KR101844078B1 - 유리 용착 방법 및 유리층 정착 방법 - Google Patents

유리 용착 방법 및 유리층 정착 방법 Download PDF

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Publication number
KR101844078B1
KR101844078B1 KR1020127006075A KR20127006075A KR101844078B1 KR 101844078 B1 KR101844078 B1 KR 101844078B1 KR 1020127006075 A KR1020127006075 A KR 1020127006075A KR 20127006075 A KR20127006075 A KR 20127006075A KR 101844078 B1 KR101844078 B1 KR 101844078B1
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South Korea
Prior art keywords
glass
glass layer
layer
laser beam
laser light
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Expired - Fee Related
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KR1020127006075A
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English (en)
Korean (ko)
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KR20120104967A (ko
Inventor
사토시 마츠모토
Original Assignee
하마마츠 포토닉스 가부시키가이샤
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Publication of KR20120104967A publication Critical patent/KR20120104967A/ko
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/26—Sealing together parts of vessels
    • H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B23K26/324—Bonding taking account of the properties of the material involved involving non-metallic parts
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00—Re-forming shaped glass
    • C03B23/20—Uniting glass pieces by fusing without substantial reshaping
    • C03B23/24—Making hollow glass sheets or bricks
    • C03B23/245—Hollow glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
KR1020127006075A 2009-11-25 2010-09-17 유리 용착 방법 및 유리층 정착 방법 Expired - Fee Related KR101844078B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009267475A JP5567319B2 (ja) 2009-11-25 2009-11-25 ガラス溶着方法及びガラス層定着方法
JPJP-P-2009-267475 2009-11-25
PCT/JP2010/066144 WO2011065111A1 (ja) 2009-11-25 2010-09-17 ガラス溶着方法及びガラス層定着方法

Publications (2)

Publication Number Publication Date
KR20120104967A KR20120104967A (ko) 2012-09-24
KR101844078B1 true KR101844078B1 (ko) 2018-03-30

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KR1020127006075A Expired - Fee Related KR101844078B1 (ko) 2009-11-25 2010-09-17 유리 용착 방법 및 유리층 정착 방법

Country Status (6)

Country Link
US (1) US9922790B2 (enExample)
JP (1) JP5567319B2 (enExample)
KR (1) KR101844078B1 (enExample)
CN (1) CN102666414B (enExample)
TW (1) TWI504468B (enExample)
WO (1) WO2011065111A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5308718B2 (ja) 2008-05-26 2013-10-09 浜松ホトニクス株式会社 ガラス溶着方法
JP5535652B2 (ja) * 2008-06-11 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法
KR101651300B1 (ko) * 2008-06-23 2016-08-25 하마마츠 포토닉스 가부시키가이샤 유리 용착 방법
JP5481167B2 (ja) * 2009-11-12 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法
JP5481173B2 (ja) * 2009-11-25 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5481172B2 (ja) 2009-11-25 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535588B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5525246B2 (ja) * 2009-11-25 2014-06-18 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5567319B2 (ja) 2009-11-25 2014-08-06 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535590B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5466929B2 (ja) * 2009-11-25 2014-04-09 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535589B2 (ja) * 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
US20140127857A1 (en) * 2012-11-07 2014-05-08 Taiwan Semiconductor Manufacturing Company, Ltd. Carrier Wafers, Methods of Manufacture Thereof, and Packaging Methods
US9666763B2 (en) 2012-11-30 2017-05-30 Corning Incorporated Glass sealing with transparent materials having transient absorption properties
CN105377783B (zh) 2013-05-10 2019-03-08 康宁股份有限公司 采用低熔融玻璃或薄吸收膜对透明玻璃片进行激光焊接
CN109071325B (zh) * 2013-05-10 2022-04-29 康宁股份有限公司 包含透明激光焊接区域的密封装置
CN107406292B (zh) 2014-10-31 2021-03-16 康宁股份有限公司 激光焊接的玻璃封装和制造方法
EP3426616A1 (en) * 2016-03-10 2019-01-16 Corning Incorporated Sealed devices comprising transparent laser weld regions
CN108687442B (zh) * 2017-03-30 2021-10-01 法拉第未来公司 用于焊接的系统和方法
CN109093251B (zh) * 2017-06-20 2020-08-04 上海微电子装备（集团）股份有限公司 一种激光封装装置及封装方法
JP6674422B2 (ja) * 2017-09-14 2020-04-01 フタバ産業株式会社 レーザ溶接装置、及び、部材の製造方法
CN110627380A (zh) * 2019-09-16 2019-12-31 深圳市裕展精密科技有限公司 玻璃复合件、玻璃复合件的制备方法以及激光焊接设备
KR102809214B1 (ko) * 2020-05-08 2025-05-19 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002366050A (ja) * 2001-06-12 2002-12-20 Matsushita Electric Ind Co Ltd 画像表示装置の製造方法、製造装置およびそれを用いて製造した画像表示装置
US20090086325A1 (en) * 2007-09-28 2009-04-02 Anping Liu Method and apparatus for frit sealing with a variable laser beam

