판 유리 적층체를 이용한 표시장치의 제조 방법 |
| JP2007090405A (ja) | 2005-09-29 | 2007-04-12 | Epson Toyocom Corp | 積層光学素子、及びその製造方法 |
| US7537504B2 (en) | 2005-12-06 | 2009-05-26 | Corning Incorporated | Method of encapsulating a display element with frit wall and laser beam |
| JP5127465B2 (ja) | 2005-12-06 | 2013-01-23 | コーニング インコーポレイテッド | 密封ガラスパッケージおよびその製造方法 |
| EP1971558B1 (en) | 2005-12-06 | 2016-05-04 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
| KR100673765B1 (ko) | 2006-01-20 | 2007-01-24 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치 및 그 제조방법 |
| JP4456092B2 (ja) | 2006-01-24 | 2010-04-28 | 三星モバイルディスプレイ株式會社 | 有機電界発光表示装置及びその製造方法 |
| KR100732808B1 (ko) | 2006-01-26 | 2007-06-27 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치의 제조방법 |
| KR100671647B1 (ko) | 2006-01-26 | 2007-01-19 | 삼성에스디아이 주식회사 | 유기전계발광 표시 장치 |
| KR100713987B1 (ko) | 2006-02-20 | 2007-05-04 | 삼성에스디아이 주식회사 | 기판 밀착장치 및 이를 이용한 유기전계발광 표시장치의밀봉방법 |
| JP4977391B2 (ja) | 2006-03-27 | 2012-07-18 | 日本電気株式会社 | レーザ切断方法、表示装置の製造方法、および表示装置 |
| EP2025650A1 (en) | 2006-05-08 | 2009-02-18 | Asahi Glass Company, Limited | Thin-sheet glass laminate, process for manufacturing display apparatus using the laminate, and supporting glass substrate |
| KR101274807B1 (ko) | 2006-06-30 | 2013-06-13 | 엘지디스플레이 주식회사 | 유기 전계 발광 표시 장치 및 이의 제조 방법 |
| US20080124558A1 (en) | 2006-08-18 | 2008-05-29 | Heather Debra Boek | Boro-silicate glass frits for hermetic sealing of light emitting device displays |
| US7800303B2 (en) | 2006-11-07 | 2010-09-21 | Corning Incorporated | Seal for light emitting display device, method, and apparatus |
| JP2008115067A (ja) | 2006-11-07 | 2008-05-22 | Lemi Ltd | フラットパネルディスプレィ薄板の割断方法 |
| JP2008115057A (ja) * | 2006-11-07 | 2008-05-22 | Electric Power Dev Co Ltd | 封止材料、ガラスパネルの製造方法および色素増感太陽電池 |
| JP2008127223A (ja) | 2006-11-17 | 2008-06-05 | Lemi Ltd | フラットパネルディスプレィ薄板の割断方法 |
| DE102007008634B3 (de) | 2007-02-16 | 2008-08-07 | Jenoptik Automatisierungstechnik Gmbh | Verfahren und Vorrichtung zum Trennen von Verbundglasscheiben |
| US20080254268A1 (en) * | 2007-04-03 | 2008-10-16 | Asahi Glass Company Limited | Color toner for electro printing, and process for producing glass plate provided with ceramic color print, employing it |
| DE202008017990U1 (de) | 2007-05-30 | 2011-02-10 | Panasonic Electric Works Co., Ltd., Kadoma-shi | Laminier-Formgebungsvorrichtung |
| JP2009070687A (ja) | 2007-09-13 | 2009-04-02 | Canon Inc | 気密容器の製造方法 |
| US7815480B2 (en) | 2007-11-30 | 2010-10-19 | Corning Incorporated | Methods and apparatus for packaging electronic components |
| JP4980265B2 (ja) | 2008-02-22 | 2012-07-18 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
| JP4928483B2 (ja) | 2008-02-22 | 2012-05-09 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
| TWI421601B (zh) | 2008-04-25 | 2014-01-01 | Au Optronics Corp | 適用雷射切割技術之顯示面板及其母板 |
| KR101519693B1 (ko) | 2008-04-25 | 2015-05-12 | 하마마츠 포토닉스 가부시키가이샤 | 유리용착방법 |
| JP5308717B2 (ja) | 2008-05-26 | 2013-10-09 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
| JP5308718B2 (ja) | 2008-05-26 | 2013-10-09 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