Family Cites Families (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1244346B (de) 1964-10-19 1967-07-13 Menzel Gerhard Glasbearbeitung Verfahren zum Schneiden von Glas
US3663793A (en) 1971-03-30 1972-05-16 Westinghouse Electric Corp Method of decorating a glazed article utilizing a beam of corpuscular energy
US4343833A (en) 1979-06-26 1982-08-10 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing thermal head
JPS5915099B2 (ja) * 1980-03-17 1984-04-07 セントラル硝子株式会社 板ガラスの着色部形成方法
JPH02120259A (ja) 1988-10-28 1990-05-08 Toshiba Corp ガラスの封止接合体およびその製造方法
JPH05166462A (ja) 1991-12-17 1993-07-02 Matsushita Electric Ind Co Ltd 平板型表示装置用真空容器の製造方法
US5489321A (en) 1994-07-14 1996-02-06 Midwest Research Institute Welding/sealing glass-enclosed space in a vacuum
JP2000313630A (ja) 1998-08-07 2000-11-14 Shin Meiwa Ind Co Ltd ガラス融着方法、ガラス融着装置、融着ガラスおよび融着ガラスの製造方法
US6297869B1 (en) 1998-12-04 2001-10-02 Samsung Electronics Co., Ltd. Substrate and a liquid crystal display panel capable of being cut by using a laser and a method for manufacturing the same
KR100626983B1 (ko) 1999-06-18 2006-09-22 미쓰보시 다이야몬도 고교 가부시키가이샤 레이저를 이용한 스크라이브 방법
KR100316781B1 (ko) 2000-02-25 2001-12-20 김순택 레이저를 이용한 유리평판표시패널의 프릿 프레임 밀봉 방법
JP2001326290A (ja) 2000-03-10 2001-11-22 Seiko Epson Corp パッケージの封止方法、電子素子モジュールの製造方法、封止装置並びにパッケージ品
JP2002015108A (ja) 2000-06-30 2002-01-18 Nomura Holding Inc 企業価値分析装置及び企業価値分析方法
WO2002054436A1 (en) 2000-12-28 2002-07-11 Jae-Hong Park A method for sealing a flat panel display in a vacuum
JP2002224871A (ja) 2001-01-31 2002-08-13 Seiko Epson Corp レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置
JP2002287107A (ja) 2001-03-28 2002-10-03 Hitachi Ltd 液晶表示装置およびその製造方法
JP2002367514A (ja) 2001-06-12 2002-12-20 Matsushita Electric Ind Co Ltd 表示パネルおよびその製造方法およびその製造装置
US6565400B1 (en) 2001-06-26 2003-05-20 Candescent Technologies Corporation Frit protection in sealing process for flat panel displays
TW517356B (en) 2001-10-09 2003-01-11 Delta Optoelectronics Inc Package structure of display device and its packaging method
JP2004182567A (ja) 2002-12-05 2004-07-02 Nippon Sheet Glass Co Ltd 真空ガラスパネルの製造方法、及び該製造方法により製造された真空ガラスパネル
US6998776B2 (en) 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US20050116245A1 (en) 2003-04-16 2005-06-02 Aitken Bruce G. Hermetically sealed glass package and method of fabrication
US20040206953A1 (en) 2003-04-16 2004-10-21 Robert Morena Hermetically sealed glass package and method of fabrication
JP4202836B2 (ja) 2003-06-17 2008-12-24 浜松ホトニクス株式会社 レーザ溶接方法およびレーザ溶接装置
KR101110998B1 (ko) 2003-07-16 2012-02-17 쓰리엠 이노베이티브 프로퍼티즈 컴파니 광학 시트, 라미네이트 및 라미네이트 제조 방법
US20050103755A1 (en) 2003-11-13 2005-05-19 Baker Martin C. Hand-held laser welding wand reflection shield
JP2005213125A (ja) * 2004-02-02 2005-08-11 Futaba Corp 電子管と電子管の気密容器の製造方法
US7820941B2 (en) 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
US20060021977A1 (en) 2004-07-30 2006-02-02 Menegus Harry E Process and apparatus for scoring a brittle material incorporating moving optical assembly
US7371143B2 (en) * 2004-10-20 2008-05-13 Corning Incorporated Optimization of parameters for sealing organic emitting light diode (OLED) displays
JP4692918B2 (ja) 2004-12-01 2011-06-01 日本電気硝子株式会社 封着材料
ATE517368T1 (de) 2005-05-16 2011-08-15 Donnelly Corp Fahrzeugspiegelanordnung mit zeichen am reflektierenden teil
US20070001579A1 (en) 2005-06-30 2007-01-04 Eun-Suk Jeon Glass-to-glass joining method using laser, vacuum envelope manufactured by the method, electron emission display having the vacuum envelope
JP5200538B2 (ja) 2005-08-09 2013-06-05 旭硝子株式会社 薄板ガラス積層体及び薄板ガラス積層体を用いた表示装置の製造方法
JP2007090405A (ja) 2005-09-29 2007-04-12 Epson Toyocom Corp 積層光学素子、及びその製造方法
DE602006021468D1 (de) 2005-12-06 2011-06-01 Corning Inc Herstellungsverfahren für eine luftdicht versiegelte Glasverpackung
US7537504B2 (en) 2005-12-06 2009-05-26 Corning Incorporated Method of encapsulating a display element with frit wall and laser beam
WO2007067533A2 (en) 2005-12-06 2007-06-14 Corning Incorporated System and method for frit sealing glass packages
CN101454860B (zh) 2005-12-06 2012-05-23 康宁股份有限公司 用玻璃料气密密封的玻璃封装物及其制造方法
KR100673765B1 (ko) 2006-01-20 2007-01-24 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
JP4456092B2 (ja) 2006-01-24 2010-04-28 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100671647B1 (ko) 2006-01-26 2007-01-19 삼성에스디아이 주식회사 유기전계발광 표시 장치
KR100732808B1 (ko) 2006-01-26 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치의 제조방법
KR100713987B1 (ko) 2006-02-20 2007-05-04 삼성에스디아이 주식회사 기판 밀착장치 및 이를 이용한 유기전계발광 표시장치의밀봉방법
JP4977391B2 (ja) 2006-03-27 2012-07-18 日本電気株式会社 レーザ切断方法、表示装置の製造方法、および表示装置
EP2025650A1 (en) 2006-05-08 2009-02-18 Asahi Glass Company, Limited Thin-sheet glass laminate, process for manufacturing display apparatus using the laminate, and supporting glass substrate
KR101274807B1 (ko) 2006-06-30 2013-06-13 엘지디스플레이 주식회사 유기 전계 발광 표시 장치 및 이의 제조 방법
US20080124558A1 (en) 2006-08-18 2008-05-29 Heather Debra Boek Boro-silicate glass frits for hermetic sealing of light emitting device displays
JP2008115057A (ja) * 2006-11-07 2008-05-22 Electric Power Dev Co Ltd 封止材料、ガラスパネルの製造方法および色素増感太陽電池
US7800303B2 (en) 2006-11-07 2010-09-21 Corning Incorporated Seal for light emitting display device, method, and apparatus
JP2008115067A (ja) 2006-11-07 2008-05-22 Lemi Ltd フラットパネルディスプレィ薄板の割断方法
JP2008127223A (ja) 2006-11-17 2008-06-05 Lemi Ltd フラットパネルディスプレィ薄板の割断方法
DE102007008634B3 (de) 2007-02-16 2008-08-07 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Trennen von Verbundglasscheiben
JP2008276215A (ja) * 2007-04-03 2008-11-13 Asahi Glass Co Ltd 電子印刷用カラートナーならびにこれを用いたセラミックカラープリント付きガラス板およびその製造方法
CN101541511B (zh) 2007-05-30 2011-12-21 松下电工株式会社 叠层成形设备
JP2009070687A (ja) 2007-09-13 2009-04-02 Canon Inc 気密容器の製造方法
JP2009123421A (ja) 2007-11-13 2009-06-04 Canon Inc 気密容器の製造方法
US7815480B2 (en) 2007-11-30 2010-10-19 Corning Incorporated Methods and apparatus for packaging electronic components
JP4928483B2 (ja) 2008-02-22 2012-05-09 浜松ホトニクス株式会社 ガラス溶着方法
JP4980265B2 (ja) 2008-02-22 2012-07-18 浜松ホトニクス株式会社 ガラス溶着方法
CN102015567B (zh) 2008-04-25 2013-08-28 浜松光子学株式会社 玻璃熔接方法
TWI421601B (zh) 2008-04-25 2014-01-01 Au Optronics Corp 適用雷射切割技術之顯示面板及其母板
JP5308718B2 (ja) 2008-05-26 2013-10-09 浜松ホトニクス株式会社 ガラス溶着方法
JP5308717B2 (ja) 2008-05-26 2013-10-09 浜松ホトニクス株式会社 ガラス溶着方法
US8147632B2 (en) 2008-05-30 2012-04-03 Corning Incorporated Controlled atmosphere when sintering a frit to a glass plate
US7992411B2 (en) 2008-05-30 2011-08-09 Corning Incorporated Method for sintering a frit to a glass plate
US8448468B2 (en) 2008-06-11 2013-05-28 Corning Incorporated Mask and method for sealing a glass envelope
JP5535652B2 (ja) 2008-06-11 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法
JP5535654B2 (ja) 2008-06-11 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法
KR101651300B1 (ko) 2008-06-23 2016-08-25 하마마츠 포토닉스 가부시키가이샤 유리 용착 방법