| US7992411B2 (en) | 2008-05-30 | 2011-08-09 | Corning Incorporated | Method for sintering a frit to a glass plate |
| US8147632B2 (en) | 2008-05-30 | 2012-04-03 | Corning Incorporated | Controlled atmosphere when sintering a frit to a glass plate |
| CN102066277B (zh) | 2008-06-11 | 2013-09-11 | 浜松光子学株式会社 | 玻璃熔接方法 |
| US10322469B2 (en) | 2008-06-11 | 2019-06-18 | Hamamatsu Photonics K.K. | Fusion bonding process for glass |
| US8448468B2 (en) | 2008-06-11 | 2013-05-28 | Corning Incorporated | Mask and method for sealing a glass envelope |
| JP5535655B2 (ja) | 2008-06-23 | 2014-07-02 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
| CN102066279B (zh) | 2008-06-23 | 2013-09-11 | 浜松光子学株式会社 | 玻璃熔接方法 |
| WO2010009213A1 (en) | 2008-07-16 | 2010-01-21 | Ferro Corporation | Hot-melt sealing glass compositions and methods of making and using the same |
| EP2321694A4 (en) | 2008-07-28 | 2012-05-30 | Corning Inc | METHOD FOR SEALING A LIQUID IN A GLASS PACKAGING AND RESULTING GLASS PACKAGING |
| US20100095705A1 (en) | 2008-10-20 | 2010-04-22 | Burkhalter Robert S | Method for forming a dry glass-based frit |
| US20100116119A1 (en) | 2008-11-10 | 2010-05-13 | Bayne John F | Method for separating a composite glass assembly |
| US8245536B2 (en) | 2008-11-24 | 2012-08-21 | Corning Incorporated | Laser assisted frit sealing of high CTE glasses and the resulting sealed glass package |
| CN102224115A (zh) | 2008-11-26 | 2011-10-19 | 旭硝子株式会社 | 带密封材料层的玻璃构件以及使用该构件的电子器件及其制造方法 |
| CN102245525B (zh) | 2008-12-12 | 2014-07-23 | 旭硝子株式会社 | 密封玻璃、带密封材料层的玻璃构件以及电子器件及其制造方法 |
| KR20100099619A (ko) | 2009-03-03 | 2010-09-13 | 삼성모바일디스플레이주식회사 | 유기 전계 발광 표시장치의 제조방법 |
| KR101097307B1 (ko) | 2009-04-16 | 2011-12-21 | 삼성모바일디스플레이주식회사 | 실링 장치 |
| US8440479B2 (en) | 2009-05-28 | 2013-05-14 | Corning Incorporated | Method for forming an organic light emitting diode device |
| SG176881A1 (en) | 2009-06-30 | 2012-02-28 | Asahi Glass Co Ltd | Glass member with sealing material layer, electronic device using same, and method for manufacturing the electronic device |
| CN102066280A (zh) | 2009-07-23 | 2011-05-18 | 旭硝子株式会社 | 带密封材料层的玻璃构件的制造方法及制造装置以及电子器件的制造方法 |
| JP5481167B2 (ja) | 2009-11-12 | 2014-04-23 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
| JP5525246B2 (ja) | 2009-11-25 | 2014-06-18 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
| JP5567319B2 (ja) | 2009-11-25 | 2014-08-06 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
| JP5481173B2 (ja) | 2009-11-25 | 2014-04-23 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
| JP5535589B2 (ja) | 2009-11-25 | 2014-07-02 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
| JP5535588B2 (ja) | 2009-11-25 | 2014-07-02 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
| JP5466929B2 (ja) | 2009-11-25 | 2014-04-09 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
| JP5481172B2 (ja) | 2009-11-25 | 2014-04-23 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
| JP5535590B2 (ja) | 2009-11-25 | 2014-07-02 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
| KR101113381B1 (ko) | 2009-11-30 | 2012-03-02 | 삼성에스디아이 주식회사 | 배터리 팩 |