JP5535655B2 (ja) 2008-06-23 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法
CN102089251B (zh) 2008-07-16 2014-06-11 费罗公司 热熔性密封玻璃组合物及其制造和使用的方法
CN102138100B (zh) 2008-07-28 2014-06-11 康宁股份有限公司 将液体密封于玻璃封装中的方法及所得到的玻璃封装
US20100095705A1 (en) 2008-10-20 2010-04-22 Burkhalter Robert S Method for forming a dry glass-based frit
US20100116119A1 (en) 2008-11-10 2010-05-13 Bayne John F Method for separating a composite glass assembly
US8245536B2 (en) 2008-11-24 2012-08-21 Corning Incorporated Laser assisted frit sealing of high CTE glasses and the resulting sealed glass package
TWI482745B (zh) 2008-11-26 2015-05-01 Asahi Glass Co Ltd A glass member having a sealing material layer, and an electronic device using the same, and a method of manufacturing the same
JP5413373B2 (ja) 2008-12-12 2014-02-12 旭硝子株式会社 レーザ封着用ガラス材料、封着材料層付きガラス部材、および電子デバイスとその製造方法
KR20100099619A (ko) 2009-03-03 2010-09-13 삼성모바일디스플레이주식회사 유기 전계 발광 표시장치의 제조방법
KR101097307B1 (ko) 2009-04-16 2011-12-21 삼성모바일디스플레이주식회사 실링 장치
US8440479B2 (en) 2009-05-28 2013-05-14 Corning Incorporated Method for forming an organic light emitting diode device
KR20120104922A (ko) 2009-06-30 2012-09-24 아사히 가라스 가부시키가이샤 봉착 재료층이 형성된 유리 부재와 그것을 사용한 전자 디바이스 및 그 제조 방법
JPWO2011010489A1 (ja) 2009-07-23 2012-12-27 旭硝子株式会社 封着材料層付きガラス部材の製造方法及び製造装置、並びに電子デバイスの製造方法
JP5481167B2 (ja) 2009-11-12 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法
JP5525246B2 (ja) 2009-11-25 2014-06-18 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5466929B2 (ja) 2009-11-25 2014-04-09 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5567319B2 (ja) 2009-11-25 2014-08-06 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535588B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535590B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535589B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5481173B2 (ja) 2009-11-25 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5481172B2 (ja) 2009-11-25 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
KR101113381B1 (ko) 2009-11-30 2012-03-02 삼성에스디아이 주식회사 배터리 팩
CN102792413B (zh) 2010-03-19 2015-11-25 旭硝子株式会社 电子器件及其制造方法
WO2011130632A1 (en) 2010-04-15 2011-10-20 Ferro Corporation Low-melting lead-free bismuth sealing glasses
WO2011139751A2 (en) 2010-04-27 2011-11-10 Ferro Corporation Hermetic sealing of glass plates
JP2011233479A (ja) 2010-04-30 2011-11-17 Canon Inc 気密容器および画像表示装置の製造方法
CN102939270B (zh) 2010-06-14 2015-11-25 旭硝子株式会社 密封材料糊以及使用其的电子器件的制造方法
JP5620492B2 (ja) 2010-07-23 2014-11-05 パナソニック株式会社 表示パネル及びその製造方法
JP5947098B2 (ja) 2011-05-13 2016-07-06 株式会社半導体エネルギー研究所 ガラス封止体の作製方法および発光装置の作製方法
JP6111022B2 (ja) 2011-06-17 2017-04-05 株式会社半導体エネルギー研究所 封止体の作製方法および発光装置の作製方法
KR102058387B1 (ko) 2011-11-28 2019-12-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 유리 패턴 및 그 형성 방법, 밀봉체 및 그 제작 방법, 및 발광 장치
KR20130118491A (ko) 2012-04-20 2013-10-30 삼성디스플레이 주식회사 레이저 실링 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002366050A (ja) * 2001-06-12 2002-12-20 Matsushita Electric Ind Co Ltd 画像表示装置の製造方法、製造装置およびそれを用いて製造した画像表示装置
US20090086325A1 (en) * 2007-09-28 2009-04-02 Anping Liu Method and apparatus for frit sealing with a variable laser beam

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US20120240632A1 (en) 2012-09-27
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KR20120104967A (ko) 2012-09-24
WO2011065111A1 (ja) 2011-06-03
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US9922790B2 (en) 2018-03-20
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