| TWI497466B (zh) | 2010-03-19 | 2015-08-21 | Asahi Glass Co Ltd | Electronic device and manufacturing method thereof |
| CN102939271B (zh) | 2010-04-15 | 2016-08-03 | 费罗公司 | 低温熔化的无铅铋密封玻璃 |
| CN102870230B (zh) | 2010-04-27 | 2016-04-20 | 费罗公司 | 用于气密密封导电馈通的方法 |
| JP2011233479A (ja) | 2010-04-30 | 2011-11-17 | Canon Inc | 気密容器および画像表示装置の製造方法 |
| CN102939270B (zh) | 2010-06-14 | 2015-11-25 | 旭硝子株式会社 | 密封材料糊以及使用其的电子器件的制造方法 |
| CN102754524B (zh) | 2010-07-23 | 2015-09-02 | 株式会社日本有机雷特显示器 | 显示面板及其制造方法 |
| JP5947098B2 (ja) | 2011-05-13 | 2016-07-06 | 株式会社半導体エネルギー研究所 | ガラス封止体の作製方法および発光装置の作製方法 |
| JP6111022B2 (ja) | 2011-06-17 | 2017-04-05 | 株式会社半導体エネルギー研究所 | 封止体の作製方法および発光装置の作製方法 |
| KR102058387B1 (ko) | 2011-11-28 | 2019-12-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 유리 패턴 및 그 형성 방법, 밀봉체 및 그 제작 방법, 및 발광 장치 |
| KR20130118491A (ko) | 2012-04-20 | 2013-10-30 | 삼성디스플레이 주식회사 | 레이저 실링 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법 |
-
2009
- 2009-11-25 JP JP2009267475A patent/JP5567319B2/ja active Active
-
2010
- 2010-09-17 US US13/511,747 patent/US9922790B2/en not_active Expired - Fee Related
- 2010-09-17 WO PCT/JP2010/066144 patent/WO2011065111A1/ja not_active Ceased
- 2010-09-17 TW TW099131761A patent/TWI504468B/zh not_active IP Right Cessation
- 2010-09-17 CN CN201080053447.5A patent/CN102666414B/zh not_active Expired - Fee Related
- 2010-09-17 KR KR1020127006075A patent/KR101844078B1/ko not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101312234A (zh) * | 2003-04-16 | 2008-11-26 | 康宁股份有限公司 | 用玻璃料密封的玻璃外壳及其制造方法 |
| CN101095247A (zh) * | 2004-10-20 | 2007-12-26 | 康宁股份有限公司 | 用于封装有机发光二极管(oled)显示器的参数的优化 |
| TW200737370A (en) * | 2005-12-06 | 2007-10-01 | Corning Inc | System and method for frit sealing glass packages |
| US20090086325A1 (en) * | 2007-09-28 | 2009-04-02 | Anping Liu | Method and apparatus for frit sealing with a variable laser beam |
| CN101434453A (zh) * | 2007-11-13 | 2009-05-20 | 佳能株式会社 | 气密容器的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201119778A (en) | 2011-06-16 |
| US20120240632A1 (en) | 2012-09-27 |
| CN102666414A (zh) | 2012-09-12 |
| WO2011065111A1 (ja) | 2011-06-03 |
| US9922790B2 (en) | 2018-03-20 |
| JP5567319B2 (ja) | 2014-08-06 |
| JP2011111339A (ja) | 2011-06-09 |
| KR101844078B1 (ko) | 2018-03-30 |
| CN102666414B (zh) | 2014-11-26 |
| KR20120104967A (ko) | 2012-09-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI504468B (zh) | Glass welding method and glass layer fixation method | |
| TWI402127B (zh) | Glass welding method and glass layer fixation method | |
| TWI402126B (zh) | Glass welding method and glass layer fixation method | |
| JP5535653B2 (ja) | ガラス溶着方法 | |
| TWI474979B (zh) | Glass fusing method | |
| TWI422546B (zh) | Glass fusion method | |
| TWI504469B (zh) | Glass welding method and glass layer fixation method | |
| TWI490071B (zh) | Glass fusion method | |
| TWI495530B (zh) | Glass welding method and glass layer fixation method | |
| JP5140201B2 (ja) | ガラス層定着方法 | |
| CN102666417A (zh) | 玻璃熔接方法及玻璃层固定方法 | |
| WO2011065104A1 (ja) | ガラス溶着方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